High throughput TEM sample preparation using automated FIB preparation Hans-Jürgen Engelmann1), Dirk Utess1), Enrico Vales1), Lars Heller1), Alexander Würfel2), Heiko Stegmann3), Ralf Lehmann4) 1) GLOBALFOUNDRIES, Dresden; 2) GWT Dresden; 3) Carl Zeiss NTS GmbH, Oberkochen; 4) FEI Deutschland GmbH, Kassel Introduction decreasing feature size, new materials and the introduction of new process steps require more and more TEM samples number of TEM samples per year (AMD/GF Dresden) 5000 4500 4000 3500 3000 2500 2000 1500 1000 500 0 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 28.07.2009 GLOBALFOUNDRIES/CCA Introduction TEM has become a valuable tool for • process control • physical failure analysis • process development currently used TEM techniques 28.07.2009 •Imaging (bright field & STEM) •Analytics (EELS, EFTEM, EDX; Line-Scans & Mapping) •Strain analysis (NBD) •3D imaging (tomography) •Determination of dielectric constant (VEELS) •Grain orientation maps (DFD) •Band gap measurements (VEELS) •Pore size measurements •p-n transitions (Holography) GLOBALFOUNDRIES/CCA Introduction TEM sample preparation at AMD/GF: • 95% target preparation • 95% FIB preparation (H-bar) • 3% FIB preparation (lift-out) • 2% classical cross-section preparation How to increase number of TEM samples with nearly the same lab manpower & lab tool capacity? application of automated TEM sample preparation 28.07.2009 GLOBALFOUNDRIES/CCA H-bar samples 1. Mechanical pre-preparation 30…50 µm 2. FIB preparation 28.07.2009 GLOBALFOUNDRIES/CCA Tools & Software 1) NVISION 40 (Zeiss) ASP software 2) Strata 400 (FEI) AutoFIB® software 28.07.2009 GLOBALFOUNDRIES/CCA Sample preparation @ NVISION 40 Steps: • Pt outgassing • stage point list for TEM grids • eucentricity • accurate FIB alignment • detector/scan-speed/noise reduction • start ASP • template selection • selection of desired location • metal deposition definition • position of boxes • align mark definition • drift correction definition 28.07.2009 GLOBALFOUNDRIES/CCA Sample preparation @ NVISION 40 Process (lift-out sample): 1. Alignment mark 4. Medium milling 28.07.2009 2. Pt deposition 3. Coarse milling 5. Fine milling 6. Cut out GLOBALFOUNDRIES/CCA Sample preparation @ NVISION 40 Reproducibility: average thickness of the prepared nine lamellae: 71 ± 4 nm (application of ‘fine correction’) 28.07.2009 GLOBALFOUNDRIES/CCA Results: NVISION 40 • number of TEM samples per run: - max.12 H-bar samples - (arbitrarily) many lamellae on the bar • lead time per sample/lamella: 6…10 min • yield: 95% (if well aligned & stage shows no mechanical clearance) • lamella final thickness: About 60 nm (depends on ion column alignment) • surface damage: Protection layer is required (80 pA ion beam is used for positioning) 28.07.2009 GLOBALFOUNDRIES/CCA Sample preparation @ Strata 400 Steps: • sample adjustment (eucentricity, x/y alignment) • start Autofib.exe and RunScript.exe • recipe selection • selection of desired location • Pt deposition for cross-marks • cross-marking • definition of boxes • Pt protection layer definition • run now (this script was developed originally for lift-out samples, now it has been adapted for H-bar samples) 28.07.2009 GLOBALFOUNDRIES/CCA Sample preparation @ Strata 400 Process (H-bar sample): 1. Alignment mark 4. Coarse milling 28.07.2009 2. Fine Pt deposition 5. Fine milling GLOBALFOUNDRIES/CCA 3. Pt deposition 6. Final Width Sample preparation @ Strata 400 Process: 28.07.2009 GLOBALFOUNDRIES/CCA Results: Strata 400 • number of TEM samples per run: - max.6 H-bar samples - (arbitrarily) many lamellae on the bar • lead time per sample/lamella: About 10 min • yield: 100% (if well aligned & good samples) 70…80% (if difficult samples) • lamella final thickness: 80 nm with high reproducibility (currently according to the width of the Pt protection layer) • surface damage: Thick protection layer is required (2800 pA ion beam is used for positioning) 28.07.2009 GLOBALFOUNDRIES/CCA Acknowledgement The financial support by the German Federal Ministry for Education and Research, FKZ 13N9431, is gratefully acknowledged. 28.07.2009 GLOBALFOUNDRIES/CCA
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