Document 404536

IEEE TENCON 2015 is going to be held at Holiday Inn, Sands Cotai Central
Macao SAR, China, a world class heritage and entertainment city.
TENCON
2015 1-4
dustrial Collaboration: Challenges and Opportunities in Electrical,
Electronic, Computer, Communication and Information Engineering”, the
Holiday Inn,
Sands Cotai Central
The conference will feature world-class keynote speeches, tutorials, exhibits, and
lectures and posters sessions. Prospective authors are encouraged to submit
high-quality technical papers for the following technical tracks.
MACAO Nov
1-4 November 2015
www.ieeetencon2015.org
1CALL FOR
st
PAPERS
Along with IEEE TENCON tradition, with the theme of “Academic-Research-In-
conference will provide a great opportunity to bring together researchers and
engineers from academia to industry for advancing the technology in various
aspects of engineering communities.
• Best paper awards will be given to corresponding technical tracks accordingly.
• Special Sessions: A proposal for a special session can be submitted to
the organizing committee through [email protected] before 1 April
2015.
Technical Tracks
1. Antenna & Microwave Theory and
Applications
2. Biomedical Engineering
3. VLSI, Circuit & Systems
4. Computational Intelligence, Cloud
and Big Data Management
5. Computer Architecture & Systems
6. Devices, Materials & Processing
7. Power, Energy and Power
Electronics
8. Robotics, Control System &
Theory
9.
10.
11.
12.
13.
14.
15.
16.
Signal & Image Processing
Multimedia Engineering
Software & Database System
Wireless Communication &
Networks
Photonic Technologies and
Applications
WIE Track and Humanitarian
Technology
Industrial Articles
Academic-Research- Industrial
Collaboration
Important Dates
•
•
•
•
1 MAR 2015
1 APR 2015
1 MAY 2015
15 JUL 2015
Website opened for submission
Special section proposal deadline
Submission of full drafts of proposed papers
Notification of acceptance or rejection by the respective technical committees.
• 15 JUL 2015 Authors to receive instructions for submission of final conference manuscripts.
• 15 AUG 2015 Deadline for submission of final conference manuscripts
Supporting Societies
SINGAPORE SECTION
CIUR
Organized by
Paper Submissions
Manuscripts must be arranged within 4-6 pages A4, double column, IEEE
conference format and submitted electrically via the conference website:
http://www.ieeetencon2015.org Manuscript format, registration fee, as well as other relevant and up to dated information of
TENCON 2015 will be posted on the website accordingly.
Publication
Presented papers will be submitted to IEEE Xplore for publication.
Honorable Chairs
General Chair
Co-General Chairs
Technical Program Chair
Prof. Rui Martins
Dr. Tak Son Cheang
Dr. Man Chung Wong
Dr. Perry Ping Shum
University of Macau
Prof. Ze Sheng Tang
Macao University of
Science and Technology
Companhia de
Electricidade de Macau,
Macao
University of Macau,
Macao
Dr. Chi Yung Chung
University of
Saskatchewan, Canada
Nanyang Technological
University, Singapore