Market & Technology Trends SEMICONDUCTOR TRENDS October 2014 COMMODITY

October 2014
Market & Technology Trends
ANALOG
COMM
DSP DISCRETE
LOGIC
MEMORY MCU
OPTO
PROCESSORS
PROGRAMMABLES
RF
ELECTROMECHANICAL INTERCONNECT PASSIVE
POWER SUPPLY
SEMICONDUCTOR TRENDS
COMMODITY
AVAILABILITY
PRICING
LEAD TIME (IN WEEKS)
Analog
2-20
Communications
4-20
Digital Signal Processors
2-16+
Discretes
4-24
Logic
4-26
Memory
6-allocation
Microcontrollers
2-24
Optoelectronics
4-14
Processors
4-20
Programmable Logic
2-20
RF
2-26
IP&E TRENDS
COMMODITY
AVAILABILITY
PRICING
LEAD TIME (IN WEEKS)
Commercial Electromechanical
Stock to 26
Military Electromechanical
Stock to 30
Commercial Interconnect
Stock to 16
Military Interconnect
Stock to 16
Commercial Passive
Stock to 22
Military Passive
Stock to 17
Power Supply
Stock to 26
Download the complete list of Market & Technology Trends Acronyms and Definitions
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be available for immediate delivery. We also reserve the right to limit quantities. Specials
and promotions may be limited to stock on hand.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – ANALOG
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
Amplifiers
Stable
Standard lead times 2-10 weeks (stable)
AMPLIFIERS
Analog Devices 4-8 weeks (stable)
New! Analog Devices introduced a family of low-power rail-to-rail amplifiers for high-speed data
acquisition systems that require exceptional accuracy, precision and power efficiency. The ADA4805-1
(single) and ADA4805-2 (dual) amplifiers provide the only solution with quiescent current as low as 495µA.
The amplifiers’ Dynamic Power Scaling (DPS) feature allows users to dynamically manage the power
consumption by shutting-down the amplifier between analog-to-digital converter samples. This further
reduces by up to 90 percent the power consumption — with no performance degradation —when compared
to similar solutions. Click for more information.
Maxim 2-10 weeks (stable)
ON Semiconductor 4-10 weeks (stable)
Texas Instruments 2-10 weeks (stable)
Converters
Stable
Standard lead times 2-14 (stable)
Analog Devices 4-14 weeks (stable)
Cirrus Logic 8-12 weeks (stable)
CONVERTERS
Maxim 2-12 weeks (stable)
Analog Devices introduced a current-to-digital converter module that reduces the cost and complexity of
computed tomography (CT) scanner system design. The ADAS1131 is a 256-channel, 24-bit current-todigital converter module that is available in a 15 mm² BGA package with a 0.8 mm pitch. The device uses
approximately 33% less PCB area than alternative devices that offer only half the channel density. The
0.8 mm pitch packaging feature enables designers to mount the ADAS1131 on a standard PCB substrate, a
less costly and higher yield option than high density, specialized PCB substrates requiring laser vias.
Click for more information.
Texas Instruments 2-12 weeks (stable)
Interfaces
Stable
Standard lead times 2-14+ weeks (stable)
Analog Devices 4-14 weeks (stable)
Intersil 4-16 weeks (stable)
Maxim 2-14+ weeks (stable)
Power Mgt ICs
Stable
NXP 8-18 weeks (stable)
SENSORS
Texas Instruments 2-8 weeks (stable)
Freescale launched a new, high-bandwidth 3-axis analog accelerometer, engineered to detect ultra-high
frequency motion and vibration in industrial motors and equipment. Building on its longtime strength
in automotive sensors, Freescale has experienced strong market acceptance across the breadth of its
sensors portfolio, including its increasingly popular devices for the growing industrial and medical markets.
Freescale’s new FXLN83xxQ accelerometer underscores the company’s industrial sensing momentum.
Designed to capture acceleration information often missed by less accurate sensors commonly deployed in
consumer products such as smartphones and exercise activity monitors, the new device enables intelligent
algorithms to better perform fault prognostication for predictive maintenance and condition monitoring
applications. Click for more information.
Standard lead times 2-10 weeks (stable)
Maxim 2-10 weeks (stable)
Intersil 4-16 weeks (stable)
International Rectifier 12-24 weeks (extended)
Texas Instruments 2-10 weeks (stable)
Power Integrations 4-6 weeks (stable)
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – ANALOG (CONTINUED)
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
Sensors
Stable
Standard lead times 2-14 weeks (stable)
Analog Devices 4-12 weeks (stable)
Freescale 6-12 weeks (stable)
Maxim 2-12 weeks (stable)
STMicroelectronics 12-14 weeks (stable)
Texas Instruments 2-10 weeks (stable)
Switches/
Muxes
Stable
Standard lead times 2-12 weeks (stable)
Analog Devices 4-12 weeks (stable)
Intersil 6-16 weeks (stable)
Maxim 2-12 weeks (stable)
Vishay/Siliconix 10-12 weeks (stable)
Voltage
Regulators
Stable
Standard lead times 2-20 weeks (stable)
Maxim 2-10 weeks (stable)
Infineon 12-20 weeks (stable)
ON Semiconductor 4-17 weeks (stable)
STMicroelectronics 4-20 weeks (stable)
Texas Instruments 2-8 weeks (stable)
TECHNOLOGY TRENDS
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – COMMUNICATION
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
Communications
ASSPs
Stable
Applied Micro 22-26 weeks (stable)
Click to learn more about Avnet's extensive Communication product offering.
Broadcom 16-20 weeks (stable)
Marvell 16-20 weeks (stable)
Mindspeed Technologies
16-22 weeks (stable)
PMC-Sierra 18-21 weeks (stable)
Peripheral
Connectivity
Stable
IDT 2-16 weeks (stable)
Intel 4-6 weeks (stable)
PLX Technology 10-20 weeks (stable)
Texas Instruments 2-6 weeks (stable)
Network
Processor
Stable
Optical
Networking
Stable
Wired Telcom
Stable
Broadcom 16-20 weeks (extended)
Marvell 16-20 weeks (extended)
Avago 4-12 weeks (stable)
Finisar 4-12 weeks (stable)
Lintiq 16-20 weeks (stable)
Texas Instruments 6-16 weeks (stable)
Microsemi 8-16 weeks (stable)
Cirrus Logic 4-12 weeks (stable)
Graphics
Stable
Intel 4-6 weeks (stable)
Mindspeed 16-22 weeks (stable)
AMD 4-6 weeks (stable)
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – DIGITAL SIGNAL PROCESSOR
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
DSP – 16 Bit
Stable
Standard lead times 2-12 weeks (stable)
Click to learn more about Avnet's extensive DSP product offering.
Analog Devices 2-12 weeks (stable)
Texas Instruments 2-16 weeks (stable)
DSP – 32 Bit
Stable
Standard lead times 2-16+ weeks (stable)
Analog Devices 2-10 weeks (stable)
Texas Instruments 2-16+ weeks (stable)
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – DISCRETE
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
BiPolar
Transistors
Stable
Standard lead times currently 4-20 weeks
DISCRETE
STMicro at 6-14 weeks
There are extended lead times with multiple suppliers on multiple packages, including SOT23, DPAK, D2PAK, SOT404,
SOT428, LFPAK, SOT669, SOT1023, SOT1205 and SOT1210.
ON Semi - Majority is at 4-20 weeks
Diodes Inc is at 8-10 weeks
IGBTs
Stable
Standard lead times 4-18 weeks
Fairchild 4-8 weeks
International Rectifier 10-18 weeks
Infineon 14-18 weeks
MOSFETs
Stable
Standard lead times 6-18 weeks
Infineon 8-18 weeks
Fairchild 4-10 weeks
Int'l Rectifier - 10-16 weeks
Vishay 12-16 weeks
STMicro 8-16 weeks
Transient
Voltage
Suppressors
Stable
Standard lead times 6-20 weeks
Fairchild 6-12 weeks
ON Semi 10-20 weeks
Vishay 8-20 weeks
Thyristors
Stable
Standard lead times 4-16 weeks
STMicro 6-12 weeks
ON Semi 6-12 weeks
NXP 8-12 weeks
ON Semi is increasing capacity by 25% in 2014 and expects the majority of lead times to improve in Q3, with the
exception of SMA/B, DPAK 2 W and SOT23, which are expected to improve in Q4. NXP is bringing on additional
capacity in Q2 and Q3 and is expecting easing toward the end of Q3 on DPAK, D2PAK, SOT404 and SOT428. The
remaining packages will be easing in Q4 for NXP. Vishay has seen extended lead times on several products, but
feels that they have stabilized.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – DISCRETE (CONTINUED)
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
Rectifiers
Increasing
Standard lead times 4 -22 weeks
ON Semi 8-22 weeks
Vishay 4-24 weeks
Fairchild 6-10 weeks
Diodes Inc 6-12 weeks
NXP 6-22 weeks
Zener
Diodes
Increasing
Standard lead times 4-24 weeks
ON Semi 10-20 weeks
Vishay averaging 6-16 weeks
Fairchild 6-10 weeks
Diodes Inc 8-12 weeks
NXP 6-24 weeks
Small Signal
Devices
Increasing
Standard lead times are at 6-24 weeks
ON Semi 6-16 weeks
Infineon 8-16 weeks
Fairchild 6-8 weeks
Diodes Inc 6-10 weeks
NXP 6-24 weeks
TECHNOLOGY TRENDS
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – LOGIC
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
CMOS – 5 V
(Metal Gates, High
Speed and Advanced)
Stable
Standard lead time is at 6-12 weeks
TIMING
Texas Instruments is at 6-8 weeks
IDT has announced the expansion of its PCIe timing portfolio with the industry’s
first 1.5 V PCI Express (PCIe®) buffer family. IDT’s new U-series ultra-low power
PCIe buffers operate from the same supply voltage as modern systems-on-chip
(SoCs) and field programmable gate arrays (FPGAs), enabling designers to use
the same power rail, thus reducing system complexity, physical size, and power
consumption. Click for more information.
NXP is running 6-12 weeks
ON Semi is at 4-12 weeks
CMOS –
Low Voltage
Stable
Standard lead time is at 4-12 weeks
Texas Instruments 4-6 weeks
Fairchild Semi 4-6 weeks
IDT 4-6 weeks
NXP 6-12 weeks
BiPolar – 5 V
(Fast, ALS, LS and AS)
Increasing
BiCMOS
Stable
Standard lead times 4-12 weeks
Texas Instruments 4-6 weeks
NXP 4-12 weeks
Standard lead time is stable at 4-16 weeks
Texas Instruments 4-8 weeks
NXP 6-16 weeks
Timing
Stable
Standard lead times are at 4-14 weeks
IDT: 4-8 weeks
Silicon Labs: 4-6 weeks
Texas Instruments : 4-6 weeks
ON Semi: 6-14 weeks
Cypress: 6-10 weeks
TECHNOLOGY TRENDS
Click to learn more about Avnet's extensive Logic product offering.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – LOGIC
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
“Mini-Logic”
Stable
Standard lead times are 4-26 weeks
Texas Instruments is at 6-8 weeks
NXP is running 6-26 weeks
Fairchild ranges from 4-6 weeks
ON Semi is at 4-10 weeks
Clock Drivers/
Special Functions
Stable
Standard lead time is running 4-20 weeks
Maxim averaging 6-12 weeks.
Intersil running 6-16 weeks
STMicroelectronics is at 12-20 weeks
NXP 10-14 weeks
ECL
Increasing
Standard lead times 6-8 weeks
Bus Switches
Stable
Standard lead time is running 4-12 weeks
Texas Instruments 4-6 weeks
IDT 4-6 weeks
NXP 8-12 weeks
(CONTINUED)
TECHNOLOGY TRENDS
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – MEMORY
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
Slow ASYNC SRAM
Stable
8-10 weeks
Cypress has broadest portfolio with highest capacity. Micron PSRAM has been announced EOL, ISSI is an alternative up to 64 Mbit.
Renesas has renewed commitment and stocking position on their low power SRAM families. ISSI has a full portfolio of solutions.
FAST ASYNC SRAM
Stable
8-10 weeks
Cypress is committed to long term support of legacy product from 16 Kb to 4 Mb. GSI is a strong player with good power
numbers and very fast speeds. Sweet spot is 1 and 4 Mb.
Synchronous Burst /
ZBT SRAM
Stable
8-10 weeks
Cypress ISSI and GSI support all densities and configurations from 4 to 72 Mb.
DDR2 / QDR2 /
QDR2+ SRAM
Stable
8-10 weeks
QDR2 and QDR2+ at 36/72 Mb are the current hot spots for new designs. 144 Mb is highest density. Many configurations
available. Be cautious with selection to be aware of volume vs. niche versions. 4-5 OEM's drive 90% of demand, so support can
be weak for devices not used by those top customers. Samsung has exited all SRAM products, affected customers should look to
GSI, Cypress, ISSI and Renesas for full support on these families. Cypress is now promoting QDR4 family, ask for details.
SDRAM
Stable
8-10 weeks
Long term support commitments from Micron, ISSI for all 64 to 256 Mb devices. Micron announcing EOL for 512 Mb, customers
can look to ISSI or Alliance Semi for exact replacement.
DDR-1 SDRAM
Stable
8-10 weeks
Long term support commitments from Micron, ISSI and Alliance Memory for all 256 and 512 Mb devices. The 1 Gb DDR-1 has
been announced EOL and is past last time buy window.
DDR-2 SDRAM
Increasing
16 weeks
All densities and options for DDR-2 have great long term support. Extended lead times mean customers should have orders and
forecasts in place. Micron has announced new revisions for 512 Mb and 1 Gb, customer should migrate. Lead times are extending.
DDR-3 SDRAM
Increasing
Allocation
DDR-3 is the design sweet spot from 1 to 4 Gb. Prevailing support is for the DDR3L / 1.35 V option which retains 1.5 V
compatibility. Allocation and delivery constraints continue, forecasting and at least 90 days of backlog in place is suggested.
Micron is now sampling 8Gb DDR3 monolithic devices.
DDR-4 SDRAM
N/A
12-16 weeks
DDR4 components are now shipping at 4 Gb density. Modules now sampling in various form factors, including RDIMM, SODIMM,
and UDIMM. Look for 8 Gb DDR4 in early 2015.
New! Texas Instruments DDR-SDRAM Memory Interface, Power and Switch Solutions. Click for more information.
Mobile or LP DRAM
Increasing
Allocation
LPDDR and LPDDR2 are in strong demand. Vendors are increasing production on LPDDR2 products. Lead times are increasing,
expect seasonal demand to increase 2H 2014. LPDDR2 parts should be chosen carefully, not all configurations and packages are
well supported. Support for LPDDR2 with industrial temperature range is limited and designers should exercise caution. Micron
exiting lower density LP-SDRAM devices, look to ISSI for replacements.
RLDRAM
Stable
8-10 weeks
Micron supporting RLDRAM2 at 288 and 576 Mb, and RLDRAM3 at 576 Mb and 1 Gb. Renesas is alternate supplier and GSI is
offering their LLDRAM family at 576 Mb, compatible to RLDRAM 2. ISSI is Micron's alternative source partner for RLDRAM products.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – MEMORY
(CONTINUED)
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
Low Density
Parallel NOR Flash
Stable
6-8 weeks
Spansion has exited low density / 5 V families. Look to Microchip and Micron for options on some devices.
High density
Parallel NOR Flash
Stable
6-8 weeks
Micron and Spansion have full offerings across all density ranges
NAND Flash IC
Increasing
16 weeks
MLC support stable, seeing shortages and price increases on many Raw SLC devices. Spansion is a solid option for SLC NAND
from 1 to 8 Gb.
Managed
NAND Devices
Increasing
14-16 weeks
eMMC is rapidly becoming popular and is a multiple sourced, JEDEC standard solution. Micron, Toshiba, Kingston, Greenliant,
Sandisk, Smart, and Samsung all have offerings. Lead times are extending rapidly.
Serial (SPI)
NOR Flash
Stable
6-8 weeks
NOR serial flash (SPI) is a simple interface/small footprint, good for code or data storage, offering small packages and less
board space. Densities range from 1 Mb to 2 Gb. Most vendors standardizing on the QUAD SPI (QSPI) offering much faster
speeds. Micron is now shipping a 2 Gb device, highest capacity in the industry. Many FPGA require SPI flash for booting.
Micron and Spansion are approved sources and compatible with Xilinx design tools. Adesto has constrained delivery on some
devices. ISSI has introduced new SPI NOR devices.
EPROM
Stable
6-8 weeks
Atmel is the sole remaining supplier for legacy EPROM products. Only OTP versions are supported.
EEPROM
Stable
6-8 weeks
Atmel, ST, and Microchip have a full offering of serial EEPROM devices.
Multi Port / FIFO
Stable
6-8 weeks
Cypress and IDT remain the strongest players in this space.
Flash Cards &
USB Drives
increasing
10-12 weeks
Densities range from 64 MB to 64 GB. Lower density MLC based cards are increasingly difficult to source due to EOL of lower
density NAND chips. Look at Delkin on industrial grade CF and SD. USB drives are supported. MicroSD is increasingly popular
as an embedded storage option. We now offer CFast cards, which is SATA interface in compact flash form factor.
Emerging Memories
Stable
8-10 weeks
MRAM, FRAM and NVSRAM are niche or emerging non-volatile memory types, as NAND and NOR don’t meet all application
needs. NVRAM is a non-volatile SRAM for high speed storage. Timekeeper options on some types. Cypress acquired Ramtron,
which gives our customers access to all FRAM products.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – MICROCONTROLLERS
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
8-bit
Microcontroller
Stable
Standard lead times
2-20 weeks (stable)
8-BIT MICROCONTROLLERS
Atmel 11-19 weeks (stable)
Freescale 8-10 weeks (stable)
New! Microchip has introduced a new addition to its PIC12/16LF155X 8-bit microcontroller family with the PIC16LF1554
and PIC16LF1559 devices. The PIC16LF1554/9 includes two independent 10-bit 100K samples per second Analog-to-Digital
Converters (ADC) with hardware Capacitive Voltage Divider (CVD) support for capacitive-touch sensing.
Click for more information.
Microchip 6-20 weeks (stable)
Silicon Labs 6 weeks (stable)
16-bit
Microcontroller
Stable
Standard lead times
2-16 weeks (stable)
Freescale 8-16 weeks (stable)
Renesas 14 weeks (stable)
Texas Instruments
2-16 weeks (stable)
32-bit
Microcontroller
Stable
Standard lead times
8-24 weeks (extended)
Atmel 11-19 weeks (stable)
Freescale 8-12 weeks (stable)
NXP 12-16 weeks (stable)
STMicroelectronics
20-24 weeks (extended)
32-BIT MICROCONTROLLERS
New! Freescale Plans Extreme Performance for Kinetis MCUs with ARM® Cortex®-M7 Core. Industry’s broadest portfolio
of compatible and scalable MCUs based on ARM Cortex-M cores set to expand with Cortex-M7. Freescale Semiconductor
announced its support for the recently unveiled ARM Cortex-M7 core, which Freescale plans to leverage for new levels of
performance and power efficiency in forthcoming embedded SoCs. A leading ARM partner and an early adopter of multiple
ARM products, Freescale was the first to market with MCUs based on the Cortex-M4 and Cortex-M0+ cores. Freescale maintains
software and hardware compatibility across six unique Kinetis series, while offering the choice of general purpose or
application specific features.
Microchip has introduced the new PIC32 Bluetooth® Starter Kit. The full-featured kit boasts a PIC32 microcontroller (MCU), HCIbased Bluetooth radio, Cree high-output multi-color LED, 3 standard single-color LEDs, an analog 3-axis accelerometer, analog
temperature sensor and 5 push buttons for user-defined inputs. Click for more information.
Toshiba America Electronic Components announced the newest addition to its TX04 series of ARM® Cortex®-M4F core-based
microcontrollers (MCUs). The TMPM411F20XBG MCU facilitates electric power calculation and communication in smart meters,
as well as sensing and communications in other measurement devices. The TMPM411F20XBG implements tamper detection
and failure detection with very low power consumption, and also incorporates key security functions suitable for secure
network communication. Click for more information.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – OPTOELECTRONICS
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
Light Emitting
Diodes
Decreasing
Standard lead times 4-12 weeks tighter binning requests may
have slightly longer lead times
or delivery dates
LEDS
Avago 4-10 weeks
Osram 8-12 weeks
Seoul 8-10 weeks
Luminus 4-6 weeks
LED Displays
Stable
Standard lead times
4-14 weeks (stable)
Avago 4-8 weeks
Osram 8-14 weeks
Motion Control
Stable
Standard lead times
8-18 weeks (stable)
Infrared
Stable
Standard lead times
4-12 weeks (stable)
Vishay 4-10 weeks
Osram 8-12 weeks
Optocouplers
Stable
Standard lead times are averaging
6-12 weeks
Avago 8-12 weeks
Fairchild - 6-8 weeks
Vishay 4-12 weeks
Toshiba 8-14 weeks
New! Seoul Semiconductor announced the release of a new Acrich module designed for omnidirectional lamps. This
new module is comprised of the Acrich MJT 2525 series LED along with Seoul Semiconductor's latest generation of
Acrich 3 driver IC and a reflector optic. Click for more information.
OPTOCOUPLERS
New! Seoul Semiconductor announced the release of a new LED Module with Acrich 3 technology. The new Acrich
Module is comprised of an LED module with Acrich MJT 5050 series LED, Acrich3 IC technology, and an innovative
heat sink and secondary optics. Click for more information.
New! Toshiba America Electronic Components announced a new series of low-profile, rail-to-rail output gate-drive
photocouplers for directly driving low- to medium-power IGBTs and power MOSFETs: the TLP5751, TLP5752 and
TLP5754. The TLP5751 offers a peak output current of ±1.0A and can drive power MOSFETs and low-power IGBTs
up to 20 A. The ±2.5 A TLP5752 and ±4.0 A TLP5754 will drive power MOSFETs and IGBTs with current ratings to
80A and 100A, respectively. Click for more information.
New! Toshiba America Electronic Components announced the launch of two new photovoltaic couplers housed in
small-size SO6 packages: the TLP3905 and TLP3906. The new photocouplers are designed for use in measuring
instruments or as MOSFET gate drivers for the replacement of mechanical relays. Photovoltaic couplers can be
used to create a MOSFET gate driver without using an external secondary-side power supply. The structure of a
photovoltaic coupler is a photorelay without a MOSFET chip. Click for more information.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PROCESSORS
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
32-bit Embedded
Microprocessors
Stable
Standard lead times 4-20 weeks (stable)
Click to learn more about Avnet's extensive Processor product offering.
Applied Micro 22-26 weeks (stable)
Freescale 8-12 weeks (stable)
Intel 4-8 weeks (stable)
Texas Instruments 8-20 weeks (stable)
64-bit Embedded
Microprocessor
Stable
Standard lead times 4-12 weeks (stable)
Intel 4-8 weeks (stable)
Freescale 4-8 weeks (stable)
AMD 4-8 weeks (stable)
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PROGRAMMABLES
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
CPLDs
Stable
Atmel 6-15 weeks (stable)
FPGAs, SoC FPGAs
Xilinx 6-8 weeks (stable)
New! Avnet Announces PicoZed™- its Newest Family of System-On-Modules (SOMs). Targeted for industrial control, embedded
vision, test and measurement, motor control and software-defined radio applications, PicoZed enables designers to get to market
faster with a proven Zynq®-7000 All Programmable SoC sub-system. In support of PicoZed development and prototyping, Avnet
also released the PicoZed Carrier Card, which provides the necessary interfaces and access to user I/O from the PicoZed SOM.
Click for more information.
FPGAs
SoC FPGAs
Stable
Microsemi (formally Actel)
2-20 weeks (extended)
Xilinx (Spartan) Family
6-14 weeks (extended)
Xilinx (Virtex) Family
6-8 weeks (stable)
Xilinx (Artix-7)
6 weeks (stable)
Xilinx (Kintex-7)
6-8 weeks (stable)
Xilinx (Zynq-7000)
6 weeks (stable)
New! New Shipment in Stock: Avnet’s Artix®-7 50T FPGA Evaluation Kit. This new Evaluation Kit allows you to evaluate the low
power, small form-factor and small density Xilinx Artix-7 FPGA for high-volume applications in cost-sensitive markets such as
industrial control, consumer, medical and test and measurement. The kit provides the necessary interfaces for Artix-7 evaluation
and when coupled with the MicroBlaze™ soft processor, becomes a powerful prototyping vehicle. Click for more information.
New! Featured at X-fest 2014: Xilinx Zynq®-7000 All Programmable SoC Mini-ITX Development Kit. This kit provides a complete
development platform for designing and verifying applications based on the Xilinx Zynq®-7000 All Programmable SoC family. The
Mini-ITX kit enables designers to prototype high-performance designs with ease, while providing expandability and customization
through the FMC HPC expansion slot. Click for more information.
New! Get the Most from Your FPGA-Based System with Maxim Integrated. Designers today need an easy-to-use-way to take the
complexity out of analog design. You always need to reduce cost and eliminate roadblocks to successful designs. That’s why you
want to work with Maxim, a trusted power supplier for Xilinx FPGAs. With Maxim as your partner, with our high-performance and
maximum energy-efficiency tools, you have a solution to help complete your designs faster. Be sure to visit them at X-fest!
Click for more information.
New! Analog Devices released the industry’s first software-defined radio (SDR) rapid prototyping kit with dual 2 x 2 AD9361 RF
transceivers to simplify and rapidly prototype 4 x 4 multiple-input multiple-output (MIMO) wireless transceiver applications on
the Xilinx® Zynq®-7000 All Programmable SoC development platforms. The AD-FMCOMMS5-EBZ rapid prototyping kit provides
a hardware/software ecosystem solution addressing the challenges of SDR transceiver synchronization experienced by RF and
analog designers when implementing systems using MIMO architectures. Click for more information.
TRAINING SECTION
New! X-fest Technical Trainings – Don’t Miss the Final Events in North America! X-fest kicked off in North America on September
9th with great attendance and interest! Where else would you get this type of top-notch training and ability to view demos from
industry-leading technology suppliers in a single day? In late fall, X-fest will be moving throughout Asia, Europe and Japan. Be
sure to check out the course videos to help you decide what classes to attend! Click for more information.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – RF
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
TECHNOLOGY TRENDS
RF Power
Stable
Standard lead times 6-26 weeks
GaN CONTINUES TO MOVE MICROWAVE RF POWER SEMICONDUCTOR MARKETS
TO OVER $300M BY 2019
Freescale 20-26 weeks (extended)
NXP 6-24+ weeks - Allocation for some
products (extended)
STMicroelectronics 12-18 weeks (stable)
RF Small Signal
Stable
Toshiba 12 weeks (stable)
SAMSUNG, ARM, AND NEST LAUNCH THREAD, A LOW-POWER NETWORK FOR THE SMART HOME
Standard lead times 2-14 weeks
Seven companies joined forces to form the Thread Group (www.threadgroup.org) and develop Thread,
a new IP-based wireless networking protocol. Built on well-proven standards, including IEEE 802.15.4,
IETF IPv6 and 6LoWPAN, Thread represents a resilient, IP-based solution for the rapidly growing
Internet of Things. Existing popular application protocols and IoT platforms can run over Thread
networks. A version of Thread is already being used successfully in Nest products today.
Analog Devices 2-17 weeks (extended)
NXP 6-12 weeks (stable)
Avago 2-14 weeks (extended)
RF Wireless
Stable
The availability of new gallium nitride (GaN) devices for 4 to 18 GHz becomes more pervasive. Pointto-point communications, SATCOM, radars of all types, and new industrial/medical applications will all
benefit by the introduction of these high-power GaN devices. GaN can operate at much higher voltages
and at power levels that were difficult or impossible to reach using Gallium Arsenide (GaAs).
Texas Instruments 2-8 weeks (stable)
VETRONICS MARKET WORTH $10.78B BY 2020
Standard lead times 2-24 weeks
The vehicle electronics (Vetronics) market is expected to reach $10.78B by 2020. The major factors
driving the vehicle electronics market are network centric battlefield warfare, rising demand for
situational awareness and SWaP specifications. Armored vehicles such as main battle tanks, armored
personnel carriers, infantry fighting vehicles, mine resistant ambush protection comprise the vehicle
electronics market.
Atmel 12-24 weeks (extended)
Freescale 8-12 weeks (stable)
NXP 10-16 weeks (stable)
Silicon Labs 2-16 weeks (stable)
RF WIRELESS
Texas Instruments 2-12 weeks (stable)
New! Broadcom Corporation introduced a new development kit into its Wireless Internet Connectivity
for Embedded Devices (WICED™) family to enable developers to rapidly prototype ideas and concepts
for IoT devices and applications. The Broadcom® WICED Sense development kit is an all-in-one IoT
prototyping kit that includes Broadcom's newest Bluetooth Smart chip, five micro electro-mechanical
systems (MEMS) and has a software stack that is Bluetooth 4.1 compatible. Click for more information.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – ELECTROMECHANICAL
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
Circuit Breakers
Stable
Stock to 14 weeks (stable)
Circuit breakers are an over current circuit protection device and generally come in magnetic and
thermal types.
Fans & Blowers
Stable
14-16 weeks ARO (unstable)
New fan and blower products are integrating intelligent equipment features including: speed
monitoring, closed loop speed control and operating monitoring.
Heat Sinks
Stable
Stock to 8 weeks (stable)
Heat sink products – active and passive lead times and costs are steady. New products for POL power
converters are now available.
Relays
Stable
12-20 (extended), some relays on allocation
Avnet's relay product offering includes general-purpose, solid-state, relay terminals and PCB relays.
Demand continues to grow for smaller, higher current relays such as smaller sized PCB-mount types
for use in automotive applications. Solid-state relays continue to outgrow EMR relays.
Sensors
Stable
Stock to 17-19 weeks (unstable)
Avnet offers a wide variety of sensor products including motion, light, speed and position, as well
thermal and voltage sensors.
Switches
Stable
Stock to 16 weeks (stable)
Avnet’s switch product offerings include: DIP, pushbutton, slide, tactile, toggle, rocker snap, rotary, and
more. Clear trend for all types is to smaller devices. Major factors driving this are the proliferation of
portable electronic products, and the general trend to make things smaller. 3-5% increase (C & K).
Switches,
Sensors, &
Circuit Breakers
Stable
Stock to 8 weeks (stable)
Includes Mil-S-83731, Mil-55116, Mil-9177.
Mil-Aero &
Industrial Relays
Stable
Stock to 16-30 weeks
M39016, M28776, M6106, M83536, M83726, & M12883.
Magnetics
Stable
Stock to 14 weeks (stable)
Avnet’s mil-aero magnetics product offering includes QPL’ed M21038 interface & Fibre Channel
transformers, QPL’ed M83531 delay lines, databus couplers, modules (interface LAN, telecom Ethernet
& Firewire transceiver) and mil-aero grade power chokes & power inductors.
MILITARY
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – INTERCONNECT
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
DIN41612(Eurocard)
Stable
Stock to 9 weeks (stable)
DIN is an older technology still widely used in VME & VME64 applications.
Compact PCI
Stable
Stock to 8 weeks (stable)
Compact PCI is the most widely used 2 mm product today. Highest usage is in Communications sector as well.
2 mm Hard Metric Standard & High
Speed Designs
Stable
Stock to 9 weeks (down)
Increasing demands for bandwidth and speed is pushing suppliers to improve 2 mm & 2.5 mm designs. New
high speed niche products appearing incorporating power, signal, & ground planes in one module.
PC Card (PCMCIA)
Stable
Stock to 8 weeks (stable)
Top apps data com, fax/modem and LAN Ethernet cards. Modem cards for notebooks and PDAs are
decreasing as other technologies, such as DSL, emerge.
Memory Card Compact
Flash 1 & 11 Multi-Media Cards
Stable
Stock to 8 weeks (stable)
Top applications consumer, telecom, & industrial segments, Competing technology Secure Digital, and Smart
Media Cards.
Smart Card
Stable
Stock to 8 weeks (stable)
Smart cards are generally associated with markets for ID/Access control. Set-top boxes may also see usage.
DIMM for DDR SDRAM
DIMM for SDRAM and EDO-DRAM
Stable
Stock to 8 weeks (stable)
Used in graphics applications, PC’s, workstations and networking equipment. High growth segment.
PCI Express ™ Edge Card
Stable
Stock to 7 weeks (stable)
PCI Express™ is a high performance serial I/O designed to meet the needs of next-generation computing and
communications platforms.
Standard Edge Card
Stable
Stock to 8 weeks (stable)
Board-to-board and Wire-to-board products. Slot 1, Slot 2, AGP, NLX, etc…edge card products.
IC Sockets
Stable
Stock to 9 weeks (stable)
DIP, ZIP, SIP, PLCC, PGA, Edge Connectors, Stamped, formed and screw machine.
BACKPLANE CONNECTORS
SOCKET/CARD CONNECTORS
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – INTERCONNECT (CONTINUED)
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
Telephone and Telecom
Stable
Stock to 8 weeks (stable)
Includes Modular plugs and jacks (ganged, stacked, filtered) HSSDC, HSSDC2, QSFP, Transceivers, XFP.
Audio/Video
Stable
Stock to 7 weeks (stable)
Includes HDMI, Display Port, DVI - Top market is digital flat panels.
Storage I/O Standards
Stable
Stock to 8 weeks (stable)
Storage I/O impact is in the networking market. Leading product families are Serial ATA disk drive, SCSI, SCA,
and HSSDC connectors associated with Fibre channel Drives. Infinband architecture appearing in a number of
high end systems and provides a cost effective solution.
Consumer I/O Standards:
USB, Micro USB, etc
Stable
Stock to 7 weeks (stable)
D-Sub usage continues to decline and is being replaced by higher speed I/O such as USB and IEEE 1394 for
serial interface on computers and peripherals.
High Density/High Speed I/O
Stable
Stock to 8 weeks (stable)
Includes: QSFP, SFP, HSSDC2, and Infiband products.
Stable
Stock to 7 weeks (stable)
Standard Power, 062, .093, High Density, Circular Power, Industrial & Combo Headers.
INPUT/OUTPUT CONNECTORS
STANDARD PRODUCTS
Power/Industrial Connectors
Molex Mega-Fit Power Connectors deliver cutting-edge current density at 23.0 A per circuit; terminals
provide six independent contact points for long-term reliability in virtually every industry and application.
Click for more information.
Board-to-Board,
Board-to-Wire Systems
Stable
Stock to 7 weeks (stable)
Board-to-Board and Board-to-Wire (flat or discrete) connector systems. .100”, .098”, & .050” products.
Micro/Nano Connector Systems
Stable
Stock to 8 weeks (stable)
Miniature connectors 2 to .050 mm board-to-board and board-to-wire (flat or discrete) connector systems.
Flexible Interconnect Systems
Stable
Stock to 7 weeks (down)
Flex cable, Flex strip, Flex assemblies from .100” to 1 mm wire-to-wire and wire-to-board.
Cables
Stable
Stock to 6 weeks (stable)
CAT 6-U/FTP, CAT 6-U/UTP, COAX, Ethernet, FFC Jumper, Fiber, Flat, Flat Flex, Ribbon Cable, Flexible, FPC
Jumper, Round, Flat Round, Solar, Twisted Pair, USB.
Cable Assembly
Stable
Stock to 7 weeks (stable)
Fiber Optic, Solar, RF, Ethernet, Ribbon Cable, Power, SAS, SATA, SCSI to SCSI, DSUB, Audio, Circular, Coax,
Backplane, Input/Output, Flat Flex, USB, IDC.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – INTERCONNECT (CONTINUED)
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
Memory Card Compact
Flash 1 & 11 Multi-Media Cards
Stable
Stock to 8 weeks (stable)
Top applications consumer, telecom, & industrial segments, Competing technology Secure Digital,
and Smart Media Cards.
.100 Centerline B-to-B Stacking
Stable
Stock to 6 weeks (stable)
Reliable & economical board-to-board stacking solution. Popular where high density packaging is not required.
Sub 2 mm Mezzanine
Stable
Stock to 7 weeks (stable)
1 mm meets IEEE 1386 Mezzanine Standard. .8 mm SMT high pin solution. .5 mm SMT low pin count solution.
Headers & Pin Strip Headers
Stable
Stock to 6 weeks (stable)
Standard type headers.
Terminal Blocks
Stable
Stock to 9 weeks (stable)
Barrier, Card Edge, DIN 5264, DIN Rail, Diode, Disconnect, Euro, Feed Thru, Fuse Block, Pluggable Mini,
ThermoCouple, Spring Cage.
Terminals
Stable
Stock to 8 weeks (stable)
Insulated, uninsulated, crimp, butt connectors, heat shrink, quick disconnect.
Tooling
Stable
Stock to 4 weeks (stable)
Most of the connector suppliers sell tooling for crimping. GRP code T1A.
SC & ST
Stable
Stock to 6 weeks (stable)
Standard single and multimode products.
Fiber Optic Cable Assemblies
Stable
Stock to 7 weeks (stable)
Due to the complexity of cabling fiber optics. Suppliers have and will continue to provide the majority of
cable assemblies. The largest growth will come from the networking and telecom market segments.
Small Form Factor (SFF)
Stable
Stock to 7 weeks (stable)
Small Form Factor (SFF) fiber optic solutions were developed in response to the need for easier-to-use fiber
optic connectivity in high-density applications such as telecommunications and datacom networks. SFF
products include LC, MU, MT-RJ, & VF-45.
Fiber Optic Backplane Products
Stable
Stock to 7 weeks (stable)
Top Interconnect Suppliers offer a wide variety of backplane interconnect solutions to meet the demand for
network bandwidth management.
SFP & XFP Connectors & Cages
Stable
Stock to 7 weeks (stable)
SFP & XFP designs support hot swap of various types of fiber optic and copper based transceivers into host
equipment. This allows the flexibility to change between different protocols such as 100BASE-SX, 1000BASECX, or 1000BASE-LX.
PCB CONNECTORS
FIBER OPTIC CONNECTORS
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – INTERCONNECT (CONTINUED)
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
D-Sub
Mil-C-24308
Stable
Factory lead times 12 weeks (stable)
Build time 2-3 days on component stock
Includes solder, crimp, PC tail, etc…(M23408/1-through M23408/26).
Micro D-Sub
Mil-C-83513
Stable
Stock to 6 weeks (stable)
Lead times are stable on this product no
changes in last month.
Available in solder tail, pig tail harness, right angle, PCB, and High-Temp versions
(High-Temp being New)…..(M83513/01-through M83513/10).
Rack & Panel
Arinc 404 & 600
Mil-C-81659 and 83733
Stable
404s factory lead times 14 weeks,
600s factory lead time 16 weeks
Build time 5 days on component stock
DPX & BKAD - Products available with up to 800 size 22 contacts.
Circular Connectors
Mil-C-5015
Stable
Build time 3-5 days on component stock
12 weeks factory lead time (stable)
MS3100 to MS3108 and MS3450 to MS3459. Covers 40 shell sizes, crimp contacts in gold
& gold flash. Zinc free alloy also available (cad free).
Circular Connectors
Mil-C-38999
Stable
Build time 3 days no component stock
14 weeks factory lead time (stable)
MS27XXX and D38999/20 thru /26. Avnet also stocks and assembles coax, triax, twinax,
Quadrax and PC tail products.
Circular Connector
Mil-C-83723
Stable
Factory lead time 16 weeks (stable)
Build time 3-5 days on component stock
M83723/71 through /96 in 3 coupling style choices, bayonet, threaded & quick disconnect.
Circular Connectors
Mil-C-26482
Stable
Factory lead time 12 weeks (stable) no
change in last month
Build time 3 days on component stock
MS3110 to MS3116: MS3120 to MS3126: MS3470 to MS3476 Versatile w/ large variety
of options & mounting styles. Also available in Cad Free finish.
MILITARY CONNECTORS
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PASSIVE
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
Aluminum
Capacitors
Stable
For some MFGs the
capacity for SMT Lytics
is MAXED due to very
high demand, there are
however multiple MFGs
building Aluminums
and lead time can vary.
Standard 12-18 weeks
Some MFGs may extend
out as far as 28 weeks,
which may include 4-6
weeks for delivery
MARKET, PRODUCT AND TECHNOLOGY TRENDS
PANSONIC OFFERING HIGH RIPPLE OS-CON, LARGER CAPACITANCE HYBRID CAPACITOR AND OS-CON
NIC Components is pleased to announce the addition of NRB-XG series of long life rated radial leaded aluminum electrolytic capacitors in reduced case sizes, to
its expanded high voltage rated capacitor offering. NRB-XG provided component downsize solution in 6.3mm, 8mm and 10mm case diameters, for use in high
voltage power applications including electronic lighting ballast circuits. Long life rated at 8000 hours at +105 °C, NRB-XG is available in 1.5~27 uF in 200 VDC
and 400 VDC ratings with operating temperature range of -40~+105 °C.
RoHS compliant and halogen-free, the NRB-XG is supplied in bulk or tape and box packaging. Typical unit pricing from $0.04 to $0.15, with lead times from 10 to
12 weeks. Please contact NIC today, for free evaluation samples and to review your application requirements.
HYBRID CAPACITOR TECHNOLOGIES
With an industry leading offering of 12 series in SMT and LDD constructions, NIC hybrid construction (liquid - polymer electrolyte) aluminum electrolytic
capacitors fit the goals and circuit requirements of tomorrow's design.
Want to compare hybrids with other capacitor technologies? The NIC QuickBUILDER Parametric search lets you instantly search all capacitor technologies. Get
detailed specifications, order samples, and compare up to 5 parts to find your best choice.
EPCOS PRODUCT PROFILE 2014
• MotorCap P2 (S2) Aluminum Can
• AC Film Capacitors for Motor Run Applications
• Ordering code EPC:26045-7600
• Language English
• Length 16 pages
The new Product Profile offers an overview of EPCOS AC motor run capacitors (MotorCapTM) in aluminum cans according to safety class P2 (S2). The B32330*,
B32332*, B32333* and B32335* series are needed for the operation of induction motors. Their main application areas are domestic appliances, heating and
cooling equipment, applications in drive technology, UPS systems as well as home and garden equipment.
Highlights
• Extremely compact product design
• Terminals available in various versions
• New version with cable terminals
• Version according to IEC 60252-1 and class A (30 000 hours of service life)
• Version according to IEC 60335-1 upon request
TAIYO YUDEN OFFERS LITHIUM ION CAPACITORS WITH LONG LIFE AND HIGH TEMPERATURE RELIABILITY
TAIYO YUDEN INC.’s new Cylindrical Lithium Ion Capacitor (LIC) offers extremely large energy density and high reliability. Combining the strength of lithium-ion
secondary batteries with conventional Electric Double Layer Capacitors (EDLC), this next-generation energy device offers an energy density 4 times greater than
EDLCs.
TAIYO YUDEN's hybrid LIC boasts the key features of batteries (high voltage and high energy) while maintaining the traditional characteristics of capacitors (rapid
charge/discharge, high durability, safety and environmental friendliness). Unlike batteries, LICs have no risk of thermal runaway and have extremely low self
discharge, even in high heat environments. These LICs are much more reliable than conventional EDLCs because of this hybrid feature.
These LICs provide an increased maximum rated voltage of 3.8 V (about 1.5 times higher than the 2.3-2.7 V of conventional capacitors), and offer 2
times the capacity of similar sized EDLCs - making their energy density up to 4 times higher than that of EDLCs. A higher energy density results in fewer
components needed and reduced mounting space when compared to EDLCs. One LIC can replace multiple EDLCs, allowing for improved thermal design in
tight spaces such as servers.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PASSIVE
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
Ceramic Chip
Capacitors
Stable
With multiple MFGs
building Ceramics leadtime can vary
(CONTINUED)
MARKET, PRODUCT AND TECHNOLOGY TRENDS
NIC "X6S" TCC MLCC CERAMIC CAPACITORS
NIC Components is pleased to announce the expansion of its high capacitance ceramic capacitor MLCC product offering to include X6S
temperature coefficient to NMC series products. X6S TCC is supported in 0201, 0402, 0603, 0805, 1206, 1210 case sizes, and is upgrade from
X5R TCC. X6S products capacitance value range of 1.0~100 uF in ±10%(K) or ±20% (M) tolerance, with voltage ratings of 4 V~50 VDC. X6S has
maximum ±22% capacitance value change over -55~ +105 °C temperature range (this is upgrade from X5R +85 °C upper limit). X6S TCC MLCCs
are ideal for use in filtering, coupling, decoupling and bypass applications in wide range of higher temperature end-product applications. Free
component samples, for evaluation and qualification purposes, are available from NIC.
AVX EXPANDS PARTNERSHIP WITH MODELITHICS
AVX has expanded its partnership with Modelithics, the leading RF/Microwave simulation model provider, with the addition of 45 new
Modelithics substrate scalable equivalent circuit models. Designed to speed up design decisions and circuit level optimizations when used
in combination with the industry's leading electronic design automation tools, including Keysight Advanced Design System (ADS), Keysight
Genesys, and NI AWR Microwave Office, highly accurate, substrate scalable models are now available for AVX thin film couplers, multilayer
organic (MLO) diplexers, and a variety of RF/Microwave capacitors and inductors
KEMET RELEASE NEW X5R DIELECTRIC COMMERCIAL GRADE, FLEX CRACKING
What is an MLCC Flex Crack ? Standard Termination MLCC Typical Board Flex Crack after severe mechanical bending. Kemet Ceramic Solutions.
Reducing Board Space """"DOWNSIZING"""" • Going Smaller, ARRAYS • Multiple MLCC’s in one package • 2, 4 elements, KPS AUTO • Stacked
MLCC’s in leadframe • 1210 - 2220. Go to www.kemet.com for NEW HIGH VOLTAGE & HIGH TEMP PRODUCTS that have been launched.
KEMET's SnPb Terminated Ceramic Capacitors for High Reliability Soldering KEMET's portfolio of tin/lead terminated ceramic surface mount
capacitors in C0G and X7R dielectric are well suited for applications which include defense and aerospace electronics.
TAIYO-YUDEN new introduction of 171 new MLCCs, both standard and AEC-Q200 qualified product, including 150, 220 and 330uF product! NPI
IN PROCESS.
Ceramic
Through-Hole
Capacitors
Stable
Stock to 20 weeks
AVX focuses on automotive-grade capacitors for radial skycaps "SR" will be "AR" series and Axial Spingaurd "SA" will be "AA" series. For more
information see www.avx.com, AVX: SR and SA Series NP0 have a longer lead time at 18 weeks, elsewhere stable stock to 12 weeks..
KEMET future demand is up. Kemet's up and coming ROHS Conversions Note, X8R/X8L Aximax Q2 CY14, BME Auto grade Aximax & Goldmax
have completed AECQ200 qual testing. Separate catalogs for Base Metal and Precious Metal designs for Aximax & Goldmax product being
developed to better align our costs and pricing strategies. Kemet wants to make BME its new standard design, so new part numbers are under
development for existing PME product.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PASSIVE
(CONTINUED)
Continued on following page
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
Ceramic Disc
Capacitors
Stable
Lead times
12-22 weeks some case
size/values may be
lengthier than others.
Pricing stable for now!
Vishay Intertechnology, Inc. introduces a new series of AEC-Q200-qualified, AC-line-rated ceramic disc safety capacitors designed to provide
high reliability for Class X1 (440 VAC) and Y2 (300 VAC) automotive applications in accordance with IEC 60384-14.3, 3rd edition.
• Single-layer AC disc capacitors
• Consist of a silver-plated ceramic disc with tinned copper connection leads offering 0.6 mm diameters
• Available with straight leads with spacing of 5 mm, 7.5 mm, and 10 mm
• RoHS-compliant and halogen-free
• Encapsulation is made of flammable-resistant epoxy resin in accordance with UL 94 V-0
Click for more information.
Film
Capacitors/
Ceramic Axial
Stable
Tantalum/
Polymer
Chip/
Through-hole
Capacitors
Stable
Standard 14-18 weeks
out as far as 36 weeks
which may include 4-6
weeks for delivery,
General lead times
extending within some
MFGs. Acquiring raw
material for agency
recognized XY safety
caps can get challenging
at times
With multiple MFGs
building Tantalums
lead time can vary.
Lead times are stable
running stock 22 weeks. This can
vary by 4-6 weeks
on extend cap values,
tolerances and
specialties.
PANSONIC OFFERS EZPE SERIES OF DC LINK CAPACITORS PLUS ECWF SERIES META PP FILM CAPACITORS
Panasonic introduces the NEW ECW-F(E) Series of Metalized Polypropylene Film Capacitors. With a durable outer box construction, this
Panasonic part is capable of withstanding vibrations better than a standard dipped type film capacitor. The polypropylene dielectric provides
better electrical characteristics than Polyester and the built-in fuse functionality allows the ECWF(E) Series to open upon failure rather than
short circuit. Currently rated for 450VDC applications, this film capacitor is essential for Power Supplies, PFC, and other applications where
vibrations are a subject of concern.
KEMET FIRST-TO-MARKET POLYMER HERM SEAL EXTENSIONS
The new T550 Polymer Hermetic Seal Series is now available in a B case size, offering the highest voltage and deliverable energy with the
lowest leakage current of any other capacitor. Through-hole Polymer Hermetic Seal Portfolio Expansion The T550 PHS DLA and T551 Polymer
Hermetic Seal (PHS) Series both offer the highest voltage and deliverable energy with the lowest leakage current of any other solid tantalum
capacitor.
KEMET EXPANDED TANTALUM POLYMER PORTFOLIO
A newly constructed T528 Series B case size design offers ESR values of 6 and 9 mOhms, making it the lowest ESR product available in this
footprint.
PANASONIC OFFERING HIGH VOLTAGE SP-CAP AND LOW PROFILE SP-CAP, AND LARGER CAPACITANCE POSCAP"
AVX RELEASES NEW CAP VALUES FOR TANTALUM MnO2 (3), TANTALUM POLYMER (3) & TANTALUM HI-REL (12) Click for more info.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PASSIVE
(CONTINUED)
Continued on following page
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
Filters
(GDTs, TVS,
Varistors,
Thyristors)
Increasing
Stock to 8-14 weeks stable
KEMET IS PLEASED TO NOW OFFER NEW ELECTRONIC COMPONENT SOLUTIONS FOR NEC TOKIN'S ELECTRONIC COMPONENT PRODUCTS
INCLUDING SUPERCAPACITORS, INDUCTORS, RELAYS, FLEX SUPPRESSORS, EMI CORES AND AC LINE FILTERS
Lead times to include
AVX, BNS, MUR, TDK,
DAL, PIC, STP, TYC
EPCOS PRODUCT BRIEF 2015, THERMOFUSE VARISTORS, T SERIES FOR HOUSEHOLD APPLIANCES AND INDUSTRIAL APPLICATIONS, ORDERING
CODE EPC:62024-7600
Language English Length 4 pages The new EPCOS Product Brief entitled ThermoFuse Varistors, T Series is now available. It provides an
overview of the ThermoFuse varistors with 14 mm and 20 mm disks and also presents examples of their application in household appliances
and industrial electronics.
EPCOS PRODUCT NEWS POWER QUALITY SOLUTIONS ACTIVE HARMONIC FILTERS FOR OPTIMIZED POWER QUALITY
With the EPCOS PQSine™ a new series of active harmonic filters is available for optimized power quality. The modular filter systems are
designed for 3-phase networks with and without neutral conductors at voltages from 200 V AC to 480 V AC and 50/60 Hz. PQSine active
harmonic filters are able to analyze and neutralize harmonics up to the 50th order. The new filter series is available in steps of 60 A up to a
maximum rated current of 600 A.
AVX VARISTORS SUCCESSFUL WHY?
Performance and Range
• Off-state capacitance (EMC Capacitance) available from 0.47pF to
30nF-> EMI Filtering
• On-state back-to-back Zener diodes -> Transient Voltage
Suppression
• Fast response, Bi-directional
Fuses
Stable
Lead times are running
any where from
2-3 weeks out to 10
weeks
Bourns 6-13 weeks
NIC 12-14 weeks
• No wear out Phenomena (can withstand repetitive ESD strikes)
• Low leakage
• Large surge and energy capability
NIC Components is pleased to announce the addition of NFVC_S series of surface mount chip fuses, to its expanded offering of circuit
protection products. NFVC series utilizes wire in air fuse construction, for superior inrush current characteristics (I2T) as compared to thick
and thin film type SMT chip fuses. Supplied in 6125 (2410) case size, the NFVC_S series features wide operating range (-55 to +125 C) with
current ratings from 1 to 5A (derated over temperature) and interrupt voltage ratings of 125 VAC (125 V & 160 VDC). NFVC_S series is UL
safety agency (USA & Canada) listed under supplemental fuses.
The NFVC series is RoHS and PB-Free soldering compliant, supplied packaged on carrier tape for automated pick and placement PCB
assemblies, followed by reflow or wave (flow) soldering process. Click for more information.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PASSIVE
(CONTINUED)
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
Inductors
Stable
TDK/EPO: Inductor currently running 14-16 weeks
out as fas as 56 weeks is a possibility
VISHAY INTERTECHNOLOGY, INC. ANNOUNCES A NEW POWDERED-IRON-BASED, WPC-COMPLIANT (WIRELESS POWER
CONSORTIUM) WIRELESS CHARGING RECEIVING COIL DESIGNED FOR 10 W APPLICATIONS
NIC is running approx. 12-16 weeks
• Provides an alternative to Ferrite-based solutions – which can saturate in the presence of a strong magnetic field
PIC Is approx. 13-19 weeks
BNS/JWM is currently running 15-20 weeks
Click for more information.
TAIYO YUDEN ANNOUNCES AN EIA 0603 SIZE CHIP BEAD INDUCTOR WITH THE HIGHEST CURRENT RATING IN THE INDUSTRY
DAL:
Model
• Rated current of 2 A enables 10 W of charge at 5 V
Inductance Current lead time in weeks
This Product Demonstrates High Reliability and High Rated Current, Making it Ideal for Car Electronics and Industrial
Equipment.
IHLP-1616
All
10 -11
IHLP-2020
All
10 -11
IHLP-2525
All
11-12
AVX EXPANDS PARTNERSHIP WITH MODELITHICS
IHLP-3232
All
12-13
IHLP-4040
All
13-14
IHLP-5050
All
11-12
IHLP-6767
All
19-20
AVX has expanded its partnership with Modelithics, the leading RF/Microwave simulation model provider, with the addition
of 45 new Modelithics substrate scalable equivalent circuit models. Designed to speed up design decisions and circuit level
optimizations when used in combination with the industry's leading electronic design automation tools, including Keysight
Advanced Design System (ADS), Keysight Genesys, and NI AWR Microwave Office, highly accurate, substrate scalable models
are now available for AVX thin film couplers, multilayer organic (MLO) diplexers, and a variety of RF/Microwave capacitors and
inductors.
TAIYO YUDEN has announced the expansion of its line-up for its chip bead inductor FB series M type, designed for increased
noise reduction for power supply use, with the EIA 0603 size FBMJ1608 (1.6 x 0.8 x 0.8mm), the EIA 0806 size FBMH2016
(2.0 x 1.6 x 1.6mm), and the EIA 1206 size FBMH3216 (3.2 x 1.6 x 1.6mm).
STP is running stock-12 weeks
EPCOS PRODUCT NEWS LEADED RF CHOKES WITH HIGH CURRENT CAPABILITY
Murata is generally running 14-16 weeks
The new LBC+ series of EPCOS leaded RF chokes offers components for rated currents of up to 4450 mA at saturation currents
of up to 7700 mA. This corresponds to an increase of up to 80 percent compared to previous versions. The range of inductance
values of the E12 series extends from 1.0 μH to 470 μH. These RoHS-compatible inductors are suitable for an operating
temperature range of -55 to +125 °C.
The components of the LBC+ series are manufactured in both axial (B82144F2*) and radial types (B82144B2*). The latter have
a lead spacing of 5 mm. The chokes have a length of 9.2 mm and a diameter of 6.5 mm. A flame-retardant enamel coating
protects the components against environmental effects. Moreover, they are marked for identification with color rings to IEC
60062.
BOURNS INDUCTIVE COMPONENTS PRODUCT LINE INTRODUCES AN ADDITIONAL MODEL, SM51589PEL, TO THE LAN
TRANSFORMER PRODUCT CATEGORY
The Bourns® Model SM51589PEL is a single-port, potted construction LAN 10/100/1000 Base-T transformer that is designed
for Ethernet applications with PoE function. This model features an extended operating temperature range from -40 to +85 °C
with unique 5 kVrms isolation voltage. Click for more information.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PASSIVE
(CONTINUED)
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
Magnetics
Stable
Stock to 14 weeks
The Bourns® Model AMS22B Non-Contacting Analog Rotary Position Sensor is designed to meet the specifications of
heavy-duty applications requiring long cycle life and high reliability. This single-turn rotary sensor features a 1/4 ”
stainless steel shaft supported by a bronze sleeve bearing and a factory programmable electrical angle from 10 to 360
degrees. Available in a bushing mount configuration with a rotational life of up to 50 million cycles, the Bourns® Model
AMS22B Sensor is a highly versatile panel mount position sensing device. Click for more information.
AVX offers Circuit Protection for Automotive, Professional, Industrial and Commercial Applications. AVX delivers
broad range of circuit protection components for today’s and future application needs. More noise created and more
susceptibility to noise. Need is for EMI attenuation, AVX Solutions include:
• Traditional AVX Capacitive Products
• Feedthrus
• Feedthru Arrays
• TransFeeds, TransGuards, MultiGuards, AntennaGuards, USB Series, Controlled Cap MLVs - these provide EMI
attenuation in addition to over voltage protection
Potentiometers
Stable
Bourns is currently is running: 8-16 weeks
DAL is currently is running 8-16 weeks
PIC is currently is running 12-14 weeks
In line with our commitment to provide our customers with innovative products, Bourns Sensors and Controls is proud to
announce the release of our “dual ball bearing” option for our Model 3549 10-Turn Precision Potentiometer. Click for
more information.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PASSIVE
(CONTINUED)
Continued on following page
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
Resistor
Chips
Stable
Bourns is running 7-14 weeks
Panasonic NPI for ERJ-6PW is an Anti Surge double-sided resistor and ERJ8CW Line Extension. Focus on high value
resistors such as Current Sense, Thin Film, and High Power types.
DAL: the "CRCW" chip resistors are currently
running about 9-12 weeks
NIC: the "NRC” chip resistors are currently
running about 9-12 weeks
PIC: "ERJ" chip resistors are at 7-12 weeks
Array's are at 8-10 weeks
Thin Film are at 8-10 weeks
RHO is running 8-10 weeks
Stackpole chip resistors are at stock-10 weeks
Vishay Intertechnology, Inc. introduces a new high-voltage thin film resistor divider network that offers a compact,
higher-precision alternative to functionally equivalent products built on thick film technology.
• High-precision thin film construction
• Compatible with high-speed assembly equipment
• Edge castellation allows visual inspection of solder joints
http://www.vishay.com/whatsnew/doc/npi_140904-NPI-Resistors-HVRD.pdf
Is there a MFG that has a Thick Film chip resistor that is 100% Lead Free and 100% RoHS Compliant? YES!
Vishay has their RCG series (Green Thick Film Chip Resistors). It is totally lead free, no lead in glass, no RoHS exemption!
Click for more information.
NIC Components also has introduced the NRCL series that is a thick film chip resistor that does not contain lead or use
exemption to achieve compliance. Click for more information.
NIC is pleased to offer NRSNL series of Pb free thick film chip resistor arrays, which does not take the RoHS exemption,
as the level of Pb has been reduced below the RoHS threshold of 1,000PPM (0.1%). The NRSNL series 4 element
arrays are available in EIA standard 0408 (0402 x 4) & 0612 (0603 x 4) case sizes with convex terminal construction.
Supported in E24 (+/-5% tolerance) and E96 (+/-1% tolerance) resistance values, with individual element power ratings
of 1/16W (0.0625W) in 0408 size and 1/10W (0.10W) in 0612 size. Click for more information.
*** Avnet now has Rohm passives!
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PASSIVE
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
Resistors,
Leaded
Stable
NIC is running approx. 10-12 weeks
WATER-COOLED WIREWOUND RESISTOR:
PIC is approx. stock to 12-14 weeks
Key Benefits:
(CONTINUED)
MARKET, PRODUCT AND TECHNOLOGY TRENDS
STP is running approx. 8-15 weeks
• Very high power dissipation up to 2500 W at 60 °C water inlet temperature and 5 l/min
DALpresently, lead times are running
6-11 weeks
• High pulse tolerance: up to 5000 W for 10 s
• Non inductive option: below 250 nH
Applications:
• Snubber and DC grading resistor for HVDC
• Discharge and balancing resistor
• Snubber resistor for drives and large drives
• Filter resistor
Click for more information.
Timing
Devices
Stable
Lead time for standard product
8-10 weeks, non-standard product
10-14 weeks, programmable
oscillators (FOX) 1-3 weeks and
resonators 10-14 weeks
Pin through oscillators selectively being discontinued, extended lead times expected.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – PASSIVE (CONTINUED)
PRODUCTS
PRICING
TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
Stable
Standard lead times 7-17 (stable)
While Vishay Bennington Facility remains on hold for the Tantalum Capacitor M39006/22/25/30/31, Styles CLR79/81/90/91,
125V ratings, Characteristic “H” suffix only all failure rates.
MILITARY
Mil-Tantalum
Capacitors
Please be advised the Vishay/Israel has a Ship Hold Notice - wet tantalum capacitors M39006/22/25/30/31, Styles
CLR79/81/90/91, 125V rating, Characteristic “H” (High Vibration) suffix only all failure rates, all case sizes Date Code- 1327
or newer Vishay-Israel Cage code SH905 only
Description:
Vishay-Israel experienced a Group C, Subgroup 1, test failure for random vibration. All parts passed all other tests within the
sub-group, to include 80g high frequency vibration. Subsequent testing isolated the failures to 125V ratings.
Related Suffix “H” Dash Numbers released from Hold:
M39006/22- 0201H to 0220H, 0421H to 0440H, 0641H to 0660H
M39006/25- 0081H to 0088H, 0169H to 0176H, 0257H to 0264H
M39006/30- 0201H to 0220H, 0421H to 0440H, 0641H to 0660H
M39006/31- 0081H to 0088H, 0169H to 0176H, 0257H to 0264H
Vishay-Israel understands the inconvenience this temporary ship-hold may have caused, but is dedicated to provide only
products which meet the full requirements of the MIL specifications. All parts numbers are now released, and we will expedite
all open customer orders to the best of our abilities. An additional update of the hold status will be provided within 30 days.
Vishay: CWR06/CWR16 Slight price Increase coming....3%
Mil-Ceramic
Capacitors
Stable
Standard level-stock to 12 weeks
What Is Driving Hi-Reliability BME Development Efforts?
Space level-stock to 24 weeks
• Application requirements are driving towards CV values that can’t be achieved with conventional Mil-qualified PME
capacitor offerings
• BME MLCC can offer up to ~10x increase in capacitance compared to the current Mil-qualified PME capacitor offerings
• Use of BME MLCC has been demonstrated in medical implantable devices for 10+ years and in various automotive
applications for >15 years
• BME technology will find increasing use in MIL applications to extend capacitance ranges as data and experience with the
product grows
• BME Industry Forum is meeting weekly to develop a detailed spec for BME/Thin Dielectric MLCC for Hi-Rel applications
• Keep in mind for Military capacitors where “Additional testing is required,” those will require more lead-time
• Price trends vary within the military arena with some being stable and others being up
Mil-Resistors
Stable
6 to 12 weeks, with lead times stable
Click to learn more about Avnet's extensive Resistor product offering.
October 2014
Market & Technology Trends
TECHNOLOGY OVERVIEW – POWER SUPPLY
PRODUCTS
PRICING TRENDS
DELIVERY TRENDS
MARKET, PRODUCT AND TECHNOLOGY TRENDS
AC/DC Front Ends
Stable
Lead time stock to
6-24 weeks (stable)
Platinum efficiency standard established as baseline. Titanium standard introduced with limited models available. 1.2"
x 1.5" x 13" dimensions widely accepted for 12 V supplies, along with edge card power connectors for 48 V supplies.
Higher power, 3 kW and above along with lower power <500 Watts are in demand for 48 V and 12 V supplies. DC
input, reverse air flow, and rack options available. I2C/PMBus digital interface becoming standard features. Avnet
Lines: Artesyn, GE-Power, Murata Power, Power One, and TDK-Lambda produce these types of power supplies.
AC/DC Switchers
Stable
Lead time stock to
6-20 weeks (stable)
Increased power densities and lower cost 2 x 3, 2 x 4 and 3 x 5 package sizes. 400-500 W power levels available. Medical
EN60601 3rd edition is the medical standard. 4th edition being planned. Extended temperature range, convection cooling.
I2C/PMBus remote sense and inhibit are key features being offered. Industrial market demands are increasing for enclosed
supplies, high surge current, conformal coating, constant current and shock/vibration options. Avnet Lines: Artesyn, GEPower, Murata Power, Power One, SL Power, and TDK-Lambda produce these types of power supplies.
AC/DC Modular Power
Stable
Lead time stock to
6-20 weeks (stable)
High power densities with voltage/current flexibility available off the shelf. Latest products have lower cost, wider
power ranges, additional output options and 1U height. I2C/PMBus digital interface options available for additional
control/monitoring functions. Medical approvals are a major selling point. Development of new models expected. Avnet
is a world leader in building these types of supplies from Artesyn, TDK-Lambda and Power One at our Value Add Center.
DC/DC Isolated
Industrial Converters
Stable
Lead time stock to
6-24 weeks (stable)
Power densities increasing, smaller package types, high efficiency, wider input voltage ranges and higher operating
temperatures evolving. Railway, Industrial and Mil-Aero applications with convection and conduction packages with base
plate attachment. Extended temperature ranges. COTS devices available. Avnet Lines: Artesyn, GE-Power, Murata, Power
One, and TDK-Lambda produce these types of power supplies.
DC/DC Isolated Converters
1/4 Brick & Smaller
Stable
Lead time stock to
6-20 weeks (stable)
1/8 and 1/16 brick packages driving market. Typical bus voltages are 24 and 48 Vdc with wide input 18 to 75 Vdc
available. I2C/PMBus digital controls/monitoring options from Ericsson, Murata Power and GE Critical Power. 12 Vdc
Intermediate Bus Converters with lower voltage outputs available. Bus Converter power has increase to 600 Watts
and beyond. Avnet Lines: Artesyn, GE-Power, Murata Power, Power One, Ericsson, and TDK-Lambda produce these
DC-DC converters.
DC/DC Non-Isolated
Converters Point-of-Load
Stable
Lead time stock to
6-20 weeks (stable)
Fourth generation DLynx POL family incorporating PMBus controlled digital telemetry from GE Critical Power is available
with up to 80Amps. Power One d-PWER GEN II next generation parts announced. POLs offer wide range of output
voltages from .45 to 5.5 Vdc and currents from 2 to 80 Amps. Murata Power and Ericsson BMR series also offer POLs
with PMBus interface. Parallel feature offered. TDK-Lambda just announced a 60 Amp Analog POL, iJB series.
External Power Supplies
Stable
Lead time stock to
6-20 weeks (stable)
External AC/DC power supplies from SL Power offer single outputs with desk-top or wall mount versions. Popular
applications are medical with EN60601 3rd edition, portable devices, tablets, PC, battery charger, POE, and consumer
products. Parts coming on the market address compliance to the latest safety and energy efficiency legislation. New
products with greater than 200 W have been released. Cost and output connector flexibility are critical factors.
Avnet Lines: TDK-Lambda and Artesyn also offer external supplies.