1. business and industrial
2. business operations
3. business plans

CALL FOR PAPERS
ABOUT EPTC
IMPORTANT DATES
th
The 17 Electronics Packaging Technology Conference
(EPTC 2015) is an International event organized by the IEEE
Reliability/CPMT/ED Singapore Chapter and sponsored by
IEEE CPMT Society.
EPTC 2015 will feature technical sessions, short courses/
forums, an exhibition, social and networking activities. It
aims to provide a good coverage of technological developments in all areas of electronic packaging from design to
manufacturing and operation. It is a major forum for the
exchange of knowledge and provides opportunities to
network and meet leading experts in the field.
Since its inauguration in 1997, EPTC has developed into a
highly reputed electronics packaging conference in Asia and
is well attended by experts in all aspects related to
packaging technology from all over the world. EPTC is the
leading flagship conference of CPMT Society in Region 10.
CONFERENCE TOPICS
You are invited to submit an abstract, presenting new
development in the following categories:
 Advanced
Packaging: Flip-chip and wire-bond
packaging, embedded passives and actives on substrates,
3D System in Packaging, etc.
 TSV/Wafer Level Packaging: Wafer level packaging
( Fan in / Fan out ), embedded chip packaging, 2.5D/3D
integration, TSV, Silicon & Glass interposer, RDL,
bumping technologies, etc.
 Interconnection Technologies: Au/Ag/Cu/Al Wire-bond
/ Wedge bond technology, Flip-chip & Cu pillar
technology, solder alternatives (ICP, ACP, ACF, NCP,
ICA), Cu to Cu, Wafer level bonding & die attachment
(Pb-free) etc.
 Emerging Technologies: Packaging technologies for
MEMS, biomedical, optoelectronics, Internet of things,
photo voltaic, printed electronics, wearable electronics,
Photonics, LED, etc.
 Materials & Processes: Materials and processes for
traditional and advanced microelectronic systems, MEMS,
solar, green and biomedical packaging.
 Electrical Modeling & Simulations: Power plane
modeling, signal integrity analysis of substrate/package.
 Mechanical
Modeling & Simulations: Thermomechanical, moisture, fracture, fatigue, vibration,
Shock and drop impact modeling, Chip-package
interaction, etc.
 Thermal Characterization & Cooling Solutions:
Thermal modeling and simulation, component, system
and product level thermal management and
characterization
 Quality & Reliability: Component, board, system and
product level reliability assessment, Interfacial adhesion,
accelerated testing, failure characterization, etc.
 Wafer/Package
level
&
TSV
Testing
and
Characterization: High-speed test architectures and
systems design, 2.5D & 3D test methodologies, probe
card design, package-test interaction, high-throughput
testing etc.
Online abstract submission start
18th Mar 2015
Closing of abstract submission
30th May 2015
Notification of acceptance
15th July 2015
Submission of manuscript
14nd September 2015
ABSTRACT AND PAPER SUBMISSION
Abstracts are solicited to describe original and unpublished
work. The abstract should be at least 500 words and it must
clearly state the purpose, methodology, results (including
data, drawings, graphs and photographs) and conclusion of the
work. Key references to prior publications and how the work
enhances existing knowledge should be included in the
abstract as well. Authors can choose between oral or
interactive presentation Accepted papers have to be
registered and presented (oral & interactive) in the
conference by the authors, then will be published in IEEE
Xplore.
Authors must designate two appropriate categories (found
under CONFERENCE TOPICS) for abstract review. All
submissions must be in English and should be made via the
online submission system found at http://www.eptc-ieee.net.
The required file format is Adobe Acrobat PDF or MS Word in
one single file for each submission.
The abstracts must be received by 15th May, 2015. Authors
must include their affiliation, mailing address, telephone and
fax numbers, and email address. Authors will be notified of
paper acceptance and publication instruction by 15th July 2015.
The final manuscript for publication in the conference
proceedings is due by 14th September 2015. The conference
proceeding is an official IEEE publication and accepted paper
will be available in IEEE Xplore.
OUTSTANDING TECHNICAL PAPERS
Author(s) of Best Technical Paper (ORAL/INTERACTIVE),
Outstanding Technical Paper (ORAL) and Best Student Paper
will receive an award at the next conference. More details can
be found on http://www.eptc-ieee.net
CALL FOR SHORT COURSES
The conference program includes short courses, which will
conducted by leading experts in the field. Details will
updated in the conference website and available
subsequent mailings. Proposals for short courses can
submitted to [email protected]
CALL FOR EXHIBITION/SPONSORSHIP PARTICIPATION
A tabletop exhibition featuring suppliers of materials,
equipment, software and service providers of microelectronics
and electronic assembly industries, will be held during the
conference. Potential exhibitors and sponsors may email
[email protected] for details.
EPTC 2015: website: http://www.eptc-ieee.net Email: [email protected]
Join us on:
Organized by
IEEE Reliability/CPMT/ED Singapore Chapter
Linkedin [EPTC OC]
General Chair
CHONG Chin Hui
Micron
be
be
in
be
Follow us on:
Technical Chair
RAJOO Ranjan
Globalfoundries
Twitter [EPTC (@EPTCOC)]
Program Chair
Ganesh V.P.
Infineon
Sponsored by
IEEE COMPONENTS, PACKAGING AND
MANUFACTURING TECHNOLOGY SOCIETY
RENAMING OF POSTER PRESENTATION TO
INTERACTIVE PRESENTATION
FORMERLY POSTER PRESENTATION
 Interactive presentations are growing in popularity on
conferences all over the world. Similar to traditional poster
sessions, demonstrating your contribution as an interactive
presentation with additional aids gives you & your audience
(one to one) a great opportunity for in-depth
discussions/sharing and direct feedback for your
work/research/finding.
 No change in abstract submission and abstract selection
process. ( same as the oral/poster paper ).
 Interactive presentation format will be same as the poster
presentation format ( A1 size ).
WHAT’S NEW
o Can bring physical samples / parts / materials to show
conference delegates during their interactive
presentation for further explanation and sharing.
o Can bring technical paper /articles prints out for hand
out.( no product/commercial/marketing brochures).
o Can bring mini portable microscope / laptop/ tablet /
netpc or any other electronics device to aid in their
interactive presentation. ( conference will not provide
any electrical source / additional space / resources )
o Interactive presenters have to conduct within the
allocated space assigned to the presenter. ( same
space as previous eptc conferences )
EPTC 2015: website: http://www.eptc-ieee.net Email: [email protected]
Join us on:
Organized by
IEEE Reliability/CPMT/ED Singapore Chapter
Linkedin [EPTC OC]
General Chair
CHONG Chin Hui
Micron
Follow us on:
Technical Chair
RAJOO Ranjan
Globalfoundries
Twitter [EPTC (@EPTCOC)]
Program Chair
Ganesh V.P.
Infineon
Sponsored by
IEEE COMPONENTS, PACKAGING AND
MANUFACTURING TECHNOLOGY SOCIETY