The Premier Exposition for the Microelectronics
Manufacturing Supply Chain
December 3 Wed. ▶ 5 Fri. 10:00ー17:00
Tokyo Big Sight East Exhibition Hall, Conference Tower
Organizer: SEMI®
Supported by:
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Tokyo Big Sight
For registration, please visit ▶▶▶
U.S. Department of Commerce; Japan LED Association;
Japan Institute of Electronics Packaging; The Japan Society of Applied Physics;
Japan Electronics and Information Technology Industries Association;
The Tokyo Chamber of Commerce and Industry; The Japanese Liquid Crystal Society;
The Vacuum Society of Japan; Japan Vacuum Industry Association;
Japan Electronics Packaging and Circuits Association;
Nippon Electronic Device Industry Association; Semiconductor Equipment Association of Japan
#PPUI/P )BMM
www.semiconjapan.org
The New SEMICON Japan
New Venue – New Exhibits – New Technologies – New Programs
New Venue: Tokyo Big Sight
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World of IoT
A new technology showcase for IoT enablers
Over 100 hours of Technology and Business Programs
A one-stop information resource for microelectronics manufacturing
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“without limits.” There are no limits to where
technology can take us or to where we can take
technology. Explore opportunity without limits in
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Global executives of IoT leading Company.
The remarks in the forums and the
seminars attract attentions from the world.
World of IoT will bring together leading global electronics
and microelectronics companies whose innovations are
driving the expansion of mobile, cloud computing, and
network-connected devices. Held in conjunction with
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“show-within-a-show”
and is the only exhibit showcase and conference of its
kind in Japan.
Yuzuru Utsumi
Chikatomo Hodo
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Accenture Japan Ltd
Gary E. Dickerson
Kosuke Hirano
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Intel K.K.
Ken NIshimura
Shinichi Abe
TechCrunch Japan
Google Japan, Inc.
Donald Jones
Tsuyoshi Kinoshita
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Global leading players of IoT provide solutions, technologies
and services in the following areas in Hall 3.
Tomoyuki Suzuki
Yasuo Naruke
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Tokuhisa Nomura
World of IoT Exhibition area
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IoT related seminars and events: Check
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marks in seminars and events lists.
SEMICON Japan 2014 Sponsorship（Alphabetical order）
Platinum Sponsors
Gold Sponsors
Kazuaki Sawada
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of Technology
Madoka Sawa
Takeshi Idezawa
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LINE Corp.
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innovation
Explore the Future of Innovation at the Exhibition Hall
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East Hall 3
East Hall 2
www.semiconjapan.org
East Hall 1
SEMICON
Lounge
Back-end Process /
Materials & Overall Process Zone
Front-end Process Zone
Special
Showcase
製造イノベーション
Manufacturing
パビリオン
Innovation
Pavilion
Ecosystem Pavilion
Secondary Equipment Pavilion
Visitor Registration
化学物質管理対策
Chemical Materials
パビリオン
Management
Pavilion
From nearest
station
Visitor Registration
Seminars
by exhibitors
It is held
in Tokyo
Big Sight
Conference
Tower
Front-end Process Zone
Seminars
SEMI Standards Meetings
others
East Hall 4
East Hall 5
Construction of two process zones and four theme pavilions
Front-end Process Zone
Manufacturing Innovation Pavilion
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to account for 80% of device markets spreads.
Back-end / Materials & Overall Process Zone
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technologies (packaging, test, and assembly),
advanced materials, services, software, components,
parts, and cross-over technologies.
This pavilion will showcase innovative process and
manufacturing technologies and materials that enable
smarter and faster devices at lower manufacturing
costs.
Secondary Equipment Pavilion
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business opportunities to the exhibitors that supply
secondary equipment and related components and
services.
Ecosystem Pavilion
Chemical Materials Management Pavilion
Ecosystem Pavilion is designed to facilitate partnership
across the microelectronics supply chain from materials
and components suppliers to manufacturing service
providers.
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designed to showcase those companies providing
technologies, services, and solutions for chemical
materials management.
Regional Pavilions
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Exhibition Hall
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Venue: East Exhibition Hall, Tokyo Big Sight
Seminars by exhibitors
A new product, leading-edge technology, a
development concept, etc. 'SFF
Exhibitor's
Seminar Room
Venue
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●
●
●
Free
Networking Events
Students Events
Happy Hour
The Kosen
Date ●5IV%FDo Venue ● Participating exhibitors will be announced in November.
A casual networking event held at participating exhibitor
booths.
Featuring presentations from the National College in Technology.
Date ●8FE%FDo'SJ%FDo
Venue ● Exhibition Hall
East Hall 1
Innovation Lounge・
Networking Reception
East Hall 3
Date ●8FE%FDo'SJ%FDo
Venue ● Innovation Lounge, East Hall 1
Connect with the engineers of the same generation in the
industry at this networking reception for young engineers.
Technical briefing session by the exhibition companies
in charge for students
Date ●5IV%FDo
Venue ● Exhibition Hall
East Hall 4
(Invitation only)
www.semiconjapan.org
Contact for Exhibition
Attendee support tools
▶
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Tel: +81.50.5804.1281 [email protected]
Joint technical briefing session
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xhibitor Search: Please visit official Web site.
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to search for companies that are exhibiting in 2014.
How to register
Please visit ▶
t NEDIA Pavilion
Contact for Seminars & Events
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www.semiconjapan.org
t The SEMICON Japan Mobile App.
-Available for Download from Nov. 25.
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iPhone, iPad, and Android devices).
information
More than 100 Hours of Seminars and Events
Venue: East Hall 3, East Exhibition Hall, Tokyo Big Sight
Wed., Dec. 3
10:20
–12:00
12:50
–14:30
14:50
–16:30
Thu., Dec. 4
Fri., Dec. 5
STS Special Session
STS DFM Session
STS Test Session
What will Big Data and IoT Bring?
Information is changing the world when things are
connected with sensors to generate enormous amount
of information that then create new services. Come to
develop your business acumen to grab the opportunity.
Improve Competitiveness through DMF/DFR
As the complexity in semiconductor manufacturing
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the latest development in fab-light/fables era.
Challenges for a Quality / Cost Balance
How can test technologies satisfy both quality and cost
requirements in a diversified semiconductor industry?
Leading test experts will present the latest
developments and future directions for test.
STS Power Device Session (1)
STS Advanced Lithography Session (1)
STS MEMS / Sensor Session (1)
SiC/GaN Power Devices: The Signs of a Leap
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devices is expected shortly. This session will discuss
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including the national project.
EUVL ? on the Way to Reality
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long time stability required for practical use. This
session will report the current status of the equipment
and the light source as well as user’s expectation.
Social Infrastructure and MEMS Sensors
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with sensors is the challenge of today, such as the
smart agriculture and prevention of accidents. This
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social infrastructure.
STS Power Device Session (2)
STS Advanced Lithography Session (2)
STS MEMS / Sensors Session (2)
SiC/GaN Power Devices: The Signs of a Leap
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devices is expected shortly. This session will discuss
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including the national project.
Alternate Patterning Technologies
As a solution for further scaling to lower the chip cost,
integration of conventional and new patterning
technologies emerges in the current lithography
development. This session will discuss candidate
technologies.
Smart Devices and MEMS
1.2 billion smartphones are expected to be shipped in
2014, and wearable devices market ramps rapidly. This
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various viewpoints.
Venue: East Hall 5, East Exhibition Hall, Tokyo Big Sight
Wed., Dec. 3
10:20
–12:00
12:50
–14:30
14:50
–16:30
Free
Thu., Dec. 4
Free
Fri., Dec. 5
SEMATECH Manufacturing Forum
Secondary Equipment Business Seminar
Innovation Lounge Spin-off Program
Challenges and Opportunities for the Semiconductor
Supply Chain
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concepts and technologies in semiconductor
manufacturing and discuss the importance of synergies
across the industry.
New Trend in Secondary Equipment 2
Japan semiconductor industry is experiencing significant
changes including restructuring and acquisitions. In this
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equipment supplier will present their insights.
Challenge of Young Engineers
450mm Status from the Viewpoint of
SEMI Standards
STS Advanced
Devices / Processes Session (1)
STS TSV / 2.5D / 3D Session
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will also report updated information.
Future Vision for Advanced Device
New materials, technologies and device structures are
required for higher integration and higher performance.
This session will provide the latest technology
information essential to your business execution.
SEMI EHS & Sustainability Update 2014
STS Advanced
Devices / Processes Session (2)
Effective Usage of Water Resource in Semiconductor
for Manufacturing Factory
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semiconductor fabs for cost reduction and productivity
improvement. This session will focus on water from the
viewpoints of equipment, components, and fab
operation.
Future Vision for Advanced Device
New materials, technologies and device structures are
required for higher integration and higher performance.
This session will provide the latest technology
information essential to your business execution.
:PVOHFOHJOFFSTJOPVSJOEVTUSZXJMMUBMLBCPVUUIFJS
FYQFSJFODFTBOEESFBNTGPS3%QSPKFDUTJOBQBOFM
discussion. All young engineers are encouraged to
participate to take-away motivation and inspiration for
the future.
This is the 3D Jisso Solution for Winners
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adoption in their volume production. This session will
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STS Packaging Session
Catch the Wave of IoT Era
IoT is going to change our life and business. This
session will introduce packaging technologies that
contribute the coming IoT era by enabling high speed
communication systems.
Conference Tower
Wed., Dec. 3
SEMI EHS Standards Energetics Workshop
Thu., Dec. 4
Paid
Emerging Chemistries and their Combinations Introducing
Risks to Semiconductor Manufacturing Operations, Fab,
Environment and Life
Time ● o Venue ● 3PPN$POGFSFODF5PXFS'
SEMI Presidents Reception
Paid
Time ● o Venue ● 3FDFQUJPO)BMM#$POGFSFODF5PXFS'
SEMATECH Symposium
Fri., Dec. 5
Free
Future vision for semiconductor manufacturing technologies
Time ● o Venue ● 3PPN$POGFSFODF5PXFS'
Int'l EHS Compliance & Regulatory Seminar
Paid
Regulatory trends for semiconductor manufacturing
equipment and their impact on supply chain
Time ● o Venue ● 3PPN$POGFSFODF5PXFS'
Hospitality Seminar TRUMPF Huettinger
Free
Plasma with its application examples and choice of power supply
Time ● o Venue ● 3PPN$POGFSFODF5PXFS'
SEMI Standards Friendship Party
Time
●
o Venue
●
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Sustainable Manufacturing &
High Tech Facility Forum
Paid
More and More High-Tech Facility – More Green and
More Intelligent
Time
●
10:00–15:00 Venue
●
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Venue: Reception Hall A, Conference Tower 1F, Tokyo Big Sight
Japanese–English Interpretation Available
Free
This exciting conference event consists of nine sessions over three days, featuring a
powerful line-up of global industry experts and business leaders. Get inspired by some of
the leading names in industry and business.
Wed., Dec. 3
9:30
–10:00
Thu., Dec. 4
Opening Ceremony
Opening Session“Women
in Business”
IT Forum
Strategy for diversity soken by Female Top Executives
Time ● 10:00–12:20
Leading female executives from around the world and
Japan will share their perspectives on the strengths,
challenges, and opportunities in bringing more women
to the highest levels of business management.
10:20
–12:00
supported by US Embassy
This session will explore the technological and business
models driving development and shaping the future of
electronics. Executives from leading global companies
will share the perspectives and strategies.
Mary Puma
CEO
Axcelis Technologies, Inc.
Chieko Asakawa
IBM Research-Tokyo,IBM Fellow
IBM Japan, Ltd.
–16:30
CP Hung
Corporate R&D, Vice President
ASE
Suresh Ramalingam
Senior Director, Packaging Design
and Technology
Xilinx
Hiroshi Yamada
Senior Research Scientist
Electron Devices Laboratory, Corporate
Reseach & Development Center
Toshiba Corp.
Takeshi Idezawa
Chief Operating Officer
LINE Corp.
Ken Nishimura
TechCrunch Japan
AOL Online Japan
Opening Keynotes:
IoT Forum
GSA Forum:
The Future: Brought by IoT
The Internet of Things (IoT) promises to bring revolutionary
change in areas including communication, health care,
education, transportation, and the environment. Leading
industry experts and executives will present their
perspectives and insights on how IoT technology will
transform innovation, technology, and society as a whole.
Strategy foward the IoT Era
Which technologies and business models will take the
lead in the coming IoT era? Key industry executive
management and engineers will explore the future of
IoT and present their business and technology
strategies.
Current intelligent and flexible wired an wireless
systems are interconnected for specific applications. In
the coming era of IoT, "systems of systems" will need to
work together over a variety of connections including
the Internet. This forum will explore the design and
system requirements and cooperation needed to
advance the promise of IoT.
Chikatomo Hodo
President
Accenture Japan Ltd
Tsuyoshi Kinoshita
Managing Director, Technology
Cisco Systems G.K.
Donald Jones
Chief Digital Officer
Scripps Translational Science Institute
Kosuke Hirano
Senior Executive Officer, Business Development
Intel K.K.
Tokuhisa Nomura
Executive General Manager, Electronics Field
Toyota Motor Corp.
Tomoyuki Suzuki
EVP, Corporate Executive, Charge of Corporate R&D, Device
Sony Corp.
Kazuaki Sawada
Professor, Department of Electrical &
Electronic Information Engineering
Toyohashi Univershitu of Technology
Yuzuru Utdumi
President
ARM K.K.
14:50
Amid the mounting expectations of 2.5D / 3D IC
volume production, top engineers at leading companies
will discuss its cost, process, adoption and equipment
readiness for rapid development.
Shinichi Abe
Enterprise Business, Japan, Managing Director
Director Google Japan, Inc.
Miwako Doi
Auditor
National Institute of Information
and Communications Technology
–14:30
2.5D / 3D IC Forum
Madoka Sawa
Microsoft Technology Center MTC
Director Microsoft Japan
Makiko Eda
CEO
Intel K.K.
12:50
Fri., Dec. 5
IoT & Its Application
Shozo Saito
Senior Advisor,
Toshiba & Board of Director, GSA
Toshiba Corp.
Janusz Bryzek
CEO and Chairman
TSensors Summit, Inc.
A panel discussion representing semiconductor,
medical, auto, equipment and materials is scheduled
after the presentations.
Semiconductor Executive Forum
SEMI Market Forum
Manufacturing Innovation Forum
Innovation without limits
Top executives of the global semiconductor industry
will present their perspectives on the innovation
without limits in both technologies and business areas
to figure out the future of the semiconductor industry.
The coming IoT revolution will lead significant change
in the entire semiconductor supply chain. In this forum,
leading analysts will give insights across the supply
chain to help you develop strategies into the future.
Manufacturing Technologies for Sub-10nm Era
The IoT revolution will create vast demand for low-cost,
high-performance devices. Executives at leading
companies will discuss the innovations required to meet
the demand, with a view to the sub-10nm generation.
Yasuo Naruke
Executive Officer, Corporate Executive Vice President
and CEO, Semi conductor & Storage Products Company
Toshiba Corp.
Akira Minamikawa
Japan Research Director IHS Techonology
IHS global Inc.
Tsuyoshi Abe
Director and Senior Executive Officer,
Vice President General Manager of
Technology & Manufacturing Group Japan
Intel K.K.
Jim Feldhan
President
SEMICO Research Corp.
Gary E. Dickerson
President and Chief Executive Ofﬁcer
Applied Materials, Inc.
The Latest News
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as it breaks!
Traffic information to Tokyo Big Sight
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“Kokusai Tenji-jo”
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Hattori Ryuichiro
Senior Managing Consultant Global
Business Services Global Center of
Competence Electronics
IBM Japan, Ltd.
Dan Tracy
Senior Director
SEMI Industry Research & Statistics
1MFBTFWJTJU5PLZP#JH4JHIUPGGJDJBMXFCTJUF www.bigsight.co.jp
By train
Yuichiro Yamazaki
CTO, Director of Strategic Planning
NGR Inc.
Risto Puhakka
President
VLSI Research Inc.
By bus
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from Haneda airport, Narita airport, and a bus service
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Hotels:
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advantageous special discount rate.
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+5#%FTL
TEL:
Email: [email protected]