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March 15-19, 2015
San Jose, CA
Schedule of Events
Short Courses
Sunday, March 15, 2015
Tuesday March 17, 2015
7:00 a.m. – 5:00 p.m.
Bayshore Ballroom Foyer
Attendee Registration
1:00p.m. – 5:00 p.m.
San Jose
SHORT COURSE 1: Crash Course on Packaging Technologies and Thermal Design of ICs
Dr. Li Li Cisco Systems
Dr. Herman Chu Pi – Coral
7:00 a.m. – 7:45 a.m.
Speakers’ Breakfast March 17 Speakers
Session Chairs and Co – Chairs only
8:00 a.m. – 12:00 p.m.
Exhibitor Set Up
1:00p.m. – 5:00 p.m.
Monterey
SHORT COURSE 2: Use of Flow Network Modeling
(FNM) for Improving Productivity of Design of
Electronics Cooling Systems
Dr.Kanchan M. Kelkar Innovative Research, Inc.
Dr. Sukhvinder Kang Aavid Thermalloy
Short Courses
8:10 a.m. – 9:10 a.m.
Oak/Fir
Keynote Address: Flexible Data Center Design
Dr. Chris Malone, Principal Engineer Google, Inc.
9:10 a.m. – 9:30 a.m.
Coffee Break
8:00a.m. – 12:00 p.m.
San Jose
SHORT COURSE 3: Thermal Transient Characterization and Simulation of Electronics Devices with
Multiple Heat Sources
Dirk Schweitzer Infineon Technologies AG
Using Platform Level Telemetry to Reduce Power
Consumption in a Datacenter
Jay L. Vincent and John Kuzma, Intel Corporation
1:00p.m – 5:00 p.m.
Monterey
SHORT COURSE 4: Three – Dimensional Packaging:
Manufacturing and Thermal Concerns
Dr. Jesse Galloway Amkor Technology
Modeling Perforated Tiles In Data Centers – What Is
required?
Mark Seymour, Future Facilities
Optimal Design and Distributed Automatic Discrete
Control of Air Conditioning Units in Data Centers
Sergio A. Bermudez, Hendrik F. Hamann, Levente J. Klein,
Fernando J. Marianno, Alan Claassen, IBM
1:00 p.m. – 6:00 p.m.
Bayshore Ballroom
SEMI – THERM Exhibitor Check – in and Set up
Bayshore Ballroom Foyer
5:00 p.m. – 6:00 p.m.
Welcome Reception
Bayshore Ballroom Foyer
Optimum Design for Thermoelectric in a Sub-cooled
Trans-critical CO2 Heat Pump
for Data Center Cooling
Kazuaki Yazawa, Supriya Dharkar, Orkan Kurtulus, Eckhard
A. Groll, Purdue University
Optimize Datacenter Management with Multi-Tier
Thermal-Intelligent Workload Placement
Chuan Song, Chun Wang, Nishi Ahuja, Xiang Zhou, Abishai Daniel, Intel Corporation
6:30 p.m. – 8:30 p.m.
Santa Clara
SEMI – THERM Program Committee Meeting
www.semi-therm.org
Gateway Foyer
Parallel Sessions
Oak and Fir
9:30 a.m. – 10:50 a.m.
Oak
Session 1: Data Center 1
Session Chair: Nishi Ahuja Intel Corporation
Session Co – Chair: Federica Maggioni KULeuven
Carmel
3:30 p.m. – 6:00 p.m.
Attendee Registration
Bayshore Ballroom
8:00 a.m. – 8:15 a.m.
Oak/Fir
Symposium Opening and Welcome by Conference
Chair
Peter Rodgers The Petroleum Institute, UAE
Monday, March 16, 2015
12:00p.m. – 1:00p.m.
SHORT COURSE LUNCH
San Jose
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March 15-19, 2015
San Jose, CA
Schedule of Events
12:40 p.m. Luncheon Speaker Dr. M. Saif Islam
Nitride-Enabled Extreme Integrated Systems
Tuesday, March 17, 2015 Continued
9:30 a.m.
Session 2: Mobile and Graphics Challenges
Chair: Hussameddine Kabbani
2:00 p.m. Vendor Workshops
5:00 p.m.
Teardown Sessions
6:00 p.m.
Dinner
Sensor Placement for Surface Temperature Control in
Thin Mobile Form Factors
Cathy Biber, Intel Corporation
Thermal Management Challenges in Forced Convection
Tablets
Bharath Nagendran, Arun Raghupathy, William Maltz,
Electronic Cooling Solutions Inc.
7:00 p.m.
Evening Speaker Dr. Ravi Mahajan
Influence of Temperature Control Limits on Passively
Cooled Computing System Performance
Mark C Carbone, Intel Corporation
Wednesday, March 18, 2015
8:10 a.m.
Session 4: Modeling and Characterization Chair:
Marta Rencz
Thermal Management in Mobile Devices: Challenges
and Solutions
Yin Hang, Comtech Xicom Technologies
Hussameddine Kabbani, NVIDIA
Micro Loop Heat Pipe for Mobile Electronics Applications
Takeshi Shioga and Yoshihiro Mizuno, Fujitsu Laboratories Ltd.
Transient Power Analysis to Estimate the Thermal
Time Lag of the Microprocessor Hot Spot
Anjali Chauhan, Bahgat Sammakia, Kanad Ghose, Binghamton University
11:20 a.m.
Embedded Tutorial:
Overview of Thermal Challenges of 2.5/3D Integration
Herman Oprins, IMEC
Sub Diffraction Limit Thermal Imaging for HEMT
Devices
Amirkoushyar Ziabari, Je-Hyeong Bahk, Yi Xuan, Peide D
Ye, Ali Shakouri, Purdue University
Dustin Kending, Kazuaki Yazawa, Microsanj, LLC
Peter G Bruke, Hong Lu, Arthur C Gossard, University of
California, Santa Barbara
11:20 a.m.
Session 3: Harsh Environments
Chair: Ross Wilcoxon
Heat Spreading Revisited - Effective Heat Spreading
Angle
Dirk Schweitzer and Liu Chen, Infineon Technologies AG
Innovative Molybdenum Carbide (MoC) – Graphite
Composite for Thermal Management
and Thermal Shock Applications
A. Bertarelli, F. Carra, M. Garlasche, P. Gradassi, J. Guardia
Valenzuela, S. Sgobba, T.Tsartati,
European Organization for Nuclear Research (CERN)
Green’s Function Solution for Dual-Phase-Lag Heat
Conduction Model in Electronic Nanostructures
Marcin Janicki, Mariusz Zubert, Agnieszka Samson,
Tomasz Raszkowski, Andrzej Napieralski,
Lodz University of Technology
Analytical Stress Modeling for TSVs in 3D Packaging
Ephraim Suhir, Portland State University, and ERS Co.
A Novel Design of Hybrid Slot Jet and Mini-Channel
Cold Plate for Electronics Cooling
Feng Zhou, Ercan M. Dede, Shailesh N. Joshi, Toyota
Research Institute of North America
3D-Convolution Based Fast Transient Thermal Model
for 3D Integrated Circuits:
Methodology and Applications
Federica Lidia Teresa Maggioni and Martine Baelmans,
KULeuven
Herman Oprins, Dragomir Milojevic, Eric Beyne, Ingrid De
Wolf, IMEC
Experimental Investigation of Designer Working Fluids
in a Flat Heat Pipe
Jacob Supowit, Kouhei Yamada, Ivan Catton, University of
California, Los Angeles
www.semi-therm.org
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March 15-19, 2015
San Jose, CA
Schedule of Events
Wednesday March 18 Continued
Electro-Thermal Modeling of Trench-Isolated SiGe
HBTs using TCAD
Konstantin O. Petrosyants, Moscow Institute of Electronics and Mathematics, Rostislav A. Torgovnikov, Institute
for Design Problems in Microelectronics
8:10 a.m.
Session 5: Data Center II
Chair: Veerendra Mulay
A Dynamic Model of Failure Scenarios of the Dry
Cooler in a Liquid Cooled Chiller-Less Data Center
Tianyi Gao, James Geer, and Bahgat Sammakia, SUNYBinghamton University
Milnes David and Roger Schmidt, IBM
Innovative Approaches of Experimentally Guided CFD
Modeling for Data Centers
Husam A Alissa, Kourosh Nemati, Bahgat Sammakia,
Kanad Ghose, Binghamton University
Mark Seymour, Future Facilities, Roger Schmidt, IBM Corp.
HTA Corrosion Resistant Technology for Free Cooling
Yongzhan He, Guofeng Chen, Wei Wei, Qiujiang Liu, Jiajun
Zhang, Tianyu Zhou, Pinyan Zhu, Yongzhong Zhu, Chao
Liu, Baidu Corporation, Nishi Ahuja, Intel Corporation
Retrieving Heat Transfer Coefficient Temperature
Dependence from Measurement Data
Tomasz Torzewicz, Andrzej Czerwoniec, Marcin Janicki,
Andrzej Napieralski , Lodz University of Technology
Evaluation of Modified Body Force (MBF) Model for
Rapid Air Flow Modeling through Perforated Tiles
Vaibhav K. Arghode and Yogendra Joshi, Georgia Institute
of Technology
Steady State CFD Modeling of an IT Pod and its Cooling System
Suhas Sathyanarayan, Betsegaw Gebrehiwot, Vishnu
Sreeram, Digvijay Sawant, Dereje Agonafer,
University of Texas, Arlington, Naveen Kannan, James
Hoverson, Mike Kaler, Mestex Corp.
On Demand Cooling with Real Time Thermal Information
Shu Zhang, Xiaohong Liu, Yu Han, Liyin Liu, Shuiwang Liu,
Yeye Shen, Alibaba Group Nishi Ahuja, Intel Corporation
Key Considerations to Implement High Ambient Data Center
Shu Zhang, Nishi Ahuja, Yu Han, Huahua Ren, Yanchang
Chen, Guangliang Guo, Alibaba Group
Nishi Ahuja, Intel Corporation
Factors that Affect the Performance Characteristics of
Wet Cooling Pads for Data Center Applications
Vishnu Sreeram, Betsegaw Gebrehiwot, Suhas Sathyanarayan, Digvijay Sawant, Dereje Agonafer,
University of Texas, Naveen Kannan, James Hoverson,
Mike Kaler, Mestex Corp.
Experimental Characterization of the Rear Door Fans
and Heat Exchanger of a Fully-Enclosed,
Hybrid-Cooled Server Cabinet
Kourosh Nemati, Tianyi Gao, Bruce T. Murray, Bahgat
Sammakia, Binghamton University
Effect of Warm Water Cooling for an Isolated Hybrid
Liquid Cooled Server
Alekhya Addagtala, John Fernandes, Divya Mani, Dereje
Agonafer, University of Texas, Arlington
Veerendra Mulay, Facebook Inc
10:40 a.m.
Thermi Award
Christian Belady, General Manager, Data Center
Services, Microsoft
11:30 a.m.
Session 6: Dialog Session
Chair: George Meyer
12:40 p.m. Lunch Break
Luncheon Speaker Dr. Syed Hossainy
Application and Characterization of Soft Tissue
Ablation by Radio Frequency
Anemometric Tool for Air Flow Rate Measurement
through Perforated Tiles
in a Raised Floor Data Center
Vaibhav K. Arghode, Taegyu Kang, Yogendra Joshi, Georgia Institute of Technology
Wally Phelps, Murray Michaels, Degree Controls
www.semi-therm.org
2:00 p.m. Vendor Workshops
6:00 p.m. How to Courses
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March 15-19, 2015
San Jose, CA
Schedule of Events
Thursday, March19, 2015
Thermal Performance and Reliability Assessment of
Nano-sintered Silver Die Attach Materials
Ross Wilcoxon, Mark Dimke, Chenggang Xie, Rockwell
Collins
Parallel Sessions
8:10 a.m.
Session 7: Measurements and Characterization I
Chair: Kazuaki Yazawa
Performance of Low Melt Alloys as Thermal Interface
Materials
Chandan K. Roy, Sushil Bhavnani, Mike Hamilton, Roy W.
Knight, Daniel K. Harris…Auburn University
Wayne R. Johnson, Tennessee Tech University
Experimental Characterization of Thermally
Enhanced Polymer Composite Heat Exchangers
Peter Rodgers, Antoine Diana, Shrinivas Bojanampati,
Sean Dewinter, Vishal Krishna, Pulkit Gulati, Valerie
Eveloy, Loutfi El Sayed , The Petroleum Institute
9:40 a.m.
Session 9: Measurements and Characterization II
Chair: Peter Rodgers
Temperature Sensitivity and Noise in Thermoreflectance Thermal Imaging
Alexander Shakouri and Dustin Kendig, Microsnaj LLC
Mohamed El Sayed Kayed, Amirkoushyar Ziabari, Bjorn
Vermeersch, Je-Hyeong Bahk, Ali Shakouri … Purdue
University
Localized TIM Characterization using Deconstructive
Analysis
Phillip Fosnot and Jesse Galloway, Amkor Technology
Application of the Transient Dual Interface Method in
Test Based Modeling of Heat-sinks Aimed at Socketable LED Modules
András Poppe, Mentor Graphics, Mechanical Analysis
Division
Gusztáv Hantos, János Hegedűs,, Budapest University of
Technology and Economics,
Local Thermal Measurements of a Confined Array of
Impinging Liquid Jets for Power
Electronics Cooling
John F. Maddox, Roy W. Knight, Sushil H. Bhavnani,
Auburn University
Transient Junction Temperature Measurements of
Power MOSFETs in the µs Range
Michael Ebli, Martin Pfost, Christoph Wendel, Robert
Bosch Centre for Power Electronics, Reutlingen University
Thermal Measurements on Flip-chipped System-onChip Packages
with Heat Spreader Integration
Rafael Prieto, Perceval Coudrain, Didier Campos, Alexis
Farcy, STMicroelectronics
Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet,
Séverine Cheramy, CEA Leti Minatec
Yvan Avenas, University of Grenoble Alpes
The Heat Transfer Performance in a Square Channel
Downstream of a Representative Shape Memory
Alloy Structure for Microfluidics Applications
Alistair Waddell, Jeff Punch, University of Limerick
Jason Stafford, Nick Jeffers, Alcatel-Lucent
8:10 a.m.
Session 8: Advanced Materials
Chair: Dave Saums
9:50 a.m.
Session 10: Computational Dynamics Analysis Modeling
Chair: William Maltz
Development and Application of Thermally Functionalized Structural Materials for Heat Spreading
in Handheld Devices
Aaron Vodnick, Robert Willis, Joseph Kaiser, Materion
Corporation
www.semi-therm.org
An Efficient Transient Thermal Model for Electronics
Thermal Management Based on Singular Value Decomposition
Xiao Hu, Sivasubramani Krishnaswamy, Saeed Asgari,
Scott Stanton, ANSYS Inc.
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March 15-19, 2015
San Jose, CA
Schedule of Events
11:10 a.m.
Session 12: Quality and Reliability
Chair: Rahima Mohammed
Thursday, March19, 2015 Continued
Parallel Sessions
Optimizing Component Reliability in Datacenters
using Predictive Models
Abishai Daniel and Nishi Ahuja, Intel Corp.
Application of a Multilevel Unstructured Staggered
Solver to Thermal Electronic Simulations
Viacheslav Semin, Mark Bardsley, Oliver Rosten, Chris
Aldham, Future Facilities Limited
Bubble Behavior in Microchannel with Saturated and
Subcooled Boiling
Wang Wen, Zhuan Rui, Shanghai Jiao Tong University
Range and Probabilities of LED Junction Temperature
Predictions based upon Forward Voltage Population
Statistics
James Petroski, Mentor Graphics
Thermal Management of Lithium-ion Battery Pack
with Liquid Cooling
Lip Huat Bernard Saw, Andrew A. O. Tay, National University of Singapore
Lizheng Winston Zhang, Novark Technology Inc.
Lifetime Estimation of Power Electronics Modules
Considering the Target Application
Attila Szel, Zoltan Sarkany, Marton Bein, Robin Bornoff,
Andras Vass-Varnai, Marta Rencz,,,,,,
Mentor Graphics, Mechanical Analysis Division
11:10 a.m.
Session 11: Enhanced Heat Transfer
Chair: Pablo Higaldo
Nanoscale Coating for Microchannel Cooler Protection in High Powered Laser Diodes
Tapan G. Desai, Matthew Flannery, Nathan Van Velson,
Phillip Griffin,
Advanced Cooling Technologies, Inc.
An Additive Design Heatsink Geometry Topology
Identification and Optimization Algorithm
Robin Bornoff, John Parry, Mentor Graphics
12:30 p.m.
Luncheon and Awards
Study of Multiple Magnetic Vibrating Fins with a
Piezoelectric Actuator
Hsiao-Kang Ma, Shao-Kai Liao, Yi-Tseng Li , National
Taiwan University
The Novel Modularized Multiple Fans System with a
Piezoelectric Actuator
Hsiao-Kang Ma, Yi-Tseng Li, Shao-Kai Liao, S.Y. Ke,
National Taiwan University
Improving Ducting to Increase Cooling Performance
of High-End Web Servers Subjected to
Significant Thermal Shadowing – An Experimental
and Computational Study
Dinya Mani,,, John Fernandes, Richard Elland, Dereje
Agonafer, University of Texas, Arlington
Veerendra, Mulay, Facebook Inc.
www.semi-therm.org
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