How to succeed in Telit Modules integration Telit M2M Seminar 7 feb 2008 Helsinki M2M Platforms www.m2m-platforms.com Overview – TTSC presentation 1 - TTSC Telit Technical Support Teams presentation 2 - How to succeed in Telit modules’ integration a) Schematics b) Placement c) Layout 3 - How to use our services properly M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 2 TTSC - Teams Three specific dedicated Teams for customer support: Technical Sales Team Customer Support Team After Sales Team M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 3 TTSC - Members Technical Sales Team members: Manager Technical Sales (Max Lonzar) 2 Technical Sales Engineer (Stefano Radetich, Daniele Scalembra) Customer Support Team members: Manager Customer Support (Andrea Ghezzo) 3 Customer Support Engineer (Alessandro Rossi, Fabio Bernardi, Luca Tomasi) Technical Support Team coordinates the RF and BB Telit R&D Engineers to give the best support to system integrator. M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 4 TTSC - Targets TTSC targets: FAE (Field Application Engineer) support Troubleshooting on customers’ problems (Base Band & Radio Frequency) Design review of customers’ applications (schematics & layout) M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 5 Hardware support requirements To give the customer the best support the following information are required: Characteristics of the application - Field of application, temperature range, low power, SIM design, special environment, type of power supply Hardware information - All the information concerning schematics and PCB description (files, datasheet) Global environment - Mechanical connection between Telit module and mother board; description of mechanical housing if exists M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 6 Overview - Schematics 1 - TTSC Telit Technical Support Teams presentation 2 - How to succeed in Telit module integration a) Schematics b) Placement c) Layout 3 - How to use properly our services M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 7 Schematics review BB schematics review target is to check: Power supply features Compatibility of analog/digital levels between Telit module and customer hardware functions Speed and timing of Telit peripheral components RF schematics review target is: Checking of connections in relation with RF behaviour VBATT ,Telit/antenna path, characteristics of antenna M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 8 Schematics review Main points to check: RF INTERFACE Power supply Serial link SIM ON/OFF Reset Audio RF Interface AUDIO INTERFACE POWER SUPPLY SIM CARD SERIAL INTERFACE UART HARDWARE INTERFACE IO/AD M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 9 Power Supply The power supply is one of the key issue in the design of a GSM terminal A weak power supply design could affect phase and frequency error, spurious emission, EMC performances Voltage range for VBATT: 3.4V – 4.2V. Nominal 3.8V When using a switching regulator, a 500kHz or more switching frequency regulator is preferable because of its smaller inductor size and its faster transient response. Power consumption in idle mode: 17 mA Beware to the current provided: 2A peak during TX bursts M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 10 Serial Link Serial link (Main serial link) RXD,TXD,RTS, CTS,DSR,DTR, DCD,RI DCD-dcd_uart RXD-tx_uart TXD-rx_uart DTR-dtr_uart DTE DSR-dsr_uart 2.8V pads with clamping diodes (Vforward=0.3V) Telit Main serial link RTS-rts_uart CTS-cts_uart RI-ri_uart Need a RS232 transceiver to comply with RS232 standard (-12V /+12V) Flow control signals (RTS-CTS) are mandatory for data transmission M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 11 SIM Interface 1.8V - 3V SIM supported SIM interface voltage level is 2.8V Add capacitor of 33pF ( on SIM_CLK, SIM_DATA and SIM_RST). It must be closed to SIM holder Ceramic capacitor placed near VSIM (should not exceed 10nF) Length of (Wire + Track) should not exceed 10 cm 10nF M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 12 On/Off To turn on the module the pad ON must be tied low for at least 1 second and then released. The maximum current that can be drained from the ON pad is 0,1 mA. Don't use any pull up resistor on the ON line, it is internally pulled up. The line ON must be connected only in open collector configuration. M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 13 Reset Active low To unconditionally reboot the module, the pad RESET# must be tied low for at least 200 milliseconds and then released. The maximum current that can be drained from the ON# pad is 0,15 mA. M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 14 Audio 2 Microphones 4 lines MIC_MT+, MIC_MT- , MIC_HF+ , MIC_HF Can be used in differential or single ended mode but differential mode is preferable to have better acoustic performances Audio filters are present inside the module 2 Speakers 4 lines EAR_HF+, EAR_HF- , EAR_MT+ , EAR_HF+ M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 15 Overview - Placement 1 - TTSC Telit Technical Support Teams presentation 2 - How to succeed in Telit module integration a) Schematics b) Placement c) Layout 3 - How to use properly our services M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 16 Overview - Placement Placement phase is as important as the layout phase: A bad placement leads to a bad layout and inevitably to EMC problems. Placement must be done by function (power supply, SIM, audio, RF,…) Specific constraints must be applied to the placement: Electrical. E.g. :Power supply part must not be placed too close to the audio one Mechanical … M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 17 Overview - Layout 1 - TTSC Telit Technical Support Teams presentation 2 - How to succeed in Telit module integration a) Schematics b) Placement c) Layout 3 - How to use properly our services M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 18 Layout review – BB & RF Base Band and Radio layout review targets are: Check all sensitive signal tracks for all PCB layer VBATT ,audio tracks, SIM tracks EMC approach in PCB analysis Check ground planes Ground plane present on top close to module Great number of via in GND layer M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 19 Layout review – BB & RF Base Band and Radio layout checked by signal type: Power Digital very fast Digital fairly fast Digital slow Analog (Audio, ADC) RF Note: ground separation between each signal type verified; 4 layers mini with ground plane recommended. M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 20 Layout review – Power Supply Power Supply recommendations: +VBATT 2.5mm typical width Ground plane on the Main board is strongly recommended Ground separation is recommended between each signal type Micro via are used to connect each layer of ground The use of a good common ground plane is suggested The power supply input cables should be kept separate from noise sensitive lines such as microphone/earphone cables. M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 21 Layout review – Audio Basic recommendations to have better acoustic performances: The speaker lines must be routed in parallel and shielded , without any wire in between these lines The microphone lines must be routed in parallel and shielded , without any wire in between these lines All the filtering components (RLC) must be placed as close as possible to the associated MIC and EAR pins A specific audio-ground can be used to reduce TDMA noise The recommended traces width is 0,3mm M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 22 Layout review – Antenna Path Needed: Description of the link between the module and the antenna Connector type Coaxial cable (type, length) Environment impact: Antenna location Application housing M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 23 Layout review – Antenna Path Four possible ways to connect the antenna (coaxial cable MMCX GSC, soldered, design the antenna directly on PCB [GE modules]. M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 24 Layout review – Antenna Path On GE863 and GE864 it is possible to design the antenna directly on application board. M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 25 Overview - Layout 1 - TTSC Telit Technical Support Teams presentation 2 - How to succeed in Telit module integration a) Schematics b) Placement c) Layout 3 - How to use properly our services M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 26 Telit services Generally, most of the time problems in a design are detected too late (after layout phase and sometimes after manufacturing beginning). The sooner we are involved in a customer design , the better the final result will be. Advise to system integrator to perform a schematic review as soon as his schematics are completed. Advise to system integrator to perform a layout review before application manufacturing. HW support experts group is dedicated to answer any HW related questions/open points customers may have during the integration project or during field support. M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 27 Telit services – Approval Telit modules are assessed to be conform to the R&TTE Directive as stand-alone product, so if the module is installed in conformance with Telit installation instructions require no further evaluation under Article 3.2 of the R&TTE Directive and do not require further involvement of a R&TTE Directive Notified Body for the final product. In all other cases, or if the manufacturer of the final product is in doubt then the equipment integrating the radio module must be assessed against Article 3.2 of the R&TTE Directive. In all cases assessment of the final product must be made against the Essential requirements of the R&TTE Directive Articles 3.1(a) and (b), safety and EMC respectively, and any relevant Article 3.3 requirements. M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 28 Telit services – Approval FAMILY PRODUCTS CERTIFICATIONS GE864 • R&TTE / CE GC864 • GCF • FCC GE863-GPS GM862-GPS • IC Canada • PTCRB M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 29 Telit services – Approval FAMILY PRODUCT DELTA CERTIFICATION FOR APPLICATION R&TTE / CE DELTA TEST GM862 based GC864 based SAFETY EMC RF SPECTRUM *(IF NEEDED) R&TTE / CE DELTA TEST GE864 based GE863 based SAFETY NO SIM test if : Path from SIM pins to the SIM holder is less than 20cm and not active components are added EMC RF SPECTRUM * * i.e. Radiated spurious emissions M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 30 Telit services – Tests Tests capabilities: RF test capabilities EMC test capabilities Validation test capabilities on application products Validation test on manufactory process Validation test on product M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 31 Telit services – Tests Internal tests facility: 8 Meters Anechoic chamber 3 Meters distance measurement 30MHz to 4GHz measurement Shield room Acoustic chamber Physical test laboratory M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 32 Telit services – Tests RF test capabilities: Conducted RF test (TS 51.10-1) Conducted RF spurious emissions (test cases 12..1.1 – 12.1.2) Transmitter frequency error under multipath/ interference (test cases 13.2) Transmitter frequency error and phase error (test cases 13.1) Transmitter output power (test cases 13.3) Transmitter output RF spectrum (test cases 13.4) Receiver Blocking and spurious response (test cases 14.7.1) Radiate RF test (TS 51.10-1) Radiated RF spurious emissions (test cases 12.2.1 - 12.2.2) M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 33 Telit services – Tests EMC test capabilities: EMC Emission test ( EN 301 489-11 EN 301 489-7) Radiate emission (30MHz-1GHz in Anechoic chamber) - EN 55022 Conducted emission at AC port (150KHz - 30MHz) - EN 55022 Conducted emission at DC port (150KHz - 30MHz) - EN 55022 EMC Immunity test ( EN 301 489-1 EN 301 489-7) Immunity to RF electromagnetic field (80-2000 MHz 3V/m) – EN 61000-4-3 Immunity to conducted RF disturbance (0.15-80MH) – EN 61000-4-6 Electrostatic discharge – EN 61000-4-2 Fast transient - EN 61000-4-4 Transient and surge – ISO 7637-1/2 Voltage dips and interruptions - EN 61000-411 Surges – EN 61000-4-5 M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 34 Telit services – Tests Validation test capabilities: Radiated power Measurement of the radiated power in free space condition (Measure in anechoic chamber) Radiated Receiver sensitivity Measurement of the receiver static sensitivity in free space conditions (Measure in anechoic chamber) Telit ANECHOIC CHAMBER aligned with TILAB laboratory in TORINO M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 35 Telit services – Tests External tests capabilities; external laboratories used by Telit: CETECOM SPAIN (Malaga, www.cetecom.es) EXPERT IN GSM/GPRS TEST CAPABILITY EXPERT IN SHORT RANGE DEVICE TEST SICOM TEST S.r.l. (ITALY – Trieste, www.sicomtesting.com) TEST CAPABILITY SHARED WITH DAI TELECO FULL SERVICE FOR CERTIFICATION PROCESS ON GSM/GPRS M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 36 Join Telit wireless solutions! M2M Telit Seminar, Feb 2008 / www.m2m-platforms.com 37
© Copyright 2024