1. business and industrial
2. manufacturing

450mm progress
Toward cross collaboration & cross utilization
Mr Guilhem Delpu –
• Introduction – RECIF short profile
• Progress & cross collaboration
• Outlook on cross utilization
• Conclusion
• Introduction – RECIF short profile
• Progress & cross collaboration
• Outlook on cross utilization
• Conclusion
Introduction – RECIF short profile
>30 years experience in semiconductor Business
Introduction – RECIF short profile
Worldwide Locations
France - HQ
Toulouse
USA
Fishkill
3 corporate entities
Corporate headcount
= EU (HQ) - USA - Taiwan
= 65 persons
Taiwan
Hsinchu
Introduction – RECIF short profile
1st 450mm sorter
delivered to imec
in March 2014
450mm EFEM integrated with
ASYS vacuum platform
throughout Q4 2014 at imec
• Introduction – RECIF short profile
• Progress & cross collaboration
• Outlook on cross utilization
• Conclusion
Progress
Project core partners
Progress
Characterization partners
Progress
Characterization partners
Progress
Computational Fluid Dynamics model with
Approach
• CFD calculations on flow field in EFEM (Fluent)
– User scenarios
• Impact of possible particle sources on particle distribution in
EFEM
– Specify release locations
– Particle tracking
– Analysis of sensitive area’s
• Identify improvements
Progress
Computational Fluid Dynamics model with
Geometry for CFD & flow calculations
Progress
Computational Fluid Dynamics model with
User scenarios
Hypothetical sources of particles
3
2
1
Progress
Computational Fluid Dynamics model with
• Particle release from robot side
• 50 particle tracks plotted
Conclusion:
• Many particles (among 50 pces) deposit
close to source, below wafer level
• Majority of the rest leaves system
through floor plates
• Potential risk areas identified
=> Mini environment should have
nominal performances with room for
improvement
Progress
Characterization partners
Progress
Cleanliness tests performed with
1 – Airborne particle measurement
2 – Particle per Wafer Pass
Tool installed in March 2014
Qualification of mini environment
Toestand van de Lucht
40
~ 24 hours
35
Deeltjes per CF
30
25
20
15
10
5
0
=> ISO class 1
Datum
> 0.1 µm
> 0.2 µm
> 0.3 µm
Progress
Cleanliness tests performed with
1 – Airborne particle measurement
2 – Particle per Wafer Pass
Preliminary
target
Preliminary results with KLA SP3 @ 30nm particle size
Achievement
~10 x Better
=> Preliminary PWP qualified
Progress
Characterization partners
Progress
Outgassing characterization with
&
Comparison of VOC, ammonia and acids levels inside and outside of
the mini-environment at the same time
Progress
Outgassing characterization with
&
Description of the method
• Sampling of AMCs to compound specific passive samplers during the “exposure
time” in the clean room/tool
• Analysis of trace of the compounds accumulated on the sampling tubes
• Determination/Calculation of the average concentration of the compounds during
the “exposure time” by type (specific algorithms)
- Limits of quantification
– Acids: ≈ 50 pptv
– Bases: ≈ 30 pptv
– Volatile organic compounds: 30 – 50 pptv
- Field proven method for cleanroom environmental control and equipment control
Capability to quantify outgassing at < 50 – 100 pptv
Progress
Outgassing characterization with
&
Comparison concentrations inside/outside of SOR450
corrected to 100% outside concentration
total bases
total acids
Volatile organic compounds (C)
outside SOR450
inside SOR450
Condensables (B)
Condensables (A)
0
10
20
30
40
50
60
70
80
90
100
110
concentration [%]
Total bases
e.g. ammonia, NMP, …
Total acids
e.g. hydrochloric acid, hydrofluoric acid, nitric acid, sulfur dioxide, acetic acid, formic acid, …
Condensables (A)
Condensables with b.p. > 175°C and sticking coefficient s > 10E-7
Condensables (B)
Condensables with b.p. > 175°C and sticking coefficient s > 10E-8
Volatile Organic Compounds
(C)
Volatile Organic Compounds with 80°C < b.p. < 175°C or sticking coefficient s < 10E-8
Progress
Outgassing characterization with
&
Conclusion
• All concentrations of the detected compounds were in the same range
inside as outside of the sorter
• There were no compounds only detected inside of the tool
=> No outgassing of compounds inside of the tool could be observed
Progress
Characterization partners
Progress
Metal contamination analysis with
Objectives:
• Perform Recif’s sorter qualification in terms of metal contamination from accurate
and sensitive methods by chemical collection techniques, coupled to ICPMS
(Inductively Coupled Plasma Mass Spectrometry), with Liquid Phase DecompositionICPMS for noble metals & Vapor Phase Decomposition-ICPMS for usual elements
• Demonstrate capability of methodologies developed by LETI for 450mm wafers
• Set-up a test protocol taking into account the challenges of:
– Geographical constraint : Tool at RECIF (Toulouse) & Analysis at CEA Léti
(Grenoble)
– RECIF prototyping line being not a cleanroom (risk of cross contamination
between test and analysis of samples)
• Reveal any strong deviation on RECIF tool Vs ITRS recommendations
Progress
Contamination & tests protocol (simplified)
Main actions and transfers between the 3 sites of investigations
MAC double cleaning
2
1
Sorter
4+1 wafers (450mm)
device grade for ICPMS
3
4 wafers
1 reference
4 wafers
4
ICPMS analysis
Progress
Metallic contamination analysis : set-up and sensitivity
VPD-DC set up (usual contaminants)
HF VPD reactor
1,0E+11
LPD set up (noble metals)
Droplet Collection
Low Limits of Detection
VPD-DC-ICPMS
VPD-ICPMS
450 mm
LPD-ICPMS
ITRS stringent
recommendations
5 E9 at/cm²
1,0E+10
Detection
at/cm²
1,0E+08
1,0E+07
1,0E+06
Li
Na
Mg
Al
K
Ca
Ti
V
Cr
Mn
Fe
Co
Ni
Cu
Zn
Sr
Mo
In
Sn
Sb
Ta
W
Pb
Ru
Pd
Ag
Ir
Pt
Au
limits 
1,0E+09
Reminding of Detection Limits- evaluated for two ICPMS methods on 450mm Si wafers
Progress
GLOBAL RESULTS AND COMPARISON (VPD + LPD)
Metallic contamination of 450mm wafer from VPD-DC-ICPMS and LPD-ICPMS
1.0E+11
5 E9 at/cm²
stringent ITRS recommandations
1.0E+10
at/cm²
Detection Limits
Ref. wafer in MAC
BS - dynamic test
FS - dynamic test
BS - static test
FS - static test
1.0E+09
1.0E+08
1.0E+07
1.0E+06
Li
,
Na Mg
Al
K
Ca
, Ti
V
,
Cr Mn Fe
Co
Ni
Cu
Zn
Sr Mo In
,
Sn
Sb
Ta
W
– Low levels of added contamination (in regard with initial contamination)
 Added by connection to the sorter (static test): Mg, Al (BS), Fe (BS), Sn (due to prototyping)
 Added by passing through the sorter (dynamic test) : Mg, Ca, Ti (BS)
 No significant contamination brought by Recif sorter
Pb
Progress
Conclusion of campaign with
LETI 450mm wafers characterization set-up
ICPMS techniques for 450mm available to perform accurate and sensitive metallic
contamination (with similar capabilities than for 300mm)
Contamination control Protocol:
Possible to conduct “off site” equipment characterization, with appropriate &
properly defined protocol.
RECIF equipment:
450MM tool is qualified in terms of metallic contamination
• No noble metals detected
• Few usual environment contaminants (Mg, Al, Ca…) detected but in the order of
magnitude of current 450mm device grade wafer characteristics and slightly higher
than stringent ITRS spec.
 No significant cross contamination observed from Recif’s sorter
• Introduction – RECIF short profile
• Progress & cross collaboration
• Outlook on cross utilization
• Conclusion
Cross collaboration
Imec placed at a central focal point…
Central strategy :
- support “More than Moore”
- support “More Moore”
- support a leading edge 450mm R&D and Innovation platform”
Has to be complementary to the G450C initiative
Source: White paper – “Balanced strategy for Nanoelectronics in Europe” - May 18, 2012
Central position:
=> foster synergies
=> ease modules maturation
=> Helps keeping cost under control
Main location of partners
participating to 450mm pilot line project
Cross collaboration
imec & G450C, technical exchanges made possible…
2014
2015
Q1 Q2 Q3 Q4
-
Q1 Q2 Q3 Q4
2017
2016
-
Q1 Q2 Q3 Q4
Prototypes installed @ Imec
Technical exchanges with G450C
-
Q1 Q2 Q3 Q4
Cross collaboration
RECIF started cross-collaboration
with
- Assessment of "nothchless wafer" within G450C task force
- Common Demonstration Test Methodology (DTM)
established through collaboration with G450C
- Offsite evaluation of RECIF tool to be started in 2015
• Introduction – RECIF short profile
• Progress & cross collaboration
• Outlook on cross utilization
• Conclusion
Cross utilization supporting 300mm
A – transfer of technology and good practices
2012
Q2 Q3 Q4
450mm
best practices
Motion control
Vibration canceling
2013
-
Q1 Q2 Q3
300mm
Improvement
Material selection
Design to cleanliness
…
@ 40 nm = 3 x better Vs 2007
@ 26 nm = best in class
Link
Cross utilization supporting 300mm
B – Re-use of existing 450mm designs:
3D IC & TSV wafers (More-than-Moore) are using some
modules coming from backend of the line.
This modules are not satisfying the requirements for
automation and cleanliness levels, toward 300mm ramp-up,
@ 20µm micro-bump pitch.
Some existing 450mm modules, can be re-used for "more
than Moore" concept MEOL (middle end) and advanced
packaging solutions.
Cross utilization supporting 300mm
B – Re-use of existing 450mm designs:
450 mm
450mm MAC + 380mm insert
300 mm
380 mm
Source: ENTEGRIS
Film frame
Constraints from
mechanical interferences
Not possible to use 300mm modules
FOUPS / Load Ports etc
Possibilities
from clearance
Possible to use 450mm modules
Cross utilization supporting 300mm
B – Re-use of existing 450mm designs:
Take benefit from 450mm standards
450mm MAC + 380mm insert
RECIF 450mm
Load port + FOUP
RECIF 450mm
EFEM / Sorter
Application of this concept on a new TSV project (pending for lablel)
• Introduction – RECIF short profile
• Progress & cross collaboration
• Outlook on cross utilization
• Conclusion
Conclusion
450mm progress and cross utilization
• 1st prototype of 450mm wafer EFEM / Sorter is installed at
imec and qualified on cleanliness point of view
• Gen 1 product to be released by Q4 2015
• Related R&D helped RECIF improving its 300mm product line
• 450mm modules can support segments such as 3D-TSV
300mm wafers, to capitalize on 450mm stds.
Conclusion
450mm cross collaboration
• Cross collaboration has been initiated with G450C, timing still
allows technical exchange
• Efforts on notchless wafer assessment supported the
standardization
• Common Demonstration Test Methodology (DTM) to be
applied to wafer handling
• RECIF offsite evaluation to be started in 2015
THANK YOU
RECIF thanks all its supporting partners (incl. G450C), and
particularly for this presentation:
J. Kames / A. Werner
B. Charlet / H. Fontaine / C. Agraffeil
J. Lundgren / D. Cheung (ECP)
W. Vansumere
O. Kievit / J. van Der Donck / C.Dam