Global System-On-
Package Market
Share, Global Trends,
Analysis, Research, Report,
Opportunities,
Segmentation and Forecast,
2016
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Report
Description
Report Description
System-on-package is the latest technology in packaging of microelectronic components
in a single chip. The integration of these microelectronic components into one chip
enhances the performance as well as reduces the cost. With the increasing demand for
technologically advanced mobile devices among the consumers that are capable of
performing an array of functions in a single small product is boosting the system-onpackage technology compared to the conventional mode of packaging for
semiconductors, thus boosting the market for system-on-package market. Moreover, the
system-on-package enables efficient integration of RF (Radio Frequency) front-end
functional building blocks. The development of thin RF materials makes it easy to
integrate into the system-on-package thus fulfilling the need of efficient wireless
communication systems. With the aforementioned advantages, the global market for
system-on-package is expected to register a healthy CAGR by the end of forecast period.
Global System-On-Package Market: Drivers & Restraints
The global system-on-package market is primarily driven by the rising demand among the
semiconductor packaging industry for compact electronic devices with high performance
and cost effective packaging. The conventional packaging cost of ICs like, die level
packaging with the variation of sizes of the ICs the cost of packaging cost becomes more
compared to production cost of the ICs. Whereas, the system-on-package, is cost efficient
compared to the production cost of the ICs.
Report
Description
Report Description
The technological advancements in RF materials, IC design & production is also to an
extent propelling the growth of global system-on-package market. Some of the new
trends in the system-on-package market such as the 3D packaging, which provides
improved electrical performance and packaging density, is also expected to boost the
market for global system-on-packages market. The fluctuations in some of the physical
properties like the coefficient of thermal expansion of the materials of used for packaging
with respect to the material of ICs, which is considered as a drawback of system-onpackage technology which might restraint the market for system-on-package.
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Global System-On-Package Market: Market Segmentation
Based on packaging type, the global system-on-package market can be segmented into:
BGA (Ball Grid Array) type package
QFN (Quad Flat No-leads) type package
Wafer Level Package
Report
Description
Report Description
Based on the applications, the global system-on-package market can be segmented into:
Consumer Electronics
Automotive
Aerospace
Healthcare
Others (Defense)
Global System-On-Package Market: Regional Outlook
Based on the geographic regions, global automotive seating systems marketing market is
segmented into seven key market segments namely North America, Latin America,
Western Europe, Eastern Europe, Asia Pacific, Japan, and Middle East & Africa. Among
the aforementioned regions, the Asia-pacific market for system-on-package market is
projected to grow with a promising growth rate, which is due to the increase in demand
for consumer electronics in the region. Moreover, the presence of leading semiconductor
manufacturers like Taiwan Semiconductor Manufacturing among others will have positive
effect on the system-on-package market in APEJ. The North America and Western Europe
market for system-on-package is followed by the Asia-Pacific market and is expected to
show stagnant growth over the forecast period.
Report
Description
Report Description
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Some of the major players identified in the global system-on-package market includes,
ChipMOS TECHNOLOGIES INC., STATS ChipPAC Ltd., IQE PLC, Amkor Technology Inc.,
TriQuint Semiconductor Inc., Deca Technologies, KLA-Tencor Corporation, Siliconware
Precision Industries Co. Ltd., China Wafer Level CSP Co. Ltd., Jiangsu Changjiang
Electronics Technology Co. Ltd among others.
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