Cree XLamp XP Family LEDs ® CLD-AP25 Rev 12A Soldering & handling ® Introduction Table of Contents This application note applies to XLamp XP Family Handling XLamp XP Family LEDs............................2 LEDs, which have order codes in the following fomat. Circuit Board Preparation & Layouts.......................4 Case Temperature (Ts) Measurement Point..............4 XPxxxx-xx-xxxx-xxxxxx Notes on Soldering XLamp XP Family LEDs..............5 Moisture Sensitivity.............................................6 This application note explains how XLamp XP Family Low Temperature Operation..................................6 LEDs and assemblies containing these LEDs should be XLamp XP Family LED Reflow Soldering handled during manufacturing. Please read the entire Characteristics....................................................7 document to understand how to properly handle Chemicals & Conformal Coatings...........................8 XLamp XP Family LEDs. Assembly Storage & Handling................................9 Tape and Reel................................................... 10 WWW.CREE.COM/XLMAP Packaging & Labels............................................ 12 Copyright © 2008-2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 www.cree.com/xlamp xlamp xp led soldering & handling Handling XLamp XP Family LEDs Manual Handling Use tweezers to grab XLamp XP Family LEDs at the base. Do not touch the lens with the tweezers. Do not touch the lens with fingers. Do not push on the lens. Do not apply more than 1000 g of shear force directly onto the lens. Excessive force on the lens could damage the LED. P CORRECT X WRONG Cree recommends the following at all times when handling XLamp XP Family LEDs or assemblies containing these LEDs: • Avoid putting mechanical stress on the LED lens. • Never touch the optical surface with fingers or sharp objects. The LED lens surface could be soiled or damaged, which would affect the optical performance of the LED. ® ® 2008-2013 Cree, All reserved. rights reserved. The information in this document is to subject to without change notice. withoutCree, notice. , logo the Cree logo and aretrademarks registered Copyright © 2010 Cree, Inc. AllInc. rights The information in this document is subject change theCree Cree and XLamp areXLamp registered trademarks of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 2 0.5 xlamp xp led soldering & handling C5 6 4 3 2 NOTICE ENTIAL. THIS PLOT AND THE INFORMATION THIN ARE THE PROPRIETARY AND INFORMATION OF CREE, INC. THIS PLOT OPIED, REPRODUCED OR DISCLOSED TO ANY D PERSON WITHOUTTHE WRITTEN CONSENT REVIS REV DESCRIPTION The following diagram shows an example of a pick & place tool to remove XLamp XP-C, XP-E and XP-G LEDs from the factory tape & reel packaging. All dimensions in mm Tolerance: + 0.01 4 B 0.5 0.439 3.06 Top View 120° Conical A SECTION A-A Side View THIRD ANGLE P 8 6 7 4 5 3 THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF COUNT ON TOOLS, INC. ANY REPRODUCTION IN PART OR WHOLE WITHOUT THE WRITTEN PERMISSION OF COUNT ON TOOLS, INC. IS PROHIBITED. Rev. 2 1 REVISIONS DESCRIPTION PRINT RELEASE A DATE 10/11/2011 The following diagram shows an example of a pick & place tool to remove XLamp XP-E2 and XP-G2 A LEDs from the factory 6 tape & reel packaging. The nozzle is implemented in urethane. 5 4 D A All dimensions in mm A Tolerance: + 0.01 0.439 C 3.06 3.734 0.147 120° Conical SECTION BA-A 6 Top View 1.016 0.040THIRD ANGLE PROJECTION Side View SECTION A-A 5 FOR SHEET METAL PARTS ONLY .X ± .06 .XX ± .03 .XXX ± .010 X° ± .5 ° SURFACE FINISH: 3ITEM NO. 4 A UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: .XX ± .01 .XXX ± .005 X° ± .5 ° 3.302 0.130 DATE DRAWN BY D. Seibel 10/15/09 CHECK DATE APPROVED DATE TITLE MATERIAL PEEK SIZE FINAL PROTECTIVE FINISH SCALE 63 PART OR IDENTIFYING NO. NOMENCLATURE OR DESCRIPTION 2 C 10.0 MATERIAL SPECIFICATIO PARTS LIST UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN INCHES TOLERANCES ARE: DECIMALS ANGLES CAD GENERATED DRAWING, DO NOT MANUALLY UPDATE APPROVALS XX = <MOD-PM>.002 <MOD-PM>DRAWN 1/2<MOD-DEG> XXX = <MOD-PM>.001 CHECKED XXXX = <MOD-PM>.0002 MATERIAL FINISH DATE 10/11/2011 RESP ENG 32 MFG ENG QUAL ENG HEW Led and Tip SIZE A DWG. NO. NOT ®SCALE DRAWING ® 2008-2013 Cree, All reserved. rights reserved. The information in this document is to subject to without change notice. withoutCree, notice. Cree , logo the Cree logo and are registered CAD FILE: SCALE Copyright © 2010 Cree, Inc. AllInc. rights The information in this document is subject change theDO Cree and XLamp areXLamp registered trademarks 3 6 5 4 specifications, please 8 trademarks purposes7 only and is not a warranty or a specification. For product see the data2 sheets of Cree, Inc.of Cree, Inc. This document is provided for informational Tuesday, October 11, 2011 available at www.cree.com. 3 SH 1 1:16:44 PM xlamp xp led soldering & handling Circuit Board Preparation & Layouts Printed circuit boards (PCBs) should be prepared and/or cleaned according to the manufacturer’s specifications before placing or soldering XLamp XP Family LEDs onto the PCB. The diagram below shows the recommended PCB solder pad layout for XLamp XP Family LEDs. All dimensions in mm Recommended PCB Solder Pad Recommended Stencil Pattern (hatched area is opening) Case Temperature (Ts) Measurement Point XLamp XP Family LED case temperature (Ts) should be measured on the PCB surface, as close to the LED’s thermal pad as possible. This measurement point is shown in the picture below. It is not required to use a solder footprint for the thermal pad that is larger than the XLamp XP Family LED itself. In testing, Cree has found such a solder pad to have insignificant impact on the resulting Ts measurement. ® ® 2008-2013 Cree, All reserved. rights reserved. The information in this document is to subject to without change notice. withoutCree, notice. , logo the Cree logo and aretrademarks registered Copyright © 2010 Cree, Inc. AllInc. rights The information in this document is subject change theCree Cree and XLamp areXLamp registered trademarks of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 4 xlamp xp led soldering & handling Notes on Soldering XLamp XP Family LEDs Notes on Soldering XLamp XP Family LEDs XLamp XP Family LEDs are designed to be reflow soldered to a PCB. Reflow soldering may be done by a reflow oven or by placing the PCBLEDs on aare hotplate and to following thesoldered reflow soldering on the previous page. XLamp XP Family designed be reflow to a PCB.profile Reflowlisted soldering may be done by a reflow oven or by thesolder PCB on a hotplate and following soldering profile listed on the previous page. Do placing not wave XLamp XP Family LEDs. Do the not reflow hand solder XLamp XP Family LEDs. Do not wave solder XLamp XP Family LEDs. Do not hand solder XLamp XP Family LEDs. P P CORRECT CORRECT X WRONG P P CORRECT CORRECT Solder Paste Type Solder Paste Type Cree strongly recommends using “no clean” solder paste with XLamp XP Family LEDs so that cleaning the PCB after reflow soldering is not required. CreeKester uses the solder paste internally: 1 soldering is not required. Cree uses r276following solder paste internally. Indium Corporation of America® Part number 82676 •CreeSn62/Pb36/Ag2 composition recommends the following solder paste compositions: SnAgCu (tin/silver/copper) and SnAg (tin/silver). • Flux: NC-SMQ92J Solder Paste Thickness Cree recommends the following solder paste compositions: SnPbAg, SnAgCu and SnAg. The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results Solder Paste Thickness using solder thickness that results in a 3-mil (75-μm) bond line, i.e., the solder joint thickness after reflow soldering. The choice of solder and the application method will dictate the specific amount of solder. For the most consistent results, an automated dispensing system or a solder stencil printer is recommended. Cree has seen positive results using solder thickness that results in a 3-mil (75-μm) bond line. P P CORRECT CORRECT X X WRONG WRONG 1kester.com/Portals/0/documents/Electronic-Assembly-Materials.pdf ® ® 2008-2013 Cree, Inc. All reserved. rightspurposes reserved. Theand information in this document is to subject to without change notice. without notice. Cree ,see thethe Cree logo and aretrademarks registered Cree, Inc. This document is provided forAll informational only is in not a warranty orisasubject specification. For product specifications, please Copyright © 2010 Cree, Inc. rights The information this document change Cree, the Cree logo and XLamp areXLamp registered trademarks Cree, Inc. This document For is provided informational purposes only and is not warranty or a specification. For product specifications, please see theSilicon data sheets 4600 Drive data sheets available at www.cree.com. warrantyfor information, please contact Cree Sales [email protected]. of Cree, Inc.of available at Durham, NC 27703 Copyright ©www.cree.com. 2008-2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo USA Tel: +1.919.313.5300 and XLamp are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners 5 www.cree.com/xlamp and do not imply specific product and/or vendor endorsement, sponsorship or association. 4 CLD-AP25 Rev 3 xlamp xp led soldering & handling Notes on Soldering XLamp XP Family LEDs (continued) After Soldering After soldering, allow XLamp XP Family LEDs to return to room temperature before subsequent handling. Premature handling of the device, especially around the lens, could result in damage to the LED. Cree recommends verifying the solder process by checking the consistency of the solder bond of several trial PCBs after reflow. After shearing selected devices from the circuit board the solder should appear completely re-flowed (no solder grains evident). The solder areas should show minimum evidence of voids on the backside of the package and the PCB. Cleaning PCBs After Soldering Cree recommends using “no clean” solder paste so that flux cleaning is not necessary after reflow soldering. If PCB cleaning is necessary, Cree recommends the use of isopropyl alcohol (IPA). Do not use ultrasonic cleaning. Moisture Sensitivity In testing, Cree has found XLamp XP Family LEDs to have unlimited floor life in conditions ≤30 ºC / 85% relative humidity (RH). Moisture testing included a 168 -hour soak at 85 ºC / 85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LEDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LEDS to the resealable moisture-barrier bag and closing the bag immediately after use. Low Temperature Operation The minimum operating temperature of these XLamp components is -40 °C. To maximize lifetime, Cree recommends avoiding applications where the lamps are cycled on and off more than 10,000 cycles at temperatures below 0 °C. ® ® 2008-2013 Cree, All reserved. rights reserved. The information in this document is to subject to without change notice. withoutCree, notice. , logo the Cree logo and aretrademarks registered Copyright © 2010 Cree, Inc. AllInc. rights The information in this document is subject change theCree Cree and XLamp areXLamp registered trademarks of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 6 xlamp xp led soldering & handling XLamp XP Family LED Reflow Soldering Characteristics In testing, Cree has found XLamp XP Family LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Lead-Based Solder Lead-Free Solder 3°C/second max. 3°C/second max. Preheat: Temperature Min (Tsmin) 100 °C 150 °C Preheat: Temperature Max (Tsmax) 150 °C 200 °C 60-120 seconds 60-180 seconds 183 °C 217 °C 60-150 seconds 60-150 seconds 215 °C 260 °C 10-30 seconds 20-40 seconds 6 °C/second max. 6 °C/second max 6 minutes max. 8 minutes max. Preheat: Time (tsmin to tsmax) Time Maintained Above: Temperature (TL) Time Maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5°C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25 °C to Peak Temperature Note: All temperatures refer to topside of the package, measured on the package body surface. ® ® 2008-2013 Cree, All reserved. rights reserved. The information in this document is to subject to without change notice. withoutCree, notice. , logo the Cree logo and aretrademarks registered Copyright © 2010 Cree, Inc. AllInc. rights The information in this document is subject change theCree Cree and XLamp areXLamp registered trademarks of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 7 xlamp xp led soldering & handling Chemicals & Conformal Coatings Below are representative lists of chemicals and materials to be used or avoided in LED manufacturing activities. For a complete and current list of recommended chemicals, conformal coatings and harmful chemicals consult Cree’s Chemical Compatibility Application Note.2 The video at www.youtube.com/watch?v=t24bf9D_1SA illustrates the process Cree has developed for testing the compatibility of chemicals and materials with LEDs. You should also consult your regional Cree Field Applications Engineer. Recommended Chemicals In testing, Cree has found the following chemicals to be safe to use with XLamp XP family LEDS. • Water • Isopropyl alcohol (IPA) Chemicals Tested as Harmful In general, subject to the specifics in Cree’s Chemical Compatibility Application Note, Cree has found certain chemicals to be harmful to XLamp XP family LEDs. Cree recommends not using these chemicals anywhere in an LED system containing XLamp XP family LEDs. The fumes from even small amounts of the chemicals may damage the LEDs. • Chemicals that might outgas aromatic hydrocarbons (e.g., toluene, benzene, xylene) • Methyl acetate or ethyl acetate (i.e., nail polish remover) • Cyanoacrylates (i.e., “Superglue”) • Glycol ethers (including Radio Shack® Precision Electronics Cleaner - dipropylene glycol monomethyl ether) • Formaldehyde or butadiene (including Ashland PLIOBOND® adhesive) 2 Chemical Compatibility Application Note, AP63, www.cree.com/xlamp_app_notes/chemical_compatibility ® ® 2008-2013 Cree, All reserved. rights reserved. The information in this document is to subject to without change notice. withoutCree, notice. , logo the Cree logo and aretrademarks registered Copyright © 2010 Cree, Inc. AllInc. rights The information in this document is subject change theCree Cree and XLamp areXLamp registered trademarks of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 8 xlamp xp led soldering & handling Assembly Storage & Handling Do not stack PCBs or assemblies containing XLamp XP Family LEDs so that anything rests on the LED lens. Force applied to the LED lens may result in the lens being knocked off. PCBs or assemblies containing XLamp XP Family LEDs should be stacked in a way to allow at least 2-cm clearance above the LED lens. Do not use bubble wrap directly on top of XLamp XP Family LEDs. Force from the bubble wrap can potentially damage the LED. P CORRECT P CORRECT X WRONG ® ® 2008-2013 Cree, All reserved. rights reserved. The information in this document is to subject to without change notice. withoutCree, notice. , logo the Cree logo and aretrademarks registered Copyright © 2010 Cree, Inc. AllInc. rights The information in this document is subject change theCree Cree and XLamp areXLamp registered trademarks of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 9 Anode Side (denoted by + and circle) User Feed Direction END START xlamp xp led soldering & handling Tape and Reel Loaded Pockets Leader Trailer (1,000 Lamps) 400mm 160mm (min) of All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. (min) of empty pockets with empty pockets at least 100mm with tape All dimensionssealed in mm. sealed by tape (20 pockets min.) (50 empty pockets min.) XP-C, XP-E, XP-G User Feed Direction Cover Tape Pocket Tape 6 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE, INC. 5 4 3 2 ÓÉ Foxit PDF Editor ±à¼°æȨËùÓÐ (c) by Foxit Software Company, 2004 ½öÓÃÓÚÆÀ¹À¡£ 1 13mm 7" D D XP-E2, XP-G2 6 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT 190 OF CREE, INC. 5 4 3 2 ÓÉ Foxit PDF Editor ±à¼°æȨËùÓÐ (c) by Foxit Software Company, 2004 ½öÓÃÓÚÆÀ¹À¡£ 1 16.40 D C D C 16.40 190 61 +/-0.5 OD 7.5 C +2.00 12.40 0 MEASURED AT HUB '' C B B 13 61 +/-0.5 OD 12.40 7.5 '' MEASURED AT INSIDE EDGE +2.00 12.40 0 MEASURED AT HUB B B A UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. TOLERANCE UNLESS SPECIFIED: .X ± 0.3 .XX ± .13 13 THIRD ANGLE PROJECTION 12.40 MEASURED AT INSIDE EDGE X° ± 1° FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 X° DRAWN BY DATE 2012/5/25 LIUDEZHI CHECK DATE APPROVED DATE 4600 Silicon Drive Durham, N.C 27703 Phone (919) 361-4770 A TITLE Reel, MATERIAL PS SIZE FINAL PROTECTIVE FINISH ± 2° SCALE C 7" x 12mm Wide DRAWING NO. 2400-00005 REV. B SHEET 1 OF 1 1:2 6 4 3 to without 2Cree 1 registered 2008-2013 Cree, All reserved. rights 5reserved. The information in this document is to subject change notice. withoutCree, notice. the Cree logo and aretrademarks registered Copyright © 2010 Cree, Inc. AllInc. rights The information in this document is subject change the Cree, logo and XLamp areXLamp trademarks of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. A UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. TOLERANCE UNLESS SPECIFIED: .X ± 0.3 .XX ± .13 ® DRAWN BY LIUDEZHI ® DATE 2012/5/25 CHECK DATE APPROVED DATE 4600 Silicon Drive Durham, N.C 27703 10 Phone (919) 361-4770 TITLE A 6 6 5 5 NOTICE 6NOTICE ONFIDENTIAL. CREE THISCONFIDENTIAL. PLOT AND THE THIS INFORMATION PLOT AND THE INFORMATION NED WITHIN CONTAINED ARE THE PROPRIETARY WITHIN AREAND THE PROPRIETARY AND NOTICE ENTIAL INFORMATION CONFIDENTIAL OF CREE, INFORMATION INC.PLOT THIS AND PLOT OF CREE, INC. THIS PLOT CREE CONFIDENTIAL. THIS THE INFORMATION T BE COPIED, MAY REPRODUCED NOT BE COPIED, OR DISCLOSED REPRODUCED TO ANY OR DISCLOSED TO ANY CONTAINED WITHIN ARE THE PROPRIETARY AND ORIZEDCONFIDENTIAL PERSON UNAUTHORIZED WITHOUT THE PERSON WRITTEN WITHOUT CONSENT INFORMATION OF CONSENT CREE,THE INC.WRITTEN THIS PLOT E INC. MAYOF CREE INC. NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY 4 4 5 3 3 4 2 2 1 REVISONS 3 REV A A REV 1 REVISONS 2 REV 1 BY DESCRIPTIONREVISONS DESCRIPTION Released J.L. Released DESCRIPTION DATE APP'D 6/30/09 BY DATE J.L. BY 6/30/09 DATE DDS DDS C Match Match supplier J.L. AC supplier drawing Released drawing xlamp xp led soldering & handling Zone A6, 2.15 tolerance A6, 2.15 was was ± 2.1, tolerance .10 . was ±12/2/10 .10 Y.Gan . D Dwas 2.1, Zone 10/21/10 Y.Gan 10/21/10 6/30/09 DDS UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. F D G Tape and Reel - Continued APP'D Y.Gan 12/2/10 10/21/10 Y.Gan Y.Gan C Added pocketZone Match supplier DDS DDS Zone C2, dimensions. C2, Added pocketdrawing dimensions. Zone A6, 2.15 was 2.1, tolerance was ± .10 . 12/2/10 Y.Gan D Zone E A6, 2.10 was Zone 2.15 A6, 2.10 was 2.15 1/3/11 J.M. DDS 1/3/11 J.M. Zone C2, Added pocket dimensions. E D APP'D DDS DDS E Zone A6, 2.10 was 2.158/26/11 DDS J.M. ZoneFB5, Added tolerance Zone B5, Added tolerance DDS DDS D to 4.39 and 3.75. to 4.39 and 3.75. F Zone B5, Added tolerance2/27/12 DDS DC DC ADDED CATHODE G ADDED AND ANODE CATHODE NOTE AND ANODE NOTE to 4.39 and 3.75. DC G ADDED CATHODE AND ANODE NOTE 1/3/11 8/26/11 J.M. J.M. 8/26/11 2/27/12 J.M. 2/27/12 All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. XP-C, XP-E, XP-G 1.50 +.10/-.00 C 1.50 +.10/-00 1.50 +.10/-.00 1.50 +.10/-00 1.50 +.10/-.00 C B B C 1.50 +.10/-00 4.00 ±.10 4.00 ±.10 2.00 ±.10 2.00 ±.10 4.00 ±.10 1.75 ±.10 4.39 +.10/.00 4.39 +.10/.00 3.75 +.10/-.00 3.75 +.10/-.00 B1.75 ±.10 B CATHODE SIDE CATHODE SIDE 2.00 ±.10 B 4.39 +.10/.00 1.75 ±.10 3.75 +.10/-.00 B CATHODE SIDE 12.00 Nominal 12.30 Max 12.00 Nominal 12.30 Max 12.00 Nominal 10.25 ±.10 12.30 Max 10.25 ±.10 10.25 ±.10 B T 0.30 ±0.05 1.50 +.10/-.00Do 1.50 +.10/-.00 B P2 2.0 ±0.05 (I) 8.00 ±.10 1.5 8.005 ±.10 ±4.39 0.0 +.10/-.00 5 3.75 +.10/-.00 1.50 +.10/-.00 5.50 ±.10 Po ANODE SIDE 5.50 ±.10 4.0 ±0.1 (II) .30 ± .10 .30 ± .10 T 0.30 ±0.05 .30 ± 1.10 .55 ±0. 0 Do 5.50 ±.10 4.39 Y +.10/-.00 B P2 2.0 ±0.05 (I E1 1.75 ±0.1 ANODE SIDE ANODE SIDE 8.00 ±.10 Y 5 3.75 +.10/-.00 4.39 +.10/-.00 3.75 +.10/-.00 8.7° 2.10 +.10/-.00 A REF 8.7° SECTION B-B 8.7° 2.10 +.10/-.00 REF 4.375 SECTION B-B Bo DRAWN BY X R0.2 REF 0.2mm Do 1.5 5 4 P2 2.0 ±0.05 (I) ±0. 0 P1 Po 4.0 ±0.1 (II) CATHODE SIDE Y 5 SECTION X-X REF 4.375 X ANODE SIDE P1 (II) (III) Ao REF 0.59 4 P1 W +/- 0.1 +0.0/-0.1 +/- 0.05 2.2 3.70 D1 2.40 1.5 MIN. 5.50 8.00 12.00 Y R Bo Ko F (I) +/- 0.1 REF SECTION Y-Y 3.70 A Fax (919) 313-5558 Y4600 Silicon Drive Durham, N.C 27703 DRAWING NO. SHEET OF DRAWING NO. 1 REV. 1 /1 SHEET (IV) SHEET 4.000 Ao 3.70 +/- 0.1 Bo Ko F 3.70 2.40 5.50 8.00 12.00 +/- 0.1 +0.0/-0.1 +/- 0.05 +/- 0.1 +0.3/-0.1 Measured from centerline of sprocket hole to centerline of pocket. Cumulative tolerance of 10 sprocket holes is ± 0.20. Measured from centerline of sprocket hole to centerline of pocket. Other material available. SECTION X-X Measured from centerline of sprocket hole to centerline of pocket. G ® ® Ao 2010 3.70 +/0.1 All reserved. 2008-2013 Cree, rights reserved. The information in this document is to subject to without change without notice. , logo the Cree logo and aretrademarks registered Copyright © Cree, Inc. AllInc. rights The information in this document is subject change notice. Cree, theCree Cree and XLamp areXLamp registered (II) Cumulative tolerance of 10 sprocket trademarks This document is provided for informational purposes only and is not a warranty or For product specifications, please see the data sheets holesa is ±specification. 0.20. Boof Cree, Inc. 3.70 +/- 0.1 of Cree, Inc. (III) Measured from centerline of sprocket available atKowww.cree.com. 2.40 +0.0/-0.1 hole to centerline of pocket. F 5.50 +/- 0.05 11 (IV) Other material available. 8.00 P1 +/- 0.1 W 12.00 +0.3/-0.1 1 /1 REV. 2402-00003 +/- 0.1 +0.3/-0.1 (I) REV. OF 1 1 P1 W W Ao Phone (919) 313-5300 Fax (919) 313-5558 2 F(III) Bo X R0.2 TYPICAL Ko SCALE REF 0.59 4600 Silicon Drive Durham, N.C 27703 Phone (919) 313-5300 1.5 MIN. 2402-00003 2402-00003 C Carrier Tape, G XPE C Ao SURFACE FINISH: 1.6 3 4 T 0.30 ±0.05 4 2.2 Ko White, 5 5 XP-E High Efficiency XP-E2, XP-G2 4Y D1 6 5 1.5 MIN. SECTION Y-Y 6 4600 Silicon Drive Durham, N.C 27703 Phone (919) 313-5300 D1 XPE Carrier Tape, XPE Carrier Tape, Fax (919) 313-5558 C R 6 SECTION Y-Y 0.2mm Notes: TYPICAL 1. 10 sprocket hole pitch cumulative tolerance ± R0.2 TYPICAL Ko E1 1.75 ±0.1 Notes: Notes: 1. 10 sprocket hole1.pitch 10 sprocket cumulative holetolerance pitch cumulative ± tolerance ± 0.2mm F(III) Bo DATE DRAWN BY UNLESS OTHERWISE SPECIFIED UNLESS OTHERWISE SPECIFIED D. Seibel D. Seibel 6/30/09 DIMENSIONS ARE IN DIMENSIONS ARE IN 6/30/09 CHECK DATE CHECK DATE MILLIMETERS AND AFTER FINISH. MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: TOLERANCE UNLESS SPECIFIED: DRAWN BY DATE SPECIFIED .XX ± .25 UNLESS OTHERWISE .XX ± .25 APPROVED APPROVED DATE DATE D.TITLE Seibel 6/30/09 DIMENSIONS IN TITLE .XXX ± .125 .XXX ±ARE .125 CHECK DATE X° ± .5 °MILLIMETERSX°AND±AFTER .5 FINISH. ° THIRD ANGLE PROJECTION THIRD ANGLE PROJECTION MATERIAL TOLERANCE UNLESS SPECIFIED: FOR SHEET METAL PARTS ONLY FOR SHEET METAL PARTS ONLY MATERIAL .XX .25 APPROVED DATE .X ± 1.5 .X ±± 1.5 TITLE DRAWING NO.SIZE .XXX .125 SIZE .XX ± .75 .XX ±± .75 X° ± ± FINISH .5.25 ° .XXX ± .25 .XXX FINAL PROTECTIVE FINAL PROTECTIVE FINISH THIRD ANGLE PROJECTION X° ± .5 ° FOR SHEETX°METAL ± PARTS .5 ° ONLY MATERIAL SCALE SCALE 1.6 1.6 .X FINISH: ± 1.5 SURFACE FINISH: SURFACE 4.000 4.000 SIZE .XX ± .75 3 3 .XXX ± 2.25 FINAL PROTECTIVE 2 FINISH X° ± .5 ° X A DATE 4.375 R 2.10 +.10/-.00 SECTION B-B G OF 1 /1 xlamp xp led soldering & handling Packaging & Labels The diagrams below show the packaging and labels Cree uses to ship XLamp XP Family LEDs. XLamp XP Family LEDs are shipped in tape loaded on a reel. Each box contains only one reel in a moisture barrier bag. Unpackaged Reel Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label CREE Binwith Code Cree Bin & Barcode LabelLot # Code, Qty, Label with Cree Bin Code, Qty, Reel ID Label with Cree Bin Label with Customer P/N, Qty,Qty, Lot #, Lot PO # # Code, Packaged Reel Patent Label Label with Customer Order Label with Cree Order Code, Code, Qty, Reel ID, PO # Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Boxed Reel Label with Cree Order Code, Qty, Reel ID, PO # Label with Cree Bin Code, Qty, Reel ID Patent Label (on bottom of box) ® ® 2008-2013 Cree, All reserved. rights reserved. The information in this document is to subject to without change notice. withoutCree, notice. , logo the Cree logo and aretrademarks registered Copyright © 2010 Cree, Inc. AllInc. rights The information in this document is subject change theCree Cree and XLamp areXLamp registered trademarks of Cree, Inc.of Cree, Inc. This document is provided for informational purposes only and is not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. 12
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