X-Ray Photoelectron Spectroscopy (XPS) What is XPS? Chapter 6:

Chapter 6:
X-Ray Photoelectron
Spectroscopy (XPS)
Electron Spectroscopy for Chemical Analysis (ESCA)
The Nobel Prize in Physics 1981
Kai M. Siegbahn
b. 1918
d. 2007
"for his contribution to the development of high-resolution electron spectroscopy"
1
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What is XPS?
X-ray Photoelectron spectroscopy,
based on the photoelectric effect,1,2 was
developed in the mid-1960’s by Kai
Siegbahn and his research group at the
University of Uppsala, Sweden.3
1. H. Hertz, Ann. Physik 31,983 (1887).
2. A. Einstein, Ann. Physik 17,132 (1905). 1921 Nobel Prize in Physics.
3. K. Siegbahn, Et. Al.,Nova Acta Regiae Soc.Sci., Ser. IV, Vol. 20 (1967).
1981 Nobel Prize in Physics.
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Comparison of Sensitivities
H
Ne
Co
Zn
Zr
Sn
Nd
Yb Hg
Th
AESa nd XPS
1%
5E19
RBS
PIXE
PIXE
1ppm
5E16
SIMS
1ppb
0
20
40
60
ATOMIC NUMBER
80
5E13
100
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X-ray Photoelectron Spectroscopy
Photon energies: 100-2000eV, Electron energies: 0-1000eV
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Photoemission, what’s it used for ?
A) What elements are present in the surface region.
Different elements have different binding energies of the inner (core) levels.
B) Often, also the chemical state of the elements can be determined,
eg. Al-metal can be distinguished from Al-oxide.
The exact binding energy of a core level depends on the chemical state. Chemical shifts.
C) The surface geometry can be qualitatively determined.
Using diffraction effects and/or the chemical shifts of the binding energies (and imagination)
D) The band-structure of the solid can be measured.
Measuring the emission from the valence band in an angle resolved manner
E) Chemically sensitive microscopy is possible. (Note: Chemically, not just element
specific)
Combine the above with either focusing of the incoming photons or magnifying electron
optics. Some 10 nanometers to micrometers are typical values for the spatial resolution.
In other words, chemical composition, geometrical structure
and electronic structure. Quite complete information !
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Introduction to the Solid State
™
In solids, atomic and molecular energy levels broaden
into bands that in principle contain as many states as
there are atoms/molecules in the solid.
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Bands may be separated by a band gap with energy Eg
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Energy Bands in the Solid State
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Bands are continuous and delocalized over the material
Band “widths” are determined by size of orbital overlap
The highest-energy filled band (which may be only
partially filled) is called the valence band
The lowest-energy empty band is called the conduction
band
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The Workfunction: A Barrier to Electron Emission
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How does the electronic arrangement in solids affect surfaces?
In particular, how can an electron be removed ?
Free electron!
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™
For some electron being removed, its energy just as it gets free is EV
The energy required to remove the electron is the workfunction φ
(typically several eV)
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The Workfunction: A Barrier to Electron Emission
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Workfunctions vary from <2 eV for alkali metals to >5 eV
for transition metals.
Material
Na
Cu
Ag
Au
Pt
W
W(111)
W(100)
W(110)
W(112)
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Crystal State
polycrystalline
polycrystalline
polycrystalline
polycrystalline
polycrystalline
polycrystalline
single crystal
single crystal
single crystal
single crystal
Workfunction (eV)
2.4
4.4
4.3
4.3
5.3
4.5
4.39
4.56
4.68
4.69
The workfunction is the ‘barrier” to electron emission –
like the wall in the particle-in-a-box concept.
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Basic Considerations for Surface Spectroscopy
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Common sampling “modes”
ƒ Spot sampling (點)
ƒ Raster scanning (二維掃描)
ƒ Depth profiling (縱深)
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Surface contamination:
ƒ The obvious contamination/alteration of surfaces that can be the
result of less-than careful sample preparation
ƒ Solid surfaces can adsorb gases:
y At 10-6 torr, a complete monolayer of a gas (e.g. CO) takes
just 3 seconds to form.
y At 10-8 torr, monolayer formation takes 1 hour.
ƒ Most studies are conducted under vaccuum – although there are
newer methods that don’t require this.
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Surface Spectrometric Analysis
™
Surface spectrometric techniques:
ƒ
ƒ
ƒ
ƒ
™
X-ray fluorescence (from electron microscopy)
Auger electron spectrometry
X-ray photoelectron spectrometry (XPS/UPS)
Secondary-ion mass spectrometry (SIMS)
Depth profiling – if you are going to study surfaces
with high lateral resolution (e.g. using microscopy), then
wouldn’t it be nice to obtain information from various
depths within the sample?
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Depth sensitivity:
E = hν
KE =
1
mv 2
2
ejected from
} Electrons
depth < ~ 1 Mean-free path
created deep in
} Electrons
material scanner and eventually
X-rays penetrate deep into material
recombine with holes
Simple analysis of XPS:
KE =
1
mv 2 = hν − Ebinding
2
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The Basic Idea Behind Surface Spectrometry
Photons, electrons,
ions: they can go in
and/or out!!!
Leads to lots of
techniques, and lots
of acronyms!
Primary
photon
electron
ion
Secondary
photon
electron
ion
Surface
Primary
Secondary
Name of Technique
photon (X-ray/UV)
electron
XPS (ESCA) and UPS
photon (X-ray) or electron
electron
Auger electron spec. (AES)
ion
ion
SIMS (secondary ion MS)
photon
ion
LMMS (laser microprobe MS)
electron
Photon (X-ray)
SEM “electron microprobe”
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X-ray Photoelectron Spectrometry (XPS)
™
Photoelectron spectroscopy is used for solids, liquids and
gases, but has achieved prominence as an analytical
technique for solid surfaces
™
XPS:“soft” x-ray photon energies of 200-2000 eV for
analysis of core levels
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UPS: vacuum UV energies of 10-45 eV for analysis of
valence and bonding electrons
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Photoelectric effect: Proposed by A. Einstein (1905),
harnessed by K. Siegbahn (1950-1970) to develop XPS
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XPS: Basic Concepts
™
™
Like in AES, photoelectrons can not escape from depths
greater than 10-50 A inside a material
Schematically, the photoelectron process is:
A + hν → A+* + e −
atom or molecule
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cation
Like in AES, the kinetic energy of the emitted electron is
measured in a spectrometer
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XPS Basic Principle
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Energy Diagram
簡化起見 EK~EK’
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XPS Energy Scale
橫軸的表示法
The XPS instrument measures the
kinetic energy of all collected electrons.
The electron signal includes contributions
from both photoelectron and Auger electron
lines.
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XPS Energy Scale- Kinetic energy
橫軸的表示法-動能
KE = hv - BE - Φspec
Where: BE=
BE= Electron Binding Energy
KE=
KE= Electron Kinetic Energy
Φspec= Spectrometer Work Function
區分
Photoelectron line energies: Dependent on photon energy.
Auger electron line energies: Not Dependent on photon energy.
If XPS spectra were presented on a kinetic energy scale,
one would need to know the XX-ray source energy used to collect
the data in order to compare the chemical states in the sample
with data collected using another source.
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XPS Energy Scale- Binding energy
橫軸的表示法 – 束縛能
BE = hv - KE - Φspec
Where: BE=
BE= Electron Binding Energy
KE=
KE= Electron Kinetic Energy
Φspec= Spectrometer Work Function
Photoelectron line energies: Not Dependent on photon energy.
Auger electron line energies: Dependent on photon energy.
The binding energy scale was derived to make uniform
comparisons of chemical states straight forward.
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Fermi Level Referencing
Free electrons (those giving rise to conductivity) find
an equal potential which is constant throughout the material.
FermiFermi-Dirac Statistics:
T=0 K
kT<<
Ef
kT<<E
f(E)
f(E) =
1
exp[(E)/kT] + 1
exp[(E-Ef)/kT]
1.0
0.5
0
1. At T=0 K:
f(E)=1 for E<E
E<Ef
f(E)=0 for E>E
E>Ef
Ef
2. At kT<<
Ef (at room temperature kT=0.025
kT<<E
kT=0.025 eV)
eV)
f(E)=0.5 for E=E
E=Ef
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Fermi Level Referencing
E f Fermi Edge of
N(E)/E
TiN, room tem perture
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
Binding energy (eV)
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Sample/Spectrometer Energy Level
Diagram- Conducting Sample
待測物為導體時
e-
Sample
Spectrometer
Free Electron Energy
Vacuum Level, Ev
hv
KE(1s)
KE(1s)
Φsample
Φspec
功函數的值跟動能
比起來好像很小
Fermi Level, Ef
BE(1s)
E1s
Because the Fermi levels of the sample and spectrometer are
aligned, we only need to know the spectrometer work function,
function,
Φspec, to calculate BE(1s). 不需知道待測物
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Sample/Spectrometer Energy Level
Diagram- Insulating Sample
待測物為絕緣體時
eSample
Spectrometer
Free Electron Energy
KE(1s)
Φspec
Vacuum Level, Ev
Ech
hv
Fermi Level, Ef
BE(1s)
E1s
A relative buildbuild-up of electrons at the spectrometer
raises the Fermi level of the spectrometer relative to the
sample. A potential Ech will develop.
介面電荷產生內建電位
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Binding Energy Referencing
BE = hv - KE - Φspec- Ech
Where: BE=
BE= Electron Binding Energy
KE=
KE= Electron Kinetic Energy
Φspec= Spectrometer Work Function
Ech= Surface Charge Energy
Ech can be determined by electrically calibrating the
instrument to a spectral feature.
還是可以校正出內建電位值
C1s at 285.0 eV
Au4f7/2 at 84.0 eV
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XPS: X-ray Processes
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XPS: Photoelectron Emission and Binding Energy
™
The kinetic energy of the emitted electron can be related
to the “binding energy”, or the energy required to remove
an electron from its orbital.
ƒ Higher binding energies mean tighter binding – e.g. as atomic
number goes up, binding energies get tighter because of
increasing number of protons.
動能表示
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Ebinding = hν − IP
(gas)
Ebinding = hν − BE − w
(solid)
束縛能表示
http://www.chem.qmw.ac.uk/surfaces/scc/scat5_3.htm
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XPS: Binding Energy
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The workfunction w is usually linked to the spectrometer
(if the sample is electrically connected)
In gases, the BE is directly related to IP
ƒ Ionization potential – the energy required to take an electron out
of its orbital all the way to the “vacuum” (i.e. far away!)
ƒ PE spectroscopy on gases is used to check the accuracy of
modern quantum chemical calculations
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In conducting solids the workfunction is involved
Koopman’s Theorem: binding energy = -(orbital energy)
ƒ Orbital energies can be calculated from Hartree-Fock
™
Another definition for XPS binding energy: the minimum
energy required to move an inner electron from its orbital
to a region away from the nuclear charge. Absorption
edges result from this same effect
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X-ray source (without monochromator) + Electron energy analyzer
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X-ray monochromators: Use similar principles to optical monochromators.
But, some important differences:
Problem: With conventional (Czerny-Turner) monochromators, need
to collimate the light (entrance slit to diffraction grating) and focus the light
(diffraction grating to exit slit). But, X-ray mirrors are very difficult to make,
very expensive, and not very efficient (reflectivity <100%).
Czerny-Turner (conventional)
Roland Circle
Solution: Use Roland Circle Monochromator design. Must bend
crystals (usually quartz) onto a curved surface. Want to match Bragg
condition and focus the X-rays simultaneously with one “grating”.
Note: X-ray diffraction occurs both parallel and perpendicular to grating
surface. If angle is “off”, then no diffraction at all (loss of intensity)
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X-ray monochromator: Roland Circle (Calc’s for quartz)
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彎曲的晶體
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X-ray monochromator
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Principle of kinetic energy
determination - I
F= qE =m(V²/R)
F --- Force
V --- speed
R --- trajectory radius
E --- electrical fields established by U
potential
m --- electron mass
q --- electron charge
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ri
F=
mv 2 2 E kinetic
=
r
r
Ekinetic =
eΔV
⎛1 1⎞ 2
⎜ − ⎟r
兩個力相等 ⎜⎝ ri ro ⎟⎠
Centrifugal
Must be the same, so
ro
F=
2 Ekinetic
eΔV
=
r
⎛1 1⎞ 2
⎜⎜ − ⎟⎟r
⎝ ri ro ⎠
Centripetal (Electrostatic)
Ekinetic =
eΔV
⎛1 1⎞
2⎜⎜ − ⎟⎟r
⎝ ri ro ⎠
eΔV
eΔV
eΔV
eΔV
=
=
=
⎛ 1 1 ⎞⎛ ri + ro ⎞ ⎛ ri + r0 ri + ro ⎞ ⎛ ro ri
⎞ ⎛ ro ri ⎞
⎟ ⎜ 1 + − − 1⎟ ⎜ − ⎟
2⎜⎜ − ⎟⎟⎜
−
⎟ ⎜⎜
ro ⎟⎠ ⎜⎝ ri ro ⎟⎠ ⎜⎝ ri ro ⎟⎠
⎝ ri ro ⎠⎝ 2 ⎠ ⎝ ri
Ekinetic =
eΔV
⎛ ro ri ⎞
⎜⎜ r − r ⎟⎟
o ⎠
⎝ i
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Resolution of the hemispherical analyzer:
E0
E
∂Ekinetic
eΔV
eΔV
=
= 0
=
=
2
∂r
⎛ ri + ro ⎞ rmean
⎛1 1⎞
⎛1 1 ⎞ r +r
⎜
⎟
2⎜⎜ − ⎟⎟r 2 2⎜⎜ − ⎟⎟⎛⎜ i o ⎞⎟
2
⎝
⎠
r
r
2
r
r
⎝
⎠
⎝ i o⎠
⎝ i o⎠
Es
⎞
⎛ ∂E
Effective resolution = ΔE = ⎜ kinetic ⎟Δr = 0
rmean
⎝ ∂r ⎠
Effective slit width
To get high resolution, need to decrease Eo (“pass energy”)
or increase rmean (use a bigger analyzer).
Phi 360: rmean = 14.0 cm.
Effective slit width = 2 mm
ΔE = 0.015 * E0
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Principle of kinetic energy
determination - II
Dispersive analysis of the kinetic energy spectrum n(KE)
A field is applied between 2
parallel plates, distance s apart.
The lower plate has slits a
distance r apart (entrance and
exit slits). The photoelectrons
with kinetic energy KE are
transmitted to the detector. By
varying Vd the spectrum of
electron kinetic energies can thus
be obtained. KE is proportional to
Vd therefore the plot of electron
flux at the detector against V is
the photoemission spectrum.
The parallel plate electrostatic analyzer
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CMA (Cylindrical Mirror Analyzer)
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Single pass
double pass (類似雙光柵也可降低動能)
優點
High collection efficiency.
Easily constructed and maintained.
Can be made compact in size.
缺點
Energy calibration depends on sample position in front of analyzer.
Resolution depends on Ep and size of analyzer.
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Advantages
The retarding grid slows down the incoming electrons to one given value of Ep regardless of their initial KE.
The absolute resolution ΔE is therefore independent of initial KE.
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CHA
™
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Channel Plate
Concentric Hemispherical Analyser (CHA) operates on principle similar to
CMA, but with a different geometry.
Channel Plate Analyzer spatially “images” electron intensity from the
sample at each given energy.
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HSA (Hemispherical Sector Analyzer)
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CMA vs. HAS
• CMA: most effective in AES due to high transmission (signal electron
/total electron generated).
• HSA: always preferred for XPS because it can maintain adequate
luminosity at high energy, resolution with the addition of a lens.
HSA
CMA
resolution
0.8- 1.0 V
>1.4 V
transmission
high
higher
luminosity
energetic position
angular dependence measurements
machining
high w/lens
independent
suitable
high precision required
irrelevant
dependent
unsuitable
less precision required
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XPS: Sources
™
Monochromatic sources using electrons
fired at elemental targets that emit x-rays.
ƒ Can be coupled with separate post-source
monochromators containing crystals, for high
resolution (x-ray bandwidth of <0.3 Å)
™
XPS Sources (hit core electrons):
ƒ Mg Kα radiation: hν = 1253.6 eV
ƒ Al Kα radiation: hν = 1486 eV
ƒ Ag Lα radiation: hν = 2984.3 eV
™
UPS Sources (hit valence electrons):
ƒ He(I) radiation: hν = 21.2 eV (~58.4 nm)
A Thermo-Electron
Dual-anode (Al/Mg)
XPS source
hν = 23 eV (~53.7 nm)
ƒ He(II) radiation: hν = 41 eV (~30.4 nm)
™
Focusing the spot and lateral resolution 10-μm diameter spots are now possible
X-ray不易聚焦
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XPS: Spectral Interpretation
™
Orbital binding energies can be interpreted based on
correlation tables, empirical trends and theoretical
analysis.
™
Peaks appear in XPS spectra for distinguishable atomic
and molecular orbitals.
™
Auger peaks also appear in XPS spectra – they are
easily distinguished by comparing the XPS spectra from
two sources (e.g. Mg and Al Kα lines). The Auger peaks
remain unchanged w.r.t. kinetic energy, while the XPS
peaks shift.
要分辨是不是Auger訊號 就用不同的X-ray波長打
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XPS: Binding Energy Ranges
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XPS Photoelectron Binding Energies versus Atomic Number (Z)
*Data from C.D. Wagner, W.M. Riggs, L.E. Davis, J.F. Moulder and G.E. Muilenberg, Eds., "Handbook of X-ray Photoelectron Spectroscopy,"
Perkin-Elmer Corp., Flying Cloud, MN, 1979.
Image from http://www.cem.msu.edu/~cem924sg/BindingEnergyGraph.html (accessed 12-Nov-2004)
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A Typical XPS spectrum
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1. Sharp peaks due to photoelectrons created within the first few atomic layers
(elastically scattered).
™
2. Multiplet splitting (occurs when unfilled shells contain unpaired electrons). Spin的影響
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3. A broad structure due to electrons from deeper in the solid which are ineslastically
scattered (reduced KE) forms the background.
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4. Satellites (shake-off and shake-up) are due to a sudden change in Coulombic potential
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5. Plasmons which are created by collective excitations of the valence band
as the photoejected electron passes through the valence band.
‧Extrinsic Plasmon: excited as the energetic PE propagates through the solid after the
photoelectric process
‧Intrinsic Plasmon: screening response of the solid to the sudden creation of the core
hole in one of its atom
The two kinds of Plasmon are indistinguishable.
™
6. Auger peaks produced by X-rays (transitions from L to K shell: O KLL or C KLL).
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Sharp Peak (core level)
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Multiplet Splitting
Multiplet splitting occurs when there are unfilled shells containing unpaired electrons.
For instance, transition metals with unfilled d orbitals and rare earths with unfilled f
orbitals all show multiplet splitting.
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Multiplet Splitting
When an additional vacancy is made by photoionization coupling occurs between the unpaired
electron left behind (after ionization) and the unpaired electron in the originally incompletely
filled shell.
Example: Fe2O3 has 5 unpaired electrons in the 3d shell as shown below. Following
photoionization in the 3s shell, there are 2 possible final states.
Schematic of Multiplet Splitting following photoionization in Fe3+ and XPS spectrum
能量的差異其實是看final與initial,因為spin的影響造成分裂
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Satellites
光電子往外跑的過程中激發了外層電子至高能階的能量損耗
™
Arise when a core electron is removed by a photoionization. There is a
sudden change in the effective charge due to the loss of shielding
electrons. (This perturbation induces a transition in which an electron
from a bonding orbital can be transferred to an anti-bonding orbital
simultaneously with core ionization. Two types of satellite are detected.
™
Shake-up: The outgoing electron interacts with a valence electron and
excites it (shakes it up) to a higher energy level. As a consequence the
energy core electron is reduced and a satellite structure appears a few
eV below (KE scale) the core level position.
™
Shake-off: The valence electron is ejected from the ion completely (to
the continuum). Appears as a broadening of the core level peak or
contribute to the inelastic background.
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™
™
Shake-up satellites distinct peaks a few eV below the main
line
Shake-off satellites broad feature at lower energy w.r.t. to
main line
打出去
打上去
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Plasmons
™
表面夠乾淨才看得到
This feature is specific to clean
surfaces. The photoelectron
excites collective oscillations in the
conduction band (free-electron
gas), so called Plasmons.
(discrete energy loss).
Surface plasmon: bulk plasmon / 1.414.
For Al, Mg, Na etc…the energies are 15.3 eV, 10.6 eV and 5.7 eV, respectively.
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Chemical shift
Chemical shift arises in the initial state from the displacement of the electronic
charge from the atom towards its ligands, reducing the electrostatic potential at the
atom. There is a final state shift due to the polarization of the ligand by the core on
the central atom. Core electron BE in molecular systems exhibits chemical shifts
which are simply related to various quantitative measures of covalency. Greater
the electronegativity of the ligands, the greater the BE of the core electron of the
ligated atom.
電負度差異越大 束縛能越大
Basic concept: The core electrons feel an
alteration in the chemical environment
when a change in the potential (charge
distribution) of the valence shell occurs.
For example assume that the core
electrons are inside a hollow spherical
charged shell. Each core electron then sees
a potential. A change in Q by ΔQ gives a
change in V.
where ΔV is the chemical shift
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Oxidized metal surfaces
Oxidized and clean Cr 2p spectra (left). Oxidized and clean Cu 2p spectra (right). The
oxide layer resulted in extra peaks (shoulder at higher BE—left of the main line).
Satellites are also seen on the Cu 2p spectra.
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Angular Distributions
The inelastic mean free paths (IMFP) are in the range of 5 -100Å falling
within 5 –40 Å for inorganic materials. To enhance the surface signal we
can vary the photon energy—closer to the attenuation length minimum
or decrease the angle of electron emission relative to a solid surface.
增強表面XPS訊號
重點是到偵測器的距離
可以穿透的長度可能一樣 不過深度就不同了
For example: for Au 4f the IMFP (d) is about 22 Å at angle of 90°using
AlKα. The depth (d) probed by XPS becomes about 4-5 Å at angle = 10°.
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Background: Spin-Orbit Energy Levels
Spin-Orbit
Zeeman
mj = 3/2
mj = 1/2
mj = –1/2
mj = –3/2
j = 3/2
l = 1 (p) s = 1/2
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mj = 1/2
mj = –1/2
j = l + s, l − s
j = 1/2
m j = − j , − j + 1,... j − 1, j
mj = 1/2
l = 0 (s) s = 1/2
mj = –1/2
j = 1/2
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XPS: Energy Level Basics
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j
1S1/2
1/2 2S1/2
1/2,3/2 2P1/2, 2P3/2
n=1
n=2
Spin-Orbit
Splitting
n=3
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Remember
→
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Spin-Orbit (l-s) Coupling
與DOS有關
(2j -+1) / (2j ++1)
Degeneracy = 2j+1
or
Initial state
Final state without
spin-orbit interaction
4f7/2
4
4f5/2
3
Spin-orbit interaction
lifts degeneracy
The degeneracy determines the probability of the state being the final state of the system!
W f7
4f7/2
4f5/2
Ratio of intensities: 4:3
4f5/2
4f7/2
4f7/2= 31.4
Δ=2.18 eV
ΔE – spin-orbit splitting
5p3/2
Binding Energy
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靠近原子核
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分開的能量就是LS耦合的大小
25
強度就是能態密度
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Static Charging
XPS: It arises as a consequence of the build-up of a positive charge at the
surface of non-conducting specimens. The rate of photo-electron loss is
greater than that of their replacement from within the specimen. It
produces a retarding field at the surface that will shift the peaks (reduce
the KE of the ejected electrons).
不導電試片會有內建電場產生
Suggestions:
1) Use of the adventitious Carbon line to correct any shift (most materials
exhibit a C 1s line).
參考準位
2) Deposition of a very thin layer of gold (as use in SEM).
3) Use of a “flood gun” low energy electrons (0-5 eV).
有點像補電子 中性化的動作
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Static Charging
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XPS: Typical Spectra
™
An XPS survey spectrum of stainless steel:
Spectrum image from http://www.mee-inc.com/esca.html
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63
XPS: Typical Spectra
™
An expanded XPS spectrum of the C1s region of PET:
Spectrum image from http://www.mee-inc.com/esca.html
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XPS spectra for clean Al(100)
Spin-orbit splitting and surface splitting
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65
XPS: Chemical Shifts
™
Peaks appear in XPS
spectra for distinguishable
atomic and molecular
orbitals.
™
Effects that cause chemical
shifts in XPS spectra:
ƒ Oxidation states
ƒ Covalent structure
ƒ Neighboring electron
withdrawing groups
ƒ Anything else that can affect
ionization/orbital energies
任何會影響週遭組態的都算
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Chemical shifts and why they exist
The core level binding energies are
A simple (and not entirely sufficient) explanation :
found to depend on the chemical state of
the atom under investigation.
WHY ?
Strange as the core levels do NOT
take part in the bonding
想像這是
Ti
想像這是
Ti+
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XPS: Depth Profiling
™
Option 1: Sputtering techniques
ƒ Disadvantage – can change the surface
normal
™
Option 2: Angle-resolved XPS (AR-XPS)
electron
ƒ Reducing the photoelectron take-off angle
(measured from the sample surface) reduces
the depth from which the XPS information is
obtained. XPS is more surface sensitive for
grazing take-off angles than for angles close to
the surface normal (longer PE paths).
ƒ The most important application of angle
resolved XPS (AR-XPS) is in the estimation of
the thickness of thin films e.g. contamination,
implantation, sputtering-altered and segregation
layers.
grazing
Sample
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XPS: Applications
™
™
68
A modern application of XPS – study the nature of PEG as a surface
coating to prevent biofouling in biosensors 生物淤積
ƒ Biofouling: the tendency of proteins to adsorb to silicon-based surfaces
XPS can be used, with AFM, to observe the coating of PEG onto
silicon surfaces (PEG-silane coupling) - Increased C 1s C-O signal
indicates greater grafting density 移植
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XPS: Quantitative Applications
™
Quantitative XPS is not as widely used as the qualitative
version of the technique. 定量分析不容易
™
Variations in instrument parameters and set-up have
traditionally caused problems with reproducibility
™
Using internal standards, XPS can achieve quantitative
accuracies of 3-10% in most cases (and getting better
every year, as more effort is put into this type of analysis)
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AES and XPS: Combined Systems
™
Dual Auger/XPS systems are very common, also
combined with a basic SEM
ƒ Note - SAM = scanning Auger microprobe
™
™
Auger is seen as complementary to XPS with generally
better lateral resolution
Both are extreme surface sensitive techniques:
ƒ AES better elemental quantitative analysis
ƒ XPS contains more chemical information
™
Also, remember that Auger peaks are often seen in XPS
spectra (and are hence useful analytically) – they can be
identified by changing source, so that the X-ray peaks
shift (the Auger peaks do not).
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Comparison of XPS, AES and Other Techniques
Characteristic
AES
XPS
SEM/X-ray
EM
SIMS
Elemental range
Li and higher Z
Li and higher Z
Na and higher Z
All Z
Specificity
Good
Good
Good
Good
Quantification
With calibration
With calibration
With calibration
Correction
necessary
Detection limits
(atomic fraction)
10-2 to 10-3
10-2 to 10-3
10-3 to 10-8
10-3 to 10-8
Lateral resolution
(um)
0.05
~1000
0.05
1
Depth resolution
(nm)
0.3-2.5
1-3
1000-50000
0.3-2
Organic samples
No
Yes
Yes*
Yes
Insulator samples
Yes*
Yes
Yes*
Yes*
Structural
information
Elemental
Elemental and
Chemical
Elemental
Elemental and
Chemical
Destructiveness
Low
Very Low
Medium
Medium
71
* = yes, with compensation for the effects of sample charging
SIMS = secondary ion mass spectrometry, discussed in the “Ion and Particle Spectrometry” Lectures.
SeeLaboratory
Strobel and Heineman, Chemical Instrumentation, A Systematic Approach, Wiley, 1989, pg. 832.
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XPS: New Applications
™
A recent report in Chem. Commun. (2005) by Peter
Licence and co-workers describes the use of XPS to
study ionic liquids
™
Normal liquids evaporate under ultrahigh vacuum (UHV),
ionic liquids do not (they have a vapor pressure of nearly
zero!)
™
Why? Ionic liquids have become important for
electrochemistry, catalysis, etc…
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73
其他跟x-ray相關的實驗
XAS: X-ray Absorption Spectroscopy
Apparatus
photon in, photon out
™
™
Energy Diagram
XAS is a photon in / photon out process.
Cross sections for XAS vs. Auger (photon in / electron out) depend on
nuclear charge Z (Auger dominates for lower Z).
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XAS: Survey & High Resolution Scans
XAS Spectrum
(survey scan)
K-level
XAS + EXAFS Spectrum
(high-resolution scan)
L-levels
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75
Need a tunable X-ray source: The only practical source is a synchrotron
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EXAFS:
(Extended X-ray Absorption Fine Structure)
™
™
EXAFS is periodic structure near XAS edge due to electron scattering.
Fourier analysis of periodicities yields information about atomic
spacings.
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EXAFS: Spectrum and Fourier Transform
™
™
XAS of Ge shows sharp rise at 11 keV (K-edge), where
modulation above edge is EXAFS data.
Fourier transform shows nearest neighbor and the second
nearest neighbor distances.
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X-ray fluorescence (XRF)
Theory
NX-rays = Natoms∫σ(E)φ'(E)dE . [ω(exp(-∑iμiδxi))εΔT]
(1)
For a monoenergetic beam of energy, Eo ,
NX-rays = Natoms σ(Eo)φ(Eo)ω(exp(-∑iμiδxi))εΔT
(2)
where
NX-rays
Natoms
σ
ω
φ
μi
δxi
ε
ΔT
=
=
=
=
=
=
=
=
=
number of background–subtracted X-rays
number of target atoms seen by the beam
photoelectric cross section
fluorescence yield
flux of incident X-rays
linear attenuation coefficient(s)
Secondary X-ray pathlength(s)
photopeak detection efficiency
detector live time
(cm2)
(#/cm2.s)
(/cm)
(cm)
(s)
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Incident wave
1
Incident wave
2
2
a
Scattered wave
Scattered by
atom 1 and atom 2
Phase shift = 2ka+2δ1+δ2
Phase shift due to scattering at atom 1, reflection back from atom 2, and then back to
atom 1 is 2ka+2δ1+δ2
Phase shift = ka+δ1
Sum of incident planewave + scattered wave = 1+expi(2ka+2δ1+δ2)
Total absorption intensity ~ E*E ~ 1+sin(2ka+2δ1+δ2)
79
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“EXAFS Equation”
Scattering intensity
of the jth atom
Number of
atoms j
“disorder” term
(decreases intensity of
oscillations)
2
χ (k ) = ∑
2
N j f j (k ) exp −2 k σ exp
kR j
2
Electron scattering
(λ=inelastic mean free path)
−2 R j / λ ( k )
sin (2kR j + δ j (k ) )
Interference factor
Sum over atoms
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X-ray Absorption
Spectroscopy
Excitation of a specific core electron with monochromatic X-ray
source
Events prior to and subsequent to ejection of electron provide
useful information about the system
XANES
EXAFS
(X-ray Absorption Near-Edge
Spectroscopy)
Information Provided
Presence or absence of
specific bonds
Oxidation state
Orientation
(Extended X-ray Absorption Fine Structure)
Information Provided
Identity of neighbors
Neighbor coordination numbers
Interatomic distances
Thermal or static disorder
81
Advanced Photonics Laboratory
XANES Theory
A visual representation
Outgoing photoelectron wave
Backscattered wave
™
Interaction of waves from absorber and backscattering neighbor yield information on the
system.
82
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X-ray Absorption Spectrum
μ(E)
EXAFS
XANES
9000
10000
Photon Energy
11000
83
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XANES Theory
•The near edge region is dominated by multiplescattering of the low kinetic energy photoelectron
by neighboring atoms
•Edge position is a function of oxidation state
•Coordination and molecular orbitals influence
peak shapes
•Comparison with known spectra allows for
‘fingerprinting’ of samples
84
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85
Electronic and atomic structures study of BaxSr1-xTiO3
by XAS spectroscopy
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Introduction
 Kuo et. al. reported that tetragonal to cubic phase transition occurs at x=0.75 and a new
structure ordering transition around x=0.4 in BaxSr1-xTiO3 (BST) system when samples
were prepared by sol-gel technique.
X-ray
Raman
Shou-Yi Kuo et. al., Phys. Rev. B 64, 224103 (2001)
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87
Experimental
BaxSr1-xTiO3 prepared by sol-gel technique
x=0, 0.2, 0.4, 0.5, 0.6, 0.75 and 1
 Samples:
Ba(Sr)-O-Ti : O K-edge
Side view
O-Ti-O : Ti K,L3,2-edge
Ba,Sr
Ti
Ba-O
Ba-Ti : Ba,Sr K-edge
Ba-Ba(Sr)
O
 Data Collection:
Facilities
BeamLine
S.R.R.C
(Taiwan)
HSGM
Edge
O K-edge
Ti L3,2-edge
Wiggler-C
Ti K-edge
BL12B2
Ba K-edge
Sr K-edge
Spring-8
(Japan)
Shou-Yi Kuo et. al., Phys. Rev. B 64, 224103 (2001)
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Detector
Storage ring
I0
monochromator
Detector
Detector
Sr K-edge
spectrum
(A)
XANES
(A)
(A)
Normailze Absorption (eV)
~50eV
Detector
Sample
X-ray absorption near edge spectrum
-Electronic Configuration*Valence, site symmetry…
(B)
(B)
EXAFS
(B)
Extend x-ray absorption fine structure
~50-1000eV
-Structural information16000
16200
16400
Photon Energy (eV)
16600
16800
*Distance, Debye-Waller Factor,
number of neighboring atoms…
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89
Results and Discussion
A1
D1
C1
B1
E1
X=1
X=0.75
X=0.6
A1
B1
O2p-Ti3d
C1
D1
O2p-Ba5d/Sr4d
E1
O3p-Ti4sp
O K-edge after subtracting a Gaussian
X=0.5
X=0.4
X=0
X=0.4
X=0.2
X=0.6
X=0.75
X=0.5
X=1
O K-edge
X=0.2
Normalized Absorption (Arb. Units)
Normalized Absorption (Arb. Units)
O K-edge
Gaussian
X=0
TiO2
530
535
540
545
0.8
0.4
0.0
Photon Energy (eV)
529
530
531
532
Photon Energy (eV)
R. Brydson et. al., J. Phys. Condens. Matter 1, 797 (1989)
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Normalized Absorption (Arb. Units)
Ti L3,2-edge
D2
B2
C2
A2
X=1
L3 :
A2
B2
O2p3/2-Ti3dπ
O2p3/2-Ti3d σ
L2 :
C2
D2
O2p1/2-Ti3dπ
O2p1/2-Ti3d σ
X=0.75
X=0.6
X=0.5
X=0.4
X=0.2
X=0
TiO2
455
460
465
470
Photon Energy (eV)
Arctangent
G. Van der Laan et. al., Phys. Rev. B41, 12366 (1990)
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91
X=0.75
Sr K-edge
X=0
X=0.2
X=0.4
X=0.5
X=0.6
X=0.75
8
X=0.6
X=0.5
3
B5
kx
Magnitude of FT (Arb. Units)
10
X=0.4
A5
X=0.2
6
X=0
4
C5
4
D5
6
8
k(
2
0
0
2
4
Radial Distance ( )
6
A5
B5
C5
D5
-1
10
12
)
Sr-O
Sr-Ti
Sr-Sr
Sr-Ba
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Li - U
1. Particle identification
2. Surface impurity
3. Film impurity
4. Chemical structure identification
Li - U
1. Particle identification
2. Surface impurity
3. Film impurity
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93
Auger electron
2p1/2, 2p3/2
L2,3
2s
L1
Photoelectron
hν
Incident electron
(or hν)
1s
K
Ekin = EK - EL - EL
Ekin = hν - EB
1
3
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Ekin = EK - EL - EL
1
N(E)
Intensity N(E)
Ekin = hν - EB
KLL
Auger
peak
3
Energy
loss Elastic Peak
peak
Binding Energy (eV)
EF
Core
levels
Valence Conduction
Band
Band
dN(E)/dE
0 eV
Kinetic energy (eV)
Ep
Al Kα → hν = 1486.6 eV
λ = 8.34 Å
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Electron Microprobes and X-ray Emission
™
Electron microscopy (usually SEM) can also be used to perform
X-ray emission analysis in a manner similar to X-ray fluorescence
analysis
ƒ see the X-ray spectrometry lecture for details on the spectra
™
The electron microprobe (EM) is the commonly used name for this
type of X-ray spectrometry
™
™
Both WDS and EDS detectors are
used (as in XRF), elemental
mapping
Not particularly surface sensitive!
Advanced Photonics Laboratory
Electron Microprobes: X-ray Emission
96
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Electron Spectroscopy
97
Electron spectroscopy – measuring the energy
of electrons.
™ Major forms:
™
ƒ Auger electron spectroscopy
ƒ X-ray/UV photoelectron spectroscopy
ƒ Electron energy loss spectroscopy (EELS)
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Electron Spectroscopy: Surface Sensitivity
™
Electrons can only escape from shallow depths in the
surface of a sample, because they will undergo
collisions and lose energy.
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99
Auger Electron Spectrometry (AES)
™
The Auger process can also be a source of spectral
information. Auger electrons are expelled from
atomic/molecular orbitals and their kinetic energy is
characteristic of atoms/molecules
™
However, since it is an electron process, analysis of
electron energy is necessary!
ƒ This is unlike the other techniques we have discussed,
most of which measure photon wavelengths or energy
™
Auger electron emission is a three-step (three electron)
process, that leaves an atom doubly-ionized
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AES: Basic Mechanism
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101
AES: Basic Mechanism
™
Auger electrons are created from outer energy levels (i.e.
less-tightly bound electrons, possibly valence levels).
This example
would be called a
LMM Auger
electron. Other
Common types
are denoted KLL
and MNN.
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AES: Efficiency of Auger Electron Production
™
Two competing
processes:
ƒ X-ray fluorescence
ƒ Auger electron emission
™
™
Auger electrons
predominate at lower
atomic number (Z)
Photoelectron emission
does not compete!
ωK =
number of K photons produced
number of K shell vacancies created
ω Auger = 1 − ω K
激發出電子後
不是直接放出x-ray 就是產生Auger電子
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AES: Spectrometer Design
™
™
AES instruments are designed
like an SEM – often they are
integrated with an SEM/EDXA
system
Unlike an SEM, AES instruments
are designed to reach higher
vacuum (10-8 torr)
Electron
detector
Electron
Gun
Energy
analyzer
from adsorbed gases, etc…
™
Basic components:
ƒ
ƒ
ƒ
ƒ
ƒ
Electron source/gun
Electron energy analyzer
Electron detector
Control system/computer
Ion gun (for depth profiling)
Io
Gu n
n
ƒ Helps keep surfaces clean and free
Auger
electrons
Sample
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AES (and XPS): Electron Energy Analyzers
™
Two types of electron energy analyzers (also used in XPS):
Electrons only pass if
their KE is:
KEelectron = ke ΔV
k=
R1 R2
R22 − R12
Concentric hemispherical analyzer
(HSA higher resolution) – better resolution, mostly
for XPS/UPS
Cylindrical mirror analyzer
(CMA higher efficiency)
More common for AES
易於聚焦與調整
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105
AES: Detectors
™
More sophisticated detectors are needed to detect low
numbers of Auger electrons. Two types of electronmultiplier detectors:
Discrete dynode
Continuous dynode
™
Both types of detector are also used in XPS/UPS!!!
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AES: Surface Analysis
™
AES is very surface sensitive (10-50 Ǻ) and its reliance
on an electron beam results in excellent lateral resolution
™
Electron beam does not
have to be monochromatic
ƒ Note: an X-ray beam can
also be used for AES, but is
less desirable b/c it cannot
currently be focused as tightly
(as is the case in XPS)
™
Auger electrons typically
have energies of < 1000
eV, so they are only
emitted from surface
layers. 能量太小 無法從深處跑出來
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AES: Spectral Interpretation
™
AES Electron Kinetic Energies* versus Atomic Number
(Most intense peaks only. Valid for CMA-type analyzers.)
*Data is from J.C. Vickerman (Ed.), "Surface Analysis: The Principal Techniques“, John Wiley and Sons, Chichester, UK, 1997 .
Image from http://www.cem.msu.edu/~cem924sg/KineticEnergyGraph.html (accessed 12-Nov-2004)
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AES: Typical Spectra
108
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AES: Elemental Surface
Analysis
™
™
™
109
Very common application of
AES - elemental surface
analysis
For true surface analysis,
AES is better than SEM/X-ray
emission (electron
microprobe) because it is
much more surface sensitive
AES can be easily made
quantitative using standards.
適合做表面成份的定量分析
Image from http://www.cem.msu.edu/~cem924sg/ (accessed 12-Nov-2004)
Advanced Photonics Laboratory
AES: Chemical Shifts
™
Chemical information (i.e.
on bonding, oxidation
states) should be found
in Auger spectra because
the electron energy
levels are sensitive to the
chemical environment.
™
In practice, it is not
(usually) there because
too many electron energy
levels are involved – it is
difficult to calculate and
simulate Auger spectra.
110
不太適合做表面chemical shift的分析
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