Engineers` Guide to PC/104 & Embedded Small Form
A pr il 2 0 15 Guiding Embedded Designers on Systems and Technologies Engineers’ Guide to PC/104 & Embedded Small Form Factors OneBank Specification Opens a New Door Tackling Performance & Low Power with SMARC www.EmbeddedSystemsEngineering.com/pc104 Gold Sponsors We simplify the use of embedded technology FAST AND COMPACT conga-TC97 HIGH END PERFORMANCE conga-TS87 - COM Express Compact Type 6 module - Dual-core 5th generation Intel® Core™ i7 processors - 3x DisplayPort 1.2, up to 4k resolution - Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) - COM Express Basic Type 6 module - Quad-core 4th generation Intel® Core™ i7 processors - 3x DisplayPort 1.2, up to 4k resolution - Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI) POWERFUL AND SMALL HIGH PERFORMANCE QSEVEN conga-MA3/conga-MA3E conga-QA3 - COM Express Mini Type 10 module - Intel® Atom™ and Intel® Celeron® processors - Gen 7 Intel® HD graphics - Extended temperature range option - Qseven module - Intel® Atom™ and Intel® Celeron® processors - Gen 7 Intel® HD graphics - Extended temperature range option Find more details at: www.congatec.us congatec Inc. | 6262 Ferris Square San Diego | CA 92121 USA | Phone: 858-457-2600 | [email protected] FROM THE EDITOR Re-Architecting the Internet Away from Data Movement IoT, streaming video, and “cloud everything” is forcing a new Internet architecture that emphasizes local data processing. By Chris A. Ciufo, Editor-in-Chief, Embedded Systems Engineering S mall form factors like the newly spacious PCIe/104 OneBank, COM, SMARC and more play an integral role in edge and gateway nodes on the emerging Internet of Things (IoT). The Internet itself is changing—“morphing” is a better verb—into a heterogeneous architecture that may soon de-emphasize mere data routing in favor of processing the data right where it’s collected. The IoT paradigm of sensors and machine to machine (M2M), the exponential growth of video streaming and content caching, coupled with software as a service (SaaS) in cloud computing are all forging how tomorrow’s Internet is constructed. Several recent announcements all point to a very different Internet within a few years. At February’s Embedded World, AMD VP Scott Aylor described the need for heterogeneous resources that could process data most efficiently. That company’s APUs—accelerated processing unit—couple an x86 CPU (or in the future: ARM) with a vector processing Radeon GPU to achieve a high-performance computing (HPC) engine in a small footprint. Aylor says this heterogeneous combo alleviates the need, for example, to upload surveillance video to a cloud server to conduct facial recognition or perform mash-up overlays. In essence: all the data is collected and processed right at the sensor node; this is a radical difference from the current data-to-cloud model. Also at Embedded World was ARM’s roll-out of the Intelligent Flexible Cloud, a heterogeneous vision of the Internet similar to AMD’s. ARM is positioning its processor cores, often on small form factor boards from Cortex-M and Cortex-A7/-A53, at the “power-optimized” edge, while still-small boards in midrange gateways and service platforms (such as DPI or content caching) rely on Cortex-A53/-A57 cores. At the heart of the Internet resides the traditionally Intel-based (Xeon) servers—but ARM and AMD are making inroads in servers with Cortex-A53, A57 and ARM’s latest Cortex-A72 monster. ARM is catalyzing myriad software to help process data at the point of use, including OpenDataPlane APIs, OpenFlow, OpenFV, Open vSwitch, Xen and more. Intel’s vision for the Intelligent Gateway is a perfect example of data processing one node removed from the edge, and the company’s SDKs and HDKs combine tons of software for—you guessed it, heterogeneous local resources for I/O, Wi-Fi, cellular and CODEC processing. Of course, Intel’s version of the IoT is like ARM’s: heavily dependent upon its own processors. But the Heterogeneous Systems Architecture (HSA) Foundation has released a series of specifications, APIs and even compilers that aims to let all these disparate processors and accelerators comingle their “ménage-a-IoT” resources. It’s a Java-like write-once concept that allows devs to start in C but targets a variety of HSA-enabled engines residing locally or far away on the IoT. This is just another tool used to build a disaggregated Internet that relies more on data processing than today’s data movement. 2 &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 Engineers’ Guide to PC/104 & Embedded Small Form Factors www.eecatalog.com/pc104 Vice President & Publisher Clair Bright Editorial Editor-in-Chief Chris Ciufo [email protected] Managing Editor Anne Fisher [email protected] Contributing Editor Caroline Hayes Creative/Production Production Manager Spryte Heithecker Graphic Designers Nicky Jacobson Caldin Seides Media Coordinator Yishian Yao Senior Web Developers Slava Dotsenko Mariam Moattari Advertising / Reprint Sales Vice President, Sales Embedded Electronics Media Group Clair Bright [email protected] (415) 255-0390 ext. 15 Sales Manager Michael Cloward [email protected] (415) 255-0390 ext. 17 Marketing/Circulation Jenna Johnson To Subscribe www.eecatalog.com Extension Media, LLC Corporate Office President and Publisher Vince Ridley [email protected] (415) 255-0390 ext. 18 Vice President & Publisher Clair Bright [email protected] Vice President, Business Development Melissa Sterling [email protected] Human Resources / Administration Darla Rovetti Special Thanks to Our Sponsors The Engineers’ Guide to PC/104 & Embedded Small Form Factors 2015 is published by Extension Media LLC. Extension Media makes no warranty for the use of its products and assumes no responsibility for any errors which may appear in this Catalog nor does it make a commitment to update the information contained herein. Engineers’ Guide to PC/104 & Embedded Small Form Factors 2015 is Copyright ®2015 Extension Media LLC. No information in this Catalog may be reproduced without expressed written permission from Extension Media @ 1786 18th Street, San Francisco, CA 94107-2343. All registered trademarks and trademarks included in this Catalog are held by their respective companies. Every attempt was made to include all trademarks and registered trademarks where indicated by their companies. 6LQJOHGXDO4XDGFRUH,QWHO®$WRP™RU&HOHURQ™ 3URFHVVRU6\VWHPRQ&KLS 8SWR*%'XDO&KDQQHO''5/DW0+] 9*$DQGGXDOFKDQQHOELW/9'6 7ZR3&,H[DQGELW3&,EXV F([SUHVV%7 *E(RQH6$7$*EVRQH3$7$,'(HLJKW86% 6XSSRUWV6PDUW(PEHGGHG0DQDJHPHQW$JHQW6(0$IXQFWLRQV &RQGXFWLRQFRROHG+HDWSODWHRU$LUFRROHG+HDWVLQNRSWLRQ RU3RUW0ESV6ZLWFK :HE*8,RU&/,0DQDJHPHQW &DUULHU*UDGH(WKHUQHW6ZLWFKLQJ $YDLODEOHZLWK5-RU5XJJHG/RFNLQJFRQQHFWRUV ;WUHPH*E( 0DQDJHG&DUULHU (WKHUQHW6ZLWFK 3&&RPSOLDQW” [”RU6PDOOHU ([WHQGHG7HPSHUDWXUH5DQJH°&WR°& 3&,([SUHVV0LQL&DUGP3&,HW\SH)ZLWKODWFKLQJ,2FRQQHFWRUV RUSRUWVHULDOFRPPXQLFDWLRQFDUGVZLWK'%0FRQQHFWLYLW\ 6RIWZDUHVHOHFWDEOH56SURWRFROVSHUSRUWVWRUHGLQ((3520 &FODVV8$57VZLWKE\WH),)2IRUHDFK7;DQG5; 3&,([SUHVV 0LQL&DUG 3RUWE\SRUWILHOGVHOHFWDEOHWHUPLQDWLRQIRU56DSSOLFDWLRQV ,QGXVWULDORSHUDWLQJWHPSHUDWXUH°&WR°&DQG5R+6VWDQGDUG 6XSSRUWVGDWDFRPPXQLFDWLRQUDWHVXSWR0ESVVLPXOWDQHRXVO\ '036R&&389RUWH[';0+] 0%*%''5RQERDUG :DWFKGRJ7LPHUVRIWZDUHSURJUDPPDEOH +'$XGLR'9*$FKLS)DVW(WKHUQHW 6XSSRUWV6$7$LQWHUIDFH 9'; 2SHUDWLRQ7HPSHUDWXUH°&WR°& °&WR°&RSWLRQDO The Embedded Products Source ZZZZGOV\VWHPVFRP ZZZZGOV\VWHPVFRPPDJ((3&BKWPO VDOHV#ZGOV\VWHPVFRP IN THIS ISSUE CONTENTS Departments From the Editor 2 Features Embedded World 2015—No Longer a One-Theme Show By Caroline Hayes, Senior Editor 8 Security Should Not Be Hard to Implement By Chowdary Yanamadala, ChaoLogix 14 PC/104 & Embedded Small Form Factors COVER STORY Right Sizing Your Embedded Application with the OneBank Specification By Matthew Henry, ADL Embedded Solutions 16 What’s the Nucleus of Mentor’s Push into Industrial Automation? By Chris A. Ciufo, Editor-in-Chief, Embedded Systems Engineering 22 Industrial IoT Looks to SMARC Architecture to Meet Low Power, Performance and Cost Goals By Dirk Finstel, ADLINK Technology 24 With Thermal Dissipation Up, Will Cooler Heads (Up) Thinking Prevail? By Christian Ganninger, Pentair Technical Solutions GmbH 28 Seeing the VITA 74 NanoX Small Form Factor Specification as Gaining a Foothold in Two Worlds By Anne Fisher, Managing Editor 32 Not Enough Just to “Take up the IoT Mantle”: Interview with Eurotech CEO Larry Wall By Anne Fisher, Managing Editor 34 Product Showcases PC/104 & Embedded SFF CPU or Single Board Computer ADL Embedded Solutions EMAC, Inc. 37 38 Enclosures ADL Embedded Solutions 4 39 &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 SBC35-C398Q – Industrial ARM® SBC with Real-Time Linux Features: UÊÊÀiiÃV>i®Ê°8ÊÈÒÊ+Õ>`VÀiÊ,® Cortex™-A9 Processors UÊÊ>iÃÃÊ{äcÊÌʳnxc Ê«iÀ>Ì>ÊÌi«iÀ>ÌÕÀi UÊÊ*ÜiÀi`ÊLÞÊ*ÊÀʳ£äxä6 Ê«ÕÌ UÊÊ£äÉ£ääÉ£äääÊÌ iÀiÌÊÜÌ Ê£xnnÒ UÊÊ1-ÊÓ°äÊ>`Ê1-Ê"/ iÊ*ÀÌà UÊÊiÝ Ê>`Ê,-ÓÎÓÉ{ÓÓÉ{nxÊ-iÀ>Ê*ÀÌà UÊÊÓ{Ê*"ÊÌiÀ>ÌÊÕ«ÊÌÊÎä6 UÊÊ* iÊ>`Ê"ÈäÊÓ ]Ê-*]Ê//]Ê>`Ê*7®ÊiÝ«>à UÊÊ£äÊÞi>ÀÊ>Û>>LÌÞ Benefits iÃ}i`ÊvÀÊ`ÕÃÌÀ>Ê>««V>ÌÃÊ>`Ê}ÌiÀÊ>Û>>LÌÞ]Ê7-ÞÃÌiýÊ- Îx În+Ê- Êvi>ÌÕÀiÃÊ>Ê µÕ>`VÀiÊ,®Ê«ÀViÃÃÀÊÜÌ Ê«ÌÃÊvÀÊiÝ«>ÃÊ>`ÊVÕÃÌâ>Ì°Ê/ iÊVL>ÌÊvÊ«ÀViÃÃ}Ê «ÜiÀÊ>`Ê`ÕÃÌÀ>ÊÉ"Ê«ÀÛ`iÃÊ>ÊyiÝLiÊÃÕÌÊvÀÊ>ÊÕLiÀÊvÊ>««V>ÌÃÊVÕ`}ÊÃiVÕÀÌÞ]Ê`ÕÃÌÀ>Ê VÌÀ]Êi`V>]ÊÌÀ>ëÀÌ>ÌÊ>`ÊÉ "/-°Ê/ ÃÊÜ«ÜiÀÊ`iÃ}Ê«iÀ>ÌiÃÊvÀÊ{äcÊÌʳnxc ÊÜÌ ÕÌÊ>Ê v>ÊÀÊ i>ÌÃÊvÀÊ«ÀÛi`ÊÀi>LÌÞ°Ê VÃÌ>ÀÌÊ`iÛi«iÌÊÜÌ ÊÕÀÊ-Ê >À`Ã]Ê>Û>>LiÊ«Ài>`i`ÊÜÌ ÊÕÀÊiÜÞÊÀii>Ãi`ÊÀi>ÌiÊÕÝÊ`ÃÌÀLÕÌÊÀÊ`À`Ò°Ê"ÕÀÊv>VÌÀÞÊi}iiÀÃÊvviÀÊÌiV V>ÊÃÕ««ÀÌÊvÀÊ«ÀiÃ>iÃÊÌ ÀÕ} Ê«À`ÕVÌ° / iÊ"ÈäÊViVÌÀÊÃÕ««ÀÌÃÊ2 ]Ê-*]Ê//1,/]Ê>`Ê*7ÊÃ}>Ã]Ê>Ü}ÊÃÌ>V>LiÊ`ÕiÊiÝ«>Ã°Ê 7 iÊVÕ«i`ÊÜÌ ÊÌ iÊ* iÊÃViÌ]ÊÌ iÊ- Îx În+ÊÃÊiÊvÊÌ iÊÃÌÊiÝ«>`>LiÊ,®ÊÃ}iÊL>À`Ê V«ÕÌiÀÃÊVÕÀÀiÌÞÊÊÌ iÊ>ÀiÌ°Ê Industrial SBC35-CC405 Small Form Factor and SYS-405 Rugged Computers Features: UÊÊÕÌ ÀiÊÌi® Atom™ E3800 Processors UÊÊ1«ÊÌÊÌÜÊ`i«i`iÌÊ`ë>ÞÃÊ6]Ê6-Ê>`Êë>Þ*ÀÌ® UÊÊ/ÜÊÌ iÀiÌÊ ÌÀiÀÃÊÜÌ ÊÊ£xnnÊÌiÊÃÌ>«} UÊÊ/ÜÊ,-ÓÎÓÉ{ÓÓÉ{nxÊ-iÀ>Ê«ÀÌà UÊÊÕÃÊÝ«>ÃÊ/ÜÊ* iÊ>`Ê"Èä® UÊÊÕÀÊ1-Ê«ÀÌÃÊ£Ý1-ÊΰäÊ>`ÊÎÝ1-ÊÓ°ä® UÊÊÌ>LiÊ-/]Ê -/]Ê>`Ê-/ UÊÊ7`iÊÀ>}iÊ£äÊÌÊxä6Ê Ê«ÕÌ UÊÊ>iÃÃÊ{äcÊÌʳnxc Ê«iÀ>Ì>ÊÌi«iÀ>ÌÕÀi Benefits / iÊ- Îx {äxÊÃiÀiÃÊvÊÃ>ÊvÀÊv>VÌÀÊV«ÕÌiÀÃÊÕÌâiÊÌ iÊÌi®ÊÌÒÊÎnääÊv>ÞÊvÊ«ÀViÃÃÀÃÊ Ê>ÊÃÌ>`>À`ÊΰxV Ê- ÊvÀ>Ì°Ê}iiÀi`ÊvÀÊÀÕ}}i`Ê>««V>ÌÃ]ÊÌ iÊÜ«ÀwiÊÌ iÀ>ÊÃÕÌÊVÀi>ÌiÃÊ >ÊÃÌÕÀ`ÞÊL>ÃiÊÌ >ÌÊ«ÀÌiVÌÃÊÌ iÊ* Ê>ÃÃiLÞ]Ê«ÀÛ`iÃÊVÛiiÌÊÕÌ}]Ê>`Êi>LiÃÊv>iÃÃÊiÝÌi`i`Ê Ìi«iÀ>ÌÕÀiÊ«iÀ>Ì°Ê / iÊ "ÊÝ«ÀiÃÃÊL>Ãi`ÊÃÕÌÊVÕ`iÃÊÌÜÊ}>LÌÊÌ iÀiÌÊVÌÀiÀÃÊÜÌ ÊÊ£xnnÊÌiÃÌ>«}]ÊÌÜÊ ÃiÀ>ÊV >iÃ]Ê1-Êΰä]Ê>`ʳ£äÊÌʳxä6Ê Ê«ÕÌ° ÕÝ]Ê7`ÜÃ]Ê>`ÊÌ iÀÊÝnÈÊ«iÀ>Ì}ÊÃÞÃÌiÃÊV>ÊLiÊLÌi`ÊvÀÊÌ iÊ -/]Ê-/]ÊÀÊ1-ÊÌiÀv>ViÃ]Ê «ÀÛ`}ÊyiÝLiÊ`>Ì>ÊÃÌÀ>}iÊ«ÌðÊ7-ÞÃÌiÃÊ«ÀÛ`iÃÊ`ÀÛiÀÃÊvÀÊÕÝÊ>`Ê7`ÜÃÊÇÉn]Ê>ÃÊÜiÊ>ÃÊ«Ài Vw}ÕÀi`Ê«iÀ>Ì}ÊÃÞÃÌiÃ°Ê / ÃÊÃiÀiÃÊÃÊ>ÃÊ>Û>>LiÊ>ÃÊ>Ê`ÕÃÌÀ>ÊV«ÕÌiÀÊÊ>ÊÌÕ} ÊxäxÓÊ>ÕÕÊiVÃÕÀi°Ê/ iÊÀ}`ÊiVÃÕÀiÊ L>ÃiÊÃÊi}iiÀi`ÊvÀÊÀÕ}}i`Ê>««V>ÌÃÊ>`ÊVÕ`iÃÊ>VViÃÃÊÌÊÌ iÊ -/ÊViVÌÀ°Ê Call 817-274-7553 or visit www.winsystems.com. 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ÕÝ]Ê7`ÜÃ]Ê>`ÊÌ iÀÊÝnÈÊ«iÀ>Ì}ÊÃÞÃÌiÃÊV>ÊLiÊLÌi`ÊvÀÊÌ iÊ -/]Ê-/]ÊÀÊ1-ÊÌiÀv>ViÃ]Ê «ÀÛ`}ÊyiÝLiÊ`>Ì>ÊÃÌÀ>}iÊ«Ìð 715 Stadium Drive I Arlington, Texas 76 011 Phone: 817-274-7553 I Fax: 817-548-1358 [email protected] ESE FEATURE Embedded World 2015—No Longer a One-Theme Show The acronym anyone following the embedded industry expected to see in Nuremberg’s Messe halls while exploring Embedded World 2015, was IoT (Internet of Things). By Caroline Hayes, Senior Editor I n fact, the IoT was one of the themes of the conference program that accompanied the industry show (‘We are the Internet of Things’). Certainly, the booths in the halls did not disappoint, with IoT mentioned somewhere on most stands, but there was another, emerging movement that began to take root at this year’s show, as the call for heterogeneous computing gathered momentum. If you would have had a bratwurst sausage only at stands that had no mention of the IoT, you would have been hungry all week. As Scott Aylor, Corporate Vice President and General Manager, AMD, put it in his keynote presentation at the ‘We are the Internet of Things’ conference: “Who would have thought three little letters would generate so much interest?”. ARM of course had a large presence at this year’s Embedded World. With over 50 billion processors sold worldwide, ARM drew lots of mentions in other companies’ literature, and its mbed IoT Device Platform won the ‘embedded AWARD 2015’ in the software category (Figure 1). At the show, the company also launched the mbed IoT Starter Kit – Ethernet Edition. Designed to accelerate the prototyping of connected devices, the Starter Kit is to ready these devices for ‘smart’ products that use cloud services. Enabling Internet-connected devices to communicate directly with IBM’s Bluemix cloud platform, the kit contains ARM mbed OS, ARM Cortex-M4-based development board from Freescale and a sensor I/O application shield. Kits to be released later will run the ARM mbed OS and use ARM mbed Device Server software. AUTOMOTIVE AND SECURITY Naturally, for a show based in Germany, automotive design figured, and Freescale used the opportunity to showcase its i.MX 6SoloX applications processor, which is a heterogeneous multicore device for the connected vehicle, home and the ubiquitous IoT (Figure 2). The heterogeneous multicore i.MX 6SoloX applications processor from Freescale addresses secure connectivity in vehicles, as well as in the home. 8 Figure 1: ARM took home the Software ‘embedded AWARD 2015’ in the software category for its ARM mbed IoT Device Platform. The SoC integrates ARM Cortex-M4 and Cortex-A9 cores with cryptographic cipher engines and a configurable resource domain controller that allows peripherals to be locked or shared by the CPU cores. A secure messaging semaphore unit enables cooperative, multi-OS software to access shared peripherals in safety. Another feature is the secure boot and protected data storage. These hardware capabilities enable users to architect custom security solutions. The company’s security theme anticipates the challenges of having 25 billion connected things by 2020 (Gartner figures.) &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 DESIGN YOUR SOLUTION TODAY CALL 480-837-5200 TS-4900 TS-7250-V2 Computer on Module Single Board Computer Industrial High Performance i.MX6 Module with Wireless Connectivity and Flash Storage Extensible PC/104 Embedded System with Customizable Features and Industrial Temps Starting at $89 Qty 100 $122 Qty 1 1 GHz Solo or Quad Core Freescale i.MX6 ARM CPU 512 MB, 1 GB, or 2 GB DDR3 RAM and 4 GB eMMC Flash Storage Wireless 802.11 b/g/n and Bluetooth 4.0 Soldered Module 4k LUT FPGA, 1x Gigabit Ethernet, 1x PCI Express Bus 1x microSD Socket, 1x SATA II, 1x USB Host, 1x USB OTG 70x DIO, 4x I2C, 1x I2S, 2x SPI, 2x CAN -40 ºC to 85 ºC Industrial Temperature Range Runs Linux, Android, QNX, QT, OpenGL Windows Support Coming Soon! Starting at (Shown with optional microSD card) 800 MHz or 1 GHz Marvell PXA166 ARM CPU 512 MB DDR3 RAM and 2 GB SLC eMMC Flash Storage PC/104 Connector with FPGA Driven Pins (8k or 17k LUT FPGA) 2x 10/100 Ethernet, 1x microSD Socket, 2x USB Host 75x DIO, 5x ACD, 3x RS232, 3x TTL UART, 1x RS485, 1x CAN -40 ºC to 85 ºC Industrial Temperature Range $165 Qty 100 $199 Qty 1 Preinstalled Debian Linux OS and Utilities Available w/ TS-8550 PC/104 Development Kit Available with TS-ENC720 enclosure TS-TPC-8390 TS-7680 Touch Panel PC Single Board Computer Modular 7” Touchscreen Computer Powered by Linux and Android Rugged Industrial Connectors with AC Power, Relays, and Wireless 802.11 and Bluetooth Starting at Up to 1 GHz Quad Core Freescale i.MX6 ARM CPU Up to 2 GB DDR3 RAM and 4 GB eMMC Flash Storage www.embeddedARM.com L NA GI Sup Support every step of the th way with ope open source vision O RI Emb Embedded syst systems that are buil built to endure Extensible 40 Pin Header for Daughter Card 1x microSD Socket, 1x USB Host, 2x Ethernet, 6x ADC, 4x DAC Preinstalled Debian Linux OS and Utilities N $389 Qty 100 $422 Qty 1 24 VAC or 8 - 28 VDC Power Supply Input 24 Position Screw Terminal Connector 3x Digital 30 V Outputs, 4x Digital Inputs (30 V Tolerant) -40 ºC to 85 ºC Industrial Temperature Range PE We’v never We’ve discontinued a disc product in 30 years prod RU GG ED LO NG LI FE Preinstalled Debian Linux OS and Utilities Headphone Connector and Speakers Resistive and Capacitive Touchscreens Series Starting at O 2x microSD Sockets for Redundant Storage 2x 10/100 Ethernet, 2x USB Host Ports DIO, RS-232, RS-485, TTL UARTS, I2C, CAN, ModBus Optional WiFi, Bluetooth, GPS, Cellular, XBee Modules $159 Qty 100 $203 Qty 1 454 MHz Freescale i.MX286 ARM CPU 128 or 256 MB DDR3 RAM and 2 GB Flash Storage Low cost plastic enclosure available Uniq Unique embedded solu solutions add value for o our customers ESE FEATURE Freescale announced several initiatives in Nuremberg, including teaming with the Embedded Microprocessor Benchmarking Consortium (EEMBC) to identify critical embedded security gaps, and, with other consortium members, to establish guidelines to secure IoT transactions and endpoints. It also announced the Freescale Security Labs to enhance IoT security technologies from the cloud to the end-node and an education program for start-ups on IoT security best practices and to provide access to its partner ecosystem. [Editor’s Note: At the time of going to press, NXP has announced its intention to buy Freescale Semiconductor, with the acquisition expected to be finalized in the second half of 2015.] VIDEO DRIVERS The human machine interface (HMI) figured heavily at the show, with companies vying for attention. At AMD, a plethora of displays showed the virtues of a heterogeneous architecture with a graphics processor unit coupled with the main processor. The one that caught my eye was a 3D synthetic vision cockpit display demonstration. The CoreAVI H.264/ MPEG2 video decode driver suite (Figure 3) with integrated OpenGL SC graphics driver uses the AMD Embedded Radeon E8860 graphics processor and Universal Video Decode engine on Wind River’s VxWorks 7 RTOS and Curtiss-Wright’s VPX3-133 single board computer, based on the Freescale T2080 and VPS3-716 graphics module. The CoreAVI thread safe video decode driver architecture allows unmanned aerial vehicles (UAVs), ground control stations, 360° geographical information systems, moving maps and other real-time, safety-critical video applications to decode multiple, independent, simultaneous compressed HD video streams, which are then rendered through the video decoder API application programming interface (API). Another video example was to be found at the FTDI booth, where the company introduced four Embedded Video Engine (EVE) ICs, making up the FT81xQ series. They support higher screen resolutions at 800 x 600 pixels, up from 512 x 512 in the earlier FT800Q and FT801Q series. The intention is to enable seven-inch (and above) screen sizes for point of sale and information kiosks, with smooth video playback, due to the enhanced algorithms. The quartet is made up of the FT810Q, with 18-bit RGB interfacing and resistive touch functionality, the FT811Q, with 18-bit RGB interfacing and capacitive touchscreen functionality (with five-point touch detection), the FT812Q (resistive) and FT813Q (capacitive touchscreens) with 24-bit RGB. Figure 2: The heterogeneous multicore i.MX 6SoloX applications processor from Freescale addresses secure connectivity in vehicles, as well as in the home. 10 Figure 3: AMD showcased its CoreAVI DO-178C certifiable H.264/MPEG2 video decode driver. WORKING IN PARTNERSHIPS Many companies announced collaboration, with Green Hills Software having a foot in both ARM and MIPS core camps, with an announcement with Imagination Technologies and ARM. The first announcement was that Green Hills’ tools and compilers now support more of Imagination’s MIPS CPU IP. This includes support for the microMIPS code compression instruction set architecture, available now and with support for MIPS 64-bit Warrior M-class and I-class CPUs, with hardware virtualization, available in the second half of this year. In the ARM camp, Green Hills also jointly announced with ARM, collaboration on a compiler optimized for the ARM Cortex-R5 processor for automotive design. The latest version of the compiler scored 1.01EEMBC Automarks/ MHz using the Cortex-R5 Traveo automotive MCUs from Spansion—a 30% increase on previous performance scores. The beauty of Embedded World is that all voices are heard. Another core provider, Cortus, based in the south of France, announced three new partners porting to its architecture, highlighted its two latest cores (the 32-bit APS23 and APS25, based on a Cortus v2 instruction set, and the collaboration with Blunk Microsystems to offer Target Tools IDE for Cortus software development. The Eclipse-alternative embedded software CrossStep IDE and TargetOS RTOS are available now for the APS processor &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 ESE FEATURE Nabto’s device software offers Cortus licensees “Skype-like” secure point-to-point connectivity from devices to smartphones, PCs and big data systems. The device software has a small firmware footprint for minimalist processor cores. Finally, if longevity of supply is an issue, congatec announced that it is extending availability of Qseven, COM Express, XTX and ETX COM (computer on modules) based on AMD’s Embedded G-Series SoCs. Now, customers have a secure supply, promises the company, for 10 years, three years more than previously available—or an extension in Q1 2024, bringing with it the security of long-term availability and reduced nonrecurring engineering costs. Figure 3: The congatec IoT kit was announced at Embedded World 2015. cores. It is, says the company, fast, small, and pre-emptive RTOS ported to the APS architecture. In addition to Blunk, the company also announced a dual IP v4/v6 stack from Oryx Embedded and secure point-topoint connection software from Nabto. True to the theme of IoT, it also announced a Qseven IoT kit to simplify IoT application development (Figure 3). It contains a Qseven COM based on the Intel Atom processor, a compact IoT carrier board and a seven-inch LVDS single touch display with LED backlight and accessories, including AC power supply and 802.11 WLAN antenna. The congatec IoT kit was announced at Embedded World 2015 Caroline Hayes has been a journalist, covering the electronics sector for over 20 years. She has worked on many titles, most recently the pan-European CycloneTCP, from Oryx Embedded, is a dual IPv4/IPv6 magazine, EPN. Now a freelance journalist, she contributes news, features, stack and offers seamless interoperability with existing interviews and profiles for electronics journals in Europe and the US. TCP/IP systems, ready for the next generation of Internet connected designs, using the IPv6 protocol. Optimizing SWaP is our passion MEET A BRAND NEW CES AT CES-SWAP.COM THE SWISS RUGGED COMPUTERS COMPANY HAS A NEW LOOK! We design and manufacture rugged embedded computers engineered to meet the most demanding performance requirements with optimal Size, Weight and Power (SWaP) considerations. CES-SWAP.COM www.eecatalog.com/pc104 r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 11 MaxSys 5300 Industrial Computing Plaforms Core i7 Fanless Embedded Computer with Wireless Support The MaxSys series of fanless industrial computers is based on the Intel Core™ i7 processor, boosting performance with minimal power consumption increase, and outstanding computing power for a variety of application needs. The MaxSys series designs provide easy access to system components for replacement and maintenance, enabling effortless access to storage, memory, and wireless modules. The feature-rich computer platform offers rugged fanless operation, high vibration resistance, and wide range DC input. ELSys-1200 Embedded Vision System S50F Series General Computing Platform 4-CH GigE Vision System with Intel® CoreTM i5/i7 Intel Haswell on PCIe/104 Combines the reliability of PCIe/104 with a flexible approach to rugged packaging. Expandable both in terms of I/O options and overall system size for optimal performance while meeting SWaP requirements. Rugged and compact system offering enhanced computing power, IEEE 1588, PoE connectivity and rich I/O capacities in a minimal footprint. The ELSys-1200’s simplified cabling installation, maintenance burdens and total cost of ownership are notably lowered. TopSys-1300 Medical Computer Intel® Atom™ Based with Rich I/O The first of Elma’s medical computers. A fanless and cable-free structure ensures extended durability for long-term usage, providing a noiseless solution satisfying stringent medical requirements. Type S51E Series PCIe/104 Platform Rugged Removable Storage Combines the reliability and power thrifty performance of an Intel Atom CPU with high capacity removable storage. Over 2TB of capacity, enables easy mission data transport for vehicular and avionics applications. S50F Series Rugged Watertight Computer Intel Atom Board This computer provides watertight protection to IP68. The box is scalable, shock and vibration proof. COMe box (S50G) Rugged Cisco® Router A rich set of I/O, the latest Intel CPU and a Cisco routing engine with mobile routing protocols for networkattached equipment on the move. Dual band WiFi connection and CANbus rounds out the major features. Packaged in a small, sealed and light weight chassis. SigPro1: Signal Acquisition, FPGA-based Record/ Playback System Elma’s SigPro1 is a high performance platform ideal for unmanned systems needs such as data acquisition, radar, signal processing, and beam-forming applications. Elma’s mission computing systems are configurable, rugged platforms which provide reliable embedded computing for a variety of unmanned systems application requirements. Elma’s expert team will help you from initial system development to the final deployed platform housed in a variety of small rugged chassis designed to meet mission size, weight and power constraints. ESE FEATURE Security Should Not Be Hard to Implement How considering side channel attacks as cousins to signal-to-noise issues could lead to stronger security for every IoT level. By Chowdary Yanamadala, ChaoLogix These emerging threats render defensive techniques adopted by the IC manufacturers less potent over time, igniting a race between defensive and offensive According to Gartner, Internet of Things connected devices (threat) techniques. For example, chips that deploy (excluding PCs, tablets and smart phones) will grow to 26 billion defensive techniques deemed sufficient in 2012 may devices worldwide by 2020—a 30-fold increase from 2009. Sales be less effective in 2014 due to emerging threats. Once these devices are deployed, they become vulof these devices will add $1.9 trillion in economic value globally. nerable to new threats. Indeed, one of the major benefits of the Internet of Things movement is the connectivity and accessibility of data; however, this Another challenge IC manufacturers face is the complexity of defensive techniques. Often times, also raises concerns about securely managing that data. defensive techniques that are algorithm or protocol specific are layered to address multiple targeted MANAGING DATA SECURITY IN HARDWARE Data security involves essential steps of authentication and threats. encryption. We need to authenticate data generation and data colThis “Band-Aid” approach is tedious and becomes lection sources, and we need to preserve the privacy of the data. unwieldy to manage. The industry must remember The Internet of Things comprises a variety of components: that leaving hardware vulnerable to SCA threats hardware, embedded software and services associated with the can significantly weaken data security. This vulnerability may manifest itself in the form of revenue “things.” Data security is needed at each level. loss (counterfeits of consumables), loss of privacy Hardware security is generally implemented in the chips that make (compromised identification information), breach of up the “things.” The mathematical security of authentication and authentication (rogue devices in the closed network) encryption algorithms is less of a concern because this is not new. and more. The industry has addressed these concerns for several years. HOW TO INCREASE THE PERMANENCE OF Nonetheless, hackers can exploit implementation flaws in these SECURITY chips. Side channel attacks (SCAs) are a major threat to data secu- A simplified way to look at the SCA problem is as a rity within integrated circuits (ICs) that are used to hold sensitive signal-to-noise issue. In this case, signal means sendata, such as identifying information and secret keys needed for sitive data leaked through power signature. Noise authentication or encryption algorithms. Specific SCAs include is the ambient or manufactured noise added to the differential power analysis (DPA) and differential electro mag- system to obfuscate the signal from being extracted from power signature. netic analysis (DEMA). Data is ubiquitous today. It is generated, exchanged and consumed at unprecedented rates. There are many published and unpublished attacks on the security of chips deployed in the market, and SCA threats are rapidly evolving, increasing in potency and the ease of mounting the attacks. 14 Many defensive measures today concentrate on increasing noise in the system to obfuscate the signal. The challenge with this approach is that emerging statis- tical techniques are becoming adept at separating the signal from the noise, thereby &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 ESE FEATURE decreasing the potency of the deployed defensive techniques. One way to effectively deal with this problem is to ”weave security into the fabric of design.” SCA threats can be addressed at the source rather than addressing the symptoms. What if we can make the power signature agnostic of the data processed? What if we can build security into the building blocks of design? That would make the security more permanent and simplify its implementation. A simplified approach of weaving security into the fabric of design involves leveraging a secure standard cell library that is hardened against SCA. Such a library would use analog design techniques to tackle the problem of SCA at the source, diminishing the SCA signal to make it difficult to extract from the power signature. Leveraging standard cells should be simple since they are the basic building blocks of digital design. As an industry, we cannot afford to bypass these critical steps to defend our data. Chowdary Yanamadala is senior vice president of business development, ChaoLogix. www.eecatalog.com/pc104 r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 15 SPECIAL FEATURE Right Sizing Your Embedded Application with the OneBank Specification An evolution that’s in step with the ascent of speedier and more sophisticated bus architectures is one reason PC/104 effectively serves embedded applications across a wide range—encompassing machine vision, security, high-speed data collection, and more. By Matthew Henry, ADL Embedded Solutions Most embedded products will provide adequate processing power when appropriately sized for the job at hand. It is I/O bandwidth and product expandability that become critical data points when defining your platform and application. Data storage I/O can bottleneck your system and keep it from performing at an optimal level. Is it very hot or cold in your area of operation? Is your application mobile or do you have limited power available? It is these factors that help differentiate one form factor from another. INTEL ® ARCHITECTURE RAISES THE BAR Perhaps you need a lot of horsepower for data processing, or you need a Windows-based platform. The PC/104 footprint allows enough PCB for the implementation of some of the highest performers available from the Intel® Core™ processor product lines. Currently, PCIe/104 is able to support the Intel 4th Generation Intel® QM87 chipset with the Intel® Core™ i7-4700EQ processor, giving it a robust set of features with near-server class performance employing six SATA /mSATA ports up to SATA 6 Gbs, USB 3.0 and advanced video like DisplayPort 1.2, HDMI 1.4 and eDP. Figure 1: ADLE3800PC (Type 2) with OneBank™ Intermediate Peripheral Card. connector contains four x1 lanes or can be utilized as a single x4 lane. Care has been taken to ensure that the OneBank connector is compatible with the three-bank Common legacy interfaces are still included for those looking to ret- PCIe/104 bus architecture and can be mated directly to rofit an existing platform, like VGA video, RS-232 COM ports, dual a full-sized three-bank connector. See Figure 1. Gigabit Ethernet and the ability to connect to a host of peripheral I/O boards to get to the interface needed via the PCIe/104 bus. 3rd and THE GREATEST THREAT? 4th generation Intel Core architecture raises the level of performance There are several environmental factors that can put in the PC/104 market space. This architecture has opened the door to your hard work into an early grave when defining an emerging markets including machine vision, high-speed data collec- embedded computer system. The top three system killers, in no particular order, are temperature, shock tion, security/surveillance and mil-aero, to name a few. and vibration, and power. The PC/104 Embedded Consortium has released the OneBank™ specification, opening another door for peripheral designers. General Thermal management may be the largest threat to the consensus for peripheral designers has been that the x16 lane of lifetime of an embedded design. Although your system the PCIe/104 connector is mostly wasted real estate, since most may be operating in a benign environment, thermal peripherals typically require a x1 PCIe lane only. The four x1 lanes in pathway issues can shorten product life significantly. the PCIe/104 connector are carried in the first of three banks. The Thermal issues can occur in a transmissive (radiative or other two banks can vary, depending on whether you have a Type 1 convective) thermal solution if the thermal interfaces or Type 2 PCIe/104 implementation, with the first bank remaining are not properly aligned for optimal heat transference. constant for both PCIe bus implementation types. The OneBank Misalignment when assembling or an extreme shock or 16 &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 PC/104 - ISA Boards Interfaces between PC/104, PC/104-Plus ISA, PCI, PMC and CompactPCI BX-DE-63/104-3TOP 6A-DE-63/104 8 XXX.douglas.com FC-PCB-DE-63/104 8 BX-DE-63/104-RA 8 8 PC/104-Plus - ISA - PCI Boards BX-DE-104+-163-265 8 BX-DE-104+-263-265 8 PCI - PC/104-Plus Boards 6-DE-65/104 8 6V-DE-65/104-38 6-DE-63/104 8 %PVHMBT&MFDUSPOJDTTQFDJBM J[FTJOCPBSETUPJOUFSGBDFCFUXFFO 1$1$Plus*4"1$*BOE $PNQBDU1$*Î0VSCPBSETBSF VTVBMMZEFTJHOFETQFDJmDBMMZGPSB DVTUPNFSXJUIUIFVOEFSTUBOEJOHUIBU XFDBOUIFONBLFUIFNBWBJMBCMF GPSPUIFSTBTQBSUPGPVSTUBOEBSE MJOF ASFBMXJOXJOTJUVBUJPO*G ZPVEPO’UTFFXIBUZPVBSFMPPLJOH GPSBTBTPMVUJPOGPSZPVSJOUFSGBDF OFFEHJWFVTBDBMM 8FNBZIBWF BMSFBEZEFTJHOFEJUGPSTPNFPOFFMTF PSQFSIBQTXFDBONBLFJUEJSFDUMZ UPNFFUZPVSOFFET4IPXOIFSFJT BQBSUPGPVSTUBOEBSEMJOF.BOZ NPSFBSFBWBJMBCMFPOUIF 8FCBU IUUQXXX.douglas.com>. 4FFPVSOFXXFCTJUFGPS1$ DPOOFDUPSTBTXFMMBT1.$BOE $PNQBDU1$*1$PlusCPBSET Extenders 6-DE-65RR-0.75 8 6-DE-65/104RH8) 6V-DE-65/104-18 6B-DE-104+ 8 6B-DE-104/16 8 BX-DE-104+-465 8 6-DE-104/16 8 6-DE-65/104RS8 %PVHMBT&MFDUSPOJDT*OD Our Next Board *UDPVMECFNBEFGPSZPV 8SFGFSTUPJUFNPOXFCQBHF 2777 "MWBSBEP4USFFUt4BO-FBOESP$At F"9 tIUUQXXXEPVHMBTDPN SPECIAL FEATURE vibration event could cause misalignment…especially if the thermal solution has not been adequately secured during system integration. Convection cooling systems are susceptible to thermal anomalies if the supplied airflow is impeded by dust buildup on fan blades, heatsinks, components and filters. ESD-type system failures. Transient voltage damage can occur slowly over time, causing latent failures that are hard to identify. Shock and vibration failures are much less subtle. Vehicles provide excellent examples of both shock and vibration. Provided that the necessary enclosure space is available, what are the chances of an ITX, mini-ITX, COM or even an Epic board surviving a vehicle crash, Extreme heat will not only affect the life of an embedded extreme airplane turbulence, or the concussion blast of artillery on system, but also the performance. Most Intel architec- the battlefield? One thing is for certain, PC/104 has a high rate of ture based embedded board designs include signaling survivability in extreme conditions. Larger PCBs are more susceptible for thermal management purposes. Onboard sensors to flex conditions that fall outside of acceptable norms. This can result monitor the processor die temperature as well as the in a higher rate of failure in a high shock and vibration environment. board temperature at various locations and provide Smaller form factors like PC/104 have a higher survivability rate. the necessary data for thermal management via the While COM is a small form factor, it employs a modular approach cooling fan (usually via BIOS and/or O/S based tool) by that adds to the risk of a shock failure because of the added connector controlling fan rotation speed. This same technology is interface. Vibration can create resonant frequencies within a PCB and used to prevent an over-temperature condition within can cause solder failures. Small form factor boards survive a wider the processor by dynamically throttling back the CPU range of vibration as they are less affected by lower vibration frequenclock multiplier to try to keep it from reaching over cies than larger form factors. temperature shutdown. If thermal pathway issues exist, your system could be perpetually running in a CUSTOMIZATION “throttled” condition, giving you less than 100 percent PC/104 form factor boards offer the highest level of customization of performance. any standards-based COTS embedded form factors. There is no carrier board to design, and generally, no onboard consumer grade connectors HEADACHE REMOVAL that limit the product implementation. I/O’s can be custom cabled to Input power can also cause an array of unforeseen meet specific needs, allowing the board to be deeply embedded within and sometimes unidentifiable problems for a system a system. The PC/104 specification has evolved with the rise of faster designer. While many COTS embedded products run and more advanced bus architectures. Slower ISA and PCI use bus on a single +5VDC rail, the quality of power supplied interfaces (PC/104 and PC/104-Plus) similar to VME style connectors, can vary greatly depending on the application. PC/104 providing a deep and secure connection to added peripheral boards, boards are often integrated into larger assemblies such and still maintains a presence in the field on platforms that have as environments where only mobile power is available. survived for decades. The current generation of PCIe/104-Express Power sources in planes, trains and automobiles vary includes support for the fastest bus architectures and is well suited greatly. Remote or “wearable” applications could use a to support Intel technology advances for the foreseeable future. It renewable energy source, run on batteries, or a gas pow- remains the form factor of choice for rugged, extreme temperature ered generator. Most ships use power from an onboard embedded applications. power generator to supply the onboard equipment. Most embedded boards simply do not have the neces- Matthew Henry is the verification engineer at ADL Embedded Solutions, sary PCB real estate to include the power conditioning based in San Diego, California. He is U.S. Navy educated in Electrical Engicircuits that are found on desktop boards. Therefore, neering and has worked in the embedded computing market segment for the choosing a quality power supply with a high switching past 24 years as an FAE/OEM customer engineer and product manager. frequency can go a long way to removing embedded CPU design headaches. Source power can pose unique problems that can shorten the life of a board. The severe power instability that can occur during a brown-out make this situation especially dangerous. This condition can send power spikes into connected equipment, often causing catastrophic component failure. Electrostatic discharge (ESD) concerns are also ever-present. ESD is always a concern when handling electronic devices, but ESD damage can also occur to a board during installation and a system where transient voltages may exist. Inadequate input filtering, hot-plugging of user interface devices, or poor grounding techniques can all lead to 18 &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 A Deep Understanding of M2M and IoT. When given an opportunity to take your place ±ĵŅĹčƋĘåŞåŅŞĬå±ĹÚƋåÏĘĹŅĬŅčƼƋʱƋ±ųåųåÚåĀĹĜĹč “smart,” there’s no time for testing the water. %ĜƴåĜĹĘå±ÚĀųŸƋ±ƋFeƚŞåųaŅÆĜĬĜƋƼƖLjŎĂţ From the hardware, software and services that form the infrastructure of the IoT, down to the end-user applications that are changing the way we live, work and play, this is where you’ll immerse yourself in the industry’s newest and biggest breakthroughs. BåųåرƋƋĘåeĵåųĜϱŸűĬ±ųčåŸƋØĵŅŸƋĜĹāƚåĹƋĜ±ĬüŅųƚĵŅĹĵŅÆĜĬå ĜĹĹŅƴ±ƋĜŅĹØƼŅƚűĬĬĹŅƋŅĹĬƼƋ±ĩå±Úƴ±ĹƋ±čåŅüƋ±ųčåƋåÚÆåĹåĀƋŸ like the Mobile Innovation Conference, Connected Life Stage and M2M Zone; you’ll also meet face-to-face with like-minded professionals who can help you take the next giant leap forward. In the process, you’ll reach an important conclusion: when it ÏŅĵåŸƋŅĀĹÚĜĹčĹåƵƵ±ƼŸƋŅĜĹĹŅƴ±Ƌåó±ĹÚŞųŅĀƋóÆåĜĹčĜĹ over your head is a beautiful thing. In partnership with REGISTER TODAY @ www.CTIASuperMobility2015.com Rugged Boards & Solutions We know PCIe/104. And we do it best. At RTD, designing and manufacturing rugged, top-quality boards and system solutions is our passion. As a founder of the PC/104 Consortium back in 1992, we moved desktop computing to the embedded world. Over the years, we've provided the leadership and support that brought the latest signaling and I/O technologies to the PC/104 form factor. Most recently, we've championed the latest specifications based on stackable PCI Express: PCIe/104 and PCI/104-Express. With our focused vision, we have developed an entire suite of compatible boards and systems that serve defense, aerospace, maritime, ground, industrial and research applications. But don't just think about boards and systems. Think TPMVUJPOT. That is what we provide: high-quality, cutting-edge, concept-todeployment, rugged, embedded solutions. Whether you need a single board, a stack of modules, or a fully enclosed system, RTD has a solution for you. Keep in mind that as an RTD customer, you're not just working with a selection of proven, quality electronics; you're benefitting from an entire team of dedicated engineers and manufacturing personnel driven by excellence and bolstered by a 28-year track record of success in the embedded industry. If you need proven COTS-Plus solutions, give us a call. Or leverage RTD's innovative product line to design your own embedded system that is reliable, flexible, expandable, and serviceable in the field for the long run. Contact us and let us show you what we do best. Copyright © 2015 RTD Embedded Technologies, Inc. All rights reserved. All trademarks or registered trademarks are the property of their respective companies. RTD is AS9100 and ISO9001 Certified, and a GSA Contract Holder. XXXSUEDPNrTBMFT!SUEDPN AS9 CE 01 90 0 - ISO 10 R TIFIE D 35%&NCFEEFE5FDIOPMPHJFT*OD SPECIAL FEATURE What’s the Nucleus of Mentor’s Push into Industrial Automation? Mentor’s once nearly-orphaned Nucleus RT forms the foundation of a darned impressive software suite for controlling meat packing or nuclear power plants. By Chris A. Ciufo, Editor-in-Chief, Embedded Systems Engineering E veryone appreciates an underdog—the pale, wimpy kid with glasses and brown polyester sweater who gets routinely beaten up by the popular boys—but sticks it out day after day and eventually grows up to create a tech start-up everyone loves. (Part of this story is my personal history; I’ll let you guess which part.) So it is with Mentor’s Nucleus RTOS, which the company announced forms the basis for the recent initiative into Industrial Automation (I.A.). Announced at the ARC Industry Forum in Orlando is Mentor’s “Embedded Solution for Industrial Automation” (Figure 1). A cynic might look at this figure as a collection of existing Mentor products…slightly rearranged to make a compelling argument for a “solution” in the I.A. space. That skinny kid Nucleus is right there, listed on the diagram. Oh, how many times have I asked Mentor why they keep Nucleus around only to get beaten up by the big RTOS kids! After all, you’ll recognize Mentor’s Embedded Linux, the Nucleus RTOS I just mentioned, and the company’s Sourcery debug/analyzer/IDE product suite. All of these have been around for a while, although Nucleus is the grown-up kid in this bunch. (Pop quiz: True or False…Did all three of these products came from Mentor acquisitions? Bonus question: From what company(ies)?) Into this mix, Mentor is adding new security tools from our friends at Icon Labs, plus hooks to a hot new automation GUI/HMI called Qt. (Full disclosure: Icon Labs founder Alan Grau is one of our security bloggers; however, we were taken by surprise at this recent Mentor announcement!) INDUSTRY 4.0: I.A. MEETS IOT According to Mentor’s Director of Product Management for Runtime Solutions, Warren Kurisu (whose last name is pronounced just like my first name in Japanese: Ku-risu), I.A. is gaining traction, big time. There’s a term for it: “Industry 4.0”. The large industrial automation vendors— like GE, Siemens, Schneider Electric, and others—have long been collecting factory data and feeding it into the enterprise, seeking to reduce costs, increase efficiency, and tie systems into the supply chain. Today, we call this concept the Internet of Things (IoT) and Industry 4.0 is basically the promise of interoperability between currently bespoke (and proprietary) I.A. systems with smart, connected IoT devices plus a layer of cyber security thrown in. Figure 1: Mentor’s Industrial Automation Solution for embedded, IoT-enabled systems relies on the Nucleus RTOS, including a secure hypervisor and enhanced security infrastructure. 22 Mentor’s Kurisu points out that what’s changed is not only the kinds of devices that will connect into I.A. systems, but how they’ll connect in more ways than via serial SCADA &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 SPECIAL FEATURE or FieldBus links. Industrial automation will soon include all the IoT pipes we’re reading about: Wi-Fi, Bluetooth LE, various mesh topologies, Ethernet, cellular—basically whatever works and is secure. THE SKINNY KID PREVAILS Herein lies the secret of Mentor’s Industrial Automation Solution. It just so happens the company has most of what you’d need to connect legacy I.A. systems to the IoT, plus add new kinds of smart embedded sensors into the mix. What’s driving the whole market is cost. According to a recent ARC survey, reduced downtime, improved process performance, reduced machine lifecycle costs—all of these, and more, are leading I.A. customers and vendors to upgrade their factories and systems. Additionally, says Mentor’s Kurisu, having the ability to consolidate multiple pieces of equipment, reduce power, improve safety, and add more local, operator-friendly Figure 2: Industrial automation a la Mentor. The embedded pieces rely on Nucleus RTOS, or graphics are criteria for investing in new equipment, sen- variations thereof. New Qt software for automation GUI’s plus security gateways from Icon Labs bring security and IoT into legacy I.A. installations. sors, and systems. PLAYGROUND VICTORY: THE TAKE-AWAY Mentor brings something to the party in each of these So if the next step in Industrial Automation is Industry 4.0—the rapid areas: build-out of industrial systems reducing cost, adding IoT capabilities with secure interoperability—then Mentor has a pretty compelling offering. - machine or system convergence, either by improved That consolidation and emphasis on low power I mentioned above can be system performance or reduced footprint had for free via capabilities already build into Nucleus. - capabilities and differentiation, allowing I.A. vendors to create systems different from “the other guys” - faster time-to-money, done through increased productivity, system design and debug, or anything to reduce the I.A. vendor’s and their customer’s efforts. For example, embedded systems based on Nucleus can intelligently turn off I/O and displays and even rapidly drive multicore processors into their deepest sleep modes. One example explained to me by Mentor’s Kurisu showed an ARM-based big.LITTLE system that ramped performance when needed but kept the power to a minimum. This is possible, in part, by Mentor’s power-aware drivers for an entire embedded I.A. system under the control of Nucleus. Figure 2 sums up the Mentor value proposition, but notice how most of the non-enterprise blocks in the diagram are built upon the Nucleus RTOS. And in the happy ending we all hope for, it looks like the maybe-forgotten Nucleus RTOS—so often ignored by editors like me writing glowingly about Wind River’s VxWorks or Green Hill’s INTEGRITY—well, maybe Nucleus, for example, has achieved safety certification by Nucleus has grown up. It’s the RTOS ready to run the factory of the TÜV SÜD complete with artifacts (called Nucleus Safety- future. Perhaps your electricity is right now generated under the control Cert). Mentor’s Embedded Hypervisor—a foundational of the nerdy little RTOS that made it big. component of some versions of Nucleus—can be used to create a secure partitioned environment for either multicore or multiple processors (heterogeneous or homo- Chris A. Ciufo is editor-in-chief for embedded content at Extension Media, geneous), in which to run multiple operating systems which includes the EECatalog print and digital publications and website, which won’t cross-pollute in the event of a virus or other Embedded Intel® Solutions, and other related blogs and embedded channels. He event. has 29 years of embedded technology experience, and has degrees in electrical engineering, and in materials science, emphasizing solid state physics. He can New to the Mentor offering is an industry-standard Qt be reached at [email protected]. GUI running on Linux, or Qt optimized for embedded instantiations running on—wait for it—Nucleus RTOS. Memory and other performance optimizations reduce the footprint, boot faster, and there are versions now for popular IoT processors such as ARM’s Cortex-Mx cores. www.eecatalog.com/pc104 r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 23 SPECIAL FEATURE Industrial IoT Looks to SMARC Architecture to Meet Low Power, Performance and Cost Goals As industrial, digital signage/POS, medical, automotive, smart energy and other IoT strategies unfold, SMARC is emerging as key to a new generation of embedded computing applications. By Dirk Finstel, ADLINK Technology and employ a common I/O interface. Through the use of common connector pinouts, it is possible for customers to select from a wide range of hardware- and software-compatible peripherals with which they can customize their end products. The ARM environment is more complex and differentiated. In contrast to the PC environment, in which the core module comprises a processor and Northbridge and Southbridge device, the ARM market focuses on SoC products, each usually optimized for a particular application. Historically, there has been far less focus on building standard I/O REDEFINING THE LOW-POWER LANDSCAPE Embedded computing today encompasses markets where users definitions; each SoC would be used on a custom board expect energy-efficient systems with a generous helping of intuitive design. There is also a wider range of I/O options that user interfaces based on touch screens and voice recognition. These ARM platforms provide, depending on their target interfaces promise revolutionized medical treatment, more market, with less emphasis on standard buses such as sophisticated industrial equipment control and Internet access in PCI Express. far-flung areas once thought off limits. The result has been the introduction of a number of As x86 architecture has evolved, Intel has addressed low-power proprietary form factors and connector definitions that requirements with smaller, more efficient Intel® Atom™ and Intel® lock the customer into a vendor’s offerings and which Quark™ processors. The latest Intel Atom processor E3800 SoC is may not have support for more than a generation of optimized for systems that require efficient imaging workflows, silicon as they move to different SoCs. Some vendors delivery of secure content and interactive, real-time processes. claim the use of a standard form factor—sometimes The Intel Quark SoC X1000 targets applications in automotive and piggybacking ARM support on an existing x86-focused wearables, where lower power, lower cost and smaller size take specification—but with additional custom connectors to support I/O lines that cannot be supported by the priority over higher performance. primary connectors. Optimized for the mobile phone and tablet markets, the ARM architecture extends the power envelope into low-energy applica- SMARC: A UNIFYING ARCHITECTURE tions that have previously found it difficult to adopt standard form Supported by a number of embedded computing factors, and so had to absorb high up-front custom board and module module vendors and held by the vendor-independent design costs. At the same time, ARM offers scalability into upcoming Standardization Group for Embedded Technologies high-performance computing and 64-bit platforms that make it (SGeT), the Smart Mobility ARChitecture (SMARC) provides an open-standard definition for ARM-based possible to build advanced, highly energy-efficient server platforms. and x86-based SoC embedded computing solutions, Intel has been instrumental in defining the core microprocessor and optimized for low power, cost efficiency and high instruction-set architecture and the architecture of peripherals. performance. SMARC also supports systems that Proprietary or open-standard embedded-computing products need more compact solutions than are offered by the based on the x86 architecture leverage Intel’s chip-level expertise PC-oriented form factors. Isolated systems symbolize the past. A network of smaller form factor sophisticated devices with power-saving thermal characteristics signals the future. When this network makes Industrial Internet of Things (IIOT) applications possible, it does so by achieving both low power consumption and healthy computing performance from control devices. Designed to play an essential role in a network that enables intelligent industrial applications is the SMARC™ computer-on-module form factor, which powers IoT devices using Intel® x86 System-on-Chip (SoC) and ARM technologies. 24 &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 SPECIAL FEATURE As SoCs do not need the support chips of a PC platform and draw less power, the amount of board space that needs to be reserved for power converters and power supply lines is greatly reduced. This allows the use of a smaller form factor, facilitating use of SMARC-based modules in low-power portable equipment. SMARC CPU modules are expected to have an actual power intake between 2W to 6W, allowing for passive cooling and thus further reducing subsequent design effort and overall cost. The standard allows for up to 9W continuous power draw for more demanding scenarios. on materials and components. Forecasting potential problems in order to implement preventive measures and maintenance or equipment replacement is critical to sustain performance and avoid costly downtime and damage. Machines or tools using a rotary axis, for example, frequently exhibit vibration and noise from unbalanced rotation. This imbalance reduces the life of shaft bearings. To avoid unacceptable vibration and noise, a process called dynamic balance is employed, using accelerometer and tachometer readings to calculate and adjust the unbalanced mass and deviation angle. Temperature and voltage readings can also be used to diagnose machine health. Based on the proven connector as it is employed by Mobile PCI Express Module (MXM) video modules, SMARC defines two sizes of module: a full-size module that measures 82mm x 80mm, and a short module for more compact systems that measures 82mm x 50mm. The edge connector supports 314 electrical contacts. For systems that are to be used in harsh environments, shock- and vibration-proof versions of the connector are readily available. The temperature range of the connector extends from −55°C to +85°C. The SMARC MXM connector guarantees a high degree of signal integrity, required by high-frequency serial interfaces. For example, on 2.5GHz signals as employed by PCI Express Gen2, the insertion loss of the connector is just 0.5dB. In comparison, the insertion loss encountered on the connection scheme used by previous generation MXM connectors is significantly higher at 3dB. SMARC also supports a wide input voltage range, reducing the need to use additional DC/DC converters on the core module and overall power dissipation. A SMARC module can support input voltages from 3V to 5.25V. Originally designed to support PC-class hardware, the many other formats are restricted to a nominal 5V input. The SMARC module is designed to support a combined height above the carrier of less than 7mm (See Figure 1). The PC heritage of most computer-on-modules (COMs) has led to the assumption that all COM boards will be used with a heatspreader, which adds to overall package height. The typical combined height of the processor board and heatspreader alone exceeds the height of a package that includes both the SMARC COM and carrier board. Many SoCs do not require a dedicated heatspreader because of their lower overall power consumption. The SMARC format allows for this, making it more suitable for systems where space is at a premium. CASE STUDY: SMARC-BASED IOT GATEWAY POWERS MACHINE FAILURE PREDICTION APPLICATION Industrial machinery is subject to nearly constant shock and vibration, which generates fatigue and wear Figure 1: SMARC defines two sizes of module: a full-size module that measures 82mm x 80mm, and a short module for more compact systems that measures 82mm x 50mm. REAL-TIME SIMULTANEOUS MONITORING Conventionally, data acquisition modules collect measurements from sensors located on individual machines. Based on the data, portable vibration detectors are used to check potential problem machines one by one, a time-consuming and labor-intensive practice, with unavoidable errors and slow reaction times. In environments where multiple machines are monitored, development of secure and reliable networking of devices from the edge to the cloud is crucial to realizing the much needed real-time simultaneous monitoring. However, current manufacturing environments utilize a wide variety of fieldbus communication protocols such as Modbus, PROFIBUS, DeviceNet, CANopen, PROFINET, EtherNet/IP and EtherCAT. The disparity among them presents a significant communication barrier impeding delivery of field data to the upper layers of the cloud structure. Overcoming this barrier to enable data flow to the cloud without replacement of legacy equipment is a major challenge for IIoT applications. In addition, a reliable, secure data connection to the cloud must be in place to protect sensitive data. Security is critical to IoT-based operations at both the device and network level. Secure boot at the device level, as well as access control and authentication, application whitelisting and firewall and intrusion prevention systems can all help combat security threats while allowing the connection of legacy equipment to the cloud. www.eecatalog.com/pc104 r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 25 SPECIAL FEATURE Finally, factory environments present demanding physical conditions. Industrial machines are frequently located in areas experiencing regular shock and vibration, extreme temperature and humidity and the presence of liquid and solid contaminants. IIoT devices require dedicated design and construction to withstand these conditions and ensure reliable operation. analyzed data to a cloud server for more advanced analytics. At each point, network connectivity is critical. IIoT gateways powered by Intel x86-based SMARC boards include characteristics that make reliable connectivity and secure data transfer possible. These gateways can offer a fanless, compact footprint that delivers both low power and high performance. When built on the Intel® IoT Gateway platform, a portfolio RELIABLE CONNECTIVITY AND of pre-integrated and pre-validated softSECURE DATA TRANSFER WITH ware and hardware bundles developed to INTEL ® X86-BASED SMARC address the challenges facing IIoT, these BOARDS The advent of cloud-based IIoT solutions gateways enable the connection of legacy has vastly improved the field of machine industrial devices and other systems to failure prediction, with real-time data the cloud. transmission, remote monitoring and control, and enhanced accuracy, efficiency Designed in collaboration with McAfee and economy. IIoT solutions require a and Wind River, Intel IoT Gateway vertical integration of networked field platform solutions are intelligent devices such as sensors and data loggers, systems integrating technologies and IoT gateways (controllers) and cloud communication protocols for netservers. The IoT gateways collect data working and embedded control with from the field, implement primary data reinforced security. McAfee Embedded maximizes security by analysis (“fog computing”) and push the Control Figure 2. Combined with cloud services, SMARC-based IoT gateways can push data to the cloud, deliver remote monitoring and control capabilities, and offer rich libraries and tools allowing OEM customers to easily configure and design intuitive GUIs viewable on any browser-based device for 24/7 data access. 26 &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 dynamically monitoring and managing whitelists that allow only pre-authorized programs to run in the system. Wind River Intelligent Device Platform XT and Wind River Workbench provide a proven development environment. Combined with cloud services, SMARCbased IoT gateways can push data to the cloud, deliver remote monitoring and control capabilities, and offer rich libraries and tools allowing OEM customers to easily configure and design intuitive GUIs viewable on any browserbased device for 24/7 data access. APPLICATION SCENARIO: DEPLOYMENT OF DYNAMIC SIGNAL ACQUISITION MODULES A possible application scenario includes deployment of dynamic signal acquisition modules and a thermocouple input module to acquire and collect sensor data and transmit it to an IoT gateway controller for primary computing. The gateway then sends only processed meaningful data to the cloud server for further analysis and utilization. Computing performed at the gateway, or fog computing, alleviates cloud computing loading and reduces data traffic volume over the network, improving connectivity and reducing networking costs. For peak performance of local analytics and other applications, ADLINK’s own SMARCbased IoT gateway, the MXE-200i, features the dual-core performance of the Intel Atom processor E3826 (see Figure 2). This processor supports Streaming SIMD Extensions (SSE, SSE2, SSE3, SSSE3) for fast, efficient digital signal processing of sensor and instrumentation data such as the FFT algorithm. To accommodate a wide range of indoor and outdoor environments, the MXE200i features a compact footprint—120 (W) x 60 (H) x 100 (D) mm, and rugged, fanless design with an environmental temperature tolerance of –20°C to +70°C. The platform offers rich I/O for sensors and data acquisition modules, as well as optional wireless modules for Wi-Fi and 3G/4G/LTE. SPECIAL FEATURE CONCLUSION The application of IoT technology helps to implement real-time and remote monitoring over industrial machinery, allowing more precise forecasting of possible equipment malfunction and responsive advance measures, minimizing unexpected failure and consequent damage and reducing repair, maintenance and human resource costs, for improved precision, yield, and quality. Most importantly, the intelligence gained from analyses of accumulated big data aids development of more advanced insight into equipment management and purchasing. services increases. Minimal power consumption is a primary driver in this renaissance. Low-power designs powered by SMARC-based building blocks support mobile, portable or embedded devices. And they capitalize on thermal characteristics to manage fully enclosed, passively cooled designs as the key to enabling connectivity anywhere. Thanks to its focused support for low-power architecture and backing from multiple vendors, SMARC is the key form factor for a new generation of embedded computing applications. INDUSTRY IMPACT OF LOW POWER IMPROVEMENTS In this new era of connected computing technology, intelligent systems add global value as standalone systems evolve from their foundation into connected networks that communicate with each other and the cloud. OEMs and developers can anticipate a convergence of increasingly connected devices, answering demand for real-time data gathering and sharing, nonstop communication, new services, enhanced productivity and more. Systems will solve business problems by being smart and connected, which is becoming a priority, adding business value such as cloud economics for compute and data operations. Dirk Finstel is CEO, EMEA, & EVP, Global Module Computer Product Segment at ADLINK Technology. He has 20+ years of in-depth experience in leading embedded computer technology, with a proven track record in embedded modules. Finstel has held executive-level positions at embedded computing companies since he founded Dr. Berghaus GmbH & Co. KG in 1991, and has been responsible for global technology, as well as research and development and setting technological strategy. Finstel holds a BS in Computer Engineering & Science. As IoT strategies unfold—for example in healthcare, smart metering, digital signage/POS and retail banking, factory floor systems and connected buildings—the business case for intelligent A network dedicated to the needs of engineers, developers, designers and engineering managers www.eecatalog.com www.eecatalog.com/pc104 r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 27 SPECIAL FEATURE With Thermal Dissipation Up, Will Cooler Heads (Up) Thinking Prevail? Greater processing power and component density is driving demand for effective cooling for AdvancedTCA, MicroTCA, CompactPCI Serial and VME systems. By Christian Ganninger, Pentair Technical Solutions GmbH T he performance of processor chips has steadily increased and the power density in systems has, as a result, risen exponentially in recent years. For example, in 2002, the AdvancedTCA specification defined 200 watts of heat dissipation for front boards and 15 watts for rear boards. At that time, the ATCA specification was expected to accommodate future increases, but today many boards in use are generating 300 watts per front board and 50 watts per rear board. The latest generation of ATCA boards are dissipating upwards of 400 watts per front board and 50 watts on rear boards, and the next generation of ATCA boards for the telecommunications market features a larger form factor and may produce up to 2 kW per board. While not as extreme, this trend can also be seen in other PICMG and VITA specifications. MicroTCA systems, while based on a relatively small form factor, have also increased thermal dissipation by Figure 1. Heat simulations highlight airflow and hot spots. as much as 50 watts for the single modules and 80 watts for double modules. Only a few years ago VME and CompactPCI boards dissi- low resistance boards in a chassis, special considerpated 20 to 30 watts of heat, but today the figure is around 40 to 50 ation must be taken to optimize airflow. watts. Today’s VPX specification allows for systems to generate up to 450 watts or more of heat dissipation per slot. While not as extreme, this trend can also be seen in other PICMG and VITA specifications. MicroTCA sysAIRFLOW OPTIMIZATION tems, while based on a relatively small form factor, In the past, air optimization wasn’t as critical as it is today; it wasn’t have also increased thermal dissipation by as much uncommon to see a system cooling with airflow from bottom to top, as 50 watts for the single modules and 80 watts for with the system above it drawing in the warm air from the system double modules. Only a few years ago VME and Combelow. Using higher-power fans compensated for poor design, inef- pactPCI boards dissipated 20 to 30 watts of heat, but ficient installation or leaks. Unfortunately, the latest chassis already today the figure is around 40 to 50 watts. Today’s VPX employ the highest-power fans on the market, so bumping up fan specification allows for systems to generate up to 450 power is no longer an option. The only option to increase cooling is watts or more of heat dissipation per slot. to optimize airflow and maximize efficiency. To better control airflow, air baffles cover empty slots, Considering the importance of cooling, airflow optimization is a ensuring that air is directed where it is needed. For primary consideration for Design Engineers from the earliest stages systems in which the board configuration does not of system development. (Figure1). change, a “slot balancing” element (Figure 2) can be used. This slot balancing element is simply a custom Board design has a direct effect on airflow since heat sinks or densely grille fitted under the card cage that redirects air to populated boards create resistance. Cold air will naturally follow the cards with greater resistance or heat dissipation and path of least resistance; thus, when combining high resistance and away from cards with lower resistance or less thermal dissipation. 28 &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 SPECIAL FEATURE Figure 2. Slot balancing: Air is blocked or restricted to some slots and directed to others. Figure 3. In a Push Configuration, fans are located in the bottom area close to the air entry and push the air through the system. Figure 4. In a Pull Configuration, fans or radial blowers are located in the top area next to the exhaust to pull the air through the system. Figure 5. In a Push-Pull Configuration, fans are located close to the air entry and close to the air exhaust. COOLING SPECIFICATIONS The AdvancedTCA specification allows for a maximum ambient temperature of +40 °C. In emergencies, such as air conditioner failure, ATCA systems can withstand ambient temperatures up to +55 °C for short periods of time (max. 96 hours). For electronic components, however, this “short period” may still be too long as board components also have operating temperature ranges that must be adhered to. When designing cooling systems, it is therefore necessary to assume an ambient temperature of +55 °C. With a +55 °C ambient temperature, the maximum ΔT per slot is 10 K; the temperature may rise by only 10 °C between the air inlet to the air outlet. temperature of the system. At a room temperature of 20 °C or 25 °C, convection can be used to remove 10 W per slot. The most common method for convection cooling is forced air, which is sufficient for the majority of situations, and employed in the latest high-performance ATCA systems. With forced air convection, natural convection is augmented with fans or blowers. Here again, the ambient temperature must be significantly lower than the specified system internal temperature. Typically, the temperature in the slot or chassis will be 10 °Kelvin higher than ambient. Some individual COOLING TECHNIQUES Natural convection is the simplest and least expensive method components on the boards, such as processors, may be of removing heat; however, it is only practical when the ambient considerably warmer. In some cases, fan trays can be temperature is significantly lower than the required internal activated when the air resistance of the incorporated components reaches a predefined threshold. www.eecatalog.com/pc104 r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 29 SPECIAL FEATURE Forced cooling techniques can be divided into three of the chassis. Radial blowers typically eliminate the need for any basic approaches: push cooling, pull cooling or a com- redirection of the air, resulting in greater airflow, better air distribution and higher static pressure within the chassis. bination of push and pull (Figure 3). For push cooling, the fans are positioned below the boards and the air is pushed over hot components. Conversely, for pull cooling the fans are mounted above the boards; they pull air up through the card cage. Both the push and pull methods have different strengths and weaknesses when considering operating life, air distribution and air pressure. If air quality is a concern, the push configuration generates positive pressure in the system, which helps to keep dust and other contaminants out of the chassis. The downside of positive pressure is leakage—some air will inevitably escape through small openings for connectors or gaps between EM gasket elements. In the pull configuration, negative pressure is created in the card cage, which can result in dust being drawn into the system. High operating temperatures are detrimental both to the mechanical condition of the fans and to the electronics they are meant to keep cool. The fans in the push configuration are situated in a cold airstream and therefore not subjected to high working temperatures, so they tend to have a longer operational life. In the pull configuration, the fans are located at the top of the enclosure within a hot airstream, frequently resulting in a shorter fan life. It is important to note that the fans themselves also consume power and generate heat. In a push system, heat generated by the fans prewarms the air reaching the boards whereas in a pull system the heat from the fans simply enters the exhaust airflow. The latest ATCA systems featuring 450W per slot cooling use pushpull designs, which provide optimum cooling with the greatest levels of air flow, air pressure and most even air distribution. With double the number of fans, the downside of the push-pull configuration is cost and increased fan noise. Pull systems often use radial blowers to draw the air up from below and blow it horizontally out the rear Current fan technology restricts greater than 450W per slot cooling in a 55 °C ambient environment. Provided that fan technology does not improve, alternative-cooling methods must be considered. AIR FLOW AND THERMAL ANALYSIS When evaluating airflow measurements provided by manufacturers, users should always consider the conditions under which the tests were conducted. Test results are not comparable unless the environmental conditions, test equipment, procedures and metrics are consistent. To resolve this issue, the Communications Platforms Trade Association (CP-TA) has developed a standardized measurement protocol, which has been integrated into the PICMG 3.0 specification. The CP-TA method defines measurement cards to be used and the PCB width, slot impedance and airspeed for four locations. Using this protocol, cooling performance for the individual slots can be quantified at each of the four zones and results compared for different configurations. There is no officially standardized measurement procedure for other bus technologies. For this reason, some manufacturers have defined their own reference boards for MicroTCA with both typical air resistance and the highest air resistance values of PCBs currently on the market and based on the CP-TA method for ATCA. Appropriate boards are also developed for CompactPCI, CompactPCI Serial and VME. Figure 6. Schroff Varistar LHX 12 with side-to-side cooling. 30 These manufacturers actively test the latest cooling concepts and designs using the latest in measurement and simulation technology. For example, a company’s thermal lab may include a wind tunnel, climate chamber (temperature and humidity) and CP-TA test equipment. On request, manufacturers can also perform testing on customer systems, using their boards, to measure and verify performance. &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 SPECIAL FEATURE HYBRID COOLING—AIR AND LIQUID When convection cooling alone is not sufficient, other alternatives must be considered. One solution is to lower the ambient temperature. By lowering the ambient temperature to +25 °C, the maximum ΔT rises by 30 K from 10 K to 40 K, which makes it possible to cool four times as much heat. The ambient temperature can be adjusted by adding an air/water heat exchanger (AWHE) in the cabinet, with redundancy if high system availability is required. An AWHE from the Schroff LHX series (Figure 4) may remove as much as 1 to 1.5 kW per board given a suitable flow temperature. Solutions with AWHEs at a system level rather than a cabinet level are also conceivable, as is the cooling of hotspots directly on the boards. However, it is important to evaluate the costs versus gains of each solution; the greater the complexity, the greater the cost. Energy costs should be considered for overall system design. Often the more complex water-cooled systems will require less energy for ongoing operation. For example, by adding an AWHE, ATCA systems only require a third or a quarter of the fan capacity. CONDUCTION COOLING Conduction cooling is the method of using thermally conductive material to transfer heat from the PCB to a cold wall or heat sink. With the clamshell design (Figure 5), electronics are completely encapsulated, and thermal interface materials (TIMs) such as pads, paste, films, adhesives, and even solders are often used to improve the conductivity of the mating surfaces. Conduction cooling is typically used in rugged applications since it provides protection against environmental conditions such as shock, vibration, EMC and contaminants. While conduction cooling alone is limited on a system level, it can be used in conjunction with forced air or liquid cooling at the chassis level for a superior cooling solution. Conduction cooling is also used in environments where airflow is restricted (sealed chassis), or for environments such as in avionics where low-pressure air is not able to remove enough heat. Figure 7. Schroff Calmark clamshells encapsulate the printed circuit board to transfer heat and protect from the environment. SUMMARY The demand for greater cooling is expected to continue. In fields such as next-generation AdvancedTCA systems, with dissipations of up to 450W per slot, air cooling has reached its physical limit. In order to continue to meet market demand, fluid cooling will supplement air cooling at the cabinet, system, or board levels. For a wide range of applications, it is still possible to provide adequate ventilation and fan capacity to handle excess heat generated despite growing power density per processor and dissipation loss per unit volume. Of greater importance than previously, however, is the case design, the packing on the boards, the arrangement of the boards in the system and ensuring that empty slots are closed off or optimal airflow is provided. Christian Ganninger, Dipl.-Ing. (FH) is global product manager for systems products at Pentair Technical Solutions GmbH, Straubenhardt, Germany. Christian began at Schroff, a Pentair brand, in 2005 and has served in many marketing related roles including product manager for backplanes, power supplies, MicroTCA and finally for all systems product lines. In these roles, he has driven product development as well as market and applications analysis. Prior to his time at Schroff, Christian was backplane designer and project manager for a firm that developed 19” systems and backplanes. He studied Electrical Engineering at the University of Applied Science in Karlsruhe, Germany. www.eecatalog.com/pc104 r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 31 SPECIAL FEATURE Seeing the VITA 74 NanoX Small Form Factor Specification as Gaining a Foothold in Two Worlds When the questions center on “how small, lightweight and power miserly can you be?” the right answers apply to mission-critical applications in the commercial world as well as that of defense. By Anne Fisher, Managing Editor W Waiming Mok, Themis 32 aiming Mok, Director of Technical Marketing, Themis Computer, a maker of board and system level products for mission-critical commercial and military applications, recently shared his insights on a number of questions about the VITA 74 NanoX Small Form Factor specification. Themis Computer is an inaugural member of the VNX Marketing Alliance. The company’s NanoATR and NanoPak products provide x86 processing supporting Linux and Windows and deliver a range of compute performance from Intel Atom to multicore AMD and Intel Core i7, along with PCI Express (PCIe) high-performance interconnect. The NanoATR also supports wireless communications with radio antenna support, as well as GPS support. COM Express Mini (type 1 and type 10) form factor, so new CPU developed on COM Express could also be adapted for quick deployment on VNX. In these ways, the VNX designs allow for straightforward technology refresh to support multiple processing platforms, including Intel Atom, Intel Core i7, AMD APU and multicore ARM processors. The I/O interconnect supports highperformance data transfer over PCI Express and radio communication. Storage supports standard SATA interfaces. Each of the technologies for processing, I/O and radio communications can be EECatalog: What applications does the VITA 74 NanoX (VNX) refreshed in a modular fashion. The card slot design Small Form Factor specification target? can accommodate independent refresh of processor/ memory from PCI Express I/O from data storage. In Waiming Mok, Themis: VITA 74 targets applications sensitive to addition, Themis supports the Mini PCIe I/O cards, so many off-the-shelf Mini PCIe cards can be added Size, Weight and Power (SWaP). These include: to the NanoATR. As an example, customers can t *OUFMMJHFODF4VSWFJMMBODF3FDPOOBJTTBODF*43 deploy camera image processing Mini PCIe cards t 4FOTPSGVTJPO that support camera input into the NanoATR for t %BUBMPHHJOHBOEDPMMFDUJPO t %JTUSJCVUFEQSPDFTTJOHPONVMUJQMFMPDBUJPOTXJUIJOBWFIJDMF reconnaissance and surveillance applications. to provide redundancy and availability t %FQMPZNFOUJO6"7BOEPUIFSTFOTPSEBUBDPMMFDUJPOWFIJDMFT EECatalog: Where can VNX solutions be used in applications outside of defense? EECatalog: How do VNX solutions address DoD requirements? Mok, Themis: VNX products can be deployed in Mok, Themis: In addition to addressing SWaP requirements, VNX applications outside of defense that require high products support MIL-STD-810G (Shock and Vibration), MIL-STD ruggedness, small size, low weight and low power, including, for example, sensor fusion and data 901D and MIL-STD 167. logging. VNX designs could also support DO-160 for EECatalog: Do VNX designs enable regular technology refresh or aviation and UAV in nondefense scenarios. NanoATR solutions can be made waterproof to survive technology insertion? operation under water for short periods of time. Mok, Themis: In the implementation of VNX designs, Themis has built VNX components that allow easy incorporation of off-the- The embedding of more sensors in nondefense shelf technologies. One such component is a Mini PCIe carrier that machinery and equipment for M2M/big data plugs into the VITA 74 slot. Additionally, mSATA interfaces are applications is an emerging trend. VNX solutions used for storage. And the NanoX form factor is compatible with the play a role for those environments that require &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 SPECIAL FEATURE standards, including Mini PCIe, mSATA and COM Express. Moore’s Law continues to thrive, and fast-evolving computing technologies EECatalog: What policies would you put in place help the cause of VNX ecosystems. Three, grow the software to see that the VNX ecosystem can gather the solutions that use the technology in the VNX ecosystem. intelligence and momentum it needs from the user community to both respond to current challenges Another policy would be to work closely with software vendors who provide sensor fusion and data logging and similar applications, and anticipate future challenges? and together provide a compelling set of solutions for defense and Mok, Themis: One, grow the customer base non-defense deployment. Four, evolve VNX specifications to match that requires the specific SWaP and processing the technology changes in computing, I/O, radio communication capabilities of the VNX solutions. Two, grow the and sensors to position the platform as best for C4ISR and related hardware technology ecosystem and associated nondefense applications. offerings around the VNX designs. ruggedization and SWaP capabilities. The VNX ecosystem supports the latest computing technologies. One key policy would be to build out the ecosystem using other compatible technology PC/104 & Embedded SFF ONLINE www.eecatalog.com/pc104 Explore... ➔ Top Stories and News ➔ White Papers ➔ Expert Opinions (Blogs) ➔ Exclusive Videos ➔ Valuable Articles Sign up for the PC/104 & Embedded Small Form Factors Quarterly Report email newsletter www.eecatalog.com/pc104 www.eecatalog.com/pc104 r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 33 SPECIAL FEATURE Not Enough Just to “Take up the IoT Mantle”: Interview with Eurotech CEO Larry Wall As embedded systems designers and chip makers turn away from a past that showed a bias toward performance and form factor, with power consumption concerns on the back burner, and as the IoT matures, what’s the best way forward for industrial, mil-aero, medical, automotive and other applications? By Anne Fisher, Managing Editor Larry Wall Eurotech Inc. “So many companies have taken up the IoT mantle,” Eurotech CEO Larry Wall told EECatalog recently, explaining that the reason some enterprises are jumping on the IoT bandwagon is to “be part of the hype.” Rather than seeing embedded developers taken in by “big brands and big promises,” Wall advocates, “working with companies who have proven they know how to build, connect and manage devices.” Other must-haves according to Wall: standards-based building blocks—from embedded boards and programmable multi-service gateways to connectivity and cloud-based processing. Wall also told us, when asked how he would like to see the Industrial, Medical and Military IoTs mature, that wider adoption of open source, standard protocols such as the Eclipse Kura Project, the OSGi container, and the Linux operating system would help. “Open source software with a broad reach gives developers flexibility to accelerate IoT solutions more smoothly and efficiently,” he said. And this is true, according to Wall, no matter where an application lives in the Internet of Things. He explained that designers and customers need to connect easily to the Cloud, and they need to be able to manage devices remotely to accommodate large and varied networks of devices. Wall names privacy and security as crucial demands that are ballooning in importance as the IoT evolves. “These requirements are never-ending issues, of course, and require designers and suppliers to evolve as capabilities grow and change, and frankly, as hackers and their capabilities grow and change,” he says. Read on for Wall’s answers to additional questions on ultra-low-power designs, small form factors and the IoT. 34 Figure 1. Lured in? Eurotech CEO Larry Wall notes the problem of embedded developers being lured by “firms that want to take up the IoT mantle, but which may not have a track record for building, connecting and managing devices.” Image By Ankara (Own work) [CC BY-SA 3.0 http://creativecommons.org/ licenses/by-sa/3.0) EECatalog: What philosophy should a manufacturer of low-power Computer-on-Modules (CoMs) follow to assure that its offerings are more than just the sum of their parts? Larry Wall, Eurotech: The best thing is to provide flexibility and give customers options. Every application is different, every industry is different, and the CoM must allow the designer to optimize the &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 SPECIAL FEATURE hardware to meet their needs. For instance, Eurotech’s Catalyst BT Ultra Low Power CoM offers the Intel® Atom™ processor E3800 Series quad-core, dual-core and single-core options depending on the need. (Figure 2). It also supports both Windows and Linux and has the OS installed for faster integration with the device. EECatalog: As you consider what has led to low-power (or other) milestones and breakthroughs, are there principles and practices to be recognized that could apply to challenges the industry is experiencing today, and to anticipating future needs? Wall, Eurotech: Future-proofing is a key in low-power design. Designers must start with a clear understanding of the customers’ application and the problem they are trying to solve, and then apply standard or customized products to meet that need. Most importantly, they have to allow for change or expansion. The closer you match with the customer, the better you match their needs. Software also plays a huge role in helping developers be prepared for future needs. With applications built on the right framework, development work doesn’t have to be lost then repeated when moving to a new hardware platform. The right framework allows an application to be ported to a new hardware platform in a straightforward manner. Additionally, full systems—processors, software, I/O, communications—must be designed with a focus on power consumption to enable new applications operating in remote and battery-powered systems EECatalog: In what areas are you finding designers struggling most as they strive to optimize and simplify the design process, particularly when working on ultra-low power designs? Wall, Eurotech: One of the difficulties we see designers face in lowpower design is understanding the application well. Designers must understand the application use cases fully, including the wake up and sleep needs and possible future needs as the application evolves over time. The best way to design a power-efficient system is to have the device turn off or go to sleep and then start when necessary. Understanding the balance for the application is essential to decide which mode works best. Connectivity is another challenge we see in the market. It is now common for devices to contain multiple radios and connectivity options that are software- or environment-defined. When considering the wake up cycle, if the device doesn’t find the network or takes a while to connect, the system is drawing off battery power during that delay. Both static and mobile devices have challenges with connectivity, so the right modes must be employed—RF, satellite or cellular depending on the application. No device is an island—in today’s world of M2M systems and devices connected to the Internet of Things, connectivity is key for all designs. Last, some designers struggle with selecting the right software and development tools to optimize and simplify the design process, www.eecatalog.com/pc104 r Figure 2. The Catalyst BT is an Ultra Low Power CoM based on the Intel® Atom™ SoC. Photo courtesy Eurotech. especially for future proofing designs. Open source versus commercial systems, coding in Java or C++ and what software frameworks to use are common questions. EECatalog: What are some approaches to addressing the challenges you’ve just named? Wall, Eurotech: As designers struggle with understanding their application and how to optimize for low power, embedded system providers like Eurotech can enable several power modes so customers can make these choices and optimize a low-power design. In addition Eurotech employs an extensible embedded controller to manage many diverse functions such as battery monitoring, A/D conversion, or even connectivity status monitoring including wireless connections and GPS interfaces. The controller can handle any low-performance function that requires some periodic servicing. Connectivity options are improving with designers able to choose wired, WiFi, cellular, Bluetooth Low Energy, and others. However, challenges are also present. For example, one of the challenges of cellular technology in particular is carrier certification. This process can cost thousands of dollars and take many months to complete. Designers have to understand the cellular landscape and then navigate the testing process, which requires extensive expertise most designers do not have. Eurotech offers a pre-certified cellular adapter, the IP67 Certified ReliaCELL, to solve this problem, with a suite of ReliaCELL units certified on different networks. Designers can simply plug the ReliaCELL in and mount it, and the expensive and time-consuming cellular certifications are already taken care of. This flexibility gives organizations options to deploy devices and services in different regions. &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 35 SPECIAL FEATURE From a software perspective, integrated hardware and software EECatalog: What are the top 3 technologies, capabiliofferings simplify the design process so designers and developers ties or features Eurotech wishes were available? experience a reduced amount of subsystem integration. Open source software for device developers is becoming more prevalent. Wall, Eurotech: Eurotech would like to see more acceptance of open source software as a starting point EECatalog: What, if anything, are you seeing as problems or challenges for development. Developers can begin their developthat are not getting their fair share of attention in the area of ultra-low- ment with open source software, then move to a fully power design and in the embedded ecosystem more generally? supported version for extra confidence and assurance for deployments. Wall, Eurotech: We see the embedded ecosystem by default evolving into the IoT ecosystem. With all the hype around IoT, the challenge for We would like to see ultra-low-power sleep modes availdesigners is to sift through all the marketing promises to determine able in chipsets and connectivity options accessible in what is real and deployable now. On a related note, it is expected that chipsets. We are adding these options separately, but innovation will continue to occur at a rapid pace for all IoT tiers. During look forward to seeing WiFi or Bluetooth integrated this period, embedded system suppliers must provide technical and directly into chips. business assurances to customers to reduce the real and perceived risk of solution adoption. We’d especially like to see more deployment of connected devices taking advantage of remote manEECatalog: What is the role management from a remote location agement capabilities, instead of relying on inefficient is playing and will play to help the Military Internet of Things, the processes based on decades-old technology. Medical Internet of Things, and the Industrial Internet of Things mature? EECatalog: What trends should system developers keep an eye on? Wall, Eurotech: Designers and customers need to connect easily to the Cloud, and they need to be able to manage devices remotely to Wall, Eurotech: There is a trend towards having more accommodate large and varied networks of devices. sensors close to where data is measured. Intelligence is getting pushed in both directions, with big data In these three vertical markets in particular, remote management analysis on one end, and collecting more data on the saves time, money, and even lives. In the military, it can be dangerous other end. System and software designers must develop to manage a sensor on-site. Remote management can save lives by the skills to understand the tradeoffs and pros and cons enabling updates, configuration and troubleshooting without physi- of varying models of computing distribution. These cally touching the device. In the medical field, remote management design decisions cannot be made at the subsystem means a network of thousands of devices can be updated all at one level, but require comprehensive understanding of the time remotely, so patients can get the most up-to-date care available. system-level requirements and objectives. And in the industrial market, managing devices remotely saves money when technicians need not be sent to service devices in the field. System developers must learn more about data compression and setting data up for cloud services for One example of a solution that enables a complete set of remote analysis. The big data trend will continue to accelerate. device management operations, over MQTT, either on demand or on We will continue to see data structured for use in tradischedule is Eurotech’s Everyware™ Software Framework (ESF), a Java tional and big-data analytics systems, but we will also OSGi software framework for M2M/IoT multiservice gateways, smart see a demand for IoT data that’s structured for easy devices and IoT applications, and which interacts with Eurotech’s integration into vast numbers and types of enterprise Everyware Cloud Web Console. application beyond analytics, CRM and ERP. ESF enables the delivery of the latest generation Pervasive/Embedded Computer hardware platforms and all the fundamental components needed to quickly develop complex applications as part of the device software as well. Anne Fisher is managing editor of EECatalog.com. Her experience has included opportunities to cover a wide range of embedded solutions in the PICMG ecosystem as well as other technologies. Anne enjoys bringing embedded designers and developers solutions to technology challenges as described In summary, the military and medical markets require higher and by their peers as well as insight and analysis from industry broader security capabilities and predictable reliability in wide leaders. She can be reached at [email protected] operating environment range. All markets benefit from protocol standardization, but the industrial markets, where there is large volume and proliferation of sensors, could benefit the most in the early phases of broad IoT adoption. 36 &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 PC/104 & Embedded Small Form Factors engineers guide to NEW ADLE3800PC – Intel® Atom™ Processor E3800 Series PCIe/104 SBC The ADLE3800PC is based on Intel’s first System-on-Chip (SoC) Intel® Atom™ processor E3800 product family, which is built using Intel’s 22nm 3D Tri-gate process. It offers vastly superior compute performance and energy efficiency including Intel’s 7th generation graphics engine for stunning graphics performance. Improved power management capabilities result in standby power measured in milliwatts with days of standby time. ◆ Portable Medical Devices ◆ Mobile Autonomous Systems for Civil, Commercial and Defense Applications Including: FEATURES & BENEFITS ◆ ◆ ◆ ◆ ◆ Intel Atom processor E3800 Series SoC, DC/Quad Junction Temperature Rated at -40C to +110C Up to 8 GB DDR3L-1333, 1.35V SoDIMM204 Socket Onboard mini PCIe/mSATA Socket 4x USB 2.0, 1x USB 3.0, 2x Serial COM, 2x SATA 3 Gb/s, 2x GLAN Ethernet CPU or Single Board Computer CPU or Single Board Computer ADL Embedded Solutions – Unmanned Ground Vehicles – Robotic Subs – Unmanned Avionics – Unmanned Buoys and Other Surface Vehicles CONTACT INFORMATION ADL Embedded Solutions 4411 Morena Blvd Suite 101 San Diego, CA 92117 USA 858-490-0597 858-490-0599 [email protected] www.adl-usa.com APPLICATION AREAS ◆ Military & Defense Rugged SFF ◆ Rugged Mobile Computing Embedded Intel® Solutions delivers in-depth product, technology and design information to engineers and embedded developers who design with Intel® Embedded processors Designing with Intel® Embedded Processors? Winter 2015 Securing Embedded a the IoT Er Devices in Summer 2014 Applications Automotive nce er Performa Pursue High Mobile an d IoT Drive Em be Small Form dded Factor Evolution PCIe nt Tackles Test Equipme lenges Receiver Chal Developm ent Options Advances Evolve with in Performance-Intel® Processor Per-Watt Advanced Image Stab Techniques ilization Performancefor Tablet Camera CONTACT INFORMATION edd www.emb sors Gold Spon www.emb edd edin tel.com Gold Spon sors Subscribe bscribe Today at www.embeddedintel.com Free! Visit www.embeddedintel.com www.eecatalog.com/pc104 tPC/104 & Embedded SFF edin tel.com Meeting the Challenge Power Neutrality in Mobile Hand sets r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 37 PC/104 & Embedded Small Form Factors EMAC, Inc. CPU or Single Board Computers CPU or Single Board Computers engineers guide to Equipment Monitor and Control EMBEDDED SERVICES AND SOLUTIONS EMAC helps clients meet demanding embedded product release schedules. 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EMAC DISTRIBUTION: EMAC separates itself from the competition by offering OEM products that we design and manufacture; as well as a full line of products from some of the other leading names in the embedded marketplace. Since 1984 EMAC has provided customers worldwide with Single Board Computers, I/O peripherals, System on Module (SoM), Computer on Module, Panel PCs, PC/104 modules, embedded servers, embedded operating systems, solid state drives, application development and custom carrier EMAC MANUFACTURING: boards. Call 618-529-4525 or email [email protected] EMAC’s manufacturing division is located in Carbondale, with your project requirements and see how our product IL. We have a team of trained technicians that understand and services can improve your solution. the deadlines and demands of our clients. We work closely with clients in all phases of product manufacturing to INDUSTRIES: build high quality products at a fair price. 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EMAC project 2390 EMAC Way engineers identify and implement solutions to accelerate Carbondale, IL 62902 time-to-market, reduce the risk of improperly configured USA 618-529-4525 Telephone systems, minimize technical support costs and deliver cost618-457-0110 Fax competitive products to you or your authorized affiliates. [email protected] www.emacinc.com 38 &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 r April 2015 tPC/104 & Embedded SFF engineers guide to PC/104 & Embedded Small Form Factors ADL Embedded Solutions The ADLMES-8200 is a highly innovative embedded enclosure design. Its highly configurable modularity makes it possible to expand or reduce a system without replacing the entire enclosure. Side wall modules may be added or removed as system requirements evolve. Three standard profiles provide quick turn inventory availability. A broad portfolio of PC/104 SBC options ranging from lowpower Intel® Atom™ processors to high performance 4th APPLICATION AREAS Generation Intel® Core™ i7 processors are available. t Military and Aerospace – Rugged SFF t Rugged Industrial Applications FEATURES & BENEFITS t Communications Applications ◆ Modular Sidewall Design Supports Variable PC/104 Stack t Mobile Routers and Other Network Appliances t Railway Train Control Heights (2 - 6 Cards) or Expanded 3.5” SBC Intelligent t Transportation Systems t Imaging Applications ◆ High and Low IP (Ingress Protection) Systems Possible via High IP, Modular Chassis Design Coupled with Full Custom, Quick-Turn I/O Panels CONTACT INFORMATION ◆ Broad Portfolio of PC/104 SBC Options Ranging from Low-Power Intel Atom processors E3800 to High PerforADL Embedded Solutions mance 4th Generation Intel Core i7 processors 4411 Morena Blvd Suite 101 ◆ Fully Supported by ADL Embedded Solutions’ Team of San Diego, CA 92117 USA 858-490-0597 Solidworks Engineers for Model and or Design Support 858-490-0599 ◆ Options for MIL-STD 461, and MIL-STD 704/1275 [email protected] ◆ Designed for MIL-STD 810 Shock & Vibration www.adl-usa.com PC/104 & Embedded SFF ONLINE Enclosures Enclosures ADLMES-8200 High-Ingress Protection (IP) Modular Enclosure Systems www.eecatalog.com/pc104 Explore... ➔ Top Stories and News ➔ White Papers ➔ Expert Opinions (Blogs) ➔ Exclusive Videos CONTACT INFORMATION ➔ Valuable Articles Sign up for the PC/104 & Embedded Small Form Factors Quarterly Report email newsletter www.eecatalog.com/pc104 www.eecatalog.com/pc104 tPC/104 & Embedded SFF r &/(*/&&34(6*%&501$&.#&%%&%4."--'03.'"$5034 39 $PNQMFUF $PWFSBHFPG ,FZ&NCFEEFE 5FDIOPMPHJFT 7BMVBCMF$PNQBOZ BOE1SPEVDU *OGPSNBUJPO 0QJOJPOTBOE*OTJHIU Daily News, Technical Articles and Analysis Featured Blogs Aerospace & Defense Solutions COTS, MCOTS & Custom Designs Video Graphic Boards & Systems NVIDIA® Tegra-K1 6PDOO)RUP)DFWRU6:D3ð&ð 6',YLGHRLQSXWV 6',YLGHRRXWSXWV *%/3''5PHPRU\ * $50S $50SURFHVVRUV *)/23V&8'$*3*38 *)/23 JPVVKRFN Jð+]#+]YLEUDWLRQ WR&RSHUDWLQJWHPSHUDWXUH &DSWXUH3URFHVV(QFRGH'LVSOD\ *HRUJHWRZQ 5RDG 6XLWH +XGVRQ 2KLR 86$ :2/)$7FRP VDOHV#:2/)$7FRP Intel® Atom™ Processor E3800 Series-based Single Board Computers Fanless -40° to +85°C Operation Intel® Atom™ Processor E3800 Series-based Industrial Computer Systems Fanless -40° to +85°C Operation Intel® Atom™ Processor-Based PC/104 Single Board Computers Rugged, Stackable Form Factor Single Board Computers COM Express Solutions Power Supplies I/O Modules Panel PCs Accelerate Your Product Development Cycle Speed up time-to-market with embedded solutions from WinSystems. 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