1. technology and computing

2014 Intel® Server Systems & Boards
Best Fit Server Use Case Recommendations
Delivering World-Class Intel® Server Products and Appliance-Ready Systems
for the next generation Intel® Xeon® processor E5-2600 v3 family
Easy. Always.
November 2014
Legal Disclaimer
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL
PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING
TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE
INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE
DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF,
DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR
NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions
marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to
them. The information here is subject to change without notice. Do not finalize a design with this information.
Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel's current plan of record product
roadmaps.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are
measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other
information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the
referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of
systems available for purchase.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families: Go to: Learn
About Intel® Processor Numbers
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, and virtual machine monitor (VMM). Functionality, performance or other benefits will
vary depending on hardware and software configurations. Software applications may not be compatible with all operating systems. Consult your PC manufacturer. For more information,
visit http://www.intel.com/go/virtualization
64-bit computing on Intel architecture Requires a system with a 64-bit enabled processor, chipset, BIOS and software. Performance will vary depending on the specific hardware and
software you use. Consult your PC manufacturer for more information. For more information, visit http://www.intel.com/info/em64t
All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel, the Intel logo, Intel Inside.,
Look Inside., the Look Inside. logo, Intel Xeon Phi, Xeon and Xeon Inside are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other
countries.
Copyright © 2014, Intel Corporation. All rights reserved. All products, computer systems, dates, and figures specified are preliminary based on current expectations,
and are subject to change without notice. *Other names and brands may be claimed as the property of others. Product availability may vary by country/geography.
Product Collaboration and Systems Division (PCSD)
Intel Confidential
331126-002US MMOD/MS/MM
2
Intel Server Use-Case Product Recommendations
3
Product Family
Best Fit For
S2600WT
(Wildcat Pass)
Enterprise and Medium Business IT,
Big Data, Storage, Cloud
S2600KP
(Kennedy Pass)
HPC, Big Data
S2600TP
(Taylor Pass)
HPC, Big Data, Storage, Cloud
S2600CW
(Cottonwood Pass)
Purpose-Built Appliance (Embedded),
SMB, Storage, Cloud
S1200V3RP
(Rainbow Pass)
SMB, Entry Level Server,
Media processing
Copyright © 2014, Intel Corporation. All rights reserved. All products, computer systems, dates, and figures specified are preliminary based on current expectations,
and are subject to change without notice. *Other names and brands may be claimed as the property of others. Product availability may vary by country/geography.
Product Collaboration and Systems Division (PCSD)
Intel Confidential
331126-002US MMOD/MS/MM
S2600WT (Wildcat Pass) System
Feature Rich and Product Flexibility
Key Benefit
Big
Data
Enterprise
& Medium
Business IT
Storage
and
Cloud
Embedded
(Appliance)
Maximum Compute Capacity in a 1U and 2U
rack with performance head-room for highly
demanding distributed processing and
intensive application workloads
√
√
√
√
High energy, thermal, power efficiency
√
√
√
√
24 DIMMs with up to maximum 64GB total
memory capacity, 1.5TB total memory;
NVDIMM support
Maximum memory capacity
√
√
√
√
Maximum IO Capacity – All 80 PCIe gen3
lanes available
Rich and flexible IO
with maximum IO capacity
√
√
√
√
Flexibility for customer custom configurations.
Lower cost of acquisition with pay-as-youneed more storage to grow number of users.
√
√
√
√
Highly serviceable system
Lower cost of operation
Increased uptime
√
√
√
√
√
√
Product Feature
2x Intel® Xeon® E5-2600 v3 processor
family, 145W max TDP
Spread-core design
Storage options: 2.5” and 3.5”
Types: SSD, 6G SATA, 12Gb SAS, NVM
Express
Amount of Storage: up to 26 drives
Operational Features:
•Reduced cabling
•Easy access to modules
•Simple system configuration and
management tools
Power Supply Options
•Platinum 80+ certified , 750W, 1100W AC
•Gold 80+ DC Power options available
(750W, -48V)
4
High efficiency, multiple power options
available for both AC and DC environments
Copyright © 2014, Intel Corporation. All rights reserved. All products, computer systems, dates, and figures specified are preliminary based on current expectations,
and are subject to change without notice. *Other names and brands may be claimed as the property of others. Product availability may vary by country/geography.
Product Collaboration and Systems Division (PCSD)
Intel Confidential
331126-002US MMOD/MS/MM
S2600KP (Kennedy Pass) Board or System**
High Performance and Density
Key Benefit
Big Data
High Performance
Computing (HPC)
2x Intel® Xeon® E5-2600 v3 processor
family, 145W max TDP, 160W for board
only
Maximum compute density with up to 4 boards
in a 2U rack mount form-factor for highly
demanding distributed processing and
intensive application workloads
√
√
Highest TDP processor support when
used with 3rd party solution with custom
cooling solution
Enables highest compute performance
√
√
Optimized for memory performance
Good memory capacity
√
√
Density and smallest form-factor board
√
√
√
√
Product Feature
8 DIMMS per board (1DPC)
6.4”x17.7” custom form-factor
Up to 4 nodes per 2U
3 risers, 64 IO lanes available on the
board, Connect IB FDR Infiniband*
onboard option.
High IO capacity in a dense form-factor board
All nodes, power supply, storage, or trays
are hot swappable
Very serviceable system for increased uptime
√
√
Easier upgrade for customers who have
designed their own custom chassis
√
√
Mechanically compatible board to
S2600JF (Jefferson Pass)
** No system BIKs offered. Only compute node and chassis KDKs are offered
5
Copyright © 2014, Intel Corporation. All rights reserved. All products, computer systems, dates, and figures specified are preliminary based on current expectations,
and are subject to change without notice. *Other names and brands may be claimed as the property of others. Product availability may vary by country/geography.
Product Collaboration and Systems Division (PCSD)
Intel Confidential
331126-002US MMOD/MS/MM
S2600TP (Taylor Pass) Board or System**
High Density System with Rich Memory & I/O
Key Benefit
High Performance
Computing (HPC)
Big
Data
Storage
and Cloud
2x Intel® Xeon® E5-2600 v3 processor
family, 145W max TDP, 160 W for board
only
Maximum compute density with up to 4 boards
in a 2U rack mount form-factor for highly
demanding distributed processing and
intensive application workloads and high
performance per dollar solution.
√
√
√
Highest TDP processor support when
used with 3rd party solution with custom
cooling solution
Enables highest compute performance
Platinum 80+ certified power supply
√
√
√
Product Feature
16 DIMMS per board
Optimized for highest memory capacity in a
dense half-width form-factor to support
demanding work-loads.
√
√
√
4 risers, 80 IO lanes available on the
board, Connect IB FDR Infiniband*
onboard option.
Maximum IO capacity in a dense form-factor
Flexible and multiple IO options for cost
effectiveness (4 nodes in a 2U)
√
√
√
Small 6.8”x18.9” custom form-factor
Up to 4 nodes per 2U
High density system
√
√
√
√
√
√
√
√
√
All nodes, power supply, storage, or trays
are Hot-swappable
Mechanically compatible board to
S2600WP (Washington Pass)
Very serviceable system for increased uptime
Easier upgrade for customers who have
designed their own custom chassis
** No system BIKs offered. Only compute node and chassis KDKs are offered
6
Copyright © 2014, Intel Corporation. All rights reserved. All products, computer systems, dates, and figures specified are preliminary based on current expectations,
and are subject to change without notice. *Other names and brands may be claimed as the property of others. Product availability may vary by country/geography.
Product Collaboration and Systems Division (PCSD)
Intel Confidential
331126-002US MMOD/MS/MM
S2600CW (Cottonwood Pass) Board
Flexible General Purpose Board
SMB
Storage
and Cloud
√
√
√
Maximum memory capacity in industry
standard 12x13” SSI EEB form factor
√
√
√
84 PCIe gen3 lanes available
• 6 slots plus 8 PCIe lanes for 10G base-T
onboard option
• Battery-less HW SAS down option
Maximum IO capacity
Very low cost of acquisition because customer
purchases the building blocks when needed.
Flexible IO configurations including storage
oriented chassis from world leading
manufacturers
√
√
√
Board is validated / compatible with a
variety of SSI compliant 3rd party chassis
offering multiple form-factor, IO and
storage options.
Maximum product feature flexibility
Standard board form-factor for a 1U/2U rack
or pedestal chassis or can be placed in custom
chassis for embedded
√
√
√
Board is validated for Intel® P4000
Pedestal Chassis with fixed or redundant
power supplies and fans.
High quality and validation
Product Feature
2x Intel® Xeon® E5-2600 v3 processor
family, 145W max TDP
16 DIMM slots that support up to 64 GB
per DIMM, 1.0 TB total system memory
7
Purpose-built
Appliance
(Embedded)
Key Benefit
Maximum compute capacity
√
Copyright © 2014, Intel Corporation. All rights reserved. All products, computer systems, dates, and figures specified are preliminary based on current expectations,
and are subject to change without notice. *Other names and brands may be claimed as the property of others. Product availability may vary by country/geography.
Product Collaboration and Systems Division (PCSD)
Intel Confidential
331126-002US MMOD/MS/MM