1. No category

Conference Program
th
Wednesday, 6 of May
19:00
Dinner + open bar
th
Thursday, 7 of May
08:45
Opening session of ISSE2015
09:00
Oral session 1
KN1
KN4
K04
D10
Heterointegration of Multifunctional Systems
Karlheinz Bock; Institute for Electronics Packaging, Germany
Advanced Automotive Electronics Development at Bosch Engineering Center Budapest
Csaba Szabó; Robert Bosch Kft., Hungary
Low-Temperature Properties of Capacitors Embedded into Printed Circuit Boards
A. Dziedzic, T. Świetlik, P. Winiarski; Wroclaw University of Technology, Poland
Placement of Embedded Temperature Sensors in a Printed Circuit Board for a Manufacturing
Process; A. Neiser, D. Seehase, A. Fink, M. Nowottnick; Rostock University, Germany
10:30
Coffee break
11:00
Oral session 2
KN3
KN2
G01
A07
G06
13:00
Chaired by Gábor Harsányi & Heinz Wohlrabe
Chaired by Johann Nicolics & Andrzej Dziedzic
Nanomanufacturing R&D for Electronics Packaging
James E. Morris; Portland State University, USA
More than Moore, how much more?
József Gyulai; Budapest University of Technology and Economics, Hungary
Grain Size and Porosity Dependence of Titanium Dioxide Nano-paste on Sintering
Temperature for Gas Sensing Application; G. Miskovic, M. Hrovat, S. Drnovsek, M.V. Nikolic, O.S.
Aleksic, G. Radosavljevic; Vienna University of Technology, Austria
Study of Carbon-Fiber-Reinforced Polymers Conductivity’s Dependence on a Mechanical
Strain
I. Kharabet, I. Patsora, H. Heuer, D. Joneit, D. Tatarchuk; Technical University of Dresden, Germany
Interface of a Single ZnO-Nanowire Assembled onto Custom-Fabricated Nanogap Device for
UV Sensing Applications
B. Miccoli, A. Bonanno, V. Cauda, A. Sanginario, D. Demarchi; Politecnico di Torino, Italy
Lunch
14:00
KN5
KN6
A16
A09
A02
Oral session 3
Electronics, Microelectronics, Nanoelectronics…
János Mizsei; Budapest University of Technology and Economics, Hungary
Energy Efficient Nanoelectronics
Hervé Fanet; CEA-Léti, Minatec Campus, France
Thermal-Electronic Devices and Thermal-Electronic Logic Circuits (TELC)
J. Mizsei, M. C. Bein, L. Juhász, É. Jelinek; Budapest University of Technology and Economics, Hungary
Perspective Methods of Creating Conductive Paths by Aerosol Jet Printing Technology
J. Navratil, A. Hamacek, J. Reboun, R. Soukup; University of West Bohemia, Czech Republic
Aerosol Jet® Printing of Optical Waveguides; T. Reitberger, J. Hoerber, R. Schramm,
S. Sennefelder, J. Franke; Friedrich-Alexander University, Germany
16:00
Coffee break
16:15
Poster session 1
A01
D02
D29
F01
F02
G02
G03
G04
G05
I01
I02
I03
I04
I05
I06
I07
I08
I11
I12
K01
20:00
Chaired by James Morris & Ryszard Kisiel
Chaired by Paul Svasta & Alena Pietriková
Carbon Nanotube Dispersion Preparation and Deposition of Thin Layers for Gas Sensors
J. Stulik, M. Kroupa, T. Blecha, A. Hamacek; University of West Bohemia, Czech Republic
Relation between Tin Whiskering Ability Sn/Ag/Cu Solder Alloys and Current Load
B. Illés, N. Fehérvári; Budapest University of Technology and Economics, Hungary
Corrosion investigations on Lead-Free Micro-alloyed Solder Alloys used in Electronics
B. Medgyes, P. Tamási, F. Hajdu, R. Murányi, M. Lakatos-Varsányi, L. Gál, G. Harsányi; BME, Hungary
The Smart City - Integrated green energy system
E. Ceuca, G. Corsiuc; University “1 December 1918” of Alba Iulia, Romania
Environmental Aspects of LED–Lighting Systems: Functional Units and Colour Conversion
Materials; M. Franz, J. Nicolics; Vienna University of Technology, Austria
UWB Antenna Based on Nanoparticles of Silver on Polyimide Substrate
P. Lukacs, A. Pietrikova, J. Potencki, G. Tomaszewski; Technical University of Kosice, Slovakia
Electrical Properties of Inkjet Printed Graphene Patterns on PET-based Substrate
Č. Žlebič, L. Živanov, M. Kisić, N. Blaž, A. Menićanin, D. RanĎelović, M. Damnjanović; Serbia
Enhancing Plasmonic Biosensors with Nanotechnology
A. Bonyár; Budapest University of Technology and Economics, Hungary
Investigation of Surface Mechanical Properties of the Copper-Solder Interface by Atomic
Force Microscopy; J. Kámán, A. Bonyár, T. Hurtony, G. Harsányi; BME, Hungary
Measurement System for Sensitive Layers of Carbon Nanotubes
T. Blecha, J. Stulik, J. Cengery, V. Smitka; University of West Bohemia in Pilsen, Czech Republic
Examination and Development of Specialized Force Sensor
N. Nenov, E. Dimitrov, P. Piskulev; University of Transport, Sofia, Bulgaria
Software for a Bidirectional Communication System for Neuromotor Disabled Patients
L. Niţă, R.G. Bozomitu, V. Cehan, C. Rotariu, R.G. Lupu; RomSoft, Iaşi, Romania
Pupil Centre Coordinates Detection Using the Circular Hough Transform Technique
R.G. Bozomitu, A. Păsărică, V. Cehan, C. Rotariu, C. Barabaşa; “Gheorghe Asachi” Techn. Uni., Romania
Improvement of NDIR Carbon Dioxide Sensor Accuracy
M. Marinov, G. Nikolov, E. Gieva, B. Ganev; Technical University of Sofia, Bulgaria
Flexible Inkjet Printed Sensor for Liquid Level Monitoring
M. Kisic, N. Blaz, C. Zlebic, L. Zivanov, M. Damnjanovic; University of Novi Sad, Serbia
Displacement Sensor Based on Interdigital Capacitor
N. Blaž, M. Kisić, Č. Žlebič, G. Mišković, G. Radosavljević, L. Živanov; University of Novi Sad, Serbia
Development of Optical Inclinometer in LTCC Technology
J. Somer, M. Štekovič, F. Urban, I. Szendiuch; Brno University of Technology, Czech Republic
A Wireless Sensor Network for Remote Monitoring of Bioimpedance
C. Rotariu, R.G. Bozomitu, V. Cehan, A. Pasarica, H. Costin; “Grigore T. Popa” Univ. of Med., Romania
A Flexible Resistive Read-Out Circuit Suitable to Multi-purpose ZnO Nanostructured
Transducers for Robotic Applications;
A. Damilano, M. Crepaldi, H.M.A. Hayat, D. Demarchi; Istituto Italiano di Tecnologia@PoliTo, Italy
A SPICE Model for Electroluminescent Foils
C. Ionescu, F. Drăghici, D. Bonfert; University “Politehnica” of Bucharest; Romania
Dinner
th
Friday, 8 of May
08:45
KN7
KN8
D08
D14
D30
Oral session 4
The Use and Abuse of HAST for Assessment of Reliability for Severe Climates
Nihal Sinnadurai; ATTAC, United Kingdom
Technical Cleanliness: the Hidden Quality Feature in Electronics Manufacturing
Bálint Balogh; Continental Automotive Hungary Kft, Hungary
Similarity Based Reliability Qualification of Electronic Components
S. Stoyanov, G. Tourloukis, C. Bailey; University of Greenwich, United Kingdom
Effect of Component Standoff Height on Thermo-mechanical Reliability of Ball Grid Array
(BGA) Solder Joints Operating in High-temperature Ambient
J.E. Njoku, S. Mallik, R. Bhatti, E.H. Amalu, N.N. Ekere; University of Greenwich, United Kingdom
Data Driven Approach to Quality Assessment of 3D Printed Electronic Products
G. Tourloukis, S. Stoyanov, T. Tilford, C. Bailey; University of Greenwich, United Kingdom
10:40
Coffee break
11:00
Poster session 2
B01
B02
B03
B05
B06
B07
B08
B09
D25
E01
E02
E03
E04
E05
E06
E07
H01
H02
K02
K03
Chaired by Jan Felba & Mihai Branzei
Chaired by Ciprian Ionescu & Anna V. Andonova
Comparative Study of Printed Circuit Board Substrates used for Thermal Management of
High Power LEDs; J. Freisleben, T. Dzugan, A. Hamacek; University of West Bohemia, Czech Republic
Tunable LED Lamp – Design and Thermal Management
P. Mashkov, B. Gyoch, R. Kandilarov, H. Beloev, T. Pencheva; University of Ruse, Bulgaria
LED Lamp For Poultry Housing – Design and Thermal Management
P. Mashkov, B. Gyoch, R. Kandilarov, H. Beloev, M. Varbanov, T. Pencheva; Univ. of Ruse, Bulgaria
Dimensioning of Peltier Cooling System for Laser Applications in an Electric Cabinet
D. Mueller, S. Hildebrandt, F. Reifegerste, T. Zerna; Technische Universität Dresden, Germany
Study of High Power COB LED Modules with Respect to Topology of Chips
N. Vakrilov, A. Andonova, N. Kafadarova; Technical University of Sofia, Bulgaria
Component Placement Optimizations on PCBs for Improved Thermal Behaviour
A. Fodor, R. Jánó, D. Pitica; Technical University of Cluj-Napoca, Romania
Heat Treatment of Epoxy Resin used for BGA Chip Capillary Underfilling from Thawing to
Curing; Cs. Dinnyés, S. Szappanos; Continental Automotive Hungary Kft., Hungary
Peltier Elements vs Heat Sink in Cooling of High Power Leds
N. Bădălan, P. Svasta; University “Politehnica” of Bucharest, Romania
Quality Control of Metric Screw-driving Process in Automotive Electronics Production
I. Major, I. Molnár; Continental Automotive Hungary Kft., Hungary
Trajectory Estimation for Transportation Systems; Aircraft Tracking Applications
I. Costea, C. Dumitrescu, C. Banu, B. Soare; University Politehnica of Bucharest, Romania
Intelligent Seat Belt Locker
I. Costea, P. Tănasă, I. Cojocaru, I. Barbu, C. Banu; University Politehnica of Bucharest, Romania
Investigation of the Pre-heating Process during Thermosonic Wire Bonding by FEM
Simulation; T. Garami, G. Takács, O. Krammer, A. Szabó; BME, Hungary
The Vibration Testing as Tool for Optimizing of Two PCB Connection
A. Otáhal, B. Psota, I. Szendiuch; Brno University of Technology, Czech Republic
Investigating the Effect of Squeegee Attack Angle on the Solder Paste Pressure during Stencil
Printing; O. Krammer; Budapest University of Technology and Economics, Hungary
Role of Risks Modelling in Electronics Manufacturing
J. Šimota, J. Tupa; University of West Bohemia, Czech Republic
Optimization of Resistance Welding Process of Copper Power Pins
K. Tóth, B. Balogh, N. Propszt, S. Nagy, G. Gerényi, G. Bojtos; Continental Automotive Hungary Kft., Hungary
Investigations on Modern Power Supplies Development based on Custom PCB Structures
C.A. Tămas, N. Codreanu, M. Pantazică; Rompower Ltd., Tucson, U.S.A
A SPICE Analysis on How PDNs Can Benefit From Crosstalk Avoidance Code
M. Daraban, R. Fizesan, D. Pitica, L. Viman; Technical University of Cluj-Napoca, Romania
A Simple Method for Measuring and Sorting RF Coils based on the Inductance and Quality
Factor; V. Cehan, R.G. Bozomitu, E. Coca; Gheorghe Asachi Technical University, Romania
Fully Integrated Artificial Intelligence Solution for Real Time Route Tracking
L.M. Ionescu, A. Mazare, A.I. Lita, G. Serban; University of Pitesti, Romania
13:00
Lunch
14:00
Poster session 3
D01
D03
D04
D05
D06
D07
D09
D11
D12
D13
D15
D16
D18
D19
D20
D21
D22
D23
D24
D26
Chaired by Stoyan Stoyanov & Dan Pitica
A Comparison of the Shear Strength of Conductive Adhesives and Soldering Alloys
M. Hirman, F. Steiner; University of West Bohemia, Czech Republic
Simulation Based Experimental Study of the Temperature and Power Density Distribution in
a High-Power LED; P. Fulmek, W. Nemitz, F.P. Wenzl, S. Schweitzer, P. Hartmann, J. Nicolics; Vienna
University of Technology, Austria
A Self-Compensation Approach for Chromaticity Coordinate Maintenance of Phosphor
Converted LEDs upon Temperature Variations; W. Nemitz, F.P. Wenzl, S. Schweitzer, C. Sommer,
P. Hartmann, P. Fulmek, J. Nicolics; Vienna University of Technology, Austria
Microstrip Methods for Measurement of Dielectric Properties in High Frequency Area
T. Rovensky, A. Pietrikova, K. Ruman, O. Kovac; Technical University of Kosice, Slovak Republic
Measuring of Dielectric Properties by Microstrip Resonators in the GHz Frequency
T. Rovensky, A. Pietrikova, I. Vehec, M. Kmec; Technical University of Kosice, Slovak Republic
Impact of No-clean Fluxes Cleaning on PCB Ionic Contamination
K. Rendl, V. Wirth, F. Steiner; University of West Bohemia, Czech Republic
Diagnostics and Testing of Photovoltaic Devices
M. Váry, V. Šály, J. Packa, M. Perný, V. Schlosser; Slovak University of Technology, Slovak Republic
Evaluation of the Quality of SMDs according to Vacuum Vapour Phase Soldering
S. Lüngen, A. Klemm, H. Wohlrabe; Dresden University of Technology, Germany
Influence of Current and Combined Thermo-current Load on Microstructure and Resistance
of Solder Joints; P. Cabúk, J. Ďurišin, A. Pietriková; Technical University of Kosice, Slovak Republic
Effect of Multiple Reflow Cycles on Intermetallic Compound Creation
V. Wirth, K. Rendl, F. Steiner; University of West Bohemia, Czech Republic
Comparison of Shear Strength of Soldered SMD Resistors for Various Solder Alloys
K. Dušek, D. Bušek, T. Beran, A. Rudajevová; Czech Technical University in Prague, Czech Republic
Surface Finish Influence on PCB Contamination by Flux Spattering Effect
K. Dušek, D. Bušek, M. Slavata, A. Rudajevová; Czech Technical University in Prague, Czech Republic
Detection of Defects on BGA Solder Balls Using 2D and 3D Methods
P. Řihák, R. Vala, I. Szendiuch; Brno University of Technology, Czech Republic
Influence of Flux throughout Reflow Process on FBGA Solder Balls
R. Vala, P. Řihák, I. Szendiuch; Brno University of Technology, Czech Republic
Shear Strength Function of Temperature for Lead/Lead-Free Alloys Samples Obtained with
Different Cooling Rate;
M. Branzei, G. Varzaru, P.M. Svasta; University Politehnica of Bucharest, Romania
Quality Control of Chip on Board LED Packaging by Transient Thermography
A. Andonova, V. Georgieva, N. Kim, N. Vakrilov, B. Bonev; Technical University of Sofia, Bulgaria
Properties of Tunnel Junctions with Alumina Barrier
P. Mach; Czech Technical University in Prague, Czech Republic
Thermal Ageing of Polypropylene Film Capacitors
P. Mach, M. Horák, C. Stancu; Czech Technical University in Prague, Czech Republic
Possibilities of Motor Oil Continuous Diagnostics
S. Kardoš, A. Pietriková, J. Tóthová; Technical University of Kosice, Slovak Republic
Innovative Procedures for the Evaluation Method of the Efficiency in the Cleaning Process
M. Buršík, J. Jankovský, M. Řezníček, I. Szendiuch, V. Sítko; Brno University of Technology, Czech
Republic
16:00
Wellness hours at Saliris Resort
20:00
Dinner
th
Saturday, 9 of May
08:45
A03
A04
A05
A06
A08
A10
A11
A12
A13
A14
A15
A17
A20
C01
C02
C04
C05
C06
C07
10:45
Poster session 4
Chaired by Zsolt Illyefalvi-Vitez & Pavel Mach
Reduction of Dielectric Constant of LTCC Substrates by Introduction of Controlled Porosity
B. Synkiewicz, J. Kulawik, A. Skwarek; Institute of Electron Technology, Poland
Ionic Liquid as an Electrolyte for Organic Electrochemical Transistor
L. Mracek, S. Pretl, T. Syrovy, A. Hamacek; University of West Bohemia, Czech Republic
Electrical Characterization of a-SiC/c-Si Solar Cell Structures
M. Perný, V. Šály, M. Váry, M. Mikolášek, J. Huran; Slovak University of Technology, Slovakia
Effect of Incorporation of Different Additives in Sustainable Polymers on Selected Electrical
and Mechanical Properties
A. Staat, M. Vogt, K. Harre, R. Bauer; University of Applied Science Dresden, Germany
A Comparison of the Interdigital Electrodes Prepared by Aerosol Jet Printing and Lift-off
Technique
R. Soukup, J. Navratil, J. Reboun, T. Rericha; University of West Bohemia, Czech Republic
Flexible Inkjet Printed CPW Octagonal Inductor on PET Substrate
A. Menicanin, L. Živanov, N. Blaž, M. Damnjanović, Č. Žlebič, M. Kisić; University of Belgrade, Serbia
Fully Inkjet Printed CPW Meander Inductors on PET Flexible Substrate
A. Menicanin, L. Živanov, Č. Žlebič, M. Kisić, N. Blaž, M. Damnjanović; University of Belgrade, Serbia
Induction of Tin Pest Transformation in Solder Joints in Ceramic Packages of sub-THz Scanner
A. Skwarek, J. Kulawik, K. Witek; Institute of Electron Technology, Poland
Investigation of the Copper Deposition on Screen Printed Front Electrode of Solar Cell
K. Drabczyk, R.P. Socha, G. Mordarski, A. Skwarek; Polish Academy of Sciences, Poland
Experimental 13.56 MHz RFID Cards on Biodegradable Substrates
A. Géczy, L. Gál, L. Dudás, G. Horváth, B. Kovács, D. Nagy, I. Hajdu; BME, Hungary
Patterning Photosensitive Layers for Optoelectronic Applications
I. Csarnovics, S. Molnar, J. Burunkova, D. Zhuk , I. Denisyuk, A. Bonyar, Cs. Cserhati, S. Kokenyesi;
University of Debrecen, Hungary
Printed Inductors for RFID Tags
A. Shlykevich, T. Blecha, J. Řeboun, A. Hamáček, T. Syrový; Univ. of West Bohemia, Czech Republic
Hybrid Microelectronic Technology in Textile Techniques with the Aim of Realizing Smart
Textiles
H. Hadjiev, I. Rrahnev, P. Philippov; Technical University of Sofia, Bulgaria
Characterization of Polymeric Encapsulation for Implantable Microsystems applying Dynamic
Fluidic and Electrical Load
M. Schubert, S. Kirsten, T. Voitsekhivska, K. Bock; Technische Universität Dresden, Germany
Modified I – Q Demodulator for M-Sequence UWB Sensor System Based on LTCC
K. Ruman, A. Pietrikova, I. Vehec, T. Rovensky, P. Galajda; Technical University of Kosice,
Slovak Republic
Comparison of the Surface Properties of Power Electronic Substrates
K. Hromadka, J. Řeboun, K. Rendl, V. Wirth, A. Hamáček; University of West Bohemia, Czech Republic
Multiphysics Investigation of Gas Sensor Packages
R. Bonasewicz, S. Knies, A. Krauss, K.J. Wolter; Technische Universität Dresden, Germany
Solder Joints for Flexible Connection Working at Low Temperatures
R. Kisiel, M. Myśliwiec; Warsaw University of Technology, Poland
Randomness Extraction Techniques for Jittery Oscillators
A. Marghescu, P. Svasta, E. Simion; Politehnica University of Bucharest, Romania
Coffee break
11:00
A18
D28
D31
D32
D33
D34
D35
E08
E10
E11
E12
E13
E14
J01
J02
J03
J04
J05
J06
Poster session 5
The Correlation Between the Mechanical and Electrochemical Properties of Solder Joints
T. Hurtony, P. Gordon; Budapest University of Technology and Economics, Hungary
Real Time System for Image Acquisition and Pattern Recognition Using Boolean Neural
Network
A. Mazare, L.M. Ionescu, A.I. Lita, G. Serban; Politehnica of Bucharest, Romania
Determination of BGA Solder Joint Detachment Cause – Warpage Effect
D. Bušek, K. Dušek, M. Plaček, J. Urbánek, J. Horník, J. Holec; Czech Technical University in Prague,
Czech Republic
Assembly Method and its Influence on Electrically Conductive Adhesives and Solder Pastes
Joints Durability
D. Bušek, I. Beshajová, T. Kodad; Czech Technical University in Prague, Czech Republic
Investigation of the Wetting Properties of Cu6Sn5 Intermetallic Compound
P. Gordon, T. Hurtony; Budapest University of Technology and Economics, Hungary
Examination of Soldering Defect Formation at QFN Components
R. Bátorfi; Budapest University of Technology and Economics, Hungary
Investigation on Current Capabilities of Ni-based Conductive Pastes for PCB Repair
C.I. Marghescu, A. Drumea, B.T. Mihailescu; Politehnica University Bucharest, Romania
Electro-Thermal Analysis of Flexible Micro-Heater
A. Botau, D. Bonfert, C. Negrea, P. Svasta, C. Ionescu; Continental Automotive, Timisoara, Romania
Analysis and Optimization of a Geothermal, Biomass, Solar Hybrid System; An Application of
PV*Sol Software
T. Patarau, D. Petreus, R. Etz; Technical University of Cluj Napoca, Romania
Analysing Current Density in the Solder Joints of Chip-size Surface Mounted Resistors
A. Géczy, O. Krammer, A. Kovács, A. Sipos; BME, Hungary
Fuel Consumption Reduction of a Diesel-Electric Power Generator
A. Grama, D. Petreus, R. Etz, T. Patarau; Technical University of Cluj-Napoca, Romania
Simulations of Nanoparticle Based Integrated Inductance to FR4 Substrate
R. Berenyi, B.D. Voros; Budapest University of Technology and Economics, Hungary
FEM Based 3D Simulation of Nanosecond UV Laser Ablation
R. Berényi, D. Szaffner; Budapest University of Technology and Economics, Hungary
Education Tools for PCB Thermal Analysis
P. Cabúk, T. Girašek; Technical University of Košice, Slovakia
Educational Tool for Capacitor Lifetime Prediction
R. Jánó, A. Fodor; Technical University of Cluj-Napoca, Romania
Tool for Design and Simulation of Flyback Converters
A. Taut, O. Pop, I. Baciu; Technical University of Cluj-Napoca, Romania
Implementing Some Fundamental Electronics Concepts Using Project Based Learning in
Educational Platforms
T. Vlad, D. Pitică; Technical University of Cluj-Napoca, Romania
Supporting the Education of CAD Tools with Hardware Virtualization
P. Martinek, B. Villányi; Budapest University of Technology and Economics, Hungary
Clusters as a Catalyst for Developing Human Resources for the Internet of Things Industry
B. Mihailescu, P. Svasta, C. Marghescu, A. Borcea; Electronic Innovation Cluster, Romania
13:00
Lunch
14:00
Oral session 5
B04
C03
E09
Chaired by Norocel D. Codreanu & Tomáš Blecha
Chaired by Ing. Ivan Szendiuch & Ioan Lita
The Method of Measuring the Efficiency of Heat Transfer through Thermal Interface
Materials in Microelectronics Packaging
K. Stojek, B. Płatek, T. Fałat, J. Felba, P. Matkowski, A. Mościcki; Wrocław Univ. of Technology, Poland
The Effect of Ultrasonic Excitation on the Electrical Properties and Microstructure of Printed
Electronic Conductive Inks; A.B. Varotsis, R.A. Harris, R.J. Friel; Wolfson School of Mechanical and
Manufacturing Engineering, United Kingdon
Sizing Photovoltaic-Geothermal Smart Microgrid with Battery Storage Interface
E. Lázár, T. Pătărău, R. Etz, D. Petreuş; Technical University of Cluj-Napoca, Romania
15:30
City tour to Eger
19:00
Wine tasting + Gala dinner
th
Sunday, 10 of May
08:30
Farewell; End of conference
ISSE2015 has been sponsored by:
ISSE2015 map:
Program at a glance
Wednesday
th
6 of May
Thursday
th
7 of May
Friday
8 of May
Saturday
th
9 of May
Sunday
th
10 of May
Breakfast
7:30-8:30
Breakfast
7:30-8:30
Breakfast
7:30-8:30
Breakfast
7:30-8:30
th
Opening
ceremony
8:45-9:00
Registration
15:00-20:00
Farewell:
end of the
conference
Oral
session 1
9:00-10:30
Oral
session 4
8:45-10:40
Poster
session 4
8:45-10:45
Coffee
break
10:30-10:45
Coffee
break
10:40-11:00
Coffee
break
10:45-11:00
Oral
session 2
11:00-12:50
Poster
session 2
11:00-13:00
Poster
session 5
11:00-13:00
Lunch
13:00-14:00
Lunch
13:00-14:00
Lunch
13:00-14:00
Oral
session 3
14:00-16:00
Poster
session 3
14:00-16:00
Oral
session 5
14:00-15:00
Coffee
break
16:00-16:15
Wellness
hours
16:00-20:00
City tour to
Eger
15:30-19:30
Poster
session 1
16:15-18:30
Dinner
19:00-21:00
Dinner
20:00-21:00
SC meeting
21:00-22:00
SC meeting
21:00-22:30
SC meeting
17:30-19:00
Dinner
20:00-21:00
Wine
tasting +
Gala dinner:
19:00-23:30