1. technology and computing

Table of Contents
Welcome Letter2
Agenda4
Keynote Speakers8
Featured Speakers12
Moderators and Panelists18
Panels20
MEMS & Sensors Technology Showcase
22
Sponsors25
Governing Council & Management Team
35
Special Thanks36
Members & Partners38
Accelerated Innovation Community43
Upcoming Events44
CELLULAR PHONES AND ALARMS
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TWITTER: @MEMSGROUP
Use #memscongress when tweeting about the conference!
PRESENTATIONS
Conference presentations will be available to attendees for
one week starting on the afternoon of 11 March 2015. Please
visit eu2015.memscongress.com/presentations and use the
password “copenhagen” to view. MIG members will have full
access to the presentations in the MIG resource library.
ANTITRUST POLICY
Please refer to MIG’s antitrust policy:
www.memsindustrygroup.org/antitrust
WI-FI LOGIN INFORMATION
Network: Public Guestnet
User: internet Password: 2660
1
Welcome
Welcome to MEMS Executive
Congress Europe® 2015!
Welcome to Copenhagen and thank you for joining MEMS Industry
Group (MIG) for MEMS Executive Congress Europe 2015! As a
conference focused on addressing the near-term issues affecting the
MEMS and sensors industries, MEMS Executive Congress provides
a unique forum for solution providers and end-market integrators
to exchange ideas and information during panel discussions and
networking events.
This year will mark our 11th year hosting MEMS Executive Congress
in the United States and our fourth time hosting this similar, yet
distinctly European version here in Copenhagen. This year we are
back to co-locating with our partners, the Smart Systems Integration
Conference.
Present at this year’s MEMS Executive Congress Europe both as
speakers and attendees are executives from a wide array of the
MEMS and sensors supply chain - from end-users/OEM integrators
to device manufacturers and foundries to equipment manufacturers,
consultants, analysts and material suppliers. We are also pleased
to have several members of the press with us, with whom we will
be doing a press conference at 15:15 on Tuesday, 10 March. I also
encourage you to follow MIG and MEMS Executive Congress on
Twitter (#memscongress and @MEMSGroup).
We have a full schedule of content and networking time planned for
you over the next two days, detailed in this program. We have two
fantastic keynotes (Dr. Franz Lärmer and Mr. Claus Nielsen) as well
as panels and featured speakers covering topics from the Internet of
Things/Everything, to automotive, consumer and health/wellness; all
discussing the business of MEMS. I am also thrilled to bring you the
MEMS and Sensors Technology Showcase for the first time in Europe
and can’t wait to find out who is crowned the winner of this crowdpleasing event.
2
As the trade association advancing MEMS and sensors across global
markets, MIG is in our 15th year, and in the fifth year of its five-year
strategic plan. We have achieved nearly all the goals we set forth in
2010 and we have over 170 international members and partners.
Thanks to the collaborative work of our organization with our
members and partners, it is clear that we are the MEMS and sensors
supply chain and a go-to resource for the industry. For those of you
who are not MIG members yet, we are offering a 10% discount on
your first year’s membership dues if you join before 30 April. Please
see a MIG staff member for more details.
MIG would like to offer special thanks to all of our sponsors. Without
the generous support of our sponsors, this event would not be
possible. So please join me in thanking our top tier sponsors, our
additional sponsors as well as our media partners. A full list can be
found on our event website and throughout this program.
Lastly, I want to thank the MIG Governing Council and European
Congress Steering Committee and in particular, the MEMS Executive
Congress Europe speaker selection committee, all who volunteered
their effort and enthusiasm to ensure this year’s MEMS Executive
Congress Europe continues to be a premier event. Next year please
mark your calendars to join us once again in Munich on 7-8 March,
but for our MEMS Technical Congress!
Thank you,
Karen Lightman
EXECUTIVE DIRECTOR, MEMS INDUSTRY GROUP
3
Agenda
TUESDAY 10 MARCH 2015
MONDAY 9 MARCH 2015
13:00 – 17:00
Everest Foyer
Registration
14:30 – 14:45
Everest Ballroom 1
Welcome
Karen Lightman, Executive Director, MEMS Industry Group
14:45 – 15:50
Everest Ballroom 1
MEMS Market Panel Presentations &
Panel Discussion
07:30 – 10:00
Everest Foyer
Registration Opens
08:30 – 09:00
Everest Ballroom 1
Welcome and MEMS Industry Group (MIG) Update
Karen Lightman, Executive Director, MEMS Industry Group
09:00 – 09:05
Everest Ballroom 1
Keynote Speaker Introduction
09:05 – 09:50
Everest Ballroom 1
Morning Keynote
Franz Laermer, Vice President, Corporate Sector Research
and Advanced Engineering, Microsystems Technologies,
Robert Bosch GmbH
09:50 – 10:10
Everest Ballroom 1
Featured Speaker
Roland Helm, Segment Head, Sensors, Infineon
Technologies AG
10:10 – 10:40
Everest Foyer
Networking Coffee Break
10:40 – 11:00
Everest Ballroom 1
Featured Speaker
Simone Severi, R&D Team Leader, IMEC
11:00 – 11:30
Everest Ballroom 1
Featured Speaker
Jean Marc Yannou, Senior Director, Technology
Strategies, ASE Europe, ASE Group
11:30 – 12:30
Everest Ballroom 1
Internet of Things Panel Discussion
Will Tu, Director, Embedded Software, ARM (Moderator)
Eric Mounier, Senior Analyst, MEMS Devices &
Technologies, Yole Développement
Jeremie Bouchaud, Director and Senior Principal Analyst
MEMS & Sensors – Industrial Electronics, IHS Inc.
15:50 – 16:00
Break
16:00 – 17:15
Everest Ballroom
MEMS and Sensors Technology Showcase®
17:15 – 18:00
Everest Foyer
MEMS & Sensors Technology Showcase
Demo Display
18:00 – 19:30
Conference Cafe
Opening Reception
Introduction by Platinum Sponsor
Introduction by
Roger Grace, Roger Grace & Associates (Moderator)
Tim Saxe, CTO, QuickLogic
Ian Chen, Director, Marketing, Systems, Applications,
Software & Algorithms, Freescale Semiconductor
Thomas Nicholls, Head of Marketing and
Communication, SigFox
12:30 – 13:45
STORM Restaurant
4
Lunch
Sponsored by
5
13:45 – 14:05
Everest Ballroom 1
Featured Speaker
Roc Blumenthal, VP of International Technical
Development, Wisdom IC
14:05 – 14:25
Everest Ballroom 1
Featured Speaker
Jaakko Sormunen, Sales Manager Europe, Okmetic Oyj
14:25 – 14:45
Everest Ballroom 1
Featured Speaker
John Fitzpatrick, Engineering Manager, Autoliv
14:45 – 15:15
Everest Ballroom 1
Featured Speaker
Sean Clay, VPGM, Honeywell HIS Sensors
15:15 – 16:15
Everest Foyer &
Loire Room
Networking Coffee Break
Etch, PVD, PECVD & Thermal Technologies
for MEMS Applications
Etch
Sponsored by
MIG Press Conference
• HighrateSiDRIEwithunique
Claritas™endpoint
• DryreleaseetchusingHForXeF2
Sponsored by
16:25 – 16:30
Everest Ballroom 1
16:30 – 17:15
Everest Ballroom 1
Keynote Speaker Introduction
Introduction by Gold Sponsor
PVD, CVD, Etch & Thermal Technologies
for MEMS Applications
Closing Keynote
Etch
Claus B. Nielsen, Business Development Manager, Health
& Care Technologies, DELTA Business Development
• HighrateSiDRIEwithunique
ClaritasTMendpoint
• DryreleaseetchusingHForXeF2
Deposition
17:15 - 17:30
Everest Ballroom 1
• PVDforBAW/SAWapplications
• Lowtemperature,stress-controlled
PECVDforSiO/SiN
Closing Thoughts & Announcement of MEMS &
Sensors Technology Showcase
Winner
Thermal
Karen Lightman, Executive Director, MEMS Industry Group
• LowCoOthickdopedandun-doped
polysilicon
• Highlyproductivestress-controlledSiN
19:00 – 20:30
Everest Ballroom 1
Dinner
[email protected]
www.spts.com
Deposition
• PVDforpiezoelectricfilms&
BAW/SAWapplications
• Lowtemperature,stress-controlled
PECVDforSiO/SiN
Sponsored by
Thermal
• LowCoOthickdopedandun-doped
polysilicon
• Highlyproductivestress-controlledSiN
www.spts.com
6
[email protected]
7
Morning Keynote
TUESDAY, 10 MARCH | 9:00
SPEAKER ABSTRACT
BOSCH-DRIE: Enabling Technology to the Market
Franz Laermer
Vice President, Corporate Sector Research
and Advanced Engineering, Microsystems
Technologies, Bosch
Dr. Franz Laermer joined the Corporate Research and Technology
Center of Robert Bosch GmbH, Stuttgart, Germany in 1990, where he
started the development of new key technologies and functionalities
in the emerging field of Micro-Electro-Mechanical Systems (MEMS) at
Bosch. His activities were mainly focused on new microstructuring,
surface-micromachining and sacrificial layer etching technologies,
enabling new micro-accelerometers, gyroscopes and pressure sensors
for automotive use. In 1997 he became section manager at Corporate
Research, leading a group of 15 Researchers.
Since 2003 he is Project Vice President for innovation projects,
covering new Microsystems and technologies in application fields
outside automotive, including the biomedical area.
Dr. Franz Laermer is the co-inventor of the “Bosch Deep Reactive Ion
Etching Process” (“BOSCH-DRIE”) for microstructuring silicon. This key
microstructuring technology revolutionized MEMS and is the enabler for
all of today’s silicon based MEMS. He holds more than 150 patents.
Dr. Franz Laermer was awarded with the prize “European Inventor of
the Year 2007 – Category Industry” by the European Commission and
the European Patent Office, together with co-inventor Andrea Urban,
for the invention, development and sustainable success of the “BOSCHDRIE”-process. In 2014 the team received the “2014 Jun-ichi Nishizawa
Gold Medal Award” from the IEEE – Institute of Electrical and Electronics
Engineers.
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Over more than two decades, Bosch-DRIE has been establishing itself
as the key microstructuring technology for all silicon based MEMS.
Such a long lifetime in a field of very fast progress like the MEMS is
remarkable. Variations of processing tools and specialty process options
have evolved, but basically the technology in itself hasn’t changed
much. Many people believe in evolutionary progress of DRIE-technology
in future, in contrast to revolutionary breakthroughs, for reasons of
stability and robustness, as well as sufficient flexibility to cover the
requirements of virtually all relevant product applications.
Successful implementation of the technology made the development
of optimized plasma-sources and partnership with a tool vendor
necessary, together with a coherent licensing strategy to open and
standardize the technology in a relatively early phase of maturity.
Quality and long-term reliability issues showed up as crucial when it
came to the fabrication of the first high-volume products by the new
technology, leaving the laboratory prototyping stage.
Being the early technology enabler, Bosch has always been on top of
successful MEMS-commercialization, starting from the automotive field,
with sensors for passenger safety and driving stability, and expanding
later into the consumer area. Market volumes for “Bosch-DRIE MEMSproducts” have exceeded expectations by many orders of magnitude.
Ramp-up of a technology into such high volumes is a challenge in itself.
The “Internet of Things” will boost sensor-demand even further, raising
volumes to the extreme. This requests ever higher etching-speeds
and increased microstructuring precision, to meet the needs of new
packaging, assembly, integration and interconnection techniques, as
well as enhancing functionality of the sensor devices. “War stories” on
technical and commercial challenges and successes and an outlook on
future perspectives will be given.
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Closing Keynote
TUESDAY, 10 MARCH | 16:30
SPEAKER ABSTRACT
mHealth’s Next Super Model
Claus B. Nielsen
Business Development Manager, Health &
Care Technologies, DELTA
Claus B. Nielsen works with Health & Care Technologies at
DELTA, a Danish Innovation & Technology Company specialized in
microelectronics, sensors, light & optics and testing. He has a long
track record of working at the national level in politics, focusing mainly
on implementation of ICT & Innovation. He jas been in charge of large
national projects in the public sector within the elderly and health
care sector, developing and implementing nation-wide ICT & mobile
solutions. He has been the Local Government’s member of the steering
committee of MedCom (Danish health data network), the National
Health Portal and contributed to the Danish national ICT strategies for
eHealth. He is currently appointed as special adviser for the Danish
government’s Council for Telemedicine.
He is involved in several international advisory boards, Programme
committees and been part of several major EU R&D projects within the
field of mHealth, Telehealth and Ambient Assisted Living (AAL). He is a
thought speaker at many conferences around the world.
He was the prime mover behind the launch of a national political
discussion of future AAL services in Denmark (welfare Technology),
which resulted in large funding from the government. On behalf of the
Danish Ministry of Science, Technology & innovation, he was chairman
of the AAL Forum 2010 that attracted more than 2.500 people and 850
delegates from 33 countries, in addition to world class thought leaders
in Technology & Innovation. He is currently vice chair of Continua
Europe under the umbrella of Personal Connected Health Alliance,
where he works globally to promote the uptake and deployment of
personal connected health.
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Thousands of dust collecting mHealth/telehealth pilots illustrates
a complex value chain in Europe, malfunction for the incentives
structures, and lack of technical infrastructure that legally can find ways
to use Google & Apple’s widespread mobile platforms to reach EMR’s at
hospitals, GP’s, care facilities or just the relatives. Can heart patients be
home monitored from the sofa wirelessly? How can we change diabetes
care dramatically and easy? Can we utilize the Quantified self data
from consumer fitness devices in a health system that still uses fax?
The Nordics have taken a bold strategic decision to change that for the
future, and have adopted Continua guidelines nationwide to be able to
securely and legally collect health data from patients devices. What are
these big nordic payers requirement to the industry? Will other public
health & care systems follow?
11
Featured Speakers
Roc Blumenthal
Vice President of International Technical Development,
MEMSRIGHT/STINI
Roc Blumenthal has over 30 years of experience driving
complex engineering technology development and
technology transfer activities at Motorola, TI, SVTC, Cypress,
ON Semiconductor, and MEMS startups; where technology
ranged from leading edge high performance and memory
application to combinatorial systems-on-a-chip to various
MEMS devices. He is the co-founder of a technical services
company (Wisdom IC Microelectronics) in China to license
and transfer MEMS technology to Chinese companies. Has
has resided in China for over 3 years.
He was the Senior Member of the IEEE, Chairman of the
Nor Cal Chapter of American Vacuum Society 2010, Texas
Chapter of AVS from 1990-1996. His education includes
a Bachelor of Science Materials Science and Engineering,
Stanford University, 1982; Master of Science Materials
Science and Engineering, Stanford University, 1983;
Awarded Outstanding Senior in Materials Science and
Engineering, 1982.
Jérémie Bouchaud
Director and Senior Principal Analyst, MEMS & Sensors
Industrial Electronics, IHS Inc.
Jérémie Bouchaud is unique to the MEMS industry –
his breadth of MEMS, sensor devices and application
knowledge is unmatched, particularly in terms of
automotive, consumer markets, industrial, and medical
applications. Formerly, he was a founder and the head of
MEMS research for Wicht Technologie Consulting. In his
current position at IHS, Bouchaud is responsible for the
MEMS service area. In the course of his career, he has led
more than 100 MEMS-related market research endeavors.
Prior to WTC, he oversaw technology transfer for sensors
and MEMS at the German office of CEA-LETI. Bouchaud is
a graduate of the Munich University of Applied Sciences
and of Ecole Supérieur de Commerce of Grenoble. He
speaks German, English and French.
12
Sean Clay
VPGM, Honeywell HIS Sensors
Sean Clay is Vice President and Global General Manager
of Honeywell Industrial Safety Sensors with over 20 years
experience of sensing technologies, edge devices, and
connected systems across a wide range of industrial and
commercial applications and market segments. He has
previously held leadership positions in Marketing, Sales,
and Service operations for leading international brands
where serving the customer through innovative solutions
has driven high customer retention, new customer
acquisition and driven strong growth in new markets and
adjacent spaces.
His work within Honeywell and the wider industry has
driven the development of novel applications, which
integrate discrete technologies and services into single
connected solutions to serve the needs of established
industries; including homes, commercial buildings,
industrial facilities and worker safety.
With the capability for connectivity, integration and
collaboration that the Internet of Things and the digital
ecosystem enables, Sean is currently developing use
cases and operating models for realising the commercial
potential of a connected strategy. These cover how, for
example, existing customers and installed bases provide
scope for accelerating the take up and ubiquity of sensor
technologies and segment focused software applications.
He holds an MBA from Cranfield School of Management
and is a Chartered Fellow of the Institute of Directors.
John Fitzpatrick
Regional Development Manager, Restraint Control and
Sensors, Autoliv Electronics
John Fitzpatrick is Systems Manager for Restraint
Control and Sesnors at Autoliv Electronics. Previously, he
managed Component Development for Autoliv, which a
high focus on MEMS. Before moving to the automotive
industry, he developed telecommunication products with
Acatel and Corvis. John holds an Engineering Degree in
Electronics and a Masters Degree in Optoelectronics from
University College Dublin, Ireland. He lives near Paris with
his German-born wife and their three Swedish children.
13
Roland Helm
Segment Head Sensors, Infineon Technologies AG
Dr. Roland Helm joined Infineon in 2003 after working
in a technology start-up and in a business consultancy.
Since 2006 he is responsible for the MEMS Microphone
business. He has been growing the biz from technical
feasibility to relevant market share by focusing on
customer requirements, leading performance MEMS
and ASIC designs as well as high volume manufacturing
and delivery capability. He is passionate to match new
technology to the needs of modern society.
Roland has a Ph. D. from Technical University of Munich
where he majored in physics.
Karen Lightman
Executive Director, MEMS Industry Group
Karen Lightman became MEMS Industry Group (MIG)
managing director in 2007 and promoted to Executive
Director in 2013. Formerly director of special projects,
Karen played a pivotal role in launching MIG in January
2001. She is active on the worldwide MEMS conference
circuit as a keynote speaker and panelist promoting MIG’s
role as the leading trade association advancing MEMS
and sensors across global markets. Karen manages the
operations of MIG; spearheads strategic growth and
oversees sales, public relations, marketing and outreach.
She plays a critical role in creating the content for all MIG
and MIG-partner conferences, events and programming
and is instrumental in establishing and maintaining
partnerships with other international organizations to
advance the MEMS industry.
Karen joined MIG from Carnegie Mellon University’s
Center for Economic Development, where she was
senior policy analyst. Prior to Carnegie Mellon, she
was senior associate at Cleveland Tomorrow, a publicprivate partnership, and before that, she was a program
associate with the Ford Foundation.
Karen has a BA from the University of Vermont
(UVM) and a MS in Public Policy from Carnegie Mellon
University. She is a board member and chair of the Board
Development Committee of the National Council of
Jewish Women (NCJW), Pittsburgh and in 2012 received
the NCJW National Award for Emerging Leaders. Karen
is secretary for her UVM alumni class, mentor at UVM’s
Honors College and volunteers at the Environmental
Charter School at Frick Park. She and her family reside in
Pittsburgh, PA.
14
Eric Mounier
Senior Analyst, MEMS Devices & Technologies,
Yole Développement
Dr. Eric Mounier has a PhD in microelectronics from the
INPG in Grenoble. He previously worked at CEA LETI R&D
lab in Grenoble, France in marketing dept. Since 1998 he
is a cofounder of Yole Développement, a market research
company based in France. At Yole Développement, Dr.
Eric Mounier is in charge of market analysis for MEMS
& Sensors, visible and IR imagers, semiconductors,
printed electronics and photonics. He is Chief Editor
of Micronews, and Yole Développement magazines:
MEMS’Trends, Power Dev, iLEDS, 3D Packaging. He has
contributed to more than 150 marketing & technological
analysis and 60 reports. Eric is also an expert at the OMNT
(“Observatoire des Micro & Nanotechnologies”) for Optics.
Simone Severi
Research and Development Team Leader, IMEC
Dr. Simone Severi has a PhD from KU Leuven and a
Masters from the University of Bologna. He has more than
8 years experience in process development and product
prototyping for customers in the area of micro-electrical
mechanical systems (including accelerometers, pressure
sensors, and resonators), photonics and specialized
sensors for bio-applications (eg: DNA sequencing, neuroprobes, cell analysis, etc). He holds more than 100 papers
as author or co-author and five granted patents.
Jaakko Sormunen
Sales Manager, Europe, Okmetic Oyj
Dr. Jaakko Sormunen received his PhD in Electrical
Engineering from the Helsinki University of Technology
(now Aalto University) in 2006. He has authored papers
for journals such as Nano Letters on topics including
thin film growth and self assembly of compound
semiconductor nanostructures.
Dr. Sormunen joined Okmetic in 2007 and is currently
based in Helsinki, Finland, working as Sales Manager,
Europe. He has recently relocated from Texas, USA, where
he had a position as Business Development Manager
for Okmetic Inc. During his time with the company, Dr.
Sormunen has held various technical and commercial
positions, with strong focus on value-added silicon
substrates for MEMS, sensors, and semiconductor
applications.
15
Jean-Marc Yannou
Senior Director, Technology Strategies, ASE Europe, ASE Group
Without intelligence, it doesn’t matter
how well connected you are.
Jean-Marc Yannou joined the ASE Group in 2012
where he now serves as a Senior Director for Technology
Strategies. He started his career as a Test & Product
Engineer at Texas Instruments, first in France then in the
USA. He then joined Philips Semiconductors (now NXP)
as principal engineer where he managed the company’s
initiatives for System-in-Package technologies. Next,
he became a senior consultant and market analyst on
advanced semiconductor packaging technology for Yole
Développement, a market research consultancy. Along
with his professional activities, Jean-Marc served as
chairman of the France chapter of IMAPS (International
Microelectronics and Packaging Society) from 2010 to
2014.
Bringing intelligence to the Internet of Things
Cars communicating with highways to avoid accidents and traffic
congestion. Home hubs talking to the smart grid to reduce energy
consumption. Medical monitoring from across town. The billions of
intelligent connections that make our world smarter, greener and
safer. This is Freescale Connected Intelligence. Make it work for you.
Visit freescale.com/intelligence.
16
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off.
All other product or service names are the property of their respective owners. © 2014 Freescale Semiconductor, Inc.
17
Moderators & Panelists
Ian Chen
Director, Marketing, System, Applications, Software &
Algorithms, Freescale Semiconductor
Ian Chen is a director leading marketing, systems
architecture, software and algorithm development
for Freescale’s Sensor Solution Division. Just prior to
Freescale, Ian was executive vice president at Sensor
Platforms focusing on context awareness and sensor data
analytics. He has also held senior business, marketing and
engineering leadership positions at Mobius Microsystems,
Analogix Semiconductor, Cypress Semiconductor, IC Works,
National Semiconductor and Texas Instruments.
Ian has a proven track record of identifying emerging
market inflections early, and addressing them with leading
edge products in such varied fields as sensors, timing,
networking, microprocessors, and serial interface devices.
Electronic Engineering Times identified Ian as one of the 40
key technologists to watch.
He received Bachelor and Master Degrees in electrical
engineering and an MBA, all from the University of Illinois at
Urbana-Champaign. He holds more than ten patents.
Roger Grace
President, Roger Grace Associates
Roger H. Grace is president of Roger Grace Associates, a
Naples Florida -based strategic marketing consulting firm
specializing in high technology, which he founded in 1982.
His background includes over 40 years in high frequency
analog design engineering, application engineering,
project management, product marketing, and technology
consulting. His clients include the international “Who’s
Who” of corporations, federal laboratories and government
agencies.
Mr. Grace has specialized in sensors and
integrated circuits for over 30 years with a focus on
microelectromechanical systems (MEMS) and is considered
a pioneer in this field. He has authored over 60 technical
papers; organized, chaired, and spoken at over 30
international technical sessions and is frequently quoted
as an industry expert in major international technical and
business publications.
He was a co-founder and served as the president
of the Micro and Nanotechnology Commercialization
Education Foundation (MANCEF) from 2002 to 2004. Mr.
Grace has been or is currently a member of the editorial
advisory boards of Chip Scale Review, Sensor Magazin
(Germany), NASA NanoTech Briefs, Sensors Magazine,
R&D Magazine Micro/Nano Newsletter, ECN , Commercial
MicroManufacturing (UK), and Small Times and has
18
authored over 40 articles on MEMS and sensors for these
and other technical publications. He serves on the advisory
boards of Northeastern University’s School of Engineering,
National Council, and Nanomanufacturing Research
Institute as well as on the Strategic Advisory Board of the
University of Michigan’s Wireless Integrated Microsystems
and Sensors Center (WIMSS). Mr. Grace has served on the
Board of Directors of the Florida Manufacturing Extension
Partnership since 2008.
He was selected as a recipient of the Outstanding
Engineering Alumni of the Year in 2004 by Northeastern
University. Mr. Grace held the position of visiting lecturer
at the University of California at Berkeley College of
Engineering from 1990 to 2003. His educational background
includes a B.S.E.E. and M.S.E.E. (as a Raytheon Company
fellow) from Northeastern University, and the MBA program
at Haas Graduate School of Business at U.C. Berkeley.
Tim Saxe
CTO, QuickLogic
Dr. Timothy Saxe joined QuickLogic in May 2001 and has
served as our Senior Vice President and Chief Technology
Officer since November 2008, Chief Technology Officer
and Senior Vice President, Engineering since August 2006,
and Vice President, Engineering since November 2001.
From November 2000 to February 2001, Dr. Saxe was Vice
President of FLASH Engineering at Actel Corporation, a
semiconductor manufacturing company. Dr. Saxe joined
GateField Corporation, a design verification tools and
services company formerly known as Zycad, in June 1983
and was a founder of their semiconductor manufacturing
division in 1993. Dr. Saxe became GateField’s Chief
Executive Officer in February 1999 and served in that
capacity until GateField was acquired by Actel in November
2000. Dr. Saxe holds a B.S.E.E. degree from North Carolina
State University, and an M.S.E.E. degree and a Ph.D. in
electrical engineering from Stanford University.
Willard Tu
Director, Embedded Software, ARM
Willard is the Director of Embedded at ARM, responsible
for developing the awareness of ARM technologies in the
embedded markets such as Automotive, Smart Energy,
and Standard Microcontrollers. He is a 26-year veteran
of the semiconductor industry, having worked in variety
of engineering, sales and marketing positions promoting
semiconductors for embedded applications for Motorola
Semiconductor (Freescale), National Semiconductor, and
NEC Electronics (Renesas). Willard holds a BSEE from the
University of Michigan, and a MBA from the University of
Phoenix. He has been with ARM since 2006.
19
Panels
www.isit.fraunhofer.de
RESEARCH AND
PRODUCTION
IN ONE LOCATION
MEMS Market
MONDAY, 9 MARCH | 14:50 - 15:50
This informative panel discussion will feature two of the leading Analysts in
the MEMS & Sensors marketplace. This power packed hour long session will
feature two key presentations from IHS and Yole Développment followed by
an interactive panel discussion and audience Q&A. This panel will discuss how
MEMS & Sensors have impacted our industry in the consumer, automotive,
wireless and industrial sectors. It will also highlight the recent hot topics such
as the Internet of Things and wearables, and will attempt to assess just how
significant these opportunities really are.
• MEMS
• Power Electronics
• Biotechnical Microsystems
• Design and Simulation
• Packaging
• Quality and Reliability
• Integrated Power Systems
Anzeige 139,7x108_4cRZ.indd 1
23.02.15 18:42
Internet of Things
TUESDAY, 10 MARCH | 11:30 - 12:30
The Internet of Things/Everything (IOE/IOT) encompasses many diverse
markets and applications. A common element in many of the markets and
applications are MEMS and sensors and the associated algorithms for sensor
fusion and more. As IOE/IOT volumes grow so do the demands on cost, low
power, security, innovation and other technology and business challenges.
MEMS and sensors are having a direct impact in all these areas and this panel
will discuss the opportunities and advances needed to scale IOT/IOE in the next
5-10 years. Wherever you are in the supply chain, this panel will discuss topics,
and take your questions on them, that could influence your future product
decisions – be sure not to miss it!
20
21
MEMS & Sensors Technology Showcase
NeOse by Aryballe
A personal device to connect to smartphones and
databases, able to recognize a wide spectrum of
different odors.
Based on the combination of Nano, Biotech, IT and
Cognitive Sciences, Aryballe will develop Innovative
technologies, databases, software and devices applied
to the identification, measurement and representation
of smells and tastes. The company’s main product
NeOse will be launched in 2016 and should be the first
Universal Portable Odor detector (e-nose) on the market.
Demox by CSEM
The Demox reader has been developed to monitor
oxygen in real time in cell and tissue cultures, but is a
versatile device that enables oxygen measurements in
many other contexts. It can be used, for example, for
the quality control of air, water, and process control of
food or beverages, as well as for diagnosis in applied
and basic researches. The only requirement is an optical
access to sensor patches in contact with the sample. An
indisputable advantage of the reader is its compatibility
with the microscopes that are used for almost all investigations with living biological
materials. The measurements are non-invasive, thus avoiding sample contamination,
show no oxygen consumption and are displayed in user friendly software. In contrast to
electrochemical methods, there are no maintenance and no calibration requirements.
In summary, a new oxygen reader has been developed. It allows rapid and efficient
non- invasion determination of oxygen concentration. As an “objective-like” device,
Demox can be installed on most commercial microscopes. The combination of this
compact reader with inexpensive sensing materials provides an innovative oxygen meter
that opens new applications in health and environmental monitoring. The solution is
highly customizable in terms of power supply, wireless communication or e-reading on
mobile devices. CO2 and pH systems are also under development.
CSEM, Centre Suisse d’Electronique et de Microtechnique (Swiss Centre for Electronics
and Microtechnology), founded in 1984, is a private research and development
centre, which has specialized in microtechnology, nanotechnology, microelectronics,
systems engineering and communications technologies. It offers its customers and
industry partners tailor made innovative solutions based on its technological expertise
from applied research. Furthermore, in founding start-ups, it actively contributes to
developing Switzerland as an industrial location. CSEM’s areas of expertise include:
medical and healthcare, safety and security, environment, transportation, industrial
process control. CSEM has as the mission of creating wealth through technological
innovation. Over time it has developed two main mechanisms of creating value for
the economy and society as a whole: by direct technology transfer to industry and by
creating spin-off companies. Further information is available at www.csem.ch.
EnerBeeRv2 by EnerBee
EnerBee Rv2 is a motion-based energy harvester, which
produces electricity independently from the motion speed,
and powers low-power devices in applications like building
automation, access control and smart objects.
EnerBee is developing motion-based energy solutions,
replacing wires and batteries in industrial and consumer
smart objects.
TLC System by BAM Labs
BAM Labs developed an innovative Touch-Free Life Care
(TLC) System using Freescale’s MPXV2010 pressure sensor,
MCU and applications processor to provide comprehensive
hardware support for data collection, networking and
communications for nonintrusive health monitoring. The
TLC System tracks bio-signals without keeping patients
tethered to bedside monitors.
Having personally experienced frustration with wired
medical monitoring devices, two old friends from Apple, Rich Rifredi and Steve Young
decided to get together to create a device that would unchain patients from this burden.
They joined with some of the top minds of Silicon Valley to build a digital health solution
that would forever redefine the health care experience. Soon, it became clear the “touchfree” aspect of this technology reached far beyond medical applications and BAM Labs
was born. (BAM: Body and Motion)
MOX Gas Sensor by Cambridge CMOS Sensors (CCS)
Founded in 2008, Cambridge CMOS Sensors
(CCS) is the industry leader in advanced sensor
solutions providing sensor technology across
multiple global markets. CCS is a fabless
semiconductor company with an established
high-volume supply chain that is qualified to
ISO:9001, ISO:14001 as well as TS16949. The
technology developed by CCS offers a radical
step change in performance when compared
to the competition; this has opened up multiple
markets which previously were unserviceable.
Ultra-low power consumption, fast response
time, embedded intelligence and ultra-small form
factor has enabled the growth of new application
areas for improved health and wellbeing such
as; ambient air quality monitoring and breath
analysis, in smartphones, tablets, wearables and
Internet of Things (IoT) devices.
Indoor air quality and alcohol
breath analysis using mobile
phone.
Place your vote at the MIG registration desk.
Results will be announced Tuesday, 10 March
at 17:15.
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Sponsors
PLATINUM SPONSOR
EV Group | www.evgroup.com
Your Partner in Collaboration
and Consensus Building
• Over 1,100 active standards
• More than 550 standards currently under development
• 6,400+ individual members
• 200+ additional corporate members
IEEE standards help to define the future:
• IEEE 2030® First Smart Grid Interoperability Guide
• IEEE 802.3TM , IEEE 802.11TM Standard for Ethernet, Wi-Fi®
• IEEE 11073TM Personal Health Device Communications
• IEEE P2301TM, IEEE P2302TM Cloud Computing Standards
• IEEE P2413TM IoT Architectural Framework Standard
• IEEE 2700TM Sensor Performance Parameter Definitions
To learn more about IEEE-SA visit standards.ieee.org
EV Group (EVG) is a leading supplier
of equipment and process solutions for
the manufacture of semiconductors,
microelectromechanical systems (MEMS),
compound semiconductors, power devices, and
nanotechnology devices. Key products include
wafer bonding, thin-wafer processing, lithography/nanoimprint lithography
(NIL) and metrology equipment, as well as photoresist coaters, cleaners and
inspection systems. Founded in 1980, EV Group services and supports an
elaborate network of global customers and partners all over the world.
GOLD SPONSOR
SPTS Technologies | www.spts.com
SPTS Technologies, an Orbotech company,
designs, manufactures, sells, and supports
etch, PVD, CVD and thermal capital equipment
and process technologies for the global
semiconductor and micro-device industries, with focus on the MEMS,
CVD,
Thermal Technolog
advanced packaging, LED, high speedPVD,
RF device
and Etch
power&
management
markets.
for MEMS Applications
The solutions offered by SPTS include market-leading silicon etch, dielectric
etch, dry-release etch, PVD, PECVD, APCVD and large batch vertical furnaces,
Etch
available with a range of wafer-handling options applicable to R&D, pilot
• HighrateSiDRIEwithunique
production, or volume production. Comprehensive service and spare
parts
ClaritasTMendpoint
support are offered through a worldwide network of service centres and
• DryreleaseetchusingHForXe
qualified local agents.
Deposition
• PVDforBAW/SAWapplications
• Lowtemperature,stress-controlled
PECVDforSiO/SiN
Thermal
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• LowCoOthickdopedandun-d
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polysilicon
SILVER SPONSORS
BRONZE SPONSORS
Analog Devices | www.analog.com
Applied Materials | www.appliedmaterials.com
Analog Devices Inc. (ADI) is a world leader
in the design, manufacturing and marketing
of a broad portfolio of high performance
sensor and signal processing technologies.
Our technology plays a fundamental role
in the sensing, converting, conditioning, and processing of real-world
phenomena such as temperature, pressure, sound, light, speed, and motion
used in a wide array of electronic devices. ADI’s MEMS portfolio includes
accelerometers, gyroscopes, MEMS subsystems, and inertial measurement
units (IMUs). ADI MEMS accelerometers provide accurate detection while
measuring acceleration, tilt, shock, and vibration, and our portfolio leads
the industry in power, noise, bandwidth, and temperature specifications.
ADI MEMS gyroscopes reliably sense and measure the angular rate of an
object under complex and severe operating conditions, and our portfolio
includes analog and digital output, high vibration and shock immunity, and
temperature sensitivity control to 25 ppm/°C. Analog Devices iSensor®
MEMS inertial measurement units (IMUs) are plug-and-play solutions
based on multi-axis combinations of precision gyroscopes, accelerometers,
magnetometers, and pressure sensors, and include full factory calibration,
embedded compensation and sensor processing, and a simple
programmable interface. iSensor MEMS IMUs reliably sense and process
multiple degrees of freedom, even in highly complex applications and under
dynamic conditions.
Applied Materials, Inc. is the global leader
in providing innovative equipment, services
and software to enable the manufacture of
semiconductor, flat panel display and photovoltaic
products. With over 40 years’ experience, we are
the global leader in creating high-volume nano-manufacturing technology
and equipment. In that time, we’ve helped high-tech manufacturers improve
factory efficiency and end-product performance, effectively creating and
taking advantage of market growth opportunities. At Applied Materials, we
understand the rigorous requirements of an evolving MEMS market and the
emerging challenges of broad new application segments such as the Internet
of Things (IoT). Our expanding portfolio of 200mm tools, materials and
processes demonstrates our ongoing commitment to helping 200mm device
makers meet the application specific needs of these markets while increasing
overall functionality and yield.
Freescale Semiconductor | www.freescale.com/xtrinsic
Freescale is a global semiconductor
company enabling the Internet of Tomorrow.
We develop solutions to provide secure
efficient connections, safer and greener
automobiles, and add intelligence to everyday
items. As a leader in processing and sensing solutions, we are driving a more
innovative and connected world for the future.
Expanding on its more than 35-year heritage of sensor innovation,
Freescale has an extensive portfolio of acceleration, magnetic, pressure,
touch sensors and gyroscopes. Freescale sensors, smart digital networks
and microcontrollers provide complete solutions for a secure Internet of
Tomorrow. Freescale is the only company supplying Internet of Tomorrow
solutions from sensors (edge) to network to cloud.
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Fraunhofer ISIT | www.isit.fraunhofer.de
Fraunhofer ISIT is a world-leading center for
Power Electronics and MEMS.
ISIT operates two 8” wafer fabs for
microelectronics and MEMS, both commonly used
for Research & Development, and mass production in close cooperation with
the companies VISHAY and X-FAB MEMS Foundry Itzehoe. In this way, ISIT can
offer to transfer new R&D results on-site instantly into volume production
and application.
Important areas of application include renewable energies, life science,
IT, automotive industry, consumer goods industry, medical technology,
communications technology, and automation.
Fraunhofer ISIT has strong activities in all important aspects of system
integration, assembly and interconnection technology (packaging), and in the
reliability and quality of components, modules, and systems. The institute
also provides design and manufacturing support for application-specific
integrated circuits (ASICs) to operate sensors and actuators. Activities are
rounded off by the development and pilot production of electrical energy
storage devices with a focus on Li-polymer batteries.
Fraunhofer ISIT supports customers all along the way from design and
system simulation to the production of prototypes, and preparation for
series production. The institute currently employs a staff of around 160 highlevel experts with engineering and natural sciences background.
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ULVAC | www.ulvac.com
SPONSORS
ULVAC is an international corporation,
based in Japan, which has been in business
for more than 60 years. ULVAC designs and
manufactures systems, equipment, and materials for the industrial and
research applications of vacuum technology. ULVAC systems products
cover a broad spectrum of markets, with equipment for: the automotive
manufacturing industry, semiconductor and electronics manufacturing,
flat panel display manufacturing, roll-coating, precision metallurgy,
solar cell/panel manufacturing, and industrial vacuum processes. In the
semiconductor and advanced electronics markets, ULVAC offers solutions
for: IC Fabrication (memory, logic, ASIC), advanced non-volatile memory
fabrication, advanced packaging applications, thin film battery fabrication,
LED manufacturing, SiC power device fabrication, and MEMS/MOEMS for
sensors, actuators, RF, Optics, and Microfluidics fabrication. A complete line
of vacuum components is also offered which includes vacuum pumps of all
types, helium leak detectors, UHV systems and gauges, RGA’s and thermal
analysis instrumentation. In North America, ULVAC Technologies Inc. has
been long-established in Methuen, MA. This facility houses: sales, customer
service support, engineering, domestic manufacturing for plasma Etching
and Ashing systems, a fully equipped applications lab, and an etch foundry
services operation.
PANEL SPONSORS
X-FAB MEMS Foundry | www.xfab.com
X-FAB MEMS Foundry offers unsurpassed
experience, expertise and execution with its highvolume MEMS manufacturing service. The first
pure-play MEMS foundry, X-FAB draws on more than
15 years MEMS manufacturing. Operating from five
fabs for MEMS and CMOS processes and an ecosystem of manufacturing and
design partners, X-FAB is the proven choice for process development and
installation, process capability, design support and long-term manufacturing
stability. As well as customer specific process installation, X-FAB offers a
range of qualified, open-platform processes and designs for key MEMS
device types, enabling customers to have the fastest time to market in the
foundry industry.
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Akustica | www.akustica.com
Akustica is a wholly owned subsidiary of the Bosch
Group and a top supplier of silicon microphone
products that are improving voice-input quality in
a host of voice-enabled applications, from mobile
phones, laptops and tablets to small wearable
accessories like headsets. The company offers worldwide customer support
services, from design-in services to post-production quality assurance.
Akustica is a global organization with corporate headquarters in Pittsburgh,
PA, regional offices in Taiwan and Shanghai, and a worldwide team of
distributors.
Bosch Automotive Electronics | www.bosch-sensors.com
Bosch Automotive Electronics (AE) –
headquartered in Reutlingen, Germany – is
the largest manufacturer of micromechanical
sensors and one of the largest automotive
semiconductor manufacturers in Europe.
AE is the undisputed market leader for automotive MEMS (Micro-ElectroMechanical Systems) sensors. We design, manufacture, and sell sensors,
ASICs, ASSPs, and power semiconductors, based on experience in automotive
electronics components of more than 40 years. With sales and application
forces located in Europe, North America, Japan, China, and South Korea, AE
offers worldwide customer support. In addition to the Bosch Group itself,
our customer base includes many well-known ECU makers in the Automotive
sector.
Bosch Sensortec | www.boschsensortec.com
Bosch Sensortec GmbH is a fully owned subsidiary of Robert Bosch GmbH,
dedicated to the consumer electronics world offering a complete portfolio of
micro-electro mechanical systems (MEMS) sensors and solutions that enable
mobile devices to feel and sense the world around them. Bosch Sensortec
develops and markets a wide portfolio of MEMS sensors and solutions for
smart phones, tablets, wearable devices and IoTS (Internet of Things &
Services) applications.
The product portfolio includes 3-axis acceleration, gyroscope and
geomagnetic sensors, integrated 6- and 9-axis as well as environmental
sensors and a comprehensive software portfolio. Since its foundation in
2005 Bosch Sensortec emerged as the technology leader in the addressed
markets. The Bosch Group has been the global market leader for MEMS
sensors since 1998 and has to date sold more than 4 billion MEMS sensors.
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PRESS CONFERENCE SPONSOR
PROGRAM SPONSOR
IEEE Standards Association (IEEE-SA) | www.ieee.org/standards
MEMS Journal | www.memsjournal.com
IEEE Standards Association (IEEESA) is a leading consensus building
organization that nurtures, develops and
advances global technologies through
a full lifecycle approach including prestandards technology exploration, standards
development, and market implementation.
Our standards drive the functionality, capabilities, and interoperability of
a variety of products and services that transform the way people live, work,
and communicate.
With collaborative thought leaders in more than 160 countries, and over
900 active standards, we promote innovation, enable the creation and
expansion of international markets and help protect health and public safety.
We are the largest MEMS publication
worldwide. We cover the most notable
MEMS news and developments to ensure
that our subscribers explore and take
advantage of the latest business development, commercialization and
partnership opportunities.
We provide the following services:
* executive and engineering recruiting
* marketing and advertising
* intellectual property brokerage
* MEMS and semiconductor equipment brokerage
* market research and intelligence
We were founded in 2003, currently have 34,800+ subscribers worldwide
and attract top-level executives, engineers and researchers who are active
participants in the MEMS community. For inquiries, please email us at info@
memsjournal.com.
DINNER SPONSOR
LUNCH SPONSOR
VTT Technical Research Centre of Finland |
www.vtt.fi
PlanOptik | www.planoptik.com
VTT Technical Research Centre of Finland is a globally networked multitechnological contract research organization. VTT offers access to the crossdisciplinary expertise of 2,500 professionals, unique research infrastructure,
and easy transfer from development to production. Our contract
manufacturing service supports customers from pilot line production to
higher volumes in wide range of applications.
VTT is a partner to build up customized solutions in MEMS. Arrowheads
in MEMS offering includes tuneable optical pass band filters enabling
spectrometer applications from UV to infrared radiation, piezoelectric
actuation platform enabling use of piezoelectric materials in various MEMS
applications, intrinsically temperature stable Si resonators, cMUT/pMUT
technology, and modelling/simulations of MEMS.
Plan Optik AG, a high tech glass processor,
existing since 1972 and based in Germany,
has focused more and more on MEMS related
products from glass, quartz and silicon (mainly
wafers used for wafer level packaging of MEMS
and carriers for temporary bonding of device wafers).
Within the last years, Plan Optik – Wafers set the standard for glass wafers
of this still young market. In the near future the technologies developed
and used by Plan Optik will set new standards in consumer electronics
– especially for mobile phones and DVD pickup heads of the newest
generation.
Plan Optik is already serving customers in Asia, North America and Europe
such as Infineon, Motorola, Samsung, Honeywell, Zeiss and Bosch. Markets
Served: MEMS, Semiconductor, Consumer Electronic.
BREAK SPONSOR
Okmetic | www.okmetic.com
Okmetic supplies advanced silicon wafers for
sensor and semiconductor applications and sells
its technological expertise. Okmetic is the global
market leader in demanding MEMS-based sensor wafers, with 30 years’
experience in MEMS business. The company provides a wide range of 100200mm silicon wafers for surface and bulk micromachining, encapsulation
and MEMS-IC-integration designs including double-side polished (DSP),
single-side polished (SSP), epitaxial, and bonded silicon-on-insulator (SOI)
wafers.
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ASSOCIATION SPONSOR
Smart Systems Integration | www.mesago.de/en/SSI
MIPI Alliance | www.mipi.org
Smart Systems Integration 2015 is the
international communication platform for
research institutes and manufacturers to
exchange know-how on Smart Systems
Integration and to create the basis for successful research co operations with
focus on Europe.
Top class speakers from well-known organizations in science and industry
will provide international experts on the most recent developments,
applications and trends.
The conference with its accompanying exhibition addresses the complete
range of products from complex systems to individual components, is user
and practically focused, and showcases the international research and
development potential of the technology.
An attractive social program including a pre-conference trip and the
traditional conference dinner will complete the event.
MIPI Alliance (MIPI) develops interface
specifications for mobile and mobile-influenced
industries. Founded in 2003, the organization
has more than 275 member companies
worldwide, more than 15 active working groups, and has delivered more
than 45 specifications within the mobile ecosystem in the last decade.
Members of the organization include handset manufacturers, device OEMs,
software providers, semiconductor companies, application processor
developers, IP providers, test and test equipment companies, as well as
camera, tablet and laptop manufacturers.
MEDIA SPONSORS
MNX | www.mems-exchange.org
MNX® is the nation’s leading provider of highquality fabrication, foundry and design services
for MEMS and Nanotechnology. We offer the most
comprehensive and diverse set of implementation
solutions for MEMS, micro- and nano-technologies
to be found anywhere in the world. The MEMS
and Nanotechnology Exchange customer list includes over 900 organizations
around the country including multinational corporations, small start-ups,
leading academic research institutions, and government facilities.
Semico Research | www.semico.com
Semico Research is a semiconductor
marketing & consulting research
company located in Phoenix, Arizona.
Semico was founded in 1994 by a group
of semiconductor industry experts. We have improved the validity of
semiconductor product forecasts via technology roadmaps in end-use
markets. Semico offers custom consulting, portfolio packages, individual
market research studies, a monthly report featuring the 1 year forward
looking Inflection Point Indicator (IPI) and premier industry conferences.
Key areas of focus include MEMS, semiconductor manufacturing, IP, design
starts, SOC, memory, logic, analog, and an on-line end use market database
offering 24/7 access.
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Solid State Technology | www.solid-state.com/mems
Solid State Technology is the leader in
covering MEMS, semiconductor, packaging,
displays and LEDs manufacturing technology,
materials, products and news. For over 50
years, we have delivered the highest caliber
content through our free magazine, and we also offer free e-Newsletters,
a comprehensive website and an annual conference, The ConFab. In Solid
State Technology Magazine, our MEMS direct e-Newsletter and the MEMS
channel on our website (www.solid-state.com/mems), we focus on MEMS
manufacturing and packaging challenges and new integration strategies.
Yole Développement | www.yole.fr
Beginning in 1998 with Yole Développement, we
have expanded to a group of companies providing
market research, technology analysis, strategy
consulting, media, and financial services.
Yole Développement group has grown to more
than 50 associates worldwide covering emerging
and disruptive silicon and micro manufacturing
markets including MEMS, medical technologies (including Microfluidics
and BioMEMS), advanced packaging, compound semiconductors, power
electronics, LEDs, and photovoltaics. The group supports companies,
investors and R&D organizations worldwide in understanding markets and
following technology trends to grow their businesses.
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MEMS Industry Group
GOVERNING COUNCIL
Dave Monk, Ph.D. (Chairman)
Freescale Semiconductor
David Kirsch
EV Group, Inc.
Kevin Crofton
SPTS Technologies
Magnus Rimskog
Silex Microsystems
John Chong, Ph.D.
Kionix
Yoshio Sekiguchi
OMRON Corporation
Jeff Hilbert
Wispry
Jason W Weigold, Ph.D.
MEMStaff, Inc.
Bryan Hoadley
Podium Advisors
Becky Oh
Precision Navigation Corp.
Evgeni Gousev
Qualcomm Technologies, Inc.
Harvey C. Nathanson, Ph.D.,
Emeritus
Northrop Grumman, Retired
(Permanent Seat)
Jim Knutti,Ph.D.
Acuity, Inc.
MANAGEMENT TEAM
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Karen Lightman
Executive Director
[email protected]
Ellen Saksen
Director of Marketing
[email protected]
Chivonne Hyppolite
Program & Event Manager
[email protected]
Rebecca Sands
Marketing Associate
[email protected]
Kara Laux-Bell
Office Associate
[email protected]
Maria Vetrano
Public Relations
[email protected]
Shelley Petro
Business Manager
[email protected]
Steve Whalley
Chief Strategy Officer
[email protected]
Monica L. Takacs
Director of Membership
[email protected]
Mike Zabka
Web Assistant
[email protected]
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Special Thanks
Thank you to our member-driven committees that make MEMS Executive
Congress® Europe a success!
Steering Committee
Vincent Agache, CEA - LETI – Minatec
Patrick ALBERT, CSEM
Ajith Amerasekera, Texas Instruments
Julien Arcamone, CEA - LETI - Minatec
Harrison Beasley, Global Semiconductor Alliance
Herbert Bennett, NIST
Roc Blumenthal, Wisdom IC Microelectronics Company, Ltd.
Michelle Bourke, Oxford Instruments
Lisa Bradley, Freescale Semiconductor
Frederic Breussin, Yole Developpement
Jess Brown, Cambridge CMOS Sensors
Gene Burk, Innovative Micro Technology IMT
David Butler, SPTS Technologies
Venkataraman Chandrasekaran, Analog Devices
Destanie Clarke, SPTS Technologies
Michael Daily, Merit Sensor Systems, Inc.
Thomas Dietrich, IVAM Fachverband Mikrotechnik
Dave Doyle, DelfMEMS
Jean-Christophe Eloy, Yole Developpement
Thomas J Fries, FRT Fries Research and Technology GmbH
Roger Grace, Roger Grace Associates
Andy Green, QuickLogic Corporation
Sam Guilaume, InvenSense, Inc.
Meggie Hakim, Intel Corporation
Paul Harris, Brewer Science
Koichi Ikeda, SONY Electronics
Anu Kärkkäinen, VTT Technical Research Centre of Finland
Andreas Kopetz, Infineon Technologies
Juhana Kostamo, Picosun Oy
Pascal Langlois, Tronics
Pinyen Lin, TSMC
Chris Magnella, Freescale Semiconductor
Lisa Mansfield, SPTS Technologies
Jennifer McAleer, MIPI Alliance
Peter Merz, X-Fab Semiconductor Foundries AG
Philippe Monnoyer, VTT Technical Research Centre of Finland
Seppo Nissila, SilverBlip Ltd
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Gary O’Brien, Bosch
Aarne Oja, VTT Technical Research Centre of Finland
Robert O’Reilly, Analog Devices
Dirk Ortloff, camLine
Marc OSAJDA, Freescale Semiconductor
Eric Pabo, EV Group
Marc Papageorge, SPEC Sensors, LLC
Yannick Pilloux, Plasma-Therm
Gino Putrino, Panorama Synergy Ltd
Hicham Riffi, Infineon Technologies
Mike Rosa, Applied Materials, Inc.
Tim Saxe, QuickLogic Corporation
Frank Schaefer, Bosch
Scott Smyser, Si-Ware
Niklas Svedin, Silex Microsystems
Jason Tauscher, MicroVision
Maurus Tschirky, CSEM
Willard Tu, ARM
Thomas Uhrmann, EV Group
Joost van Beek, NXP Semiconductors
Martina Vogel, Fraunhofer ENAS
Anna-Riikka Vuorikari-Antikainen, Okmetic Oyj
Bettina Weiss, SEMI
Kevin Witt, ClassOne Equipment
Melody Wolfgram, CareSpan International
Shuang Yu, IEEE Standards Association
Speaker Selection Committee
Patrick Albert, CSEM
Jess Brown, Cambridge CMOS
Meggie Hakim, Intel Corporation
Gary O’Brien, Bosch
Eric Pabo, EV Group
Hicham Riffi, Infineon
Anna-Riikka Vuorikari-Antikainen, Okmetic Oyj
Dave Thomas, SPTS Technology
Martina Vogel, Fraunhofer ENAS
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Members & Partners
Members
Acuity Incorporated
ACUTRONIC
AEPI Grenoble-Isere France
Economic Development Agency
Akrion Systems
AM Fitzgerald & Associates
Amkor Technology Euroservices
Analog Devices
Applied Materials
Applied Microstructures
ARM
ASE Group
Asia Pacific Microsystems
Audience
Axetris
bluechiip
Bosch
Boston Scientific
Brewer Science
Broadcom
Brooks Kushman
Bullen Ultrasonics
C2MI
Cambridge CMOS Sensors
Cambridge Software
camLine
CareSpan
CEA-Leti
Charles Stark Draper Laboratory
Cinder Solutions
ClassOne Equipment, Inc.
Coto Technology
Coventor
CrucialTec
CSEM
DelfMEMS
DME Microelectronics
dms-service llc
Dunan Sensing
Dyna-Image
Dynaloy Division |
Eastman Chemical Company
Empower Materials
Energizer Personal Care
Epson Electronics America
European Sensor Systems
EV Group
Expertech
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as of 3 March 2015
Fairchild Semiconductor/Xsens
Fraunhofer ENAS
Fraunhofer IPMS
Fraunhofer ISIT
Freescale Semiconductor
FRT - Fries Research & Technology
General Electric
GLOBALFOUNDRIES
Hanking Electronics
Hewlett-Packard Company (HP)
Hillcrest Labs
Honeywell
HTC
ICSense
IME
INEX Microtechnology
Infineon
Innovative Micro Technology (IMT)
Intel
Intellisense Software
Interlink
Invenios
InvenSense, Inc.
KBSO
Kionix
Knowles Electronics
Lam Research Corporation
Lenovo
LG Electronics
Ling Star Technology
Maradin Technologies
Maxim Integrated
mCube
MEMSRight
memsstar
MEMStaff
Merit Sensor Systems
Micralyne
Micrel
MicroGen Systems
Micron Technology
Micronit Microfluidics
MicroVision
Midwest MicroDevices
NADAtech
NIST
Novatel
Novati
NXP Semiconductors
OEM Group
Okmetic
OMRON Corporation
Optical Associates (OAI)
Oxford Instruments
Panorama Synergy
Picosun
Plan Optik
Plasma-Therm
PNI Sensor Corporation
Polytec
Qualcomm
Qualtré
QuickLogic
Rhyno 360
Rogue Valley Microdevices
Sand 9
Sensata
SHANGHAI INDUSTRIAL
µTECHNOLOGY RESEARCH (SITRI)
Siargo
Silex Microsystems
SilverBlip
SiWare
SmallTech Consulting
SMART Commercialization Center
for Microsystems
Smart System Technology &
Commercialization Center
SoftMEMS
SolMateS
Sony
SPEC Sensors
SPP Technologies Co., Ltd. (SPT)
SPTS Technologies
SSEC
STMicroelectronics
SunEdison
SUSS Microtec
Teledyne DALSA
Texas Instruments
The NEDLOH Group, LLC
Tronics Microsystems
TSMC
UBOTIC
ULVAC
Unisem
Valencell
Vesper
VirtualBeam
Virtuix
VTT Technical Research Centre
of Finland
Wafer World
Wisdom IC
Wispry
Xaarjet
X-FAB MEMS foundry
ZMDI
Partners
BSAC
Consumer Electronics Association
CMU ICES
Continua Healthcare
Extension Media
FlexTech Alliance
GSA
HIMSS
I.H.S
IEEE Standards Association
iNEMI
IVAM
M2M Evolution
MEMS and Nanotechnology
Exchange
MEMS Engineer Forum
MEMS Journal
MEPTEC
Micromachine Center
MIPI Alliance
MST-BW
Questex
Roger Grace Associates
SEMI
Semico Research
SIMIT
Smart System Integration
Tsensors Summit
WIMS2
Yole Développement
View our member list and get more information on each member at
www.memsindustrygroup.org/OurMembers
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MEMS Industry Group is the trade
association advancing MEMS &
Sensors across global markets.
As the “go-to” resource for globally linking the MEMS and sensors supply
chain to strategic markets, MIG helps companies in and around the MEMS
and sensors industry to make meaningful business connections. Device
manufacturers, software designers, materials and equipment suppliers,
foundry partners, market analysts, and OEM integrators all plug into the MIG
network to form alliances that will move their businesses forward.
MIG membership features a number of exclusive benefits:
The go-to resource for the
MEMS & Sensors industry.
Visit our website for membership information
and a full list of upcoming events:
www.memsindustrygroup.org
MEMS Industry Group
1620 Murray Avenue, Pittsburgh, Pennsylvania, USA
412-390-1644 (Phone)
twitter.com/MEMSGroup
youtube.com/user/MEMSIndustryGroup
memsindustrygroup.org/linkedin
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MIG offers members a seat in the MEMS and sensor ecosystem - from
upstream supplier to downstream customer
•
At our flagship and partner events, MIG provides myriad opportunities to
interface clearly and easily between each link of the MEMS and sensors
supply chain
•
MIG provides exclusive market data to inform business decisions
•
MIG provides exclusive market data to inform business decisions
•
MIG and MIG members drive standardization activities
•
MIG’s strong links to other industry groups and key research
organizations allows for easy engagement in adjacent fields
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MIG provides neutral, experienced forum for problem-solving
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MIG offers unparalleled visibility and promotion; we tap members first
for speaking engagements, press opportunities, digital content,
posters, etc.
•
MIG webinars and other educational materials provided by practitioners
with real experience and knowledge to share with members
SAVE 10% ON MEMBERSHIP DUES
for new members before 30 April!
www.memsindustrygroup.org
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Co-creating the MEMS
and Sensors Ecosystem
for the Next Decade
M2M Forum is now...
Be a part of the
Accelerated Innovation
Community (AIC)!
For companies creating sensor-based solutions, MEMS Industry
Group’s Accelerated Innovation Community (AIC) makes open
source sensor algorithms available for free - lowering cost and
barriers to entry and accelerating innovation.
The purpose of AIC is to reduce time-to-market, startup
costs, risk and barriers-to-entry by encouraging inputs and
collaboration from across the MEMS/sensors supply chain.
It has never been more critical to co-create technical solutions
and connect with the MEMS and sensors supply chain to
implement them. In its 15th year, the MEMS Technical
Congress (formerly Member-to-Member Forum) is your
focused opportunity to collaborate and address the important
technical hurdles common to MIG members, partners,
colleagues and customers.
Agenda Includes:
• Working Groups • Break Out Sessions • Keynotes
• Actual Deliverables • Draper Labs Tour
May 6-7, 2015 | Boston, MA
memstechcongress.memsindustrygroup.org
OPEN MEETING! MIG MEMBERS RECEIVE DISCOUNT
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COMMITTEE MEMBERS INCLUDE:
John Chong, Kionix Inc
Ian Chen, Freescale Semiconductor
Gary Fedder, Carnegie Mellon University
Michael Gaitan, NIST
John Huggins, BSAC - Berkeley Sensor & Actuator Center
Jim McGlasson, Freescale Semiconductor
Becky Oh, PNI Sensor Corporation
Robert O’Reilly, Analog Devices
Kristofer Pister, BSAC - Berkeley Sensor & Actuator Center
Andrew Taylor, PNI Sensor Corporation
Teoman Ustun, Analog Devices
Visit www.memsindustrygroup.org/aic for more
information, or contact Monica Takacs at
[email protected]
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May 6-7, 2015 - Boston, MA
November 6-7, 2015 - Napa, CA
http://memstechcongress.
memsindustrygroup.org
http://us2015.memscongress.com
September 9-10, 2015 - Shanghai, China
http://asia2015.memsindustrygroup.org
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Visit http://events.memsindustrygroup.org
or scan the QR code below for a
complete listing of upcoming events and
sponsorship opportunities!
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