MEMS Sensor From Chip to Sensor Data Integration MiraMEMS Sensing Technology Co., Ltd. David Wang MiraMEMS Introduction • China 1st MEMS Fabless shipping 3 axis g-sensor in volume • Among the smallest 3 axis MEMS g-sensor (1.1mm*1mm) in the world • 12 years focusing on MEMS process & product development • 1st using standard CMOS process to realize MEMS-CMOS integration • XmotionTM & SensorPackTM turn key solution enables faster sensor adoption • Over 130+ US patents issued and pending Process & IP Sensor Chips Xmotion Software Activ ity Dete ction Incline Detection Xmot ion Sensor Pack Gesture Engine Sensor Pack Pede stria n Navi gatio n Customized Solution The Challenge of MEMS Sensor Development • Big multi-disciplinary team • Device • Process • Assembly • Test Structures New materials New tools Process integration Algorithm IP • Integration of manufacturing flow Process / Materials WLP/ Assembly Device/ Layout Simulation MEMS Device Reliability & proven reliability • It takes years to develop a family of MEMS product CMOS Interface/ ASIC Characterization/ Testing MiraMEMS is leading the way to shorten the development time and “standardize” MEMS Design & Process platform MiraMEMS Process Platform Evolution Monolithic MEMS/CMOS Integration Fusion bonding to CMOS Substrate Integration of other MEMS Sensing Elements Through Si VIA scheme Capacitive Sensing Isolated electric path on MEMS Si Glass Frit WLP Hermetic Eutectic WLP Vacuum Eutectic WLP Single crystal Si MEMS 1.1x1.0mm 3 axis g-sensor Multiple MEMS thickness Micro Mirror Display 3-axis Accelerometer 2003~2009 2010~2013 3-axis Accelerometer & other MEMS sensing elements 2013~ Our proprietary 3D-CMOS/MEMS platform • Standard MEMS Process/ Device Features:  MEMS-last  CMOS compatible  Single crystal Si  Bulk micro-machined  Thru-Si via (TSV) interconnect  Hermetic WLP •High performance - Low parasitic •Better reliability - TSV interconnect - Anti-stiction solution •Low Cost - 3D integration and WLP MiraMEMS Process Platform’s Potential Feasible MiraMEMS 6 DoF eCompass • – I2C/SPI standard interface – Dedicated programmable interrupt 6DoF eCompass • • Accelerometer • Magnetometer Integrated 3 axis accelerometer& magnetometer • Excellent noise density specific • 9 DoF feature with soft gyro supported World’s Smallest eCompass I/O – ±2g, ±4g, ±8g, ±16g scalable range – 14 bits high resolution – ±48Gauss wide range – 16 bits high resolution Chip Function Dimension Pin2Pin dc213 A+M 2mm×2mm da213 dc312 A+M 3mm×3mm da312 Pin2Pin g-Sensor family for easy upgrading to eCompass MiraMEMS XmotionTM TM Pedestrian Navigation XmotionTM Sleeping Detection Gesture Engine Auto-calibration, 6D Orientation, eCompass, Shake, free-fall…… Standard OS API Application developers Activity Monitoring Xmotion Extended API Sensors A / M / P / G / … Fall Detection XmotionTM Applied to Smart Mattress + XmotionTM Middleware = SensorPackTM Module Sleeping Monitoring • • • • • • Bedtime in Sleeping duration Sleeping status Deep sleep time Shallow sleep time …… Customized Solution Medical-care Monitoring • Events of sitting on& leave the bed • Sleep monitoring • Abnormal activities Alarm …… MiraMEMS Team • World-class team with rich experiences, Headquarter in Suzhou, China • Branches in Shenzhen, Shanghai, Taiwan and Silicon Valley RD/AE Marketing RD Sales USA Sales FAE Suzhou Shenzhen Sales FAE Shanghai Taiwan RD Our Key Success Factors Technology • Over 12 years focusing on MEMS Process & Product development • 130+ US patents issued and pending Cost • Self-made ATE with highest efficiency & lowest cost • Smallest die size of accelerometer & magnetometer Capacity • 8 inch MEMS wafer fabricated in the world’s leading foundry • Assembly & Test leveraged local leading vendors Service • FAEs at Shenzhen & Shanghai to provide support <24hours • Support algorithm & customized sensor solution development China Rooted with Global Perspective & Capability! Thanks MiraMEMS Sensing Technology Co., Ltd www.MiraMEMS.com