Parametrics and Optimization using ANSYS DesignXplorer 15.0 Release Introduction to ANSYS Icepak © 2014 ANSYS, Inc. October 8, 2014 ANSYS Confidential Release 15.0 Contents • • • • • • Need for Optimization Icepak Optimization : Overview & Scope Why DesignXplorer? ANSYS DesignXplorer (DX) : Overview Common Terminologies in Icepak, Workbench & DX ANSYS DesignXplorer Systems/Components • • • • • Parameters Correlation System Design of Experiments (DOE) Component Response Surface System Goal Driven Optimization System Six Sigma Analysis System • Appendix © 2014 ANSYS, Inc. October 8, 2014 ANSYS Confidential Release 15.0 Need for Optimization Uncertain Design Parameters Fan Flow rate Number of Heatsink Fin ……… Component Location Time to Market Innovation Robust & Reliable Cost Optimization Techniques System Optimized Design © 2014 ANSYS, Inc. October 8, 2014 ANSYS Confidential Release 15.0 Icepak Optimization • Built-in optimizer of Icepak provides the option of predicting the best case/optimum values for the parameters of interest (design variables) • Scope : ▪ ▪ ▪ ▪ Only one objective function Variation of output parameters with respect to design parameters is not known Limited post-processing capabilities with optimization results Does not connect with other ANSYS tools for complete optimization © 2014 ANSYS, Inc. October 8, 2014 ANSYS Confidential Release 15.0 DesignXplorer (DX) Overview • DesignXplorer (DX) is a tool that uses Response Surfaces and direct optimization to efficiently explore the solution space. ▪ ▪ ▪ ▪ Explore and understand the performance at other design or operating conditions Find the conditions which give the best performance Determine the key parameters influencing the design Explore the robustness of the design ? ? Single Point © 2014 ANSYS, Inc. October 8, 2014 ? What If? ANSYS Confidential Response Surface Release 15.0 DesignXplorer & Icepak in Workbench Icepak Starting R15, Icepak and DesignXplorer are data integrated into Workbench framework Design Exploration Systems DesignXplorer © 2014 ANSYS, Inc. October 8, 2014 ANSYS Confidential Release 15.0 Problem Definition 8 IC packages dissipating 20 W each Objective : Minimize Thermal resistance of Large heat sink Connector Design parameters/Variables • Number of fins on Large heat sink • Fin thickness of Large heat sink PCB Large HS Small HS Constraint : Total mass of heat sinks should not exceed 400 g Outlet grille © 2014 ANSYS, Inc. October 8, 2014 Inlet Opening 2 m/s ANSYS Confidential Power caps dissipating 1.5 W each CPU dissipating 50 W Release 15.0 Path to Robust Design ? Optimization •Algorithms ? Design Exploration •DOE, Response Surfaces, Correlation, Sensitivity analysis Solutions compared, Provides Doesn’t design provide Doesn’t account but design isfor notbut understanding, direction for physics well understood and optimization designis not interactions no optimum is found automated improvement Single Physics Solution •Fast, simple & easy. © 2014 ANSYS, Inc. Multiphysics Solution •Workbench integration platform, more accurate October 8, 2014 “What if” Study •Parametric analysis ANSYS Confidential Release 15.0 Problem Definition Socket • Optimize the design of heat sink for a LED    Minimizing the total mass of heat sink Keeping maximum temperature on sources below a certain critical limit Minimizing thermal stress and deformation 6 sources 1.5 W each Heat sink • ANSYS products required      Workbench Multiphysics environment DesignModeler to create geometry Icepak for flow & thermal simulation Mechanical for stress analysis DesignXplorer for optimization © 2014 ANSYS, Inc. October 8, 2014 Bulb ANSYS Confidential PCB Release 15.0