Why do we care
about Pb-free
Electronics?
Presented to: 2009 SW&AEH Conference
By: Gary Horan, ANE-111
Date: August 20, 2009
Federal Aviation
Administration
History of Tin-Lead Solder
63% Tin / 37% Lead solder alloy
Utilized in the electronics industry for over 60 years

Mature technology

Used to inhibit growth of “Tin Whiskers”

Proven industry standard

Well documented engineering characteristics

Excellent history of reliable use

Low cost
Why do we care about Pb-free?
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What is Changing?
The electronics industry is
eliminating Lead from the
world-wide market.
Why do we care about Pb-free?
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The Transition
• On our way to the transition from leaded
solder and finishes to lead-free
• Neither our desire
….nor our plan
……….but events have overtaken us
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Why are we going there?
• EU RoHS initiative (Restrictions on Hazardous
Substances) started it all
• Increasing numbers of similar initiatives in other
countries and states
• These have driven the semiconductor industry to
alternate materials.
• This would all be good if the alternatives were
– Clear,
– Well Understood
and
– Uniform
• However none of these characteristics are the case
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What is the Impact?
Because of Lead-Free,
Aerospace is in the middle of an
uncontrolled transition for which
we are currently unprepared.
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How are we getting drawn into this?
The Supply Chain
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Electronics Market Share
The Military and Aerospace
sectors have little influence on the
global transition to Lead-Free.
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The Global Electronics Supply Chain
Doing nothing maximizes the risk
Aerospace Electronics
• Dependent on materials and
components developed for
other industries
Using components targeted for
other markets
To build products that must meet
MIL-Aero requirements
(what we cannot control)
(what we must control)
1. Parts &
Materials
Suppliers
2. Board
Assemblers
• Vastly different lifecycle
applications
Parts
Requirements
flow-down vs.
products flow-up
process is
disrupted here
3. Avionics 4. Platform 5. Operators
Integrators & Regulators
OEMs,
Logistics,
Maintenance
and Repair
Contract Mfg.
15 - 40 yr
Lifecycle
3 - 6 yr
Lifecycle
Aerospace
Boards
Captive
Solder etc.
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Suppliers
Majority of procurement
costs incurred here
Customers
Majority of lifecycle
costs incurred here
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A Number of Broad Technical Challenges are Rooted in Our
Dependence on the Electronics Supply Chain
The Lead-free Initiative is Currently the most Prominent
Component finishes switching
to pure Sn or other Pb-free
• Tin whiskers
• Parts identification
Interface voids
• System level failure events in
space applications
Solder alloys changing to various Pbfree types
• Different microstructure & failure mechanisms
• Non-converging alloy set
• High melting temps - all new assembly processes and
equipment
• Metallurgically incompatible with SnPb – no mixed solder
assembly
• Less Reparable
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Lead-Free Parts
Involves multiple electronic components:
Capacitors
Flat Packs
DIPS
Transistors
BGA’s
etc
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Think you can avoid it?

A recent random sampling
identified 90% of 2N2222A
transistors are Lead-Free
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Tin Whiskers
Tin Whiskers are electrically conductive, crystalline
structures that grow from tin surfaces.
Numerous electronic system failures have been attributed to
short circuits caused by Tin Whiskers.
Tin Whiskers have been successfully suppressed for decades
by the addition of at least 3% lead to the tin plating used in
high reliability applications.
Tin Whiskers pose a serious reliability risk to electronic
assemblies.
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The Situation Elements, i.e., the way it is:
•
The Pb-free materials solution space will remain unstable (nonconverging) for several years to come.
•
All programs that look, will find lead-free components, and possibly
lead-free subassemblies
- Costs to build tin-lead are quantifiably up
- Reliability is down, but that is not quantifiable now
•
There is a level of consensus from several perspectives that as an
industry we are at a decision point:
- Continue in a defensive risk management mode.
- Initiate a proactive solution development and implementation mode.
•
Still a remarkable lack of awareness/acceptance at program
management and policy levels of the demonstrated disruptive impact
-
Customers may choose to specify a lead-free design approach
At some point, an “event” of some form may
dramatically alter tacit acceptance of the situation
Each Element has Risk & Opportunity Implications
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So, what’s the impact?
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Reliability & Maintainability

Lead-Free parts have entered the supply chain

Repair Technicians lack knowledge and have not received
guidance

Lead-Free outside of current regulations

No standard Lead-Free alloy

Over 300 different Lead-Free alloys (but realistically about 12
active players)

Little or No reliability/engineering data

Tests prove some alloys are not compatible

Tin Whiskers have been found on components
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…and
There is high reliability risk for
Aerospace when we don't know
for sure what solder we are using
in the repair process.
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MIL-Aero Response to Pb-free
Severity of
the Problem:
• Scope
• Complexity
• Pervasiveness
• Cost
Our response is falling behind the curve.
JG-PP
JCAA
Mil-Aero R&D
NASA
ELF IPT
LEAP WG
R
I
S
K
Consumer electronics conversion to Pb-free
<1%
RoHS proposed
90%
Mil-Aero conversion to Pb-free
?%
Mil/Aero
Response:
RoHS takes effect
RoHS revised
1995
2000
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2005
2010
2015
• Recognition
• Investment
R
E
S
P
O
N
S
E
2020
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LEAP
• Since 2004 an ad hoc committee, Lead-free
Electronics for Aerospace Projects (LEAP)
Working Group has been operating under
the umbrella of AIA-GEIA-AMC.
• In this time the working group has produced
three standards and four handbooks that
together form the basis for the aerospace
industry to move into the transition.
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GEIA-STD-0005-1
Performance Standard for Aerospace and High Performance Electronic
Systems Containing Lead- free Solder
Used by aerospace electronic system “customers” to communicate requirements to aerospace electronic system “suppliers”
GEIA-STD-0005-2
Standard for Mitigating the Effects of Tin Whiskers in Aerospace In High
Performance Electronic Systems
GEIA-STD-0005-3
Performance Testing for Aerospace and High Performance Electronic
Interconnects Containing Lead-Free Solder and Finishes
Used by aerospace electronic system “suppliers” to develop reliability test methods and interpret results for input to analyses
GEIA-HB-0005-1
Program Management / Systems Engineering Guidelines For Managing
The Transition To Lead-Free Electronics
Used by program managers to address all issues related to lead-free electronics, e.g., logistics, warranty, design, production, contracts, procurement, etc.
GEIA-HB-0005-2
Technical Guidelines for Aerospace and High Performance Electronic
Systems Containing Lead-Free Solder and Finishes
Used by aerospace electronic system “suppliers” to select and use lead-free solder alloys, other materials, and processes. It may include specific solutions,
lessons learned, test results and data, etc.
GEIA-HB-0005-3
Rework and Repair Handbook for Aerospace and High Performance
Electronic Systems Containing Heritage SnPb and Lead-Free Solder
and Finishes
GEIA-HB-0005-4
Impact of Lead Free Solder on Aerospace Electronic System Reliability
and Safety Analysis
Used to determine, quantitatively if possible, impact of lead-free electronics on system safety and certification analyses, using results from tests performed
per GEIA-STD-0005-3
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Where has the LEAP WG been?
•
The LEAP WG has exceeded initial expectations
–
–
•
More work needed
–
–
•
Problem is growing and morphing
Additional needs have been identified
The deliverables will require a significant amount of time and work
–
–
–
•
Longer time
More work
By AIA member organizations
Exceeds work done to date
Need advice of AIA management
The LEAP WG is the only major forum for information exchange in
the aerospace and high performance electronics industries
–
–
Forum is needed for the foreseeable future
LEAP WG has concentrated on actionable deliverables
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AIA Lead-free Strategy Group
• Formed to address issues raised on
previous slide
– Led by Ed Morris and Vance Anderson
• Recommendations made to AIA TOC in
December 2008
– Pb-free Electronics Risk Management Council
– Pb-free Manhattan Project
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Aerospace & Defense
Pb-Free Electronics Risk Management
(PERM) Consortium Framework
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Pb-free Electronics Risk Management (PERM) Consortium Framework
PERM Beneficiaries
Advisory Council
DoD1
AIA EMC
PERM Consortium
Steering Committee
DoE
Executive Committee
FAA
- Industry Chairman
- Industry Vice-chair
- U.S. Government Vice-chair
- DoD LSA4 for Soldering Technologies
- AIA Liaison/Executive Secretary
NASA
Industry2
Research
Coordination
Task Team
Task Team Leads
International Advisory Group Lead
Supply Chain
Risk Mgmt
Task Team
Standards &
Handbooks
Task Team
Communications
Task Team
Members-at-large3
International
Advisory Group
Training
Task Team
Advocacy
Task Team
1. Membership of Senior Stakeholders determined by OSD and DoD
Lead-free
Electronics
Research
Manhattan Project
(Gov’t Contract)
2. Including representatives of Industry Associations such as AIA, TechAmerica, AMC,
IPC, etc.
Beneficiaries
Sponsor
3. Any individual participant (Government, industry and academia) in PERM meetings and
consensus process; Integrated Membership from prior LEAP WG and ELF IPT
4. LSA = Lead Standardization Activity
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Consortium Steering Committee
Charter:
– The PERM Consortium provides overarching leadership and
coordination of Pb-free electronics risk management activities for the
government and industry, aerospace and defense community
– The Steering Committee is responsible for overall strategic direction and
execution of the PERM Consortium’s activities
Scope/Expected Result:
– Responsible for the long-term overall aerospace and defense strategy
and tactics to effectively deal with the Pb-free electronics issues
– Expected result: A coordinated risk management approach for the
industry transition to Pb-free electronics
– Desired end state: As a minimum, lead-free technology must maintain
the performance, reliability, and safety characteristics required in
aerospace-defense electronics.
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Tasks/Business Plan
Sponsorship:
– The PERM Consortium Steering Committee’s oversight is provided
by the AIA EMC, reporting to the AIA TOC
• Leadership:
– The Steering Committee is led by an Executive Committee that is
responsible for:
• Leadership of the Steering Committee
• Planning and coordinating PERM Consortium face-to-face meetings
and teleconferences
• Maintaining and coordinating with the PERM Beneficiaries Advisory
Council, chaired by the Executive Committee Chair
• Interfacing with the AIA EMC
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PERM Deliverables
– Develop, maintain and execute a strategic and tactical plan to effectively
deal with the Pb-free electronics risks, addressing:
1. Overarching Executive Leadership and Organizational Framework
2. Communications (both good and bad news)
3. Research Coordination
4. Standards and Handbooks with Timely Updates
5. Training Materials and Courses
6. Advocacy (promote good legislation and block the bad)
7. International Coordination
8. Supply Chain Risk Management
– All-encompassing national and international coordination network to share
plans and progress between the numerous working groups, teams, and
associations working the issues
– Quarterly Progress Reports
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PERM External Interfaces
– AIA Engineering Management Committee and Technical Operations
Council
– DoD Stakeholders
– FAA
– NASA
– ESA, EASA, & Other International Governmental Organizations
– Major Electronics Industry Members and Associations
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PERM Beneficiaries
– US Government Stakeholders (DoD (including Program Offices &
Depots/Repair Centers), FAA, NASA, DHS)
– International Government Stakeholders (NATO, Ministries of Defense
(MODs), European Space Agency (ESA), European Aviation Safety
Agency (EASA), JAXA, Civil Aviation Authority (EU), etc.)
– Aerospace & Defense Primes and Suppliers
– Avionics & Defense OEMs and their Suppliers
– Aircraft and Airline Operators (Includes Commercial Maintenance,
Repair, and Overhaul (MRO) Community)
– National Labs, Universities and DoD Labs (AFRL, ARL, etc.) engaged in
Pb-free electronics research
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And the Manhattan Project…
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So what about the FAA’s Position
relative to Pb-free?
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GEIA-STD-0005-1
• GEIA-STD-0005-1 Performance Standard for
Aerospace and High Performance Electronic
Systems Containing Lead-free Solder
– Defines requirements for documenting processes in a Plan
that assures customers that aerospace / high performance
electronic systems containing lead-free solder will satisfy the
applicable requirements for performance, reliability,
airworthiness, safety, and certifiability throughout the life of
the system.
– Lists the high-level requirements for such processes and
areas of concern to the aerospace / high performance industry
that must be addressed by the processes.
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What is GEIA-STD-0005-1?
"This document specifies that users develop
and implement written Lead Free Control
Plans (LFCP). The purpose of the plan is to
document processes that assure the Plan
owners, their customers, and all other
stakeholders that aerospace and high
performance high-reliability electronics
systems will continue to be reliable, safe,
producible, affordable, and supportable."
LEAP WG White Paper, 12/2/2006
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What is a Lead-free Control Plan
(LFCP)?
• An LFCP Is not (necessarily)
– A Plan to introduce lead-free solder into the Plan
owner's products.
– A Plan to prohibit the use of lead-free solder
– A Plan to do anything the Plan Owner wants
• An LFCP is:
– A set of documented processes to assure that the
objectives of GEIA-STD-0005-1 are met by the Plan
Owner
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GEIA-STD-0005-1 Objectives
•
5.1 Reliability
• The processes and materials related to the use of Pb-free
solder are capable of producing reliable products.
•
5.2 Configuration control and product identification
• The configurations of all systems, equipment, assemblies, subassemblies, and piece parts are identified and controlled.
•
5.3 Risks and limitations of use
• Risks and limitation of use of the Plan owner's products, due to
the use of Pb-free solders, are identified, and information is
provided to control them.
•
5.4 Deleterious effects of tin whiskers
• The deleterious effects of tin whiskers are mitigated.
•
5.5 Repair, rework, maintenance, and support
• Repair, rework, maintenance, and support activities are
controlled in a manner that controls effects of Pb-free solder
materials and processes.
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FAA Recommendations are:
•
State what you are going to do (documented
processes)
This no more that the ISO9000 Philosophy:
“Say what you do, Do what you say”
•
Please refer to document GEIA STD-0005-1, If you
intend to create a LFCP. This may help the FAA
reduce evaluation time.
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What the FAA is doing
• Developing a Policy Memorandum to
increase awareness on the potential
hazards to migration to Lead Free
Electronic Components and/or Systems.
• Briefing DER’s and ASE’s via the DER
Recurrent Seminars
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What the Policy will require
• Memorandum to communicate an awareness of
reliability concerns and certification procedures for
electrical and electronic equipment and systems
using lead free solder and/or lead-free finishes on
components
• Each certification applicant should ensure that their
systems and programs minimize the safety impacts
as they transition their products and processes to
lead free
• Each applicant should assess and mitigate the
applicable risks in order to meet their
safety/reliability requirements to comply with ALL
applicable airworthiness regulations
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Lead-Free Assessment or Analysis
• The assessment may be accomplished by
the development of a LFCP for each
applicant organization or for each affected
program
• GEIA-STD-0005-1 and -2, along with the
supporting references, provides a basis by
which the plan and mitigation strategy may
be developed
• Any equivalent assessment/analysis agreed
upon by the applicant and cognizant ACO.
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Stay alert
Watch for
Policy
publication
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Questions
Photo courtesy of Peter Bush, SUNY at Buffalo
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