1. No category

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Vedtatt 12.02.2012
1
Price list No
orFab
The vision of
T
f NorFab is to
o be a robust and compeetent backbo
one consortiaa supportingg and enablin
ng research and innovati
a
on within micro‐and nan
notechnologyy (MNT) in N
Norway. NorFFab will be an enabling reesource for both academ
b
mic and indusstrial R&D. The member
T
rs of the NorrFab consortium are NTN
NU NanoLab, UiO MiNaLaab, SINTEF M
MiNaLab and MSTLab at HiVe. More i
H
information about the naational infrasstructure No
orFab can be found at ww
ww.norfab.no. This docume
T
ent introduce
es the comm
mon price system for NorFab. In geneeral, the threee university//university college clean
c
nrooms* are hands‐on an
nd open‐acce
ess, meaningg that the ussers will carryy out the ressearch themselves a
t
after an initiaal training prrocess. Howeever, for som
me instrumen
nts an operaator is requireed. SINTEF MiNa
S
aLab has an‐IISO certified semi‐production line wiith strong req
quirements regarding acccess and cleanliness. T
c
Therefore, th
he infrastruccture requirees an operato
or for all processing carriied out in thee lab and the prices fo
t
ollow a different system tthan for the university No
orFab nodess. The presente
T
ed prices are
e based on th
he intention to share thee costs of the
e infrastructu
ure among users. Prices for academic
f
c activities arre subsidised
d through baasic funding ffrom the universities. Priices for indusstrial activities are
a
e based on a full‐cost app
proach; no crross‐subsidiees between tthe user grou
ups are given
n. User
U categgories
NorFab distin
N
nguishes bettween acadeemic, start‐up
p and industtry activities that use the infrastructu
ure. The correspondin
c
ng users are defined as follows. Academic us
A
sers are defin
ned as: 



Bach
helor, Master and PhD sttudents. Postt docs/researrchers Fullyy internally‐financed reseearch within non‐profit research institutes. Public funded an
nd co‐funded
d projects (i.e
e. NFR, EU). Users from s
U
start‐up comp
panies are defined as: 
Com
mpanies follo
owing the EU
U definition ffor micro entterprises. The reduced fe
ee is paid forr the first 24 months after start‐up. Ressearch projeccts financed by start‐up ccompanies 
Industrial use
I
ers are defin
ned as: 

Anyy other comp
pany/users Ressearch projeccts fully finan
nced by indu
ustry with a pronou
unced aim to
o contribute tto the Academic activities are considered aas knowledge building w
ng ambition that processses developeed during general scieentific knowledge base. TThere is therefore a stron
the course o
of academic activities will be documeented and to
o a large exteent made avaailable to No
orFab. * hereafter caalled “university cleanrooms”
Postadresse
Realfagbygget
m
7491 Trondheim
ost: [email protected]
E-po
Telefon
+ 47 73 59 45 444
Telefaks
+ 47 73 59 14 100
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NorFab
Prices NorFab’s price structure is based on the costs for use of the infrastructure and is divided into four parts: 
Instrument costs, paid per booked hour for more expensive instruments with running costs >100 NOK/hour 
Operator costs, paid per hour of use of personnel for operating machines 
Task costs, for a fully performed task within the infrastructure (only applicable for SINTEF) 
Costs for basic infrastructure, paid per working hour in the cleanroom; includes standard chemicals and small instruments (only applicable for NTNU NanoLab) Table 1: Price list of NorFab (in NOK) Academia
Start‐up
Industry
Instrument prices (a list of available equipment and pricing is given in appendix 1) Instrument type A (/h) 100
125
150 Instrument type B (/h) 300
375
450 Instrument type C (/h) 500
625
750 Instrument type D (/h) 800
1000
1200 Instrument type E (/h) 1000
1250
1500 Instrument type F (/h) 1250
1580
1900 Basic Infrastructure* additional fee /h (only NTNU NanoLab) 250 300 350 * Fee for using the basic infrastructure (including standard chemicals and small instruments – see instrument list in appendix 1) is charged per working hour in the cleanroom. Fees for use of instruments type A‐F are charged in addition. Table 2: Flat rate prices of NorFab (in NOK) Academia
Start‐up
Industry
Flat rate (only available at university cleanrooms)
Flat rate / full infrastructure (free use of the entire NorFab infrastructure) 15% of the research project funding*; PhD students/post docs: 125.000/year 40.000 /month/person 50.000/month/person Flat rate / basic infrastructure (only NTNU NanoLab) 25.000/semester/project 6000/month/person 7.500/month/person 0
0
0 Training costs *The total funding of the project is reduced by the amount for consumables and running costs for equipment used in laboratories outside NorFab. 3 av 9
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General rules for flat rates
Flat rates are based on average cost estimations and the purpose of flat rate is to facilitate project planning. The following rules apply: 


PhD students are charged for a maximum of 3 years Instrument booking rules apply No operator service included Other conditions
The following conditions apply: 
Users of the institute sector are charged after the following rules: o
o
o
all public funded and co‐funded projects (ie NFR, EU) projects fully financed by industry internal projects* academia industry/start‐up academia *Requires project and budget description accepted by the institute management and access to cleanroom process descriptions. 
Training costs (to become a user) are currently covered by NorFab, for any user involved in a proposed activity in NorFab. 
To enable easy calculation of prices for long‐term use of the infrastructure, NorFab also offers flat rates, with full use of the university cleanrooms within the infrastructures on a monthly, semester, or year. 
Furthermore, NorFab offers both opportunities and space for own instruments and more permanent set‐ups. To utilise this and evaluate possibilities please contact NorFab for further discussions. 
The prices listed in Appendix 1 may vary for users originating from NorFab infrastructures due to local subsidies given by NorFab partners to their employees. For information regarding local subsidises, contact your local laboratory. Tasks performed by operator
The following operator prices are charges in addition to the fees given above: NFR/EU projects SINTEF* Universities Start‐up/Industry projects SINTEF* based on SINTEF hourly rates depending on operator qualification and project type 750 NOK/h based on SINTEF hourly rates depending on operator qualification and project type 1100 NOK/h Universities The university infrastructures have limited capacity for operator services. SINTEF offers operator services at NTNU NanoLab. Here SINTEF operator prices apply, based on SINTEF hourly rates. All prices are given exclusive VAT. The price system including the prices given in this document will be enforced from 01.07.2012 and
subjected to annual revision.
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Appendix 1
Price matrix
For readability the price matrix is repeated here: A B C D E F Academia Start up Industry 100 300 500 800 1000 1250 125
375
625
1000
1250
1580 150
450
750
1200
1500
1900 Price per hour in NOK excl. VAT For NTNU NanoLab an hourly fee is charged per working hour in the cleanroom: all cleanroom areas Academia Start up Industry 250 300 350 Price per hour in NOK excl. VAT List of instruments
Tool Nr.
Tool name
NL
NL0001 NL0003 NL0096 NL0101 NL1410 NL2331 NL3010 NL3021 NL0004 NL5010 NL1101 NL1105 NTNU NanoLab
STM, Nanosurf (4 pcs) AFM, Nanosurf Nanosight Particle size analyser AFM, Veeco Wire bonder Dicing Saw Scriber AFM, Nanosurf Flex Rapid Thermal Processing (RTP) oven Sputter coater and Thermal Evaporator Student photolithography Photolithography Nanoimprinter NL1207 Reactive Ion Etch (RIE) Oxford Instruments NL1512 NL1103 NL1205 S(T)EM Electron Beam Lithography E‐beam evaporator Hitachi S‐5500
Hitachi 4300SE Raith stage
Pfeiffer Vacuum Classic 500
NL0120 NL1461 Price
group
Model
Category
easyScan2
easyScan2
LM10
Beckman coulter N5
diMultimodeV
Leica/tpt S6
Disco DAD‐ 2H/6
Dynatex DXIII
easyScan2
Characterization Characterization Characterization Characterization Characterization Packaging Other Other Characterization A
A
A
A
A
A
A
A
A
Jipelec Jetfirst 200mm Thermal Processes B Cressington 308R Deposition B Karl Suss MJB3 + Wet stations
Karl Suss MA56 + Wet stations
EVG620
Lithography Lithography Lithography Etching, dry and wet
Characterization Lithography Deposition B
C
C
C C
D
D
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NL1225 PECVD NL1230 Inductive Coupled Plasma RIE NL1405 Focussed Ion Beam (FIB) NL0010 SECM NL0020 NL0021 NL0022 NL0023 NL0024 NL0030 NL0031 NL0040 NL0041 NL0050 Drying Oven
Drying Oven
Drying Oven
Binder vacuum Oven Binder vacuum Oven Heidolph Rotary Evaporator
Heidolph Rotary Evaporator
Glove Box Ar Glove Box N2 Centrifuge (Table top) NL0051 Ultracentrifuge NL0070 NL0098 NL0110 NL0130 Microwave Oven Syringe pump WTW pH‐meter Ultrasound desintegrator NL0150 Autoclaves NL0160 Dip Coater NL0163 NL0230 NL1120 NL1130 NL1131 NL1435 NL1436 Spin coater (not litho) Calcination (gold) furnace Yellow light microscope 2 DIC microscope 2 Stereomicroscope 4 DIC microscope 1 Stereomicroscope 2 Oxford Instruments, PlasmaLab System 100‐PECVD
Oxford Instruments, PlasmaLab System 100‐ICP180
FEI Princeton Applied Research 370
Termaks TS 8056
Termaks TS 8056
Termaks TS 8056
Binder VD23
Binder VD23
Laborota 4000/ G4 bath
Laborota 4000/ G4 bath
MBraun Unilab MB‐20‐G
MBraun Unilab MB‐20‐G
Heraeus Labofuge 400R
Thermo Electron Corporation, WX Ultra 100
Anton Paar Multiwave 3000
KDScientific KDS‐200‐CE
inoLab pH 730
450 CE Digital
Parr 4560 Mini Bench Top Reactor
Nima Technology Dip Coater DC Mono 75
WS‐400B‐6NPP‐LITE/ AS
Thermcraft
Nikon LV150 eclipse
Zeiss AxoScope A1
Nikon SMZ460/C‐PS
Zeiss AxoScope A1
Nikon SMZ800/C‐PS
NL1450 Plasma cleaner Diener Electronics, Femto NL1470 NL1500 NL1501 NL1510 NL1720 NL1735 NL1920 NL1922 UV/Ozone cleaner Reflectometer 1 Reflectometer 2 Carbon coater Profilometer Stereomicroscope 3 Fluorescence microscope SEM (Table top) novascan PSDPro‐UVT6
Filmetrics F20
Filmetrics F20
Cressington 208 Carbon
Veeco Dektak 150
Nikon SMZ460/C‐PS
Zeiss AxoScope A1
Hitachi TM3000
Deposition Etching, dry and wet
Characterization D D E
Characterization incl. Thermal Processes Thermal Processes Thermal Processes Thermal Processes Thermal Processes Other Other Other Other Other incl.
incl.
incl.
incl.
incl.
incl.
incl.
incl.
incl.
incl.
Other incl. Thermal Processes Other Other Other incl.
incl.
incl.
incl.
Thermal Processes incl. Deposition incl. Deposition Thermal Processes Characterization Characterization Characterization Characterization Characterization Etching, dry and wet
Other Characterization Characterization Deposition Characterization Characterization Characterization Characterization incl.
incl.
incl.
incl.
incl.
incl.
incl.
incl. incl.
incl.
incl.
incl.
incl.
incl.
incl.
incl.
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NL2008 NL2314 NL2315 NL2326 NL2327 NL2330 PDMS/silanes area Curing Oven for PDMS Safety bench Syringe pump Syringe pump Stereomicroscope 1 NL3012 Surface Plasmon Resonance NL5012 NL5013 NL5014 Oven for lithography Yellow light microscope 1 Oven for lithography Sputter coater for SEM Sample Prep. UiO MinaLab
Warm cabinet 4‐point probe Ellipsometer Stylus profilometer CV/IV characterization; probe station NL1460 UIO
UIO001 UIO002 UIO003 UIO004 UIO005 Referanse
Other Thermal Processes Other Other Other Characterization incl.
incl.
incl.
incl.
incl.
incl.
Other incl. Thermal Processes Characterization Thermal Processes incl.
incl.
incl.
Cressington 208HR Deposition incl. Thermal Processes Characterization Characterization Characterization A
A
A
B
Characterization A Characterization B Fume hood, spinner, oven
Termaks TS 8024
Kojair Biowizard silver
Chemyx Fusion 400
Chemyx Nexus 3000
Nikon SMZ460/C‐PS
Reichert Life Sciences SR 7000 DC
Memmert U26
Nikon LV150 eclipse
Memmert U26
Jandel KM3‐AR
Rudolf Research / AutoEL
Veeco Dektak 8
Agilent 4284A, Keithley 617, Keithley 2440
Newport 91160 Full Spectrum Solar Simulator
UIO006 Solar simulator UIO007 Wet etch Manual wet station UIO008 UIO009 UIO011 Spectrophotometer Hall/TDH FTIR UIO012 Photolithography UIO013 Photolithography UIO014 UIO015 UIO016 UIO017 UIO018 UIO019 UIO020 UIO021 UIO022 UIO023 UIO024 UIO025 UIO026 High temp tube furnace High temp tube furnace Tube furnace Thermal evaporation E‐beam evaporation XRD Tube furnaces Tube furnaces Rapid Thermal Processing Rapid Thermal Processing Magnetron sputtering Magnetron sputtering E‐beam evaporation Shimadzu SolidSpe‐3700 DUV
LakeShore EM4 HGA
Bruker IFS 125HR
Karl Suss MH56 + wet etch + spinner
Karl Suss MJB55 + wet etch + spinner
Gero 1 75242
Gero 2
Lindberg 59544
Balzers BAE 250
BioRad
Bruker AXS D8 Discover
4‐stack ThermCo
GSL1100X
AnnealSys AS‐Micro
AnnealSys AS‐One
CVC type AST‐601, DC system
Semicore TriAxis
Leybold L 560 K
Etching, dry and wet
Characterization Characterization Characterization B C
C
C Lithography C Lithography C Thermal Processes Thermal Processes Thermal Processes Deposition Deposition Characterization Thermal Processes Thermal Processes Thermal Processes Thermal Processes Deposition Deposition Deposition B
B
B
B
C
D
B
B
C
C
C
C
D
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Doping – Ion Implantation ALD Advanced Vacuum Vision 310 MK II
Advanced Vacuum Vision 320 MK II
NEC Tandem accelerator
Beneq TFS 200‐ 148
Etching, dry and wet
Other Deposition D*
E*
UIO031 MOCVD Titan (EMF) reactor Deposition E* UIO032 UiO033 MST
MST101 MST102 Optical Microscope RBS MSTLab HiVE
Thermal cycling Interferometer Olympus BX 41 M
Other Characterization incl.
D*
Characterization Characterization A
A
MST103 IR camera Characterization incl. MST104 Microscopes Characterization incl. MST106 Probe station Characterization A
MST107 Profilometer Characterization B MST109 MST201 MST301 MST302 MST303 Shear tester Tube furnace (Oxidation) Oven
Student photolithography Photolithography Plasma cleaner MST305 UV Cleaner MST401 Au sputter UIO027 PECVD UIO028 RIE UIO029 UIO030 Weiss‐ Weiss Technik 64
Veeco ‐ Wyko NT9100 PL‐B741E 1.3MP monochrome camera
Leica ‐ DM 4000M
Carl Zeiss Jena Neophot 32
PWS ‐ Probe II
Veeco‐ Dektak 150 Stylus ProfilerScan
F&K‐ Delvotec 5600
HarmbridgeHitech Furnace
Karl Suss: MA56
EVG ‐AL6 / 620
March Plasmod
UVOCS (Ultra‐Violet Ozone Cleaning System)
Fison Instruments Polaron SC500
Deposition D C Characterization Thermal Processes Lithography Lithography Lithography A
A
B
C
incl.
Lithography incl. Deposition incl. Heimerle + Meule ‐ PGG 20 Deposition C MiniLab T25M
Deposition Etching, dry and wet
Etching, dry and wet
C
MST403 Electroplating (wafer and pieces) Thermal evaporator MST501 RIE PlasmaTherm ‐ SLR series MST502 Wet Etching General wet‐benches Wafer bonding (Anodic, Fusion and Metallic) Die attach Flip‐chip bonder Dicing SI‐wafer Dicing ceramik ++ Wirebonder EVG 501 Wafer bonder
EVG 620 Bond aligner
Wafer bonding B Laurier Incorporated Packaging Packaging Packaging Packaging Packaging A
B
A
B
A
MST402 MST602 MST701 MST702 MST703 MST703 MST704 *operator required MAT‐ MAT 6400
Disco‐ DAD‐2H/6T
Disco‐ DAD‐2H/6T
F&K‐ Delvotec 5610
B B 8 av 9
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SINTEF MiNaLab The price list applies only to single processes at SINTEF MiNaLab and cannot be used to price projects including integrated processes. The indicated prices are exclusive operator cost. Activities at SINTEF MiNaLab will be performed by SINTEFs operators. For any binding quotation please contact SINTEF MiNaLab at norfab‐
[email protected] as most of the indicated prices are volume sensitive and as some processes might require pre‐ and/or post processes. Please observe that most of the equipment includes automatic or semi‐
automatic wafer handling, and as such yields a more industry‐compatible process and capacity. The price groups used at SINTEF MiNaLab refer to the prices listed in the "industry" column of the price matrix and will be used independently of user types and project types. User types and projects will, however, be reflected in the operators hourly rates. Price list for process steps at SINTEF MiNaLab
Process step
SI 001 Lithography
Priming, coating, aligning, baking Primer YES Resist Coater Suss ACS 200 Resist Coater ATMsse Maximus 804 Mask Aligner (two) Suss MA 150e Baking Chamber Different brands SI 002 ICP‐equipment
F RIE, PECVD Reactive Ion Etch Alcatel AMS 200 SE I‐speeder Reactive Ion Etch, non‐silicon etching Alcatel AMS 200 SE I‐speeder Reactive Ion Etch, electrostatic chuck Alcatel AMS 200 SE I‐Productivity PECVD deposition Alcatel AMS 200 PECVD SI 003 Wafer bonding line
B wafer stack aligning, bonding Bond Aligner Suss Microsystems MA6/BA6 Wafer Bonder Suss Microsystems SB6e SI 004 Thin Film (ex. material costs)
Al. + noble metals sputtering Sputter for Al, Ti, TiN and W
MRC 643 Sputter for Au, NiCr, TiW and Al MRC 603 SI 005 Surface Characterization
B SEM, Zygo, EDX SEM, Scanning Electron Microscope Equipment type
Price group E C FEI Quanta FEG 600 with EDAX 9 av 9
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Interferometer (white light) Zygo NewView 6300 Energy Dispensive X‐ray analysis (EDX) EDAX SI 006 Electrical Characterisation
C Automatic probing Automatic probing station (two) SI 007 Wet processing
Wet chemistry Manual etching of Si, SiO2 and Al Stangl wet benches Manual RCA cleaning Stangl wet benches SI 008 Gold process line
priming, coating, aligning, baking Primer YES Resist Coater Suss Gyrset RC8 Mask Aligner Suss MA 150 KWS Baking Chamber Different brands SI 009 TMAH, KOH (etching), RCA cleaning
Manual wet benches for etch and clean SI 010 Packaging
Wafer dicing Disco DAD 321 wafer saw Post dicing cleaning Disco DSC 141 spin rince dryer Wire bonding Kulicke & Soffa 4522 SI 011 RTP
Annealsys AS‐Master 2000 RTP B
SI 012 Thermal processes
SI 013 Standard diffusion tubes A
SI 014 Boron and phosphorous deposition tubes B
SI 015 SiC high temperature tube B
SI 016 Poly‐Si and Silicon nitride LPCVD tubes *Price exclusive VAT ACCRETECH TSK A‐PM‐90A B D C Stangl wet benches B 4615 kr
/time*