1. No category

Halogen-free CCL (D - Type)
D-Type 동박적층 폴리이미드 필름 은
도레이첨단소재의 첨단 케미컬 기술을 기반으로 개발한 접착제를 활용하여 동박과 폴리이미드 필름을
적층한 할로겐 프리 연성인쇄회로기판(FPCB)용 3층 CCL(Copper Clad Laminate)입니다.
TAK’s copper clad polyimide film D-Type is a three layer CCL that laminates copper foil and polyimide
film for FPCB. D- Type CCL is halogen-free and developed with the adhesives of TAK’s advanced chemical technology.
특징
Feature
·고굴곡성 및 미세피치 대응
·For high flexibility & fine pitch FPC
·고신뢰성
·High reliability
·높은 납땜 내열성
·Excellent solder heat resistance
·우수한 접착강도
·Excellent peel strength
·난연성 UL94 V-0
·Flammability UL94 V-0
·우수한 전기적 신뢰성
·Excellent electrical reliability
구성
Structure
Cu Foil
Adhesive
Polyimide Film
Adhesive
Cu Foil
Cu Foil
Adhesive
Polyimide Film
< Double Side CCL >
< Single Side CCL >
제품규격
Specification
Description
Spec.
PI Film(μ
m)
Copper Foil(μ
m)
Adhesive(μ
m)
Width(mm)
Length(m)
10/12.5/25
12/18/35
10
250/500
100
Halogen-free CCL (D-Type) / 01
Halogen-free CCL (D - Type)
대표물성
General Properties
Item
Test Condition
1/2mil PI 1/2oz HTE Double
9D2L-TM55
Competitor A
Competitor B
As received
13
10
10
E-1/180
12
9
9
15
13
12
90°Peel Strength
(N/cm)
Acf Bonding
(N/cm)
Solder
Resistance
(℃)
JIS-C6471.8.1
Single side etching
AC-4251FY-16
(Hitachi)
TAK Method
Double side etching
12
7
8
Normal
pass
pass
pass
330℃, 1min,
Floating
JIS-C6471.9.3
D-24/25 in H2O
Limit Temp’
1min, Floating (non etching)
Normal
Manual
Soldering
Remark
pass
pass
pass
370
360
340
pass
pass
pass
340℃×3sec
TAK Method
TAK Method
D-24/25 in H2O
pass
pass
pass
Initial, 500V
2.2×1012
1.5×1011
2.8×1011
JIS-C6471.7.2
Migration 85/85/1,000, 50V
1.0×1010
1.3×109
2.2×109
-
-0.06
-0.05
-0.06
Insulation
Resistance (Ω)
MD
Dimensional
Stability (%)
Flexibility
Flammability
E-1.0/150
after etching
JIS-C6471.9.6
TD
0.01
0.08
0.09
MIT
L/S=1mm/1mm,
R=0.38
300
290
280
-
IPC
L/S=1mm/1mm,
R=2mm, 1,500rpm
37,000
33,000
30,000
-
IPC
L/S=0.10mm/0.13mm,
R=2mm, 1,500rpm
Above
10million
Above
6million
Above
8million
-
V-0
V-0
V-0
-
UL- 94
Halogen-free CCL (D-Type) / 02
Halogen-free CL (C-Type)
C-Type 폴리이미드 커버레이 필름 은
도레이첨단소재의 할로겐 프리 연성인쇄회로기판용 보호필름입니다.
TAK’s polyimide coverlay film, ‘C-Type’ is a protection film for FPCB which is designed as halogen
-free.
특징
Feature
·미세피치 대응
·For fine pitch FPC
·고신뢰성
·High reliability
·우수한 납땜 내열성
·Excellent solder heat resistance
·우수한 저장 안정성
·Excellent storage stability
·높은 접착강도
·Excellent peel strength
·우수한 전기적 신뢰성
·Excellent electrical reliability
·난연성 UL94 V-0
·Flammability UL94 V-0
구성
Structure
Polyimide Film
Adhesive
Release Paper
제품규격
Specification
Description
Spec.
PI Film(μ
m)
Adhesive(μ
m)
Width(mm)
Length(m)
12.5/25
15/18/25/30/50
250/500
200
Halogen-free CL (C-Type) / 01
Halogen-free CL (C-Type)
대표물성
General Properties
1/2mil PI 25μ
m ADH
Item
Test Condition
90°Peel Strength
(N/cm)
Solder Resistance
(℃)
Remark
9C1L-4S
Competitor A
Competitor B
As received
[H/P condition :
160℃ x 44kgf x 30min]
13
7
5
C-24/40/90
12
6
4
E-3/160
7
6
3
Solder resistance [290℃×1min]
OK
OK
OK
JIS-C6471.
8.1
JIS-C6471.
9.3
After moisture absorption
C-24/40/90
260
240
240
MD
-0.03
-0.05
-0.07
Dimensional
Stability (%)
JPCA-BM02
7.11
Insulation
Resistance (Ω)
TD
-0.03
-0.06
-0.12
Initial, 500V
2.0×1011
1.3×1010
3.5×1010
JIS-C6471.
7.2
Migration with 3layer CCL
85/85/1,000, 50V
6.0×109
2.5×108
5.0×108
-
13
7
5
HCl (2N)
Chemical
Resistance
(N/cm)
IPC-FC241
B232
D-10min/23
NaOH (2N)
m)
Resin Flow (μ
MIT
12
6
4
[H/P condition :
160℃×44kgf×30min]
130
105
100
With 3 layer CCL, R=0.38,
1mm/1mm
4,600
4,100
4,700
With 3 layer CCL
Above
10million
Above
10million
4.6 million
1/2 life(hr, 45℃)
>250
90
70
Flexibility
TAK Method
IPC
Storage Stability
1/2 life(day, 25℃)
>40
30
26
Tg (℃)
DMA
106
76, 105
70
-
Flammability
UL- 94
V-0
VTM-0
V-0
-
Halogen-free CL (C-Type) / 02
Halogen-free White Coverlay
White Coverlay 는
뛰어난 신뢰성과 반사효율로 기존 White ink가 가지고 있는 크랙 발생 문제와 도포 작업성 문제를
해결한 제품입니다.
TAK’s white coverlay has not only excellent reliability and reflectance efficiency
but also excellent printability and crack problem resolved products from white ink.
특징
Feature
·고굴곡성, 크랙 방지 특성
·High flexibility, anti-crack property
·고반사율
·High reflectance
·우수한 저장 안정성
·Excellent storage stability
·높은 접착강도
·Excellent peel strength
·난연성 UL94 V-0
·Flammability UL94 V-0
Protection Film
구성
Structure
/25㎛(PET)+10㎛(PSA)/Protection of White Layer
White Layer
15㎛ / Reflecting Light from LED
Polyimide Film
12.5 or 25㎛ / Substrate
Adhesive
15 to 25㎛ / Adhesion to CCL
Release Paper
※Name of layer
130㎛ / Protection of Adhesive
제품규격
Specification
대표물성
General Properties
Thickness / Function
Description
Spec.
PI Film(μ
m)
Adhesive(μ
m)
Width(mm)
Length(m)
12.5/25
15/18/25/30/50
250/500
200
1. Properties of White Coverlay
Product
Item
m)
Thickness(μ
90°Peel Strength
(N/cm)
Solder Resistance(℃)
Dimensional
Stability(%)
Resin Flow(μ
m)
Curl(mm)
Flammability
Test Condition
PI/Adhesive
Release Film
As received
[H/P condition :
160℃×44kgf×30min]
280℃×1min floating
MD
TD
[H/P conditon :
160℃×44kgf×30min]
TAK Method
UL94 : Project Number
09CA63868
TAK
White Coverlay
Test Method
12.5
130
JIS-C6471. 6.2
14.2
JIS-C6471. 8.1
OK
-0.06
-0.02
JIS-C6471. 9.3
JIS-C6471. 9.6
130
TAK Method
2
TAK Method
V-0
-
Halogen-free White Coverlay / 01
Halogen-free White Coverlay
대표물성
General Properties
2. Properties of White Layer
Property
Item & Treatment
Thickness
Reflectance
[AVE./550nm]
Optical
Property
Color value
[L*a*b*]
Whiteness
[W]
Unit
White layer
Mechanical
Property
Thermal
Property
Electronic
Property
JIS-C6471 6.2
80.93
82.67
JIS-Z8722
After soldering test
80.24
82.59
(Color-meter,
N社 SA-2000)
81.55
82.88
C-240/40/90
81.7
81.63
Thermal shock test
80.78
82.14
100℃×15days
%
After hot press
92.59/0.04/-1.22
After soldering test
92.37/-0.18/-1.01
100℃×15days
-
92.10/-0.05/-1.36
C-240/40/90
92.69/-0.49/-1.15
Thermal shock test
92.40/0.01/-1.68
After hot press
91.73
After soldering test
91.49
100℃×15days
-
91.11
Thermal shock test
91.19
After reflow
1~3 times
After soldering test
(280℃)
After reflow
1~3 times
After soldering test
(280℃)
Bending test
After H/P
Chemical resistance
with MEK
After reflow
1~3 times
After soldering test
(280℃)
CTE (Coefficient of
thermal expansion )
JIS-C8729
-40℃ ↔ 125℃
×100cycle
-40℃ ↔ 125℃
×100cycle
H
5B
~
5H
H
JIS-K5400
H
OK
OK
or
NG
OK
JIS-D0202
OK
OK
TAK Method
OK
OK
or
NG
MD
TD
-40℃ ↔ 125℃
×100cycle
ASTM E313
91.83
C-240/40/90
After H/P
Chemical
Property
15
μ
m
After H/P
Cross-cutting
Test Method
After hot press
After H/P
Surface hardness
[pencil hardness]
White Layer
ppm/℃
OK
TAK Method
OK
15.36
ASTM D696
15.96
Temp. range :
100~200℃
Surface resistance
Ω
1.54×1014
Insulation resistance (max 5kV×60sec)
-
○
Dielectric constant
-
1MHz : 2.57
1GHz : 2.43
JIS-C6471 7.2
IPC-TM-650
Halogen-free White Coverlay / 02
Lead Lock Tape RF-351ES
RF-351ES 는
단면 열경화성 접착 테이프입니다. 고온에 대한 우수한 저항성을 지녔으며 구리(Cu) 리드프레임에 대한
뛰어난 접착력이 있는 리드프레임의 리드 고정용 테이프입니다. 고온 혹은 높은 전기적 신뢰성을 요구하는
패키지에 적합한 리드 고정용 테이프입니다.
RF-351ES is a single side thermosetting adhesive.
It has outstanding thermal resistance and adhesion for copper type lead frame.
This applies to lead locking for high reliability type package.
특징
Feature
·낮은 작업 온도
·Lower operation temperature
·우수한 접착 특성 및 전기적 신뢰성
·Excellent adhesion property & electrical reliability
·Wire Bonding시 공정 안정성
·Safety on wire bonding process
·우수한 CPO(Copper Peel Off) 안전성
·Good CPO property
구성
Structure
Cover Film : PET (38μ
m)
m)
Adhesive : Epoxy (20μ
Base Film : Polyimide (50μ
m)
제품규격
Specification
Cover Film
Adhesive
Base Film
Type
m)
Thickness(μ
Thickness(μ
m)
Type
Thickness(μ
m)
PET
38
20
Polyimide
50
Lead Lock Tape RF-351ES / 01
Lead Lock Tape RF-351ES
대표물성
General Properties
Property
Unit
Condition/Value
Method
Electrical
Reliability
-
Open
(Nothing)
Thermal Treat : 170℃ / 5hr
HAST : 130℃ / 85% RH / 20V / 200hr
Ion Impurity
Na+
K
+
0.46
ppm
100g of deionized water + 10g of tape
after thermal processing
0.28
Cl-
0.43
SO42-
0.63
Thermal Processing : 175℃ / 1hr
Extracted by PCT : 121℃ / 2atm / 20hr
pH
-
6.6
Conductivity
㎲/cm
33
Out Gas
%
0.6
Weight Loss for 5hr at 175℃
CPO
-
Pass
310℃ / 5min
Adhesive
Strength
Bleed Out
g
μ
m
130℃
145
Taping Condition : ℃ / 10Kg / ㎠ / 0.25sec
150℃
248
Lead Frame : 40 PIN DIP
170℃
363
Measured by Push Pull Gauge(Pushing)
130℃
40
Lead frame
150℃
48
Tape
170℃
60
Bleed Out
Young’
s
Modulus
Dyne/㎠
0.04 X 1010
Taping after thermal processing was measured
by DMA
Thermal Processing : 175℃ / 1hr
Lead Lock Tape RF-351ES / 02
Lead Lock Tape HL-150
HL-150 은
열경화성 접착제가 도포된 단면 폴리이미드 테이프입니다. 합금(Alloy)용 리드프레임에 적용할 수 있도록
개발되었으며, 내열성과 접착력이 우수합니다. 낸드 플레시 메모리 패키지에 적용 가능한 리드 고정용
테이프입니다.
HL-150 is a single side polyimide tape coated with thermosetting adhesive.
It has outstanding thermal resistance and adhesion for alloy type lead frame.
This applies to lead locking for Nand Flash Memory.
특징
Feature
·낮은 온도에서 Wire Bonding 가능
·Lower wire bonding temperature
·우수한 전기적 신뢰성
·Excellent electrical reliability
·우수한 CPO(Copper Peel Off) 안전성
·Good CPO property
·리드프레임에 높은 접착력
·Higher adhesion on lead frame
구성
Structure
Cover Film : PET(38μ
m)
m)
Adhesive : Epoxy (25μ
Base Film : Polyimide(25μ
m)
제품규격
Specification
Cover Film
Adhesive
Base Film
Type
m)
Thickness(μ
Thickness(μ
m)
Type
Thickness(μ
m)
PET
38
25
Polyimide
25
Lead Lock Tape HL-150 / 01
Lead Lock Tape HL-150
대표물성
General Properties
Property
Adhesion
Strength
Resin Flow
(RF)
Unit
g/cm
μ
m
Ion Impurity
Condition/Value
Method
Temp. (℃)
Ad (g)
130
1,200
140
1,700
150
2,050
160
2,250
170
1,700
180
1,800
Temp. (℃)
RF (μ
m)
130
410
140
690
150
750
160
1,260
170
1,280
180
1,780
Specimen : 10mm X 70mm
Taping Tool : Hot Press
Taping Condition : 10Kgf / X ℃ / 1sec
Substrate : Copper Foil
Measurement : Instron
Specimen : 10mm X 70mm
Taping Tool : Hot Press
Taping Condition : 30kgf / X℃ / 10sec
Substrate : Lead frame
Measurement : Microscope
0.41
Na
+
NH4+
1.34
Cure Condition : 175℃ / 1hr
0.46
Measurement : Ion Chromatography
ppm
Cl-
1.51
SO42pH
-
5.3
Thermal
Decomposition
Temp.
℃
> 400
Out Gas
%
Measurement : pH meter
10℃ / min / Nitrogen
Measurement : TGA
1.1
Weight Loss after 5hr at 175℃
Lead Lock Tape HL-150 / 02
QFN Masking Tape TQ-128P
TQ-128P QFN 테이프 는
핫 프레스 방식으로 리드 프레임 후면에 부착되어 QFN 제조 공정 간 몰드 플러쉬를 방지하는 마스킹
테이프 제품입니다. 기존 제품의 Wire-Bond 바운싱 및 Warpage 취약점을 개선하였으며 플라즈마 클리닝
후 테이프 제거 시 점착제 잔사가 없는 특징을 자랑합니다.
TQ-128P is attached to the backside of QFN lead frame by hot press machine in order to prevent EMC
mold flush during EMC mold process while supporting firm die attach, wire bond process and removed
easily with heat after the encapsulation, and left no adhesive residue on the lead frame or the EMC
surface even after plasma cleaning process. TQ-128P features good wire-bondability and low warpage
and applicable for various plasma cleaning methods.
특징
Feature
·실리콘 점착제 미사용
·Non-silicone type adhesive
·우수한 내열성
·Excellent heat resistance
·낮은 점착 온도로 Warpage 최소화
·Less warpage by low temperature taping
·테이프 박리 용이 및 점착제 잔사 없음
·Clean detaping with heat
구성
Structure
m)
Adhesive : Thermoplastic(3μ
Base Film : Polyimide (25μ
m)
제품규격
Specification
Item
Unit
TQ-128P
Thickness of Polyimide Film
μ
m
25
Thickness of Adhesive Layer
μ
m
3
Total Thickness
μ
m
28 ± 4 (PI + Adhesive)
Appearance
-
Amber colored film
Width
mm
Required width ± 0.2
Length
m
Requested length
Inside Diameter
mm
As requested
Color
-
As requested
Material
-
As requested
Core
QFN Masking Tape TQ-128P / 01
QFN Masking Tape TQ-128P
대표물성
General Properties
Classification
TQ - 128P
Adhesive Type
Thermoplastic
Adhesion at Room Temperature
None
Structure (Adhesive / Film)
3/25
Lamination Condition
170 ~ 230 °
C, 2 ~ 6 MPa, 8 ~ 12 sec
Hot Pressing
5% Weight Loss Temperature ( °
C)
> 400
Glass Transition Temperature ( °
C)
112
Tensile Modulus (MPa)
4, 262 ± 215
Outgas (%) ± 0.1
1.1
Detaping Temperature (°
C)
160 ~ 180
220/170 °
C, Hot pressing
Warpage (mm, model L/F, PPF, 8 mil)
Avg. < 0.1
Peel Strength
(N / m, model L / F, PPF,
recommended lamination condition)
After the lamination
117
on L / F
◎
on EMC
◎
L / F Imprint*
(After detaping)
L / F pattern
Impressed on adhesive
◎
Void
After the lamination
◎
Adhesive Residue
(After detaping without chemical deflash)
·*Good imprint indicates less probability of mold bleed-out or flush
·◎ Excellent ○ Good △ Nomal X Bad
공정 프로세스
Production Process
Lamination
TQ-128P
Die Attachment
Wire Bonding
Encapsulation
Tape Removal
175℃×max. 2hr
220℃×max. 45 min
180℃×3 min
160 ~ 180℃
TQ-128P
TQ-128P
TQ-128P
QFN Masking Tape TQ-128P / 02
QFN Masking Tape EX-RE
EX-RE
제품 은
Die Attach 및 Wire Bonding 공정 완료 후 QFN 리드 프레임에 부착하는 상온 점착 마스킹 테이프입니다.
우수한 Wetting성 구현으로 Roll 및 Press type 라미네이션 설비에 공통적으로 적용 가능한 제품입니다.
비실리콘계 점착제 적용으로 실리콘 전사 위험을 방지하였으며, 견고한 L/F 표면 부착 특성으로 EMC
몰드 플러쉬 특성을 크게 개선한 제품입니다.
QFN tape ‘EX-RE’ is laminated on the backside of QFN lead frame to prevent mold flush during molding process. EX-RE is widely referred to ‘Post tape’ which is attached on the lead frame after die
attach and wire bonding process. Excellent wettability of EX-RE enables roll and dambar press machine
lamination and acrylic rubber based adhesive guarantees no silicon contamination. Firm adhesion to
lead frame minimizes mold flush defect.
특징
Feature
·상온 박리 특성 및 점착제 잔사 없음
·RT detaping
·우수한 점착제 내열성
·High thermal resistance
·상온 점착 특성 및 다양한 설비 적용 가능
· Roll and dambar press lamination
No additional deflash process require
at room temperature
구성
Structure
Cover Film : PET (38μ
m)
m)
Adhesive : Acrylic (6μ
Base Film : Polyimide (25μ
m)
제품규격
Specification
Item
Unit
EX-RE
Thickness of Polyimide Film
μ
m
Avg. 25
Thickness of Adhesive Layer
μ
m
Avg. 6
Total Thickness
μ
m
31 ± 4 (PI + Adhesive)
Appearance
-
One side of dark orange
colored polyimide film
and the other side of
transparent polyester film
Width
mm
Required width ± 0.1
Length
m
50, 100, 150, 200, 250 + 0.2
Lamination Condition
Temperature
°
C
25
Detaping Condition
Temperature
°
C
25
-
Wind tape with
the cover film inside
Lamination Condition
QFN Masking Tape EX-RE / 01
QFN Masking Tape EX-RE
대표물성
General Properties
Adhesive Type
Acrylic/Rubber
Lamination Type
Roll & Dambar Press Lamination
Release Film
38 (PET)
Adhesive
6 (Acrylic/Rubber)
Base Film
25 (PI film)
Tape Construction
m)
(μ
Peel Strength(180°peel 300mmpm)
Detaping Conditions
■ 몰드플러쉬
Acrylic
40~100
Rubber
20↓
at RT(gf/25mm, copper)
RT
비교 Data(Mold Flush Comparison Data)
Causes of Mold flush ppm and Glue ppm(Fvi Result)
Ref. tape
EX-RE
Mold
Defression
Tape Related
FM
Bubble
Shifted Lead
Glue
Identified causes of mold flushes
공정 프로세스
Production Process
D/A and W/B
Tape Attachment
EX-RE Tape
Encapsulation
Tape Removal
EX-RE Tape
QFN Masking Tape EX-RE / 02
Package Spacer Tape TP Series
TP
Series 는
메모리 카드 및 기타 패키지 제조용 Die attach 테이프로 폴리이미드 필름에 양면 접착제가 도포된 형태
입니다. Silicon die 및 PCB에 대한 높은 접착력과 우수한 신뢰성을 확보한 제품으로 현재 Micro SD
Memory Card 제조에 널리 적용 되고 있습니다.
TP Series is a double side polyimide tape coated with thermosetting adhesive. It has outstanding
adhesion strength and reliability to die and PCB. It is widely applied to micro SD memory card.
특징
Feature
·낮은 접착 온도 및 우수한 전기적 신뢰성
·Lower bonding temperature & higher
·낮은 Out gas
·Lower level of out gas
·우수한 작업성 확보
·Good workability
eletrical reliability
구성
Structure
Cover Film : PET(50μ
m)
Adhesive : Epoxy(12μ
m)
Base Film : Polyimide (25μ
m or 50μ
m)
Adhesive : Epoxy(12μ
m)
제품규격
Specification
Item
Unit
Specification
Thickness of Polyimide Film
μ
m
25, 50 ± 2.5
Thickness of Adhesive Layer
μ
m
12 ± 1.2(each side)
Total Thickness
μ
m
49, 75 ± 4.9
Appearance
-
None of harmful defects in practical use as follows
1)Unevenness, damage, alien substance
Splice
number
0
Width
mm
Required width ± 0.1
Length
Width 10mm under
Width 10mm over
Core
Winding Method
m
80~100
250~285
Inside Diameter
mm
77 ± 0.5
Color
-
Red
Material
-
ABS
-
Wind tape with the cover film inside or outside
Package Spacer Tape TP Series / 01
Package Spacer Tape TP Series
대표물성
General Properties
Property
Unit
Condition/Value
Die Shear
Strength
kg
16.6 (RT)
Method
175℃ / 1hr Cured
Dage - 4000,
Die Size : 80×80
Ion Impurity
Before Cure
After Cure
Na+
1.7
1.9
Cure Condition : 175℃ / 1hr
Measurement : Ion Chromatography
K+
ppm
Cl-
ND
ND
0.7
0.4
pH
-
5.2
4.9
pH Meter
Conductivity
㎲ / cm
44.9
21.5
Measurement : Ion Chromatography
2.79 (25℃)
3.79 (25℃)
1.88 (130℃)
2.67 (130℃)
1.75 (175℃)
2.38 (175℃)
153 (25℃)
191 (25℃)
51.3 (130℃)
112 (130℃)
50.8 (175℃)
69.9 (175℃)
Storage
Modulus
Loss
Modulus
Tg
GPa
MPa
℃
Cure Condition : 175℃ / 1hr
by DMA
86℃
1.77 (PI Film + Adhesive)
Moisture
Absorption
%
0.15 (Adhesive)
85℃ / 85%RH / 48hr
1.62 (PI Film)
Package Spacer Tape TP Series / 02
FPCB용 Carrier Film RCF Series
RCF
Series 는
FPCB 완제품 운송 중 이물유입 및 스크래치 방지, 외부충격으로부터 제품을 보호하기 위한 포장용 Carrier
Film입니다. 안정적인 점착 특성과 비실리콘계 점착제의 사용을 통해 전사문제를 완벽히 해결하여 고객에게
다양한 편의를 제공하고 있습니다.
TAK’s RCF series are speically designed for carrying complete FPCB, preventing scratch, the influx of
foreign materials from outside and to minimize external shocks.
It provides stable viscosity which is ideal for FPCB packing process. By using non-silicone type PSA
TAK’s RCF series can help solving residue & contamination issue.
·FPCB 포장 공정에 적합한 점착력
특징
Feature
·Appropriate viscosity
- Ideal property for FPCB packing process
·非오염 및 전사 타입 - 非실리콘 타입 점착제 사용 ·No contamination and residue from adhesive
- Non-silicone type PSA
·Good storage life
·안정적인 경시안정성 확보 - 6개월 보증
- No deterioration after aging
- Stable over 6 months
·우수한 전기적 특성
·Excellent electrical reliability
구성
Structure
Cover Film : PET (125μ
m)
m)
Adhesive : PSA (10μ
Release Film : PET(38μ
m)
대표물성
General Properties
Item
Unit
Base Film Thickness
Product type
RCF125A
RCF125B
μ
m
125±2
125±2
Release Film
Thickness
μ
m
38±1
38±1
Total Thickness
μ
m
178±4
178±4
Peel Strength
g.inch
130±20
90±20
PSA Peel Off
Residue
Visual
Residue Free
Residue Free
Elongation
%
> 70
> 70
Tensile Strength
Kgf / cm
> 8.5
> 8.5
Appearance
-
Transparent
Transparent
Test Method
ASTM D3652
TAK Method
- Peel off speed : 50mm/min
- Peel off angel : 90 °
- Peel off substrate : 1mil PI film
Room temperature peel off
ASTM D3759
Visual Test
·Note : Above properties are typical and should not be used for any specification purpose
FPCB용 Carrier Film RCF Series / 01
FPCB용 Carrier Film RCF Series
공정 프로세스
General Process Flow
① Slitting
⑤ Pre-Attaching
② Drilling
⑥ Hot Pressing
③ Copper Plating
⑦ Post-Manufacturing
④ Etching
⑧ Final Inspection
적용
Application
PET Seperator
Acrylic Adhesive
Base Film (PET)
PET Seperator
Coverlay
CCL
Acrylic Adhesive
Base Film
FPCB용 Carrier Film RCF Series / 02