EFFICIENCY 提升轉換效率 PHOTOVOLTAIC METALLIZATIONS 太陽能導電漿料 目標為於 年達到 的電池轉換效率 DuPont Solamet PV3Nx silver/aluminum paste for p-type emitter ™ ® 杜 邦 Solamet PV3Nx 銀 鋁 漿 – 適 用 於 P型 射 極 ™ ® Fineline printability (for gridlines with screen printing) 細線印刷能力(使用於網版印刷) Fire-through passivation layer 透過燒結穿透鈍化層 Low gridline resistivity (high conductivity) 較低的導線電阻 (較好的導電性) Co-fireable with rear side contacts 可與背面導電漿料共燒 Good solderability and adhesion 好的焊接性與黏著力 DuPont Solamet complete metallization package for higher efficiency ® 杜邦™ Solamet 為高效率電池打造完整的金屬化方案 ™ ® Solamet® PV3Nx or PVD2x (Layer2) Solamet® PV3Nx (Layer1) 985 965 1 945 0 925 2 905 5 885 3 865 10 4 845 Typical firing window 5 825 Solamet® PV17x 15 Gridline resistivity** 805 Rear passivation (e.g. SiNx) 20 Contact resistivity* 785 n+-Si (P-doped BSF) 6 25 (uohm*cm) n-Si (base) Phosphorus BSF DuPont™ Solamet® PV3Nx on 60Ω B-doped emitter ρ c (mohm*cm2) p+-Si (B-doped emitter) Boron emitter Suitable for Single or double printing 可適用於單層或雙層印刷 785 805 825 845 865 885 905 925 945 965 985 Front passivation (e.g. SiNx/SiO2) Contact resistivity on B-doped emitter* 在硼摻雜電極的接觸電阻比較 10 9 30-40% improvement 8 ρ c (mohm*cm2) Copyright © 2013 DuPont. All rights reserved. The DuPont Oval Logo, DuPont™, The miracles of science™, Materials Matter™, Solamet®, Tedlar® and Kapton® are trademarks or registered trademarks of E.I. du Pont de Nemours and Company or its affiliates. Low contact resistivity on B-doped emitter layer 在硼摻雜射極層形成較低的接觸電阻 7 6 5 4 Peak SET T(˚C) 825 845 865 The new generation Solamet® PV3N2 provides 30-40% better contact resistivity on ® B-doped emitter compared to Solamet PV3N1. 新一代Solamet® PV3N2銀鋁漿較Solamet® PV3N1, 在硼摻雜射極層減少30-40%的接觸電阻 3 2 1 0 PV3N1 PV3N2 * Measured by TLM. ** Rgl measured on fired-through contacts. Apparent values calculated assuming uniform line width and height. Crosssectional areas of fired gridlines measured using confocal microscope.
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