Application Note Samsung Electronics LM362A (3623) rev0.0 Index Page 1. Introduction 1.1 Product Description 1.1.1 High Power LED (HPL) vs Middle Power LED (MPL) 5 1.1.2 Economically powerful solution – LM362A 7 1.2 Product Information 1.2.1 Feature and Dimension 8 1.2.2 Product code and binning 9 1.2.3 Spectrum Distribution 11 1.2.4 Polar Intensity Diagram 11 1.3 Applicable Lighting Fixture 1.3.1 Luminous output vs the number of packages 12 1.3.2 Package array guide for Bulb and Down Light 14 2. Package Characteristics 15 2.1 Electrical Characteristics 2.2 Optical Characteristics 2.2.1 Characteristic examples for single package driving 16 2.2.2 5000K measurement data mounted on Metal PCB 21 2.2.3 3000K measurement data mounted on Metal PCB 23 2.2.4 5000K measurement data mounted on FR PCB 24 2.2.5 3000K measurement data mounted on FR PCB 25 2 Page 3. Package array performance 3.1 Module performance 26 3.1.1 Module Devise under Test (DUT) 26 3.1.2 Electrical power consumption 27 3.2 5000K 68Ra performance graph 3.2.1 50mA driving current 28 3.2.2 100mA driving current 28 3.2.3 150mA driving current 29 3.2.4 200mA driving current 29 3.3 5000K 80Ra performance graph 3.3.1 50mA driving current 30 3.3.2 100mA driving current 30 3.3.3 150mA driving current 31 3.3.4 200mA driving current 31 3.4 3000K 80Ra performance graph 3.4.1 50mA driving current 32 3.4.2 100mA driving current 32 3.4.3 150mA driving current 33 3.4.4 200mA driving current 33 3 Page 4. Application 4.1 PKG Array Guide 34 4.2 Application - Example 36 4.3 Lens Solution 39 5. Caution 5.1 Mechanical Considerations 5.1.1 Handling Guide 41 5.1.2 Recommended Land Pattern 42 5.1.3 SMT Set 43 5.1.4 Reflow Profile 44 6. Appendix 6.1 Risk of Sulfurization (or Tarnishing) 45 6.2 Discoloration of LED 52 64 7. Revision History 4 1.1 Product Description 1.1.1 High Power LED (HPL) vs Middle Power LED (MPL) There are many kinds of LED packages and module products in the LED industry. In the lighting industry, there are mainly two different package types, one is middle power LED package (MPL) and the other is high power LED package (HPL). Usually MPL is composed of conventional LED chip and lead-frame package. HPL is composed of vertical LED chip and heat-slug package or ceramic package. Ceramic substrate package, small and compact size, is much more popular rather than heat slug package. Normally MPL power dissipation is about 0.2W~0.3W and HPL is 1~2W. Size of these two kinds of packages are similar, but properties of optic and thermal are very different. Phosphor Lens Mold Phosphor Lead-Frame Ceramic [ MPL package structure ] [ HPL package structure ] Light emitting Light emitting Heat dissipation Heat dissipation [ MPL light and heat visual ratio] [ HPL light and heat visual ratio] 5 Due to good spreading effects of thermal and optic properties, MPL is a powerful solution for the following applications: flat light engines, LED Linear Tubes, bulbs and others. The thermal dissipation and optical properties of the MPL allow customers to use it with FR-PCB as a cost effective solution; instead of MetalPCB. Light emitting [ Module for multi-MPL concept] Heat dissipation If users want to get high luminous flux from a compact board area, then HPL is a very powerful solution. HPL is suitable for 2nd lens applications to optimize the optical flux in a wider beam angle, especially for outdoor products; or for focusing the optical flux in applications such as : flash lights/torches, MR, and PAR applications. Therefore high reliability and thermal management of HPL is the main design issue. Light emitting Heat dissipation [ Module for multi-HPL concept] 2nd Lens [ HPL 2nd lens effect for outdoor and MR, PAR ] 6 1.1 Product Description 1.1.2 Economically powerful solution – LM362A Especially in case of bulb and down light application, there’s so many light sources that could be possible. HPL and MPL have each advantage and disadvantage aspects of thermal, optical and cost. HPL has high reliability properties, but it is a little bit more expensive solution. On the contrary to HPL, MPL is inexpensive solution, but it has low reliability properties especially on compact board area. LM362A has both strong points, reliability from HPL and inexpensive platform from MPL. LM362A is designed for indoor and outdoor lightings such as bulb, ceiling lighting, down light etc. And it can provide stable performance and long lifetime. Above all, LM362A is economically compatible solution. MPL Low Power Power Up Low Cost required [Feature] LM362A Economically powerful solution 7 HPL High Power Cost Down High Cost required [Feature] 1.2 Product Information 1.2.1 Feature and Dimension With very small package dimension size, designer can get superior performance from LM362A. - Lead Frame Type LED Package : 3.6 x 2.3 x 0.6t mm - Superior Performance : 133lm/W, 80lm, 0.6W @100mA, 5000K Anode (+) LED Zener Diode Cathode (-) LM362A is very attractive solution for the compatible TCO (total cost of ownership). - 2 Die per PKG : higher lumen output with small total footprint - GaN / Al2O3 Chip & SMD type package with long time reliability - Eco-friendly : RoHS compliant Top View Side View [ LM362A Package Dimension ] 8 Bottom View 1.2 Product Information 1.2.2 Product code and binning LM362A has full color line-up. Product Code CCT [K] CRI (Min.) SPMWHT325AD5YBW0S0 2700 80 SPMWHT325AD5YBV0S0 3000 80 SPMWHT325AD5YBU0S0 3500 80 SPMWHT325AD5YBT0S0 4000 80 SPMWHT325AD5YBR0S0 5000 80 SPMWHT325AD3YBR0S0 5000 68 SPMWHT325AD5YBQ0S0 5700 80 SPMWHT325AD5YBP0S0 6500 80 LM362A has 3 kinds of parameter binning, - Voltage, Flux, Color 110 Luminous Flux Rank - S1. S2,S3 @If=100mA, Ts=25℃ 100 90 S3 S2 S1 80 70 60 9 (80Ra) P0-6500K (80Ra) Q0-5700K (68Ra) R0-5000 (80Ra) R0-5000K (80Ra) T0-4000K (80Ra) U0-3500K (80Ra) V0-3000K (80Ra) 50 W0-2700K Luminous Flux [lm] - Luminous flux (Iv (Φv)) is divided by 3 rank – S1, S2, S3 - Forward voltage(VF) is divided to 5 rank - A1,A2,A3,A4,A5 A1 5.4 5.6 A2 5.8 A3 A4 6 6.2 A5 6.4 6.6 6.8 Forward Voltage [V] - Color CIE binning is according to ANSI bin and suitable for lighting application. - As for 5000K, 5700K, 6500K, 8 sub bins are operated. As for 2700K, 3000K, 3500K, 4000K, 16 sub bins are operated. 0.45 2700K 0.43 3000K 3500K 0.41 4000K Cy 0.39 5000K W V 5700K 0.37 Black Body Locus U ANSI C78.377A T 6500K 0.35 0.33 R Q 0.31 P 0.29 0.29 0.33 10 0.37 0.41 Cx 0.45 0.49 1.2 Product Information 1.2.3 Spectrum Distribution Optical spectrum of LM362A are shown at each CCT 3000K and 5000K. Measured data is just for representative reference only. ※ CCT: 3000K (X: 0.4360, Y: 0.3985) ※ CCT: 5000K (X: 0.3463, Y: 0.3584) 1.2.4 Polar Intensity Diagram Viewing angle describes the spatial distribution and the value is 120°(FWHM, Full width at half maximum), FWHM is the difference between the angles corresponding to 50% of the maximum intensity. 11 1.3 Applicable Lighting Fixture 1.3.1 Luminous output vs the number of packages In the non-directional application such as bulb, down light and flood light , user can design compatible and powerful lighting product. In the directional application such as MR, PAR, user can design lighting product economically using LM362A and correlated 2nd lens. For a reference, user can refer to the relations with luminous flux and the number of packages sampling by typical rank (Φ,VF). LM362A 2700K Power Consumption Range per package number LM362A 2700K Luminous Flux Range per package number 80 200mA_w/o_optic_loss 200mA_w_loss 100mA_w/o_optic_loss 100mA_w_loss 6000 5000 Consumption power [W] Luminous Flux [lm] 7000 4000 3000 2000 70 60 50 40 30 20 1000 10 0 0 1 6 11 16 21 26 31 36 41 46 51 power @200mA power @100mA 1 6 11 16 21 26 31 36 41 46 51 Package number Package number 12 For example, in case of CCT 5000K and 68Ra, if the number of 21 packages is used, user can expect that the power consumption will be 12.6W, and luminous flux will be 1680lm (100mA typ.) to 2940lm (200mA max.) without optic overlap loss which is varied with the thermal and optic condition. LM362A 5000K (Ra80) Luminous Flux Range per package number Luminous Flux [lm] 7000 200mA_w/o_optic_loss 200mA_w_loss 100mA_w/o_optic_loss 100mA_w_loss 6000 5000 4000 3000 2000 1000 0 1 6 11 16 21 26 31 36 41 46 51 Package number LM362A 5000K (Ra68) Luminous Flux Range per package number 7000 Luminous Flux [lm] MP36S can be driven at 100mA typically and get 133lm/W for 5000K, 68Ra. To get more efficacy, driving current could be chosen under typical value. If the aspect of cost is prior to the efficiency quality, then user can drive current until 200mA maximum value which should be operated under derating curve printed on datasheet. 200mA_w/o_optic_loss 200mA_w_loss 100mA_w/o_optic_loss 100mA_w_loss 6000 5000 4000 3000 2000 1000 0 1 13 6 11 16 21 26 31 36 41 46 51 Package number 1.3 Applicable Lighting Fixture 1.3.2 Package array guide for Bulb and Down Light Bulb Luminous Flux [lm] Traditional Lamp Grade Set target PKG target CCT (3000K ~ 5000K) CRI 80 Driving Current per PKG 50 mA 100 mA 530~560 16EA 8EA 6EA 5EA 810 950~1000 28EA 15EA 11EA 9EA 75W 1100 1290~1360 38EA 20EA 14EA 11EA 100W 1600 1880~1980 54EA 30EA 21EA 17EA 150W 2000 2340~2470 68EA 36EA 26EA 21EA at Ts 75℃ at Ts 25℃ 40W 450 60W 150 mA 200 mA Number of Packages Down Light CCT (3000K ~ 5000K) CRI 80 Driving Current per PKG Luminous Flux [lm] Set target PKG target at 75℃ at 25℃ 1100 50 mA 100 mA 150 mA 200 mA 1430~1510 42EA 22EA 16EA 13EA 2000 2600~2750 76EA 40EA 29EA 23EA 3000 3900~4120 116EA 60EA 43EA 34EA 4000 5200~5500 150EA 80EA 57EA 45EA Number of Packages ※ These table for lighting design should be considered about real module size and thermal resistance from LED solder point to heat sink ※ Heat sink performance (System thermal resistance) should meet package Ts point on 75℃ These boundary condition is following up on derating curve printed at page.17 ※ Adopted luminous loss rate for Bulb : Thermal 5%, Optic 10% for 3000K Thermal 10%, Optic 10% for 5000K ※ Adopted luminous loss rate for Down Light : Thermal 5%, Optic 10%, Fixture 10% for 3000K Thermal 10%, Optic 10%, Fixture 10% for 5000K 14 2.1 Electrical Characteristics Ts point Copper electrothermal pad Forward Current vs. Forward Volatge 250 Ts 90℃ 75℃ 50℃ 25℃ Forward Current (mA) In order to get stable lighting output, LED should be driven by constant current. And forward voltage of LED is varied with driving current and junction temperature. Therefore if constant current is driven, forward voltage will be dropped as temperature goes up. Ts is a temperature of solder point beside package lead. 200 150 100 50 0 5.00 5.20 5.40 5.60 5.80 6.00 6.20 6.40 Forward Voltage (V) The consumption power of LED is also varied as per temperature. Consumption power is slightly changed lower according to temperature and thermal system at each constant current. MP36S power consumption Power Consumption [W] MP36S VF @McPCB 5000K 7.0 Vf [V] 6.5 6.0 5.5 5.0 25℃ 50℃ 75℃ 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 50mA 100mA 150mA 200mA 25℃ 50℃ 75℃ 90℃ Ts 90℃ Ts 15 2.2 Optical Characteristics 2.2.1 Characteristic examples for single package driving CCT 5000K, CRI 73 CCT 3000K, CRI 84 McPCB (Metal printed circuit board) Thermal resistance : Thermal resistance : Thermal resistance : Thermal resistance : FR-PCB (FR printed circuit board) The specification and typical characteristics of LM362A are presented on datasheet. This application note shows more various properties and dynamic operation trends as changing as several input parameters and PCB material and temperature. Four kinds of DUT have been tested and optical measured data was different as per each thermal resistance and CCT and driving current. Thermal resistance is related with package structure and PCB and bonding materials. To make white color, phosphor is used and this has various temperature properties. As changing driving current, luminous and thermal efficacy also varies. Actually these measured characteristics might be different depending on concrete case by case. Therefore attention is needed. As these test data was measured from the base on some samples not mass samples, it should be used for reference only. 16 LED Chip Chip attach material to substrate Lead-Frame (substrate) Molding Solder to PCB PCB Solder Pads PCB Dielectric layer Phosphor Bonding wire TJ : Junction Temp. TLF : Lead Frame substrate PLED : Thermal Source RJ-LF TS : Solder Temp. RLF-S RJS : Junction-Solder RSB : Solder to Board TB : Board Temp. Aluminium or FR Plate Classical TIM to heat-sink TC : Case Temp. RBC : Board to Case Heat Sink RCA : Case to Air TA : Ambient Temp. Tambient : Thermal Ground Normally lighting fixture using LED as a lighting source has a ordinary structure that consist of PCB for electrical connection and heat sink for heat transfer. Originally LED is semiconductor component which means the performance of LED has very close relations with thermal and driving bias condition. Most of LED packages need to be mounted on PCB (Printed Circuit Board) to flow current into LED for driving. But PCB has a dielectric layer which makes negative performance against heat transfer. PCB substrate material, FR or metal, including dielectric material and it’s thickness of PCB is important to LED reliability and performance. If same LED packages are used, different characteristics are shown according to PCB type which is main factor to decide thermal resistance of system. Material has it’s own thermal conductivity and when different materials are connected by bonding material, there’s thermal resistance. Even if each material has good thermal conductivity, it is possible to get poor thermal resistance regarding to bonding material and quality between each different material. 17 LED lighting fixture has many thermal resistances. Rpackage is thermal resistance within only package inner structure which include junction, chip substrate, package substrate, bonding material and phosphor effect etc. RJS is thermal resistance between chip junction and solder point and usually used as a package thermal resistance. RSB is that of solder to PCB board, RBC is that of board to case. RCA is case to ambient. 3000K_Metal-PCB 5000K_Metal-PCB 3000K_FR-PCB 5000K_FR-PCB 10000 100 1 0.01 0.0001 1E-06 0 A B 10 C D E 20 F 30 G 40 H 50 Rpackage C RJS D E RSB RBC RCA F RJS G RSB H RBC RCA Each thermal resistances of four cases of test device, 3000K CCT samples on metal or FR PCB and 5000K CCT on metal or FR PCB, are presented. Thermal resistance within package only, Rpackage, is similar like as ‘B’ point between each case, but RJS regarding with PCB type is different. In metal PCB case, RJS is ‘C’ point but case of FR PCB is ‘F’ point. Package characteristics can be easily changeable through these different thermal resistances which defined by material and manufacture process quality and driving current under various Ts conditions. 18 We can expect and calculate drivable current and ambient temperature ranges. If driving current is 100mA and system thermal resistance is 46℃/W, then 105℃ Tj (junction temperature) could be known at 80℃ Ta (ambient temperature) condition. Driving Range at Rth(j-a) 46℃/W (under Tj maximum) Forward current [mA] 250 Tj=78℃ Tj=106℃ Tj=125℃ 200 Tj=71℃ Tj=100℃ 150 Tj=66℃ Tj=125℃ Tj=105℃ 50mA Tj=125℃ 100 Tj=72℃ Tj=102℃ Tj=125℃ 100mA 150mA 200mA 50 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [℃] Boundary condition like as derating curve for maximum driving current could be drawn by connecting point in Tj maximum at each different system thermal resistance. Derating Curve Forward current [mA] 250 200 Rth(j-a) 20″/W Rth(j-a) 40″/W 150 Rth(j-a) 60″/W Rth(j-a) 80″/W 100 Rth(j-a) 100″/W Max. Current 50 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 Ambient Temperature [℃] 19 Color shift @100mA, 5000K 0.362 McPCB 0.360 FRPCB 0.358 50℃ 0.354 90℃ 0.350 0.348 50℃ 75℃ Ts temperature 75℃ McPCB FRPCB 90℃ 0.346 90℃ 50℃ 75℃ 0.352 25℃ 25℃ 25℃ 0.356 Cy Relative luminous Flux Relative output @100mA, 5000K 1.1 1.05 1 0.95 0.9 0.85 0.8 0.75 0.7 0.338 0.340 0.342 0.344 0.346 0.348 0.350 Cx The test results of same rank samples at 5000K CCT show different characteristics between case of mounting on Metal PCB and FR PCB. Due to different ability of heat dissipation, characteristic curves show different performance as per TS temperature. These results are caused by the thermal degradation performance of LED chip and phosphor which convert blue power to white light. Color shift @100mA, 3000K 0.404 McPCB 25℃ 0.402 FRPCB 50℃ 0.400 Cy Relative luminous Flux Relative output @100mA, 3000K 1.1 1.05 1 0.95 0.9 0.85 0.8 0.75 0.7 0.398 0.396 25℃ 75℃ 90℃ 90℃ FRPCB 0.394 25℃ 50℃ 75℃ Ts temperature 90℃ 0.434 0.436 McPCB 0.438 Cx 0.440 0.442 In case of warm white, also thermal characteristics are possible differently with cool white’s. Normally several kinds of phosphors could be mixed in single package and then as per phosphor mixing ratio, thermal performance could be different. 20 2.2 Optical Characteristics 2.2.2 5000K measurement data mounted on Metal PCB Relative Luminous Flux (%) Relative Luminous Flux vs. Forward Current 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 50 100 150 Forward Current (mA) 200 As increase driving current, the gradient of relative luminous flux curve drops due to thermal effects. If LM362A is mounted on metal PCB, at 75℃ Ts condition, final luminous flux is about 90% of initial value. At 50℃ Ts case, 95% relative luminous output is expected. Current deviation is not that large at each Ts, but at 90℃ Ts, as current increase the relative output gap becomes to larger. In view of design point, LM362A should be considered under these various driving conditions. LM362A degradation ratio 160 140 120 100 80 60 40 20 0 25℃ 50℃ Ts 75℃ 90℃ Luminous degradation ratio [%] Luminous Flux [lm] LM362A Luminous Flux 1.10 1.05 1.00 0.95 0.90 0.85 0.80 0.75 0.70 50mA 100mA 150mA 200mA 25℃ 50℃ 75℃ Ts 90℃ ※ The value is measured from typical binning rank. Real design result is possible to be changed from the table depends on each rank 21 LM362A Efficacy LM362A Efficacy 160 160 150 150 50mA 140 100mA 120 110 150mA 100 200mA 90 Efficacy [lm/W] 130 25℃ 130 50℃ 120 110 75℃ 100 90℃ 90 80 80 25℃ 50℃ 75℃ Ts 90℃ 50mA 100mA 150mA 200mA Current When LM362A is driving at 100mA and 25℃ Ts condition, 63.5lm 133lm/W efficacy could be obtainable. As Ts goes on 75℃, 56.8lm 126lm/W is expected and power consumption comes to low slightly. Important characteristics is color shift performance related with Ts condition and thermal resistance. Color shift trends has close connection with phosphor performance against CCT, Ts condition, driving current and system thermal resistance. In addition to these factors, depending on which diffuser is used at the fixture level, the direction of color shift could be various. Therefore color shift degree should be considered at initial design stage. Color shift 0.40 0.39 R0 0.38 0.37 0.36 0.35 0.34 0.33 0.32 0.33 0.34 Color shift 0.362 0.360 25℃ 0.358 Cy y Efficacy [lm/W] 140 50℃ 0.356 0.354 75℃ 0.352 0.350 0.348 x 0.35 0.346 0.36 90℃ 50mA 100mA 150mA 200mA 0.338 0.340 0.342 0.344 0.346 0.348 0.350 Cx ※ The value is measured from typical binning rank. Real design result is possible to be changed from the table depends on each rank 22 2.2 Optical Characteristics 2.2.3 3000K measurement data mounted on Metal PCB 160 140 120 100 80 60 40 20 0 LM362A degradation ratio 50mA 100mA 150mA 200mA 25℃ 50℃ 75℃ 90℃ Ts 110% 105% 100% 95% 90% 85% 80% 75% 70% Luminous degradation ratio [%] Luminous Flux [lm] LM362A Luminous Flux 200mA LM362A Efficacy 50mA 100mA 150mA 200mA Efficacy [lm/W] Efficacy [lm/W] 150mA 160 150 140 130 120 110 100 90 80 25℃ 50℃ 75℃ 90℃ 50mA 100mA150mA200mA Current 25℃ 50℃ 75℃ 90℃ Ts Color shift 0.404 0.43 0.42 100mA 25℃ 50℃ 75℃ 90℃ Ts LM362A Efficacy 160 150 140 130 120 110 100 90 80 50mA Color shift 0.402 V0 0.400 y Cy 0.41 0.40 0.398 0.396 0.39 25℃ 50℃ 75℃ 90℃ 0.394 0.38 0.41 0.42 0.43 0.44 0.45 0.46 0.434 0.436 0.438 0.440 0.442 Cx ※ The value is measuredx from typical binning rank. Real design result is possible to be changed from the table depends on each rank 23 50mA 100mA 150mA 200mA 2.2 Optical Characteristics 2.2.4 5000K measurement data mounted on FR PCB LM362A degradation ratio 160 140 120 100 80 60 40 20 0 110% 105% 100% 95% 90% 85% 80% 75% 70% Luminous degradation ratio [%] Luminous Flux [lm] LM362A Luminous Flux 50mA 100mA 150mA 200mA 25℃ 50℃ 75℃ Ts 90℃ Efficacy [lm/W] 100mA 150mA 200mA 0.38 50℃ 75℃ 90℃ Color shift 0.362 25℃ 0.360 R0 0.358 Cy 0.37 0.354 0.35 0.352 0.34 0.350 0.33 0.348 0.34 0.35 50℃ 0.356 0.36 0.32 0.33 25℃ 50mA 100mA 150mA 200mA Current Color shift 0.39 200mA 160 150 140 130 120 110 100 90 80 90℃ 0.40 y Efficacy [lm/W] 50mA 75℃ Ts 150mA LM362A Efficacy 160 150 140 130 120 110 100 90 80 50℃ 100mA 25℃ 50℃ 75℃ 90℃ Ts LM362A Efficacy 25℃ 50mA 100mA 75℃ 90℃ 0.346 0.36 0.338 0.340 0.342 0.344 0.346 0.348 0.350 x ※ The value is measured from typical binning rank. Cx Real design result is possible to be changed from the table depends on each rank 24 50mA 150mA 200mA 2.2 Optical Characteristics 2.2.5 3000K measurement data mounted on FR PCB LM362A degradation ratio 50mA 100mA 150mA 200mA 25℃ 50℃ 75℃ Ts 90℃ Luminous degradation ratio [%] Luminous Flux [lm] LM362A Luminous Flux 160 140 120 100 80 60 40 20 0 110% 105% 100% 95% 90% 85% 80% 75% 70% Efficacy [lm/W] 50mA 100mA 150mA 200mA 200mA 50℃ 75℃ Ts 90℃ 160 150 140 130 120 110 100 90 80 25℃ 50℃ 75℃ 90℃ 50mA 100mA 150mA 200mA Current Color shift Color shift 0.404 0.43 0.402 V0 0.400 Cy 0.41 y Efficacy [lm/W] 150mA LM362A Efficacy 25℃ 50℃ 75℃ 90℃ Ts 0.42 100mA 25℃ LM362A Efficacy 160 150 140 130 120 110 100 90 80 50mA 0.40 0.398 0.39 0.396 0.38 0.41 0.42 0.43 0.44 0.45 0.46 0.394 25℃ 50℃ 100mA 150mA 75℃ 200mA 90℃ 0.434 0.436 0.438 0.440 0.442 Cx x ※ The value is measured from typical binning rank. Real design result is possible to be changed from the table depends on each rank 25 50mA 3.1 Module performance 3.1.1 Module Devise under Test (DUT) Ts temperature at solder point 5000K 80Ra 6s X 8p array 3000K 80Ra 6s X 8p array In order to show various module performance, typical rank samples were chosen and tested. From one module, 5 array cases were made and measured depend on each driving current and Ts temperature. The purpose of these test is focused on concentrating light source for bulb and down light. And the result is just for reference value due to using typical values. in real design, there’s so various cases by Vf, color, luminous flux rank and especially system thermal resistance. 1EA (1sX1p) 6EA (6sX1p) 12EA (6sX2p) 26 24EA (6sX4p) 48EA (6sX8p) 3.1 Module performance 3.1.2 Electrical power consumption Total Power vs Number of PKGs LED forward voltage, Vf is changing depend on solder temperature and biased current. In case of module, parasitic resistance of pcb board also effects on LED forward voltage. But middle power led operating under 0.6W is less influenced by that kind of parasitic resistance rather than high power led operating over 1W The power consumption value of table shows slightly change as to each input current and temperature. These fine changes is from forward voltage characteristics of single LED. And solder material, assembly process including SMT(surface mount technologies) process can effects on LED forward voltage, and then power consumption could be increased by parasitic resistance factor. Total Power Consumption [W] 70.0 200mA 60.0 50.0 150mA 40.0 30.0 100mA 20.0 50mA 10.0 0.0 1 6 12 24 48 50mA 25℃ 0.3 1.7 3.4 6.9 13.8 50mA 50℃ 0.3 1.7 3.4 6.8 13.5 50mA 75℃ 0.3 1.7 3.3 6.7 13.3 50mA 90℃ 0.3 1.6 3.3 6.6 13.2 100mA 25℃ 0.6 3.6 7.2 14.5 29.0 100mA 50℃ 0.6 3.5 7.1 14.2 28.4 100mA 75℃ 0.6 3.5 6.9 13.9 27.9 100mA 90℃ 0.6 3.4 6.9 13.8 27.6 150mA 25℃ 0.9 5.6 11.2 22.5 45.1 150mA 50℃ 0.9 5.5 11.0 22.0 44.1 150mA 75℃ 0.9 5.4 10.8 21.6 43.2 150mA 90℃ 0.9 5.3 10.7 21.4 42.8 200mA 25℃ 1.3 7.7 15.4 30.9 61.9 200mA 50℃ 1.3 7.5 15.0 30.2 60.5 200mA 75℃ 1.2 7.4 14.8 29.6 59.4 200mA 90℃ 1.2 7.3 14.6 29.4 58.8 Number of Packages 27 3.2 5000K 68Ra performance graph 3.2.1 50mA driving current 2500 2000 1500 1000 500 0 1 6 12 24 48 25℃ 43 259 527 1062 2108 50℃ 41 248 501 1011 2019 75℃ 40 238 480 967 90℃ 39 233 471 948 Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs Luminous Efficacy vs Number of PKGs 160 150 140 130 120 110 100 1 6 12 24 48 25℃ 151 150 153 153 152 50℃ 148 147 148 149 149 1927 75℃ 144 143 144 145 145 1892 90℃ 142 141 143 144 143 3.2.2 100mA driving current 4000 3000 2000 1000 0 1 6 12 24 48 25℃ 80 480 975 1953 3895 50℃ 76 459 927 1866 3734 75℃ 73 439 889 1787 90℃ 72 429 869 1745 Luminous Efficacy vs Number of PKGs Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs 160 150 140 130 120 110 100 1 6 12 24 48 25℃ 133 133 135 135 134 50℃ 130 130 131 132 132 3572 75℃ 127 127 128 128 128 3487 90℃ 126 125 127 127 126 ※ Each temperature means Ts temperature at solder point ※ The value is measured from typical binning rank. Real design result is possible to be changed from the table depends on each rank 28 3.2 5000K 68Ra performance graph 3.2.3 150mA driving current 6000 5000 4000 3000 2000 1000 0 1 6 12 24 48 25℃ 113 677 1380 2762 5509 50℃ 108 648 1314 2637 5277 75℃ 103 620 1255 2525 90℃ 100 600 1213 2440 Luminous Efficacy vs Number of PKGs Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs 160 150 140 130 120 110 100 1 6 12 24 48 25℃ 120 121 123 123 122 50℃ 118 118 120 120 120 5046 75℃ 115 116 117 117 117 4877 90℃ 113 113 114 114 114 3.2.4 200mA driving current 7000 6000 5000 4000 3000 2000 1000 0 1 6 12 24 48 25℃ 143 859 1749 3498 6976 50℃ 137 824 1671 3348 6699 75℃ 131 787 1595 3201 90℃ 125 751 1525 3062 Luminous Efficacy vs Number of PKGs Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs 160 150 140 130 120 110 100 1 6 12 24 48 25℃ 111 112 114 113 113 50℃ 109 110 111 111 111 6399 75℃ 106 107 108 108 108 6119 90℃ 103 103 104 104 104 ※ Each temperature means Ts temperature at solder point ※ The value is measured from typical binning rank. Real design result is possible to be changed from the table depends on each rank 29 3.3 5000K 80Ra performance graph 3.3.1 50mA driving current 2000 1500 1000 500 0 1 6 12 24 48 25℃ 36 216 439 885 1757 50℃ 34 204 412 832 1661 75℃ 32 193 390 786 90℃ 31 188 380 766 Luminous Efficacy vs Number of PKGs Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs 130 120 110 100 90 80 1 6 12 24 48 25℃ 126 125 127 128 127 50℃ 121 121 122 123 123 1566 75℃ 117 116 117 118 117 1528 90℃ 115 114 115 116 116 3.3.2 100mA driving current 4000 3000 2000 1000 0 1 6 12 24 48 25℃ 71 426 866 1735 3460 50℃ 67 403 814 1638 3278 75℃ 63 381 771 1550 90℃ 62 370 749 1503 Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs 130 Luminous Efficacy vs Number of PKGs 120 110 100 90 80 1 6 12 24 48 25℃ 118 118 120 120 119 50℃ 114 114 115 116 116 3097 75℃ 110 110 111 111 111 3004 90℃ 108 108 109 109 109 ※ Each temperature means Ts temperature at solder point ※ The value is measured from typical binning rank. Real design result is possible to be changed from the table depends on each rank 30 3.3 5000K 80Ra performance graph 3.3.3 150mA driving current 5000 4000 3000 2000 1000 0 1 6 12 24 48 25℃ 96 576 1175 2351 4689 50℃ 91 545 1106 2219 4440 75℃ 86 515 1043 2098 90℃ 82 493 998 2008 Luminous Efficacy vs Number of PKGs Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs 130 120 110 100 90 80 1 6 12 24 48 25℃ 102 103 105 104 104 50℃ 99 100 101 101 101 4194 75℃ 96 96 97 97 97 4013 90℃ 93 93 94 94 94 3.3.4 200mA driving current 6000 5000 4000 3000 2000 1000 0 1 6 12 24 48 25℃ 121 726 1479 2957 5897 50℃ 115 688 1396 2797 5598 75℃ 108 650 1316 2641 90℃ 102 610 1240 2489 Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs 130 Luminous Efficacy vs Number of PKGs 120 110 100 90 80 1 6 12 24 48 25℃ 94 94 96 96 95 50℃ 91 92 93 93 93 5279 75℃ 88 88 89 89 89 4975 90℃ 84 84 85 85 85 ※ Each temperature means Ts temperature at solder point ※ The value is measured from typical binning rank. Real design result is possible to be changed from the table depends on each rank 31 3.4 3000K 80Ra performance graph 3.4.1 50mA driving current 2000 1500 1000 500 0 1 6 12 24 48 25℃ 35 211 428 863 1713 50℃ 35 208 420 848 1692 75℃ 34 204 413 831 90℃ 33 200 405 816 Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs Luminous Efficacy vs Number of PKGs 130 120 110 100 90 80 1 6 12 24 48 25℃ 123 122 124 125 124 50℃ 124 123 124 125 125 1656 75℃ 124 123 124 125 124 1629 90℃ 123 122 123 124 123 3.4.2 100mA driving current 4000 3000 2000 1000 0 1 6 12 24 48 25℃ 65 390 793 1588 3168 50℃ 64 384 776 1562 3125 75℃ 63 376 762 1532 90℃ 61 369 747 1499 Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs Luminous Efficacy vs Number of PKGs 130 120 110 100 90 80 1 6 12 24 48 25℃ 108 108 110 109 109 50℃ 109 109 110 110 110 3062 75℃ 109 109 110 110 110 2996 90℃ 108 107 109 109 109 ※ Each temperature means Ts temperature at solder point ※ The value is measured from typical binning rank. Real design result is possible to be changed from the table depends on each rank 32 3.4 3000K 80Ra performance graph 5000 Luminous Flux vs Number of PKGs 4000 3000 2000 1000 0 1 6 12 24 48 25℃ 92 550 1122 2244 4476 50℃ 90 541 1097 2200 4403 75℃ 88 529 1070 2152 90℃ 86 517 1047 2106 Luminous Efficacy [lm] Total Luminous Flux [lm] 3.4.3 150mA driving current 130 Luminous Efficacy vs Number of PKGs 120 110 100 90 80 1 6 12 24 48 25℃ 98 98 100 100 99 50℃ 99 99 100 100 100 4302 75℃ 98 98 100 100 99 4208 90℃ 98 97 98 98 98 3.4.4 200mA driving current 6000 5000 4000 3000 2000 1000 0 1 6 12 24 48 25℃ 116 698 1422 2843 5670 50℃ 114 687 1393 2791 5585 75℃ 112 670 1358 2725 90℃ 109 656 1333 2676 Luminous Efficacy [lm] Total Luminous Flux [lm] Luminous Flux vs Number of PKGs 130 Luminous Efficacy vs Number of PKGs 120 110 100 90 80 1 6 12 24 48 25℃ 90 91 92 92 92 50℃ 91 92 93 92 92 5447 75℃ 91 91 92 92 92 5348 90℃ 90 90 91 91 91 ※ Each temperature means Ts temperature at solder point ※ The value is measured from typical binning rank. Real design result is possible to be changed from the table depends on each rank 33 4.1 Symmetric and asymmetric array for Package 1) Asymmetric of Lens Lens PKG Array Light distribution Result 0° ~ 180° : 26° Lens Target 90° ~ 270° : 28.8° ( 25° ) Asymmetric : 2.8° 0° ~ 180° : 40.4° Lens Target 90° ~ 270° : 43.4° ( 40° ) Asymmetric : 3° - Array in one direction : Asymmetric - Gap : 2.8° ~ 3° 34 4.1 Symmetric and asymmetric array for Package 2) Symmetric of Lens Lens PKG Array Light distribution Result 0° ~ 180° : 28° Lens Target 90° ~ 270° : 28° ( 25° ) Symmetric 0° ~ 180° : 42° Lens Target 90° ~ 270° : 42° ( 40° ) Symmetric - Bi- Directional array : Symmetric 35 4.2 Lighting Example 1) MR16 – Lens Type Product MR16 Item Data Target Flux ( Lm ) 250 LED PKG Q’ty ( Ea ) 4 Power Consumption (W) 3 Replacement Halogen 25W Array Light distribution Array Light distribution 2) PAR20 – Lens Type Product PAR20 Item Data Target Flux ( Lm ) 400 LED PKG Q’ty ( Ea ) 8 Power Consumption (W) 5.8 Replacement Halogen PAR 20 36 4.2 Lighting Example 3) PAR30 – Lens Type Product PAR30 Item Data Target Flux ( Lm ) 700 LED PKG Q’ty ( Ea ) 12 Power Consumption (W) 8.7 Replacement Halogen PAR 30 Array Light distribution Array Light distribution 4) Bulb – Diffuser Cap Type Product Bulb 1000lm Item Data Target Flux ( Lm ) 1000 LED PKG Q’ty ( Ea ) 16 Power Consumption (W) 11.6 Replacement Halogen 75W Lamp 37 4.2 Lighting Example 5) DLE(Down light Engine ) -12W Product Down light Engine Item Data Target Flux ( Lm ) 1037 LED PKG Q’ty ( Ea ) 16 Power Consumption (W) 11.6 Replacement Samsung DLE 20W With diffuser Array 6) DLE(Down light Engine ) – 21W Product Down light Engine Item Data Target Flux ( Lm ) 1776 LED PKG Q’ty ( Ea ) 28 Power Consumption (W) 20.2 Replacement Samsung DLE 30W With diffuser 38 Array 4.3 Lens Solution Baikang (www.baikang.cn) Product Code Type BK-LED-767 8 in1 Beam Angle 17 ° Material Size(mm) Application PMMA Φ80*11.08 PAR30 / PAR38 39 Picture 4.3 Lens Solution OK Lens (www.lensled.com) Product Code OK-L91CR0925Z 111 OK-L91CR0940Z 112 OK-L73CR0625Z 109 OK-L73CR0640Z 110 OK-L32CR0530J Type Beam Angle Material Size(mm) Application 9 in1 25° PMMA Φ90.6*18.5 PAR30 / PAR38 9 in1 40 ° PMMA Φ90.6*18.5 PAR30 / PAR38 6 in1 25 ° PMMA Φ73.3*15.4 PAR30 6 in1 40 ° PMMA Φ73.3*15.4 PAR30 5 in 1 50 ° PMMA Φ32*7.5 MR16 / GU10 40 Picture 5.1 Mechanical Considerations 5.1.1 Handling Guide Please use tweezers to grab MP36S at the base. Do not touch the silicon mold side with the tweezers or fingers. Correct Handling Incorrect Handling 41 5.1 Mechanical Considerations 5.1.2 Recommended Land Pattern 42 5.1 Mechanical Considerations 5.1.3 SMT Set Taping Start End More than 40 mm Unloaded tape Mounted with More than 100~200)mm Leading part more than Flash LED Unloaded tape (200~400)mm (1) Quantity : The quantity/reel to be 4,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2㎜ (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7 N when the cover tape is turned off from the carrier tape at 10℃ angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package 43 5.1 Mechanical Considerations 5.1.4 Reflow Profile Reflow conditions and work guide Below reflow profile is recommended for reflow soldering. Conditions can be changed in various soldering equipment and PCB. It is recommended that users follow the reflow guide line of a solder manufacturer For Manual Soldering Not more than 5 seconds @MAX300 ℃, under soldering iron. 44 6.1 Risk of Sulfurization (or Tarnishing) Injurious chemicals to SLED MP36S silicone LM362A 45 6.1 Risk of Sulfurization (or Tarnishing) Packing guide (After SMT) 1 2 3 1) Use the PP or PET tray (Corrugated paper tray is NOT allowed) 2) Include the silica gel 3) Block Sulfur from the outside (using the anti-static vinyl) ※ Recommended wrapping paper box is PP. (If corrugated paper Box is used, Sulfur must be less than 850ppm) [anti-static vinyl] PE MBB-80 - Best Alternative Tray PP PET Anti-static vinyl MBB PE Out Box PP Corrugated paper box (less than 850PPM) 46 6.1 Risk of Sulfurization (or Tarnishing) Type & cause of Ag L/F discoloration Discoloration example Ag2S The material of cause Sulfur / Sulfur compound AgCl Primary source Penetration route Organic rubber, Penetrate the silicon, Corrugated paper, interface between Solder cream L/F and Reflector Cl FR1(PCB), / Cl compound NH4Cl Diffusion of Corrosive Gas (H2S, Cl2) Penetrate the silicon interface between L/F and Reflector Result of Ag2S, AgCl creation 1. Luminance aging 2. Color Shift 3. Bonding strength is Silicon Chip Reflector Ag plating layer Lead Frame (Cu) 47 weaken between silicon and Ag Layer 6.1 Risk of Sulfurization (or Tarnishing) The example of organic rubber failure (5630PKG) Partial PKG discoloration due to organic rubber * Refer the below revised specification Risk of Sulfurization (or Tarnishing) Samsung LED's lead frame based package products (such as mid power and HV AC) contain silver (Ag) plated lead frames. Silver may turn black (or tarnish) when exposed to substances such as sulfur, chlorine, or other halogen compounds. Sulfurization of the lead frame may result in reduction of lumen output, color shift and an open circuit in some extreme cases. Do not store or use such lead frame LED's together with oxidizing substances listed above. The following examples could be sources of such substances: rubber, corrugate paper, solder cream etc. 48 6.1 Risk of Sulfurization (or Tarnishing) The example of Corrugated paper Tray failure(5252 PKG) PKG Sulfurization The result of corrugated paper EDX analysis, Sulfur is included more than 1,700 PPM 49 6.1 Risk of Sulfurization (or Tarnishing) Consideration of S/Cl noxious properties by PCB Test / Condition TGA (Thermogravimetric analysis) IC (Ion Chromatography) Conclusion CEM1 CM1 FR4 FR1 The mass reduction from initial state (Roomtemperature~280℃) 4% < 1% 25% The mass reduction from initial state (Stored 1hr @280℃) 29% 24% 35% - - 69.4 The Cl quantity that eluted by water (Unit : ug / PCB) • Normal PCB : When the PCB is heated by 280℃, the heat resistance is good. • Faulty PCB : When the PCB is heated by 280℃, 25% of the weight lose out. So, a lot of out gas is detected, and plenty of Cl is detected. FR1 The result of FR1 EDX analysis, Cl ingredient is included more than 30,000 PPM 50 6.1 Risk of Sulfurization (or Tarnishing) Conclusion Samsung LED's lead frame based package products (such as mid power and HV AC) contain silver (Ag) plated lead frames. Silver may turn black (or tarnish) when exposed to substances such as sulfur, chlorine, or other halogen compounds. Sulfurization of the lead frame may result in reduction of lumen output, color shift and an open circuit in some extreme cases. Do not store or use such lead frame LED's together with oxidizing substances listed above. The following examples could be sources of such substances: rubber, corrugate paper, solder cream etc. 51 6.2 Discoloration of LED in operation Volatile organic chemicals can make the fast degradation of luminous flux in LED lightings. This phenomena locally should occur in physically closed system, which means space without air movement. The operation of LED should lead to elevate temperature in close system. In two conditions, the volatile organic chemicals can vaporize and diffuse in the system. This diffusion of VOCs can affect normal operation in LEDs. The bulbs in below figure shows the discoloration of LED in bulbs and the inner surface of itself. Discoloration of LED Normal LED Bulbs Abnormal LED Bulbs Clear chips 52 Black colored chips 6.2 Discoloration of LED_ Cause Conditions 1.Generation of VOCs - VOC(volatile organic compounds)s possibly can generate from the silicone encapsulant itself and other materials, such as glue(sealing material), conformal coating, O-ring and potting materials. 2. Enveloped in Closed system(Sealed system without air movement) - In any sealed system, the vapor of VOC can diffuse in entire closed system. 3. Diffusion of VOCs - VOCs can diffuse into the silicone encapsulant of LED, which should result from the weak binding force between molecules. And the free space within silicone is helpful to the diffusion of VOCs . The weak binding energy and the free space is related with cured silicone. This means the more gas-permeable state. The black color just on the surface of LED chip is the where highest temperature. Black colored surface of LED chip 53 6.2 Discoloration of LED_ Reversibility - The discolor in LED can disappear during the normal operation in ambient atmosphere. (below table) - It seems that VOCs can outgas from the inside of encapsulant. - The reversible reaction should demonstrate that VOCs could not chemically react with any parts in LED [Table] Recovery of appearance in discolored LED Time(hr) spl1 spl2 0 24 48 72 96 120 144 168 54 spl3 spl4 spl5 6.2 Discoloration of LED_ Solutions Recommending Open System Design for Free Air Ventilation : Easy to outgas VOCs(Contaminating materials on LED) - When customer use adhesive for cover, please secure open system as shown below. Full Dotting (Not Recommended) Partial Dotting (Recommended) Recommending Expansion of Contact Area for Efficient Heat Transfer : To control acceleration of contamination in accordance with temperature PKG Fixing Plate Contact Area (Not Recommended) Side View Case Enlarged View Contact Area (Recommended) 6.2 Discoloration of LED_ Solutions Substances Information inducing VOCs Source : XLAMP Chemical Compatibility(CREE Inc.) 6.2 Discoloration of LED_ Solutions Substances Information inducing VOCs Source : XLAMP Chemical Compatibility(CREE Inc.) 6.2 Discoloration of LED_ Solutions Substances Information inducing VOCs Source : XLAMP Chemical Compatibility(CREE Inc.) 6.2 Discoloration of LED_ Solutions Substances Information inducing VOCs Source : XLAMP Chemical Compatibility(CREE Inc.) 6.2 Discoloration of LED_ Solutions Substances Information inducing VOCs Source : XLAMP Chemical Compatibility(CREE Inc.) 6.2 Discoloration of LED_ Solutions Substances Information inducing VOCs Source : XLAMP Chemical Compatibility(CREE Inc.) 6.2 Discoloration of LED_ Example Minimizing factor and environment of contamination Epoxy Adhesive Transformation of Adhesive Material in accordance with temperature Example of using epoxy adhesive - Please use silicon affiliated adhesive at a minimum quantity. - Flux(Rosin) in solder paste when combining wire to PCB can make discoloration on LED by thermal and lighting acceleration factor. We recommend cleaning procedure using IPA(Isopropyl Alcohol) after soldering. 62 6.2 Discoloration of LED_ Example Designing efficient thermal Design - Inefficient thermal design makes increasing of temperature. And it make acceleration and becoming permanent of contamination. - Samsung recommends all-in-one heat sink type to control redundant chemical material and secure efficient thermal design. All-in-one type is excellent for heat transfer function. Please refer to below pictures All-in-one Heat Sink Design of Samsung E17 Base Bulb - Buck converter of good efficiency also helps keeping down of temperature. 63 Writer Date Revision History 2012.08.03 New Version 64 Drawn Approved Y.J. Lee D.M. Jeon
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