October 2014 Market & Technology Trends ANALOG COMM DSP DISCRETE LOGIC MEMORY MCU OPTO PROCESSORS PROGRAMMABLES RF ELECTROMECHANICAL INTERCONNECT PASSIVE POWER SUPPLY SEMICONDUCTOR TRENDS COMMODITY AVAILABILITY PRICING LEAD TIME (IN WEEKS) Analog 2-20 Communications 4-20 Digital Signal Processors 2-16+ Discretes 4-24 Logic 4-26 Memory 6-allocation Microcontrollers 2-24 Optoelectronics 4-14 Processors 4-20 Programmable Logic 2-20 RF 2-26 IP&E TRENDS COMMODITY AVAILABILITY PRICING LEAD TIME (IN WEEKS) Commercial Electromechanical Stock to 26 Military Electromechanical Stock to 30 Commercial Interconnect Stock to 16 Military Interconnect Stock to 16 Commercial Passive Stock to 22 Military Passive Stock to 17 Power Supply Stock to 26 Download the complete list of Market & Technology Trends Acronyms and Definitions The availability of certain products shown on this email may be limited and may not always be available for immediate delivery. We also reserve the right to limit quantities. Specials and promotions may be limited to stock on hand. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – ANALOG PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS Amplifiers Stable Standard lead times 2-10 weeks (stable) AMPLIFIERS Analog Devices 4-8 weeks (stable) New! Analog Devices introduced a family of low-power rail-to-rail amplifiers for high-speed data acquisition systems that require exceptional accuracy, precision and power efficiency. The ADA4805-1 (single) and ADA4805-2 (dual) amplifiers provide the only solution with quiescent current as low as 495µA. The amplifiers’ Dynamic Power Scaling (DPS) feature allows users to dynamically manage the power consumption by shutting-down the amplifier between analog-to-digital converter samples. This further reduces by up to 90 percent the power consumption — with no performance degradation —when compared to similar solutions. Click for more information. Maxim 2-10 weeks (stable) ON Semiconductor 4-10 weeks (stable) Texas Instruments 2-10 weeks (stable) Converters Stable Standard lead times 2-14 (stable) Analog Devices 4-14 weeks (stable) Cirrus Logic 8-12 weeks (stable) CONVERTERS Maxim 2-12 weeks (stable) Analog Devices introduced a current-to-digital converter module that reduces the cost and complexity of computed tomography (CT) scanner system design. The ADAS1131 is a 256-channel, 24-bit current-todigital converter module that is available in a 15 mm² BGA package with a 0.8 mm pitch. The device uses approximately 33% less PCB area than alternative devices that offer only half the channel density. The 0.8 mm pitch packaging feature enables designers to mount the ADAS1131 on a standard PCB substrate, a less costly and higher yield option than high density, specialized PCB substrates requiring laser vias. Click for more information. Texas Instruments 2-12 weeks (stable) Interfaces Stable Standard lead times 2-14+ weeks (stable) Analog Devices 4-14 weeks (stable) Intersil 4-16 weeks (stable) Maxim 2-14+ weeks (stable) Power Mgt ICs Stable NXP 8-18 weeks (stable) SENSORS Texas Instruments 2-8 weeks (stable) Freescale launched a new, high-bandwidth 3-axis analog accelerometer, engineered to detect ultra-high frequency motion and vibration in industrial motors and equipment. Building on its longtime strength in automotive sensors, Freescale has experienced strong market acceptance across the breadth of its sensors portfolio, including its increasingly popular devices for the growing industrial and medical markets. Freescale’s new FXLN83xxQ accelerometer underscores the company’s industrial sensing momentum. Designed to capture acceleration information often missed by less accurate sensors commonly deployed in consumer products such as smartphones and exercise activity monitors, the new device enables intelligent algorithms to better perform fault prognostication for predictive maintenance and condition monitoring applications. Click for more information. Standard lead times 2-10 weeks (stable) Maxim 2-10 weeks (stable) Intersil 4-16 weeks (stable) International Rectifier 12-24 weeks (extended) Texas Instruments 2-10 weeks (stable) Power Integrations 4-6 weeks (stable) October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – ANALOG (CONTINUED) PRODUCTS PRICING TRENDS DELIVERY TRENDS Sensors Stable Standard lead times 2-14 weeks (stable) Analog Devices 4-12 weeks (stable) Freescale 6-12 weeks (stable) Maxim 2-12 weeks (stable) STMicroelectronics 12-14 weeks (stable) Texas Instruments 2-10 weeks (stable) Switches/ Muxes Stable Standard lead times 2-12 weeks (stable) Analog Devices 4-12 weeks (stable) Intersil 6-16 weeks (stable) Maxim 2-12 weeks (stable) Vishay/Siliconix 10-12 weeks (stable) Voltage Regulators Stable Standard lead times 2-20 weeks (stable) Maxim 2-10 weeks (stable) Infineon 12-20 weeks (stable) ON Semiconductor 4-17 weeks (stable) STMicroelectronics 4-20 weeks (stable) Texas Instruments 2-8 weeks (stable) TECHNOLOGY TRENDS October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – COMMUNICATION PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS Communications ASSPs Stable Applied Micro 22-26 weeks (stable) Click to learn more about Avnet's extensive Communication product offering. Broadcom 16-20 weeks (stable) Marvell 16-20 weeks (stable) Mindspeed Technologies 16-22 weeks (stable) PMC-Sierra 18-21 weeks (stable) Peripheral Connectivity Stable IDT 2-16 weeks (stable) Intel 4-6 weeks (stable) PLX Technology 10-20 weeks (stable) Texas Instruments 2-6 weeks (stable) Network Processor Stable Optical Networking Stable Wired Telcom Stable Broadcom 16-20 weeks (extended) Marvell 16-20 weeks (extended) Avago 4-12 weeks (stable) Finisar 4-12 weeks (stable) Lintiq 16-20 weeks (stable) Texas Instruments 6-16 weeks (stable) Microsemi 8-16 weeks (stable) Cirrus Logic 4-12 weeks (stable) Graphics Stable Intel 4-6 weeks (stable) Mindspeed 16-22 weeks (stable) AMD 4-6 weeks (stable) October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – DIGITAL SIGNAL PROCESSOR PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS DSP – 16 Bit Stable Standard lead times 2-12 weeks (stable) Click to learn more about Avnet's extensive DSP product offering. Analog Devices 2-12 weeks (stable) Texas Instruments 2-16 weeks (stable) DSP – 32 Bit Stable Standard lead times 2-16+ weeks (stable) Analog Devices 2-10 weeks (stable) Texas Instruments 2-16+ weeks (stable) October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – DISCRETE PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS BiPolar Transistors Stable Standard lead times currently 4-20 weeks DISCRETE STMicro at 6-14 weeks There are extended lead times with multiple suppliers on multiple packages, including SOT23, DPAK, D2PAK, SOT404, SOT428, LFPAK, SOT669, SOT1023, SOT1205 and SOT1210. ON Semi - Majority is at 4-20 weeks Diodes Inc is at 8-10 weeks IGBTs Stable Standard lead times 4-18 weeks Fairchild 4-8 weeks International Rectifier 10-18 weeks Infineon 14-18 weeks MOSFETs Stable Standard lead times 6-18 weeks Infineon 8-18 weeks Fairchild 4-10 weeks Int'l Rectifier - 10-16 weeks Vishay 12-16 weeks STMicro 8-16 weeks Transient Voltage Suppressors Stable Standard lead times 6-20 weeks Fairchild 6-12 weeks ON Semi 10-20 weeks Vishay 8-20 weeks Thyristors Stable Standard lead times 4-16 weeks STMicro 6-12 weeks ON Semi 6-12 weeks NXP 8-12 weeks ON Semi is increasing capacity by 25% in 2014 and expects the majority of lead times to improve in Q3, with the exception of SMA/B, DPAK 2 W and SOT23, which are expected to improve in Q4. NXP is bringing on additional capacity in Q2 and Q3 and is expecting easing toward the end of Q3 on DPAK, D2PAK, SOT404 and SOT428. The remaining packages will be easing in Q4 for NXP. Vishay has seen extended lead times on several products, but feels that they have stabilized. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – DISCRETE (CONTINUED) PRODUCTS PRICING TRENDS DELIVERY TRENDS Rectifiers Increasing Standard lead times 4 -22 weeks ON Semi 8-22 weeks Vishay 4-24 weeks Fairchild 6-10 weeks Diodes Inc 6-12 weeks NXP 6-22 weeks Zener Diodes Increasing Standard lead times 4-24 weeks ON Semi 10-20 weeks Vishay averaging 6-16 weeks Fairchild 6-10 weeks Diodes Inc 8-12 weeks NXP 6-24 weeks Small Signal Devices Increasing Standard lead times are at 6-24 weeks ON Semi 6-16 weeks Infineon 8-16 weeks Fairchild 6-8 weeks Diodes Inc 6-10 weeks NXP 6-24 weeks TECHNOLOGY TRENDS October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – LOGIC PRODUCTS PRICING TRENDS DELIVERY TRENDS CMOS – 5 V (Metal Gates, High Speed and Advanced) Stable Standard lead time is at 6-12 weeks TIMING Texas Instruments is at 6-8 weeks IDT has announced the expansion of its PCIe timing portfolio with the industry’s first 1.5 V PCI Express (PCIe®) buffer family. IDT’s new U-series ultra-low power PCIe buffers operate from the same supply voltage as modern systems-on-chip (SoCs) and field programmable gate arrays (FPGAs), enabling designers to use the same power rail, thus reducing system complexity, physical size, and power consumption. Click for more information. NXP is running 6-12 weeks ON Semi is at 4-12 weeks CMOS – Low Voltage Stable Standard lead time is at 4-12 weeks Texas Instruments 4-6 weeks Fairchild Semi 4-6 weeks IDT 4-6 weeks NXP 6-12 weeks BiPolar – 5 V (Fast, ALS, LS and AS) Increasing BiCMOS Stable Standard lead times 4-12 weeks Texas Instruments 4-6 weeks NXP 4-12 weeks Standard lead time is stable at 4-16 weeks Texas Instruments 4-8 weeks NXP 6-16 weeks Timing Stable Standard lead times are at 4-14 weeks IDT: 4-8 weeks Silicon Labs: 4-6 weeks Texas Instruments : 4-6 weeks ON Semi: 6-14 weeks Cypress: 6-10 weeks TECHNOLOGY TRENDS Click to learn more about Avnet's extensive Logic product offering. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – LOGIC PRODUCTS PRICING TRENDS DELIVERY TRENDS “Mini-Logic” Stable Standard lead times are 4-26 weeks Texas Instruments is at 6-8 weeks NXP is running 6-26 weeks Fairchild ranges from 4-6 weeks ON Semi is at 4-10 weeks Clock Drivers/ Special Functions Stable Standard lead time is running 4-20 weeks Maxim averaging 6-12 weeks. Intersil running 6-16 weeks STMicroelectronics is at 12-20 weeks NXP 10-14 weeks ECL Increasing Standard lead times 6-8 weeks Bus Switches Stable Standard lead time is running 4-12 weeks Texas Instruments 4-6 weeks IDT 4-6 weeks NXP 8-12 weeks (CONTINUED) TECHNOLOGY TRENDS October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – MEMORY PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS Slow ASYNC SRAM Stable 8-10 weeks Cypress has broadest portfolio with highest capacity. Micron PSRAM has been announced EOL, ISSI is an alternative up to 64 Mbit. Renesas has renewed commitment and stocking position on their low power SRAM families. ISSI has a full portfolio of solutions. FAST ASYNC SRAM Stable 8-10 weeks Cypress is committed to long term support of legacy product from 16 Kb to 4 Mb. GSI is a strong player with good power numbers and very fast speeds. Sweet spot is 1 and 4 Mb. Synchronous Burst / ZBT SRAM Stable 8-10 weeks Cypress ISSI and GSI support all densities and configurations from 4 to 72 Mb. DDR2 / QDR2 / QDR2+ SRAM Stable 8-10 weeks QDR2 and QDR2+ at 36/72 Mb are the current hot spots for new designs. 144 Mb is highest density. Many configurations available. Be cautious with selection to be aware of volume vs. niche versions. 4-5 OEM's drive 90% of demand, so support can be weak for devices not used by those top customers. Samsung has exited all SRAM products, affected customers should look to GSI, Cypress, ISSI and Renesas for full support on these families. Cypress is now promoting QDR4 family, ask for details. SDRAM Stable 8-10 weeks Long term support commitments from Micron, ISSI for all 64 to 256 Mb devices. Micron announcing EOL for 512 Mb, customers can look to ISSI or Alliance Semi for exact replacement. DDR-1 SDRAM Stable 8-10 weeks Long term support commitments from Micron, ISSI and Alliance Memory for all 256 and 512 Mb devices. The 1 Gb DDR-1 has been announced EOL and is past last time buy window. DDR-2 SDRAM Increasing 16 weeks All densities and options for DDR-2 have great long term support. Extended lead times mean customers should have orders and forecasts in place. Micron has announced new revisions for 512 Mb and 1 Gb, customer should migrate. Lead times are extending. DDR-3 SDRAM Increasing Allocation DDR-3 is the design sweet spot from 1 to 4 Gb. Prevailing support is for the DDR3L / 1.35 V option which retains 1.5 V compatibility. Allocation and delivery constraints continue, forecasting and at least 90 days of backlog in place is suggested. Micron is now sampling 8Gb DDR3 monolithic devices. DDR-4 SDRAM N/A 12-16 weeks DDR4 components are now shipping at 4 Gb density. Modules now sampling in various form factors, including RDIMM, SODIMM, and UDIMM. Look for 8 Gb DDR4 in early 2015. New! Texas Instruments DDR-SDRAM Memory Interface, Power and Switch Solutions. Click for more information. Mobile or LP DRAM Increasing Allocation LPDDR and LPDDR2 are in strong demand. Vendors are increasing production on LPDDR2 products. Lead times are increasing, expect seasonal demand to increase 2H 2014. LPDDR2 parts should be chosen carefully, not all configurations and packages are well supported. Support for LPDDR2 with industrial temperature range is limited and designers should exercise caution. Micron exiting lower density LP-SDRAM devices, look to ISSI for replacements. RLDRAM Stable 8-10 weeks Micron supporting RLDRAM2 at 288 and 576 Mb, and RLDRAM3 at 576 Mb and 1 Gb. Renesas is alternate supplier and GSI is offering their LLDRAM family at 576 Mb, compatible to RLDRAM 2. ISSI is Micron's alternative source partner for RLDRAM products. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – MEMORY (CONTINUED) PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS Low Density Parallel NOR Flash Stable 6-8 weeks Spansion has exited low density / 5 V families. Look to Microchip and Micron for options on some devices. High density Parallel NOR Flash Stable 6-8 weeks Micron and Spansion have full offerings across all density ranges NAND Flash IC Increasing 16 weeks MLC support stable, seeing shortages and price increases on many Raw SLC devices. Spansion is a solid option for SLC NAND from 1 to 8 Gb. Managed NAND Devices Increasing 14-16 weeks eMMC is rapidly becoming popular and is a multiple sourced, JEDEC standard solution. Micron, Toshiba, Kingston, Greenliant, Sandisk, Smart, and Samsung all have offerings. Lead times are extending rapidly. Serial (SPI) NOR Flash Stable 6-8 weeks NOR serial flash (SPI) is a simple interface/small footprint, good for code or data storage, offering small packages and less board space. Densities range from 1 Mb to 2 Gb. Most vendors standardizing on the QUAD SPI (QSPI) offering much faster speeds. Micron is now shipping a 2 Gb device, highest capacity in the industry. Many FPGA require SPI flash for booting. Micron and Spansion are approved sources and compatible with Xilinx design tools. Adesto has constrained delivery on some devices. ISSI has introduced new SPI NOR devices. EPROM Stable 6-8 weeks Atmel is the sole remaining supplier for legacy EPROM products. Only OTP versions are supported. EEPROM Stable 6-8 weeks Atmel, ST, and Microchip have a full offering of serial EEPROM devices. Multi Port / FIFO Stable 6-8 weeks Cypress and IDT remain the strongest players in this space. Flash Cards & USB Drives increasing 10-12 weeks Densities range from 64 MB to 64 GB. Lower density MLC based cards are increasingly difficult to source due to EOL of lower density NAND chips. Look at Delkin on industrial grade CF and SD. USB drives are supported. MicroSD is increasingly popular as an embedded storage option. We now offer CFast cards, which is SATA interface in compact flash form factor. Emerging Memories Stable 8-10 weeks MRAM, FRAM and NVSRAM are niche or emerging non-volatile memory types, as NAND and NOR don’t meet all application needs. NVRAM is a non-volatile SRAM for high speed storage. Timekeeper options on some types. Cypress acquired Ramtron, which gives our customers access to all FRAM products. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – MICROCONTROLLERS PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS 8-bit Microcontroller Stable Standard lead times 2-20 weeks (stable) 8-BIT MICROCONTROLLERS Atmel 11-19 weeks (stable) Freescale 8-10 weeks (stable) New! Microchip has introduced a new addition to its PIC12/16LF155X 8-bit microcontroller family with the PIC16LF1554 and PIC16LF1559 devices. The PIC16LF1554/9 includes two independent 10-bit 100K samples per second Analog-to-Digital Converters (ADC) with hardware Capacitive Voltage Divider (CVD) support for capacitive-touch sensing. Click for more information. Microchip 6-20 weeks (stable) Silicon Labs 6 weeks (stable) 16-bit Microcontroller Stable Standard lead times 2-16 weeks (stable) Freescale 8-16 weeks (stable) Renesas 14 weeks (stable) Texas Instruments 2-16 weeks (stable) 32-bit Microcontroller Stable Standard lead times 8-24 weeks (extended) Atmel 11-19 weeks (stable) Freescale 8-12 weeks (stable) NXP 12-16 weeks (stable) STMicroelectronics 20-24 weeks (extended) 32-BIT MICROCONTROLLERS New! Freescale Plans Extreme Performance for Kinetis MCUs with ARM® Cortex®-M7 Core. Industry’s broadest portfolio of compatible and scalable MCUs based on ARM Cortex-M cores set to expand with Cortex-M7. Freescale Semiconductor announced its support for the recently unveiled ARM Cortex-M7 core, which Freescale plans to leverage for new levels of performance and power efficiency in forthcoming embedded SoCs. A leading ARM partner and an early adopter of multiple ARM products, Freescale was the first to market with MCUs based on the Cortex-M4 and Cortex-M0+ cores. Freescale maintains software and hardware compatibility across six unique Kinetis series, while offering the choice of general purpose or application specific features. Microchip has introduced the new PIC32 Bluetooth® Starter Kit. The full-featured kit boasts a PIC32 microcontroller (MCU), HCIbased Bluetooth radio, Cree high-output multi-color LED, 3 standard single-color LEDs, an analog 3-axis accelerometer, analog temperature sensor and 5 push buttons for user-defined inputs. Click for more information. Toshiba America Electronic Components announced the newest addition to its TX04 series of ARM® Cortex®-M4F core-based microcontrollers (MCUs). The TMPM411F20XBG MCU facilitates electric power calculation and communication in smart meters, as well as sensing and communications in other measurement devices. The TMPM411F20XBG implements tamper detection and failure detection with very low power consumption, and also incorporates key security functions suitable for secure network communication. Click for more information. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – OPTOELECTRONICS PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS Light Emitting Diodes Decreasing Standard lead times 4-12 weeks tighter binning requests may have slightly longer lead times or delivery dates LEDS Avago 4-10 weeks Osram 8-12 weeks Seoul 8-10 weeks Luminus 4-6 weeks LED Displays Stable Standard lead times 4-14 weeks (stable) Avago 4-8 weeks Osram 8-14 weeks Motion Control Stable Standard lead times 8-18 weeks (stable) Infrared Stable Standard lead times 4-12 weeks (stable) Vishay 4-10 weeks Osram 8-12 weeks Optocouplers Stable Standard lead times are averaging 6-12 weeks Avago 8-12 weeks Fairchild - 6-8 weeks Vishay 4-12 weeks Toshiba 8-14 weeks New! Seoul Semiconductor announced the release of a new Acrich module designed for omnidirectional lamps. This new module is comprised of the Acrich MJT 2525 series LED along with Seoul Semiconductor's latest generation of Acrich 3 driver IC and a reflector optic. Click for more information. OPTOCOUPLERS New! Seoul Semiconductor announced the release of a new LED Module with Acrich 3 technology. The new Acrich Module is comprised of an LED module with Acrich MJT 5050 series LED, Acrich3 IC technology, and an innovative heat sink and secondary optics. Click for more information. New! Toshiba America Electronic Components announced a new series of low-profile, rail-to-rail output gate-drive photocouplers for directly driving low- to medium-power IGBTs and power MOSFETs: the TLP5751, TLP5752 and TLP5754. The TLP5751 offers a peak output current of ±1.0A and can drive power MOSFETs and low-power IGBTs up to 20 A. The ±2.5 A TLP5752 and ±4.0 A TLP5754 will drive power MOSFETs and IGBTs with current ratings to 80A and 100A, respectively. Click for more information. New! Toshiba America Electronic Components announced the launch of two new photovoltaic couplers housed in small-size SO6 packages: the TLP3905 and TLP3906. The new photocouplers are designed for use in measuring instruments or as MOSFET gate drivers for the replacement of mechanical relays. Photovoltaic couplers can be used to create a MOSFET gate driver without using an external secondary-side power supply. The structure of a photovoltaic coupler is a photorelay without a MOSFET chip. Click for more information. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PROCESSORS PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS 32-bit Embedded Microprocessors Stable Standard lead times 4-20 weeks (stable) Click to learn more about Avnet's extensive Processor product offering. Applied Micro 22-26 weeks (stable) Freescale 8-12 weeks (stable) Intel 4-8 weeks (stable) Texas Instruments 8-20 weeks (stable) 64-bit Embedded Microprocessor Stable Standard lead times 4-12 weeks (stable) Intel 4-8 weeks (stable) Freescale 4-8 weeks (stable) AMD 4-8 weeks (stable) October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PROGRAMMABLES PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS CPLDs Stable Atmel 6-15 weeks (stable) FPGAs, SoC FPGAs Xilinx 6-8 weeks (stable) New! Avnet Announces PicoZed™- its Newest Family of System-On-Modules (SOMs). Targeted for industrial control, embedded vision, test and measurement, motor control and software-defined radio applications, PicoZed enables designers to get to market faster with a proven Zynq®-7000 All Programmable SoC sub-system. In support of PicoZed development and prototyping, Avnet also released the PicoZed Carrier Card, which provides the necessary interfaces and access to user I/O from the PicoZed SOM. Click for more information. FPGAs SoC FPGAs Stable Microsemi (formally Actel) 2-20 weeks (extended) Xilinx (Spartan) Family 6-14 weeks (extended) Xilinx (Virtex) Family 6-8 weeks (stable) Xilinx (Artix-7) 6 weeks (stable) Xilinx (Kintex-7) 6-8 weeks (stable) Xilinx (Zynq-7000) 6 weeks (stable) New! New Shipment in Stock: Avnet’s Artix®-7 50T FPGA Evaluation Kit. This new Evaluation Kit allows you to evaluate the low power, small form-factor and small density Xilinx Artix-7 FPGA for high-volume applications in cost-sensitive markets such as industrial control, consumer, medical and test and measurement. The kit provides the necessary interfaces for Artix-7 evaluation and when coupled with the MicroBlaze™ soft processor, becomes a powerful prototyping vehicle. Click for more information. New! Featured at X-fest 2014: Xilinx Zynq®-7000 All Programmable SoC Mini-ITX Development Kit. This kit provides a complete development platform for designing and verifying applications based on the Xilinx Zynq®-7000 All Programmable SoC family. The Mini-ITX kit enables designers to prototype high-performance designs with ease, while providing expandability and customization through the FMC HPC expansion slot. Click for more information. New! Get the Most from Your FPGA-Based System with Maxim Integrated. Designers today need an easy-to-use-way to take the complexity out of analog design. You always need to reduce cost and eliminate roadblocks to successful designs. That’s why you want to work with Maxim, a trusted power supplier for Xilinx FPGAs. With Maxim as your partner, with our high-performance and maximum energy-efficiency tools, you have a solution to help complete your designs faster. Be sure to visit them at X-fest! Click for more information. New! Analog Devices released the industry’s first software-defined radio (SDR) rapid prototyping kit with dual 2 x 2 AD9361 RF transceivers to simplify and rapidly prototype 4 x 4 multiple-input multiple-output (MIMO) wireless transceiver applications on the Xilinx® Zynq®-7000 All Programmable SoC development platforms. The AD-FMCOMMS5-EBZ rapid prototyping kit provides a hardware/software ecosystem solution addressing the challenges of SDR transceiver synchronization experienced by RF and analog designers when implementing systems using MIMO architectures. Click for more information. TRAINING SECTION New! X-fest Technical Trainings – Don’t Miss the Final Events in North America! X-fest kicked off in North America on September 9th with great attendance and interest! Where else would you get this type of top-notch training and ability to view demos from industry-leading technology suppliers in a single day? In late fall, X-fest will be moving throughout Asia, Europe and Japan. Be sure to check out the course videos to help you decide what classes to attend! Click for more information. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – RF PRODUCTS PRICING TRENDS DELIVERY TRENDS TECHNOLOGY TRENDS RF Power Stable Standard lead times 6-26 weeks GaN CONTINUES TO MOVE MICROWAVE RF POWER SEMICONDUCTOR MARKETS TO OVER $300M BY 2019 Freescale 20-26 weeks (extended) NXP 6-24+ weeks - Allocation for some products (extended) STMicroelectronics 12-18 weeks (stable) RF Small Signal Stable Toshiba 12 weeks (stable) SAMSUNG, ARM, AND NEST LAUNCH THREAD, A LOW-POWER NETWORK FOR THE SMART HOME Standard lead times 2-14 weeks Seven companies joined forces to form the Thread Group (www.threadgroup.org) and develop Thread, a new IP-based wireless networking protocol. Built on well-proven standards, including IEEE 802.15.4, IETF IPv6 and 6LoWPAN, Thread represents a resilient, IP-based solution for the rapidly growing Internet of Things. Existing popular application protocols and IoT platforms can run over Thread networks. A version of Thread is already being used successfully in Nest products today. Analog Devices 2-17 weeks (extended) NXP 6-12 weeks (stable) Avago 2-14 weeks (extended) RF Wireless Stable The availability of new gallium nitride (GaN) devices for 4 to 18 GHz becomes more pervasive. Pointto-point communications, SATCOM, radars of all types, and new industrial/medical applications will all benefit by the introduction of these high-power GaN devices. GaN can operate at much higher voltages and at power levels that were difficult or impossible to reach using Gallium Arsenide (GaAs). Texas Instruments 2-8 weeks (stable) VETRONICS MARKET WORTH $10.78B BY 2020 Standard lead times 2-24 weeks The vehicle electronics (Vetronics) market is expected to reach $10.78B by 2020. The major factors driving the vehicle electronics market are network centric battlefield warfare, rising demand for situational awareness and SWaP specifications. Armored vehicles such as main battle tanks, armored personnel carriers, infantry fighting vehicles, mine resistant ambush protection comprise the vehicle electronics market. Atmel 12-24 weeks (extended) Freescale 8-12 weeks (stable) NXP 10-16 weeks (stable) Silicon Labs 2-16 weeks (stable) RF WIRELESS Texas Instruments 2-12 weeks (stable) New! Broadcom Corporation introduced a new development kit into its Wireless Internet Connectivity for Embedded Devices (WICED™) family to enable developers to rapidly prototype ideas and concepts for IoT devices and applications. The Broadcom® WICED Sense development kit is an all-in-one IoT prototyping kit that includes Broadcom's newest Bluetooth Smart chip, five micro electro-mechanical systems (MEMS) and has a software stack that is Bluetooth 4.1 compatible. Click for more information. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – ELECTROMECHANICAL PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS Circuit Breakers Stable Stock to 14 weeks (stable) Circuit breakers are an over current circuit protection device and generally come in magnetic and thermal types. Fans & Blowers Stable 14-16 weeks ARO (unstable) New fan and blower products are integrating intelligent equipment features including: speed monitoring, closed loop speed control and operating monitoring. Heat Sinks Stable Stock to 8 weeks (stable) Heat sink products – active and passive lead times and costs are steady. New products for POL power converters are now available. Relays Stable 12-20 (extended), some relays on allocation Avnet's relay product offering includes general-purpose, solid-state, relay terminals and PCB relays. Demand continues to grow for smaller, higher current relays such as smaller sized PCB-mount types for use in automotive applications. Solid-state relays continue to outgrow EMR relays. Sensors Stable Stock to 17-19 weeks (unstable) Avnet offers a wide variety of sensor products including motion, light, speed and position, as well thermal and voltage sensors. Switches Stable Stock to 16 weeks (stable) Avnet’s switch product offerings include: DIP, pushbutton, slide, tactile, toggle, rocker snap, rotary, and more. Clear trend for all types is to smaller devices. Major factors driving this are the proliferation of portable electronic products, and the general trend to make things smaller. 3-5% increase (C & K). Switches, Sensors, & Circuit Breakers Stable Stock to 8 weeks (stable) Includes Mil-S-83731, Mil-55116, Mil-9177. Mil-Aero & Industrial Relays Stable Stock to 16-30 weeks M39016, M28776, M6106, M83536, M83726, & M12883. Magnetics Stable Stock to 14 weeks (stable) Avnet’s mil-aero magnetics product offering includes QPL’ed M21038 interface & Fibre Channel transformers, QPL’ed M83531 delay lines, databus couplers, modules (interface LAN, telecom Ethernet & Firewire transceiver) and mil-aero grade power chokes & power inductors. MILITARY October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – INTERCONNECT PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS DIN41612(Eurocard) Stable Stock to 9 weeks (stable) DIN is an older technology still widely used in VME & VME64 applications. Compact PCI Stable Stock to 8 weeks (stable) Compact PCI is the most widely used 2 mm product today. Highest usage is in Communications sector as well. 2 mm Hard Metric Standard & High Speed Designs Stable Stock to 9 weeks (down) Increasing demands for bandwidth and speed is pushing suppliers to improve 2 mm & 2.5 mm designs. New high speed niche products appearing incorporating power, signal, & ground planes in one module. PC Card (PCMCIA) Stable Stock to 8 weeks (stable) Top apps data com, fax/modem and LAN Ethernet cards. Modem cards for notebooks and PDAs are decreasing as other technologies, such as DSL, emerge. Memory Card Compact Flash 1 & 11 Multi-Media Cards Stable Stock to 8 weeks (stable) Top applications consumer, telecom, & industrial segments, Competing technology Secure Digital, and Smart Media Cards. Smart Card Stable Stock to 8 weeks (stable) Smart cards are generally associated with markets for ID/Access control. Set-top boxes may also see usage. DIMM for DDR SDRAM DIMM for SDRAM and EDO-DRAM Stable Stock to 8 weeks (stable) Used in graphics applications, PC’s, workstations and networking equipment. High growth segment. PCI Express ™ Edge Card Stable Stock to 7 weeks (stable) PCI Express™ is a high performance serial I/O designed to meet the needs of next-generation computing and communications platforms. Standard Edge Card Stable Stock to 8 weeks (stable) Board-to-board and Wire-to-board products. Slot 1, Slot 2, AGP, NLX, etc…edge card products. IC Sockets Stable Stock to 9 weeks (stable) DIP, ZIP, SIP, PLCC, PGA, Edge Connectors, Stamped, formed and screw machine. BACKPLANE CONNECTORS SOCKET/CARD CONNECTORS October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – INTERCONNECT (CONTINUED) PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS Telephone and Telecom Stable Stock to 8 weeks (stable) Includes Modular plugs and jacks (ganged, stacked, filtered) HSSDC, HSSDC2, QSFP, Transceivers, XFP. Audio/Video Stable Stock to 7 weeks (stable) Includes HDMI, Display Port, DVI - Top market is digital flat panels. Storage I/O Standards Stable Stock to 8 weeks (stable) Storage I/O impact is in the networking market. Leading product families are Serial ATA disk drive, SCSI, SCA, and HSSDC connectors associated with Fibre channel Drives. Infinband architecture appearing in a number of high end systems and provides a cost effective solution. Consumer I/O Standards: USB, Micro USB, etc Stable Stock to 7 weeks (stable) D-Sub usage continues to decline and is being replaced by higher speed I/O such as USB and IEEE 1394 for serial interface on computers and peripherals. High Density/High Speed I/O Stable Stock to 8 weeks (stable) Includes: QSFP, SFP, HSSDC2, and Infiband products. Stable Stock to 7 weeks (stable) Standard Power, 062, .093, High Density, Circular Power, Industrial & Combo Headers. INPUT/OUTPUT CONNECTORS STANDARD PRODUCTS Power/Industrial Connectors Molex Mega-Fit Power Connectors deliver cutting-edge current density at 23.0 A per circuit; terminals provide six independent contact points for long-term reliability in virtually every industry and application. Click for more information. Board-to-Board, Board-to-Wire Systems Stable Stock to 7 weeks (stable) Board-to-Board and Board-to-Wire (flat or discrete) connector systems. .100”, .098”, & .050” products. Micro/Nano Connector Systems Stable Stock to 8 weeks (stable) Miniature connectors 2 to .050 mm board-to-board and board-to-wire (flat or discrete) connector systems. Flexible Interconnect Systems Stable Stock to 7 weeks (down) Flex cable, Flex strip, Flex assemblies from .100” to 1 mm wire-to-wire and wire-to-board. Cables Stable Stock to 6 weeks (stable) CAT 6-U/FTP, CAT 6-U/UTP, COAX, Ethernet, FFC Jumper, Fiber, Flat, Flat Flex, Ribbon Cable, Flexible, FPC Jumper, Round, Flat Round, Solar, Twisted Pair, USB. Cable Assembly Stable Stock to 7 weeks (stable) Fiber Optic, Solar, RF, Ethernet, Ribbon Cable, Power, SAS, SATA, SCSI to SCSI, DSUB, Audio, Circular, Coax, Backplane, Input/Output, Flat Flex, USB, IDC. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – INTERCONNECT (CONTINUED) PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS Memory Card Compact Flash 1 & 11 Multi-Media Cards Stable Stock to 8 weeks (stable) Top applications consumer, telecom, & industrial segments, Competing technology Secure Digital, and Smart Media Cards. .100 Centerline B-to-B Stacking Stable Stock to 6 weeks (stable) Reliable & economical board-to-board stacking solution. Popular where high density packaging is not required. Sub 2 mm Mezzanine Stable Stock to 7 weeks (stable) 1 mm meets IEEE 1386 Mezzanine Standard. .8 mm SMT high pin solution. .5 mm SMT low pin count solution. Headers & Pin Strip Headers Stable Stock to 6 weeks (stable) Standard type headers. Terminal Blocks Stable Stock to 9 weeks (stable) Barrier, Card Edge, DIN 5264, DIN Rail, Diode, Disconnect, Euro, Feed Thru, Fuse Block, Pluggable Mini, ThermoCouple, Spring Cage. Terminals Stable Stock to 8 weeks (stable) Insulated, uninsulated, crimp, butt connectors, heat shrink, quick disconnect. Tooling Stable Stock to 4 weeks (stable) Most of the connector suppliers sell tooling for crimping. GRP code T1A. SC & ST Stable Stock to 6 weeks (stable) Standard single and multimode products. Fiber Optic Cable Assemblies Stable Stock to 7 weeks (stable) Due to the complexity of cabling fiber optics. Suppliers have and will continue to provide the majority of cable assemblies. The largest growth will come from the networking and telecom market segments. Small Form Factor (SFF) Stable Stock to 7 weeks (stable) Small Form Factor (SFF) fiber optic solutions were developed in response to the need for easier-to-use fiber optic connectivity in high-density applications such as telecommunications and datacom networks. SFF products include LC, MU, MT-RJ, & VF-45. Fiber Optic Backplane Products Stable Stock to 7 weeks (stable) Top Interconnect Suppliers offer a wide variety of backplane interconnect solutions to meet the demand for network bandwidth management. SFP & XFP Connectors & Cages Stable Stock to 7 weeks (stable) SFP & XFP designs support hot swap of various types of fiber optic and copper based transceivers into host equipment. This allows the flexibility to change between different protocols such as 100BASE-SX, 1000BASECX, or 1000BASE-LX. PCB CONNECTORS FIBER OPTIC CONNECTORS October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – INTERCONNECT (CONTINUED) PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS D-Sub Mil-C-24308 Stable Factory lead times 12 weeks (stable) Build time 2-3 days on component stock Includes solder, crimp, PC tail, etc…(M23408/1-through M23408/26). Micro D-Sub Mil-C-83513 Stable Stock to 6 weeks (stable) Lead times are stable on this product no changes in last month. Available in solder tail, pig tail harness, right angle, PCB, and High-Temp versions (High-Temp being New)…..(M83513/01-through M83513/10). Rack & Panel Arinc 404 & 600 Mil-C-81659 and 83733 Stable 404s factory lead times 14 weeks, 600s factory lead time 16 weeks Build time 5 days on component stock DPX & BKAD - Products available with up to 800 size 22 contacts. Circular Connectors Mil-C-5015 Stable Build time 3-5 days on component stock 12 weeks factory lead time (stable) MS3100 to MS3108 and MS3450 to MS3459. Covers 40 shell sizes, crimp contacts in gold & gold flash. Zinc free alloy also available (cad free). Circular Connectors Mil-C-38999 Stable Build time 3 days no component stock 14 weeks factory lead time (stable) MS27XXX and D38999/20 thru /26. Avnet also stocks and assembles coax, triax, twinax, Quadrax and PC tail products. Circular Connector Mil-C-83723 Stable Factory lead time 16 weeks (stable) Build time 3-5 days on component stock M83723/71 through /96 in 3 coupling style choices, bayonet, threaded & quick disconnect. Circular Connectors Mil-C-26482 Stable Factory lead time 12 weeks (stable) no change in last month Build time 3 days on component stock MS3110 to MS3116: MS3120 to MS3126: MS3470 to MS3476 Versatile w/ large variety of options & mounting styles. Also available in Cad Free finish. MILITARY CONNECTORS October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PASSIVE PRODUCTS PRICING TRENDS DELIVERY TRENDS Aluminum Capacitors Stable For some MFGs the capacity for SMT Lytics is MAXED due to very high demand, there are however multiple MFGs building Aluminums and lead time can vary. Standard 12-18 weeks Some MFGs may extend out as far as 28 weeks, which may include 4-6 weeks for delivery MARKET, PRODUCT AND TECHNOLOGY TRENDS PANSONIC OFFERING HIGH RIPPLE OS-CON, LARGER CAPACITANCE HYBRID CAPACITOR AND OS-CON NIC Components is pleased to announce the addition of NRB-XG series of long life rated radial leaded aluminum electrolytic capacitors in reduced case sizes, to its expanded high voltage rated capacitor offering. NRB-XG provided component downsize solution in 6.3mm, 8mm and 10mm case diameters, for use in high voltage power applications including electronic lighting ballast circuits. Long life rated at 8000 hours at +105 °C, NRB-XG is available in 1.5~27 uF in 200 VDC and 400 VDC ratings with operating temperature range of -40~+105 °C. RoHS compliant and halogen-free, the NRB-XG is supplied in bulk or tape and box packaging. Typical unit pricing from $0.04 to $0.15, with lead times from 10 to 12 weeks. Please contact NIC today, for free evaluation samples and to review your application requirements. HYBRID CAPACITOR TECHNOLOGIES With an industry leading offering of 12 series in SMT and LDD constructions, NIC hybrid construction (liquid - polymer electrolyte) aluminum electrolytic capacitors fit the goals and circuit requirements of tomorrow's design. Want to compare hybrids with other capacitor technologies? The NIC QuickBUILDER Parametric search lets you instantly search all capacitor technologies. Get detailed specifications, order samples, and compare up to 5 parts to find your best choice. EPCOS PRODUCT PROFILE 2014 • MotorCap P2 (S2) Aluminum Can • AC Film Capacitors for Motor Run Applications • Ordering code EPC:26045-7600 • Language English • Length 16 pages The new Product Profile offers an overview of EPCOS AC motor run capacitors (MotorCapTM) in aluminum cans according to safety class P2 (S2). The B32330*, B32332*, B32333* and B32335* series are needed for the operation of induction motors. Their main application areas are domestic appliances, heating and cooling equipment, applications in drive technology, UPS systems as well as home and garden equipment. Highlights • Extremely compact product design • Terminals available in various versions • New version with cable terminals • Version according to IEC 60252-1 and class A (30 000 hours of service life) • Version according to IEC 60335-1 upon request TAIYO YUDEN OFFERS LITHIUM ION CAPACITORS WITH LONG LIFE AND HIGH TEMPERATURE RELIABILITY TAIYO YUDEN INC.’s new Cylindrical Lithium Ion Capacitor (LIC) offers extremely large energy density and high reliability. Combining the strength of lithium-ion secondary batteries with conventional Electric Double Layer Capacitors (EDLC), this next-generation energy device offers an energy density 4 times greater than EDLCs. TAIYO YUDEN's hybrid LIC boasts the key features of batteries (high voltage and high energy) while maintaining the traditional characteristics of capacitors (rapid charge/discharge, high durability, safety and environmental friendliness). Unlike batteries, LICs have no risk of thermal runaway and have extremely low self discharge, even in high heat environments. These LICs are much more reliable than conventional EDLCs because of this hybrid feature. These LICs provide an increased maximum rated voltage of 3.8 V (about 1.5 times higher than the 2.3-2.7 V of conventional capacitors), and offer 2 times the capacity of similar sized EDLCs - making their energy density up to 4 times higher than that of EDLCs. A higher energy density results in fewer components needed and reduced mounting space when compared to EDLCs. One LIC can replace multiple EDLCs, allowing for improved thermal design in tight spaces such as servers. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PASSIVE PRODUCTS PRICING TRENDS DELIVERY TRENDS Ceramic Chip Capacitors Stable With multiple MFGs building Ceramics leadtime can vary (CONTINUED) MARKET, PRODUCT AND TECHNOLOGY TRENDS NIC "X6S" TCC MLCC CERAMIC CAPACITORS NIC Components is pleased to announce the expansion of its high capacitance ceramic capacitor MLCC product offering to include X6S temperature coefficient to NMC series products. X6S TCC is supported in 0201, 0402, 0603, 0805, 1206, 1210 case sizes, and is upgrade from X5R TCC. X6S products capacitance value range of 1.0~100 uF in ±10%(K) or ±20% (M) tolerance, with voltage ratings of 4 V~50 VDC. X6S has maximum ±22% capacitance value change over -55~ +105 °C temperature range (this is upgrade from X5R +85 °C upper limit). X6S TCC MLCCs are ideal for use in filtering, coupling, decoupling and bypass applications in wide range of higher temperature end-product applications. Free component samples, for evaluation and qualification purposes, are available from NIC. AVX EXPANDS PARTNERSHIP WITH MODELITHICS AVX has expanded its partnership with Modelithics, the leading RF/Microwave simulation model provider, with the addition of 45 new Modelithics substrate scalable equivalent circuit models. Designed to speed up design decisions and circuit level optimizations when used in combination with the industry's leading electronic design automation tools, including Keysight Advanced Design System (ADS), Keysight Genesys, and NI AWR Microwave Office, highly accurate, substrate scalable models are now available for AVX thin film couplers, multilayer organic (MLO) diplexers, and a variety of RF/Microwave capacitors and inductors KEMET RELEASE NEW X5R DIELECTRIC COMMERCIAL GRADE, FLEX CRACKING What is an MLCC Flex Crack ? Standard Termination MLCC Typical Board Flex Crack after severe mechanical bending. Kemet Ceramic Solutions. Reducing Board Space """"DOWNSIZING"""" • Going Smaller, ARRAYS • Multiple MLCC’s in one package • 2, 4 elements, KPS AUTO • Stacked MLCC’s in leadframe • 1210 - 2220. Go to www.kemet.com for NEW HIGH VOLTAGE & HIGH TEMP PRODUCTS that have been launched. KEMET's SnPb Terminated Ceramic Capacitors for High Reliability Soldering KEMET's portfolio of tin/lead terminated ceramic surface mount capacitors in C0G and X7R dielectric are well suited for applications which include defense and aerospace electronics. TAIYO-YUDEN new introduction of 171 new MLCCs, both standard and AEC-Q200 qualified product, including 150, 220 and 330uF product! NPI IN PROCESS. Ceramic Through-Hole Capacitors Stable Stock to 20 weeks AVX focuses on automotive-grade capacitors for radial skycaps "SR" will be "AR" series and Axial Spingaurd "SA" will be "AA" series. For more information see www.avx.com, AVX: SR and SA Series NP0 have a longer lead time at 18 weeks, elsewhere stable stock to 12 weeks.. KEMET future demand is up. Kemet's up and coming ROHS Conversions Note, X8R/X8L Aximax Q2 CY14, BME Auto grade Aximax & Goldmax have completed AECQ200 qual testing. Separate catalogs for Base Metal and Precious Metal designs for Aximax & Goldmax product being developed to better align our costs and pricing strategies. Kemet wants to make BME its new standard design, so new part numbers are under development for existing PME product. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PASSIVE (CONTINUED) Continued on following page PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS Ceramic Disc Capacitors Stable Lead times 12-22 weeks some case size/values may be lengthier than others. Pricing stable for now! Vishay Intertechnology, Inc. introduces a new series of AEC-Q200-qualified, AC-line-rated ceramic disc safety capacitors designed to provide high reliability for Class X1 (440 VAC) and Y2 (300 VAC) automotive applications in accordance with IEC 60384-14.3, 3rd edition. • Single-layer AC disc capacitors • Consist of a silver-plated ceramic disc with tinned copper connection leads offering 0.6 mm diameters • Available with straight leads with spacing of 5 mm, 7.5 mm, and 10 mm • RoHS-compliant and halogen-free • Encapsulation is made of flammable-resistant epoxy resin in accordance with UL 94 V-0 Click for more information. Film Capacitors/ Ceramic Axial Stable Tantalum/ Polymer Chip/ Through-hole Capacitors Stable Standard 14-18 weeks out as far as 36 weeks which may include 4-6 weeks for delivery, General lead times extending within some MFGs. Acquiring raw material for agency recognized XY safety caps can get challenging at times With multiple MFGs building Tantalums lead time can vary. Lead times are stable running stock 22 weeks. This can vary by 4-6 weeks on extend cap values, tolerances and specialties. PANSONIC OFFERS EZPE SERIES OF DC LINK CAPACITORS PLUS ECWF SERIES META PP FILM CAPACITORS Panasonic introduces the NEW ECW-F(E) Series of Metalized Polypropylene Film Capacitors. With a durable outer box construction, this Panasonic part is capable of withstanding vibrations better than a standard dipped type film capacitor. The polypropylene dielectric provides better electrical characteristics than Polyester and the built-in fuse functionality allows the ECWF(E) Series to open upon failure rather than short circuit. Currently rated for 450VDC applications, this film capacitor is essential for Power Supplies, PFC, and other applications where vibrations are a subject of concern. KEMET FIRST-TO-MARKET POLYMER HERM SEAL EXTENSIONS The new T550 Polymer Hermetic Seal Series is now available in a B case size, offering the highest voltage and deliverable energy with the lowest leakage current of any other capacitor. Through-hole Polymer Hermetic Seal Portfolio Expansion The T550 PHS DLA and T551 Polymer Hermetic Seal (PHS) Series both offer the highest voltage and deliverable energy with the lowest leakage current of any other solid tantalum capacitor. KEMET EXPANDED TANTALUM POLYMER PORTFOLIO A newly constructed T528 Series B case size design offers ESR values of 6 and 9 mOhms, making it the lowest ESR product available in this footprint. PANASONIC OFFERING HIGH VOLTAGE SP-CAP AND LOW PROFILE SP-CAP, AND LARGER CAPACITANCE POSCAP" AVX RELEASES NEW CAP VALUES FOR TANTALUM MnO2 (3), TANTALUM POLYMER (3) & TANTALUM HI-REL (12) Click for more info. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PASSIVE (CONTINUED) Continued on following page PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS Filters (GDTs, TVS, Varistors, Thyristors) Increasing Stock to 8-14 weeks stable KEMET IS PLEASED TO NOW OFFER NEW ELECTRONIC COMPONENT SOLUTIONS FOR NEC TOKIN'S ELECTRONIC COMPONENT PRODUCTS INCLUDING SUPERCAPACITORS, INDUCTORS, RELAYS, FLEX SUPPRESSORS, EMI CORES AND AC LINE FILTERS Lead times to include AVX, BNS, MUR, TDK, DAL, PIC, STP, TYC EPCOS PRODUCT BRIEF 2015, THERMOFUSE VARISTORS, T SERIES FOR HOUSEHOLD APPLIANCES AND INDUSTRIAL APPLICATIONS, ORDERING CODE EPC:62024-7600 Language English Length 4 pages The new EPCOS Product Brief entitled ThermoFuse Varistors, T Series is now available. It provides an overview of the ThermoFuse varistors with 14 mm and 20 mm disks and also presents examples of their application in household appliances and industrial electronics. EPCOS PRODUCT NEWS POWER QUALITY SOLUTIONS ACTIVE HARMONIC FILTERS FOR OPTIMIZED POWER QUALITY With the EPCOS PQSine™ a new series of active harmonic filters is available for optimized power quality. The modular filter systems are designed for 3-phase networks with and without neutral conductors at voltages from 200 V AC to 480 V AC and 50/60 Hz. PQSine active harmonic filters are able to analyze and neutralize harmonics up to the 50th order. The new filter series is available in steps of 60 A up to a maximum rated current of 600 A. AVX VARISTORS SUCCESSFUL WHY? Performance and Range • Off-state capacitance (EMC Capacitance) available from 0.47pF to 30nF-> EMI Filtering • On-state back-to-back Zener diodes -> Transient Voltage Suppression • Fast response, Bi-directional Fuses Stable Lead times are running any where from 2-3 weeks out to 10 weeks Bourns 6-13 weeks NIC 12-14 weeks • No wear out Phenomena (can withstand repetitive ESD strikes) • Low leakage • Large surge and energy capability NIC Components is pleased to announce the addition of NFVC_S series of surface mount chip fuses, to its expanded offering of circuit protection products. NFVC series utilizes wire in air fuse construction, for superior inrush current characteristics (I2T) as compared to thick and thin film type SMT chip fuses. Supplied in 6125 (2410) case size, the NFVC_S series features wide operating range (-55 to +125 C) with current ratings from 1 to 5A (derated over temperature) and interrupt voltage ratings of 125 VAC (125 V & 160 VDC). NFVC_S series is UL safety agency (USA & Canada) listed under supplemental fuses. The NFVC series is RoHS and PB-Free soldering compliant, supplied packaged on carrier tape for automated pick and placement PCB assemblies, followed by reflow or wave (flow) soldering process. Click for more information. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PASSIVE (CONTINUED) PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS Inductors Stable TDK/EPO: Inductor currently running 14-16 weeks out as fas as 56 weeks is a possibility VISHAY INTERTECHNOLOGY, INC. ANNOUNCES A NEW POWDERED-IRON-BASED, WPC-COMPLIANT (WIRELESS POWER CONSORTIUM) WIRELESS CHARGING RECEIVING COIL DESIGNED FOR 10 W APPLICATIONS NIC is running approx. 12-16 weeks • Provides an alternative to Ferrite-based solutions – which can saturate in the presence of a strong magnetic field PIC Is approx. 13-19 weeks BNS/JWM is currently running 15-20 weeks Click for more information. TAIYO YUDEN ANNOUNCES AN EIA 0603 SIZE CHIP BEAD INDUCTOR WITH THE HIGHEST CURRENT RATING IN THE INDUSTRY DAL: Model • Rated current of 2 A enables 10 W of charge at 5 V Inductance Current lead time in weeks This Product Demonstrates High Reliability and High Rated Current, Making it Ideal for Car Electronics and Industrial Equipment. IHLP-1616 All 10 -11 IHLP-2020 All 10 -11 IHLP-2525 All 11-12 AVX EXPANDS PARTNERSHIP WITH MODELITHICS IHLP-3232 All 12-13 IHLP-4040 All 13-14 IHLP-5050 All 11-12 IHLP-6767 All 19-20 AVX has expanded its partnership with Modelithics, the leading RF/Microwave simulation model provider, with the addition of 45 new Modelithics substrate scalable equivalent circuit models. Designed to speed up design decisions and circuit level optimizations when used in combination with the industry's leading electronic design automation tools, including Keysight Advanced Design System (ADS), Keysight Genesys, and NI AWR Microwave Office, highly accurate, substrate scalable models are now available for AVX thin film couplers, multilayer organic (MLO) diplexers, and a variety of RF/Microwave capacitors and inductors. TAIYO YUDEN has announced the expansion of its line-up for its chip bead inductor FB series M type, designed for increased noise reduction for power supply use, with the EIA 0603 size FBMJ1608 (1.6 x 0.8 x 0.8mm), the EIA 0806 size FBMH2016 (2.0 x 1.6 x 1.6mm), and the EIA 1206 size FBMH3216 (3.2 x 1.6 x 1.6mm). STP is running stock-12 weeks EPCOS PRODUCT NEWS LEADED RF CHOKES WITH HIGH CURRENT CAPABILITY Murata is generally running 14-16 weeks The new LBC+ series of EPCOS leaded RF chokes offers components for rated currents of up to 4450 mA at saturation currents of up to 7700 mA. This corresponds to an increase of up to 80 percent compared to previous versions. The range of inductance values of the E12 series extends from 1.0 μH to 470 μH. These RoHS-compatible inductors are suitable for an operating temperature range of -55 to +125 °C. The components of the LBC+ series are manufactured in both axial (B82144F2*) and radial types (B82144B2*). The latter have a lead spacing of 5 mm. The chokes have a length of 9.2 mm and a diameter of 6.5 mm. A flame-retardant enamel coating protects the components against environmental effects. Moreover, they are marked for identification with color rings to IEC 60062. BOURNS INDUCTIVE COMPONENTS PRODUCT LINE INTRODUCES AN ADDITIONAL MODEL, SM51589PEL, TO THE LAN TRANSFORMER PRODUCT CATEGORY The Bourns® Model SM51589PEL is a single-port, potted construction LAN 10/100/1000 Base-T transformer that is designed for Ethernet applications with PoE function. This model features an extended operating temperature range from -40 to +85 °C with unique 5 kVrms isolation voltage. Click for more information. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PASSIVE (CONTINUED) PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS Magnetics Stable Stock to 14 weeks The Bourns® Model AMS22B Non-Contacting Analog Rotary Position Sensor is designed to meet the specifications of heavy-duty applications requiring long cycle life and high reliability. This single-turn rotary sensor features a 1/4 ” stainless steel shaft supported by a bronze sleeve bearing and a factory programmable electrical angle from 10 to 360 degrees. Available in a bushing mount configuration with a rotational life of up to 50 million cycles, the Bourns® Model AMS22B Sensor is a highly versatile panel mount position sensing device. Click for more information. AVX offers Circuit Protection for Automotive, Professional, Industrial and Commercial Applications. AVX delivers broad range of circuit protection components for today’s and future application needs. More noise created and more susceptibility to noise. Need is for EMI attenuation, AVX Solutions include: • Traditional AVX Capacitive Products • Feedthrus • Feedthru Arrays • TransFeeds, TransGuards, MultiGuards, AntennaGuards, USB Series, Controlled Cap MLVs - these provide EMI attenuation in addition to over voltage protection Potentiometers Stable Bourns is currently is running: 8-16 weeks DAL is currently is running 8-16 weeks PIC is currently is running 12-14 weeks In line with our commitment to provide our customers with innovative products, Bourns Sensors and Controls is proud to announce the release of our “dual ball bearing” option for our Model 3549 10-Turn Precision Potentiometer. Click for more information. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PASSIVE (CONTINUED) Continued on following page PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS Resistor Chips Stable Bourns is running 7-14 weeks Panasonic NPI for ERJ-6PW is an Anti Surge double-sided resistor and ERJ8CW Line Extension. Focus on high value resistors such as Current Sense, Thin Film, and High Power types. DAL: the "CRCW" chip resistors are currently running about 9-12 weeks NIC: the "NRC” chip resistors are currently running about 9-12 weeks PIC: "ERJ" chip resistors are at 7-12 weeks Array's are at 8-10 weeks Thin Film are at 8-10 weeks RHO is running 8-10 weeks Stackpole chip resistors are at stock-10 weeks Vishay Intertechnology, Inc. introduces a new high-voltage thin film resistor divider network that offers a compact, higher-precision alternative to functionally equivalent products built on thick film technology. • High-precision thin film construction • Compatible with high-speed assembly equipment • Edge castellation allows visual inspection of solder joints http://www.vishay.com/whatsnew/doc/npi_140904-NPI-Resistors-HVRD.pdf Is there a MFG that has a Thick Film chip resistor that is 100% Lead Free and 100% RoHS Compliant? YES! Vishay has their RCG series (Green Thick Film Chip Resistors). It is totally lead free, no lead in glass, no RoHS exemption! Click for more information. NIC Components also has introduced the NRCL series that is a thick film chip resistor that does not contain lead or use exemption to achieve compliance. Click for more information. NIC is pleased to offer NRSNL series of Pb free thick film chip resistor arrays, which does not take the RoHS exemption, as the level of Pb has been reduced below the RoHS threshold of 1,000PPM (0.1%). The NRSNL series 4 element arrays are available in EIA standard 0408 (0402 x 4) & 0612 (0603 x 4) case sizes with convex terminal construction. Supported in E24 (+/-5% tolerance) and E96 (+/-1% tolerance) resistance values, with individual element power ratings of 1/16W (0.0625W) in 0408 size and 1/10W (0.10W) in 0612 size. Click for more information. *** Avnet now has Rohm passives! October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PASSIVE PRODUCTS PRICING TRENDS DELIVERY TRENDS Resistors, Leaded Stable NIC is running approx. 10-12 weeks WATER-COOLED WIREWOUND RESISTOR: PIC is approx. stock to 12-14 weeks Key Benefits: (CONTINUED) MARKET, PRODUCT AND TECHNOLOGY TRENDS STP is running approx. 8-15 weeks • Very high power dissipation up to 2500 W at 60 °C water inlet temperature and 5 l/min DALpresently, lead times are running 6-11 weeks • High pulse tolerance: up to 5000 W for 10 s • Non inductive option: below 250 nH Applications: • Snubber and DC grading resistor for HVDC • Discharge and balancing resistor • Snubber resistor for drives and large drives • Filter resistor Click for more information. Timing Devices Stable Lead time for standard product 8-10 weeks, non-standard product 10-14 weeks, programmable oscillators (FOX) 1-3 weeks and resonators 10-14 weeks Pin through oscillators selectively being discontinued, extended lead times expected. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – PASSIVE (CONTINUED) PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS Stable Standard lead times 7-17 (stable) While Vishay Bennington Facility remains on hold for the Tantalum Capacitor M39006/22/25/30/31, Styles CLR79/81/90/91, 125V ratings, Characteristic “H” suffix only all failure rates. MILITARY Mil-Tantalum Capacitors Please be advised the Vishay/Israel has a Ship Hold Notice - wet tantalum capacitors M39006/22/25/30/31, Styles CLR79/81/90/91, 125V rating, Characteristic “H” (High Vibration) suffix only all failure rates, all case sizes Date Code- 1327 or newer Vishay-Israel Cage code SH905 only Description: Vishay-Israel experienced a Group C, Subgroup 1, test failure for random vibration. All parts passed all other tests within the sub-group, to include 80g high frequency vibration. Subsequent testing isolated the failures to 125V ratings. Related Suffix “H” Dash Numbers released from Hold: M39006/22- 0201H to 0220H, 0421H to 0440H, 0641H to 0660H M39006/25- 0081H to 0088H, 0169H to 0176H, 0257H to 0264H M39006/30- 0201H to 0220H, 0421H to 0440H, 0641H to 0660H M39006/31- 0081H to 0088H, 0169H to 0176H, 0257H to 0264H Vishay-Israel understands the inconvenience this temporary ship-hold may have caused, but is dedicated to provide only products which meet the full requirements of the MIL specifications. All parts numbers are now released, and we will expedite all open customer orders to the best of our abilities. An additional update of the hold status will be provided within 30 days. Vishay: CWR06/CWR16 Slight price Increase coming....3% Mil-Ceramic Capacitors Stable Standard level-stock to 12 weeks What Is Driving Hi-Reliability BME Development Efforts? Space level-stock to 24 weeks • Application requirements are driving towards CV values that can’t be achieved with conventional Mil-qualified PME capacitor offerings • BME MLCC can offer up to ~10x increase in capacitance compared to the current Mil-qualified PME capacitor offerings • Use of BME MLCC has been demonstrated in medical implantable devices for 10+ years and in various automotive applications for >15 years • BME technology will find increasing use in MIL applications to extend capacitance ranges as data and experience with the product grows • BME Industry Forum is meeting weekly to develop a detailed spec for BME/Thin Dielectric MLCC for Hi-Rel applications • Keep in mind for Military capacitors where “Additional testing is required,” those will require more lead-time • Price trends vary within the military arena with some being stable and others being up Mil-Resistors Stable 6 to 12 weeks, with lead times stable Click to learn more about Avnet's extensive Resistor product offering. October 2014 Market & Technology Trends TECHNOLOGY OVERVIEW – POWER SUPPLY PRODUCTS PRICING TRENDS DELIVERY TRENDS MARKET, PRODUCT AND TECHNOLOGY TRENDS AC/DC Front Ends Stable Lead time stock to 6-24 weeks (stable) Platinum efficiency standard established as baseline. Titanium standard introduced with limited models available. 1.2" x 1.5" x 13" dimensions widely accepted for 12 V supplies, along with edge card power connectors for 48 V supplies. Higher power, 3 kW and above along with lower power <500 Watts are in demand for 48 V and 12 V supplies. DC input, reverse air flow, and rack options available. I2C/PMBus digital interface becoming standard features. Avnet Lines: Artesyn, GE-Power, Murata Power, Power One, and TDK-Lambda produce these types of power supplies. AC/DC Switchers Stable Lead time stock to 6-20 weeks (stable) Increased power densities and lower cost 2 x 3, 2 x 4 and 3 x 5 package sizes. 400-500 W power levels available. Medical EN60601 3rd edition is the medical standard. 4th edition being planned. Extended temperature range, convection cooling. I2C/PMBus remote sense and inhibit are key features being offered. Industrial market demands are increasing for enclosed supplies, high surge current, conformal coating, constant current and shock/vibration options. Avnet Lines: Artesyn, GEPower, Murata Power, Power One, SL Power, and TDK-Lambda produce these types of power supplies. AC/DC Modular Power Stable Lead time stock to 6-20 weeks (stable) High power densities with voltage/current flexibility available off the shelf. Latest products have lower cost, wider power ranges, additional output options and 1U height. I2C/PMBus digital interface options available for additional control/monitoring functions. Medical approvals are a major selling point. Development of new models expected. Avnet is a world leader in building these types of supplies from Artesyn, TDK-Lambda and Power One at our Value Add Center. DC/DC Isolated Industrial Converters Stable Lead time stock to 6-24 weeks (stable) Power densities increasing, smaller package types, high efficiency, wider input voltage ranges and higher operating temperatures evolving. Railway, Industrial and Mil-Aero applications with convection and conduction packages with base plate attachment. Extended temperature ranges. COTS devices available. Avnet Lines: Artesyn, GE-Power, Murata, Power One, and TDK-Lambda produce these types of power supplies. DC/DC Isolated Converters 1/4 Brick & Smaller Stable Lead time stock to 6-20 weeks (stable) 1/8 and 1/16 brick packages driving market. Typical bus voltages are 24 and 48 Vdc with wide input 18 to 75 Vdc available. I2C/PMBus digital controls/monitoring options from Ericsson, Murata Power and GE Critical Power. 12 Vdc Intermediate Bus Converters with lower voltage outputs available. Bus Converter power has increase to 600 Watts and beyond. Avnet Lines: Artesyn, GE-Power, Murata Power, Power One, Ericsson, and TDK-Lambda produce these DC-DC converters. DC/DC Non-Isolated Converters Point-of-Load Stable Lead time stock to 6-20 weeks (stable) Fourth generation DLynx POL family incorporating PMBus controlled digital telemetry from GE Critical Power is available with up to 80Amps. Power One d-PWER GEN II next generation parts announced. POLs offer wide range of output voltages from .45 to 5.5 Vdc and currents from 2 to 80 Amps. Murata Power and Ericsson BMR series also offer POLs with PMBus interface. Parallel feature offered. TDK-Lambda just announced a 60 Amp Analog POL, iJB series. External Power Supplies Stable Lead time stock to 6-20 weeks (stable) External AC/DC power supplies from SL Power offer single outputs with desk-top or wall mount versions. Popular applications are medical with EN60601 3rd edition, portable devices, tablets, PC, battery charger, POE, and consumer products. Parts coming on the market address compliance to the latest safety and energy efficiency legislation. New products with greater than 200 W have been released. Cost and output connector flexibility are critical factors. Avnet Lines: TDK-Lambda and Artesyn also offer external supplies.
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