36th International Electronics Manufacturing Technology
Conference (IEMT 2014)
Renaissance Johor Bahru Hotel, Johor, Malaysia
11th – 13th Nov, 2014
PROGRAM
COMMUNICATION
http://ewh.ieee.org/r10/malaysia/cpmt/
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36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
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Program Highlights
 5 technical courses offered by industry
leaders on 3D advanced packaging,
package reliability and mechanics,
advanced failure analysis techniques,
embedded technologies, power electronics
and high temperature power module design.
 9 keynotes covering latest technology and
industry trend in electronics packaging
 A panelist
forum titled “IoT: Roles of
Packaging and Industry Trends”, will
touch on packaging cost and its margin in
product; 18” wafer investment versus
Panel/FOWLP; SiP versus SoC; and low cost
innovation.
 Technical paper presentation tracks featuring
>90 technical papers & posters from around
the industry and academia
 More than 15 exhibitors from the renowned
microelectronics industries and supply chain
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
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36th IEMT 2014 PROGRAM OVERVIEW 11th – 13th Nov 2014
SHORT COURSES: 11th November 2014, TUESDAY
0800-0830
Meeting Room 2
0830-1200
Introduction to Mechanics based Quality
and Reliability Assessment Methodology
1200-1330
1330-1700
by Dr. Sane Sandeep &
Dr. Shubhada Sahasrabudhe
Registration at Secretariat (Level 2)
Meeting Room 3
Failure Analysis on Modern Logic and
Mixed-Signal IC’s: Tools and Methods
by Christian Burmer
Lunch
Advanced Stacked Die Packaging
Technology: More than 2D
by Dr John Yuanlin Xie
Meeting Room 5
High-Temperature Packaging with Emphasis
on Power Electronic Module
by Prof. Simon S. Ang
Power Electronics and Embedding
Technologies
by Rolf Aschenbrenner
EXHIBITION – 12th November, 2014, WEDNESDAY
0950-1730
Tabletop display at Foyer (Level 2)
CONFERENCE SESSION: 12th November, 2014, WEDNESDAY
0730-1730
Registration at Secretariat (Level 2)
Welcome Speech, Grand Ballroom
by Prof. Mohd. Nasir Tamin, IEMT2014 General Chair
0815-0830
0830-0910
0910-0950
0950-1045
Conference Opening Address: “Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices”
by Mr. Rolf Aschenbrenner, Fraunhofer Institute for Reliability and Microintegration
Keynote Address I: “Packaging and Interconnection Trend”
by Mr. Xavier Baraton, VP of Packaging & Test Manufacturing, STMicroelectronics
Coffee Break / Exhibition / Poster Session I
1045-1125
Keynote Address II: “Automotive Power Packaging – Trends and Challenges”
by Dr. Andreas Knoblauch, Director, Package Development Automotive Power, Infineon Technologies AG
1125-1205
Keynote Address III: “Packaging Technology Challenges for Mobile Computing Electronics”
by Mr. Sow Yeek Kooi, Director, Technology Enabling and Start-up, Intel Malaysia
1205-1330
1330-1510
Session A1, Meeting Room 2
Advanced Packaging
Lunch
Session B1, Meeting Room 3
Session C1, Meeting Room 5
Characterization & Test I
Materials I
Session D1, Meeting Room 6
Process I
Session A2, Meeting Room 2
Advanced Materials
Coffee Break / Exhibition
Session B2, Meeting Room 3
Session C2, Meeting Room 5
Design
Pb-free Technology
Session D2, Meeting Room 6
Wirebond I
1510-1545
1545-1725
1830-2200
Dinner & Cultural Show
1830-1930
PANELIST FORUM: IoT: Role of packaging and industry trends
Panelists: Rolf Aschenbrenner, John Xie, Xavier Baraton, Byeong Cheon Koh; Moderator: Chee Choong Kooi
1930-1945
BANQUET DINNER ADDRESS
by Dr. Siow Kim Shyong, Chairman, IEEE-CPMT Malaysia Chapter
EXHIBITION – 13th November, 2014, THURSDAY
0950-1500
Tabletop display at Foyer (Level 2)
CONFERENCE SESSION: 13th November, 2014, THURSDAY
0800-1500
Registration at Secretariat (Level 2)
0830-0910
Keynote Address IV: “Innovation in Low Cost Packaging”
by Dr John Yuanlin Xie, Director, Packaging Technology R&D, Altera Corporation
0910-0950
Keynote Address V: “Challenges and Solutions in Modeling of Ultra-Fine Pitch Microelectronics Packages”
by Prof. Andrew A O Tay, Department of Mechanical Engineering, National University of Singapore
0950-1020
1020-1200
Coffee Break / Exhibition
Session A3, Meeting Room 2
Process II
Session B3, Meeting Room 3
Session C3, Meeting Room 5
Characterization & Test II
Wirebond II
Lunch
Session D3, Meeting Room 6
Reliability
Session A4, Meeting Room 2
Copper Wire
Session B4, Meeting Room 3
Interconnect
Session D4, Meeting Room 6
Modeling
1200-1300
1300-1420
Session C4, Meeting Room 5
Materials II
1420-1500
Coffee Break / Exhibition / Poster Session II
1500-1540
Keynote Address VI: “Review of New MEMS Devices and their Manufacturing Technologies”
by Dr. Koh Byeong Cheon , Senior Executive Vice President (Retired), Samsung Electro-Mechanics
1540-1620
1620-1700
1700-1730
Keynote Address VII: “Test Point Selection Method for Mixed Signal Testing”
by Prof. Simon S. Ang, High Density Electronics Center, University of Arkansas
Conference Closing Address: “It’s a Small World After All: Recent Advances on Nano-materials and Technologies for Advanced Electronic,
Photonics and MEMS Applications”
by Prof. CP Wong, Dean of the Faculty of Engineering, The Chinese University of Hong Kong
Award Ceremony
11 NOVEMBER 2014, TUESDAY
0800-0830
Registration at Secretariat (Level 2)
Course I
Meeting Room 2
Course II-A
Meeting Room 3
Course III-A
Meeting Room 5
Introduction to Failure Analysis
Mechanics based
on Modern
Quality and
Logic and
Reliability
Mixed-Signal
0830-1200
Assessment
IC’s: Tools and
Methodology
Methods
by Dr. Sane
by Christian
Sandeep & Dr.
Burmer
Shubhada
Sahasrabudhe
HighTemperature
Packaging with
Emphasis on
Power Electronic
Module
by Prof. Simon S.
Ang
Lunch
1200-1330
Cont.’
1330-1700
Course II-B
Meeting Room 3
Course III-B
Meeting Room 5
Advanced
Stacked Die
Packaging
Technology:
More than 2D
Power Electronics
and Embedding
Technologies
by Dr John
Yuanlin Xie
by Rolf
Aschenbrenner
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
5
12 NOVEMBER 2014, WEDNESDAY
0730-1730
Registration at Secretariat (Level 2)
Welcome Speech
0815-0830
Grand Ballroom
by Prof. Mohd. Nasir Tamin, IEMT2014 General Chair
Conference Opening Address
0830-0910
“Panel Level Packaging Technologies as
Enabler for Innovative Mobile Devices”
by Mr. Rolf Aschenbrenner,
Fraunhofer Institute for Reliability and Microintegration
Keynote Address I
0910-0950
0950-1045
“Packaging and Interconnection Trend”
by Mr. Xavier Baraton,
VP of Packaging & Test Manufacturing, STMicroelectronics
Coffee Break / Exhibition / Poster Session I
Keynote Address II
1045-1125
“Automotive Power Packaging – Trends and Challenges”
by Dr. Andreas Knoblauch,
Director, Package Development Automotive Power,
Infineon Technologies AG
Keynote Address III
1125-1205
1205-1330
“Packaging Technology Challenges for Mobile
Computing Electronics”
by Mr. Sow Yeek Kooi
Director, Technology Enabling and Start-up, Intel Malaysia
Lunch
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
6
12 NOVEMBER 2014, WEDNESDAY
1330–
1510
Session A1
Session B1
Session C1
Session D1
Meeting Room 2
Meeting Room 3
Meeting Room 5
Meeting Room 6
Advanced
Packaging
Session Chairs:
Characterizati
on & Test I
Session Chairs:
Materials I
Process I
Session Chairs:
Session Chairs:
See Beng Keh &
Olivia Ng
Mario Bolanos &
Phee Boon Hor
Vemal Raja
Manikam &
Jamaliah Idris
Loke Mun
Leong &
Lily Khor
1510–
1545
1545–
1725
1830–
2200
1830–
1930
1930–
1945
Coffee Break / Exhibition
Session A2
Session B2
Session C2
Session D2
Meeting Room 2
Meeting Room 3
Meeting Room 5
Meeting Room 6
Advanced
Materials
Session Chairs:
Design
Wirebond I
Session Chairs:
Pb-free
Technology
Session Chairs:
Yong Wae Chet
& Cheong Kuan
Yew
Andreas
Knoblauch &
Eu Poh Leng
Loh Jan Sing &
Siow Kim
Shyong
Session Chairs:
John Xie &
Hew Ling Fong
Dinner & Cultural Show
PANELIST FORUM
IoT: Role of packaging and industry trends
Panelists: Rolf Aschenbrenner, John Xie, Xavier Baraton,
Byeong Cheon Koh
Moderator: Chee Choong Kooi
BANQUET DINNER ADDRESS
by Dr. Siow Kim Shyong
Chairman, IEEE-CPMT Malaysia Chapter
7
13 NOVEMBER 2014, THURSDAY
Keynote Address IV
“Innovation in Low Cost Packaging”
by Dr John Yuanlin Xie,
Director, Packaging Technology R&D,
Altera Corporation
08300910
Keynote Address V
0910–
0950
“Challenges and Solutions in Modeling of Ultra-Fine Pitch
Microelectronics Packages”
by Prof. Andrew A O Tay,
Department of Mechanical Engineering,
National University of Singapore
0950–
1020
Coffee Break / Exhibition
1020–
1200
1200–
1300
Session A3
Session B3
Session C3
Session D3
Meeting Room 2
Meeting Room 3
Meeting Room 5
Meeting Room 6
Process II
Wirebond II
Reliability
Session Chairs:
Characterizati
on & Test II
Session Chairs:
Session Chairs:
Session Chairs:
Yik Yee Tan &
Khor Swee Har
Simon Ang &
E. K. Pradeep
Wang Soon Wei
& Angeline Fon
Shubhada
Sahasrabudhe &
Eu Poh Leng
Lunch
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
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13 NOVEMBER 2014, THURSDAY
1300 –
1420
Session A4
Session B4
Session C4
Session D4
Meeting Room 2 Meeting Room 3 Meeting Room 5 Meeting Room 6
Copper Wire
Session Chairs:
Interconnect
Session Chairs:
Materials II
Session Chairs:
Modeling
Session Chairs:
Tan Chee Eng &
Koh Byeong
Cheon
Ishak Abdul
Azid & Lim
Siew Lan
Klaus Muller &
Mohd Foad
Abdul Hamid
Siow Kim
Shyong &
Sandeep Sane
1420 –
1500
Coffee Break / Exhibition / Poster Session II
1500 –
1540
Keynote Address VI
1540 –
1620
1620 –
1700
1700 –
1730
“Review of New MEMS Devices and their Manufacturing
Technologies”
by Dr. Koh Byeong Cheon ,
Senior Executive Vice President (Retired), Samsung ElectroMechanics
Keynote Address VII
“Test Point Selection Method for Mixed Signal Testing”
by Prof. Simon S. Ang,
High Density Electronics Center, University of Arkansas
Conference Closing Address
“It’s a Small World After All: Recent Advances on Nanomaterials and Technologies for Advanced Electronic,
Photonics and MEMS Applications”
by Prof. CP Wong,
Dean of the Faculty of Engineering,
The Chinese University of Hong Kong
Award Ceremony
9
CONFERENCE: 12 NOVEMBER 2014, WEDNESDAY [1330 – 1510]
Session A1
Advanced Packaging
Meeting Room 2
Session Chairs:
See Beng Keh &
Olivia Ng
Session B1
Characterization & Test I
Meeting Room 3
Session Chairs:
Mario Bolanos &
Phee Boon Hor
Session C1
Materials I
Meeting Room 5
Session Chairs:
Vemal Raja Manikiam &
Jamaliah Idris
Session D1
Process I
Meeting Room 6
Session Chairs:
Loke Mun Leong &
Lily Khor
1330 A1.1
Junctionless Sub-Micron
Silicon Wire Device
Fabricated by Atomic Force
Microscope Lithography
and Electrically
Characterized for Gas
Sensing Application at
Room Temperature
M.T. Asmah, et. al.
Universiti Sains Malaysia
1330 B1.1
Prediction Of Electrostatic
Discharge (ESD) Soft Error In
Two-Way Radio Using ESD
Simulation In CST And ESD
Immunity Scanning Techniques
1330 C1.1
(INVITED PAPER) Microwave
Curing of Polymeric Materials
for Microelectronics
Applications
1330 D1.1
Quantifying Solder Paste
Printing Yield Improvements
From The Use of Stencil
Nanocoatings and
Engineered Under Wipe
Solvents
Rosmah Antong, et al.
Motorola Solution
Prof. Sung Yi
Portland State University
Mike Bixenman, et. al.
Kyzen Corporation
1350 A1.2
Analyzing Package-OnPackage (PoP) Reflow
Assembly Interfaces with
Interconnect Gap Analysis
1350 B1.2
Maximizing Electrical
Capabilities of Test Setup
Resources to Enhance
Detection of Set Up
Problems(Test Set-up Mini
Diagnostic)
Jonathan Velsco
ON Semiconductor
1350 C1.2
The Effect Of Organic
Solvent (Ethanol) On
Electroless Ni-P Deposition
1350 D1.2
Methodology to Improve the
Die Singulation Quality for
Low-k and High TEG Saw
Street Wafer
Norhayati Ahmad, et. al.
Universiti Teknologi Malaysia
Lam Kok Meng, et. al.
Unisem
1410 B1.3
Characterization of Electronic
Materials Using Fundamental
Parameter Micro X-ray
Fluorescence
Kim Kia Yong
Fischer Instrumentation (S) Pte
Ltd
1410 C1.3
Copper Descaling Capability
and Material Decision
1410 D1.3
Copper Bonding on Thin Top
Metal Bonding Pad
Ronizan bin Mohd Salleh, et.
al.
Infineon Technologies
Rodan Melanio, et. al.
On Semiconductor
1430 A1.4
Ultrasonic Solder Writing,
the Next Level Die Attach
Process
1430 B1.4
Adaptive Trimming Test
Approach: The Efficient Way
on Trimming Analog Trimmed
Devices at Wafer Sort
1430 C1.4
The Effect of Nano Fillers in
Electrical and Mechanical
Properties of Isotropic
Conductive Adhesive
Lim Fong, et. al.
Infineon Technologies
Rex Bullag, et. al.
ON Semiconductor
C. S. Chew, et. al.
UTAR
1430 D1.4
Optimization and
Characterization of
Development Rate in
Photolithography Process for
Optical Biosensor
K. Y. Lau, et. al.
Universiti Malaysia Perlis
1450 A1.5
A Conceptual Assembly
Study on Enhancing the
Voltage Supply of The
Clipbond Product Via
Tandem Diodes
Izzati Farhana Ab Aziz, et. al.
NXP
1450 B1.5
Non-Fickian Moisture Uptake
Characterization of Epoxybased Moulding Compound
With Thickness Effect
1450 C1.5
Effect of Ni Nanoparticle on
IMC Compounds Formation
in SAC305 Solder Joint Under
High Current Density
1450 D1.5
Die Attach Film (DAF) for
Breakthrough in
Manufacturing (BIM)
Application
K. J. Wong, et. al.
Universiti Teknologi Malaysia
Muhammad Nasir Bashir, et.
al., Universiti Malaya
Premila Krishnan, et. al. 10
NXP
Ken Chiavone, et. al.
Akrometrix LLC
1410 A1.3
Packaging Technologies and
Challenges on Using Fine
Pitch Cu-Pillar
M.J. Lee, et. al.
Altera Corp.
CONFERENCE: 12 NOVEMBER 2014, WEDNESDAY [1545 – 1725]
Session A2
Advanced Materials
Meeting Room 2
Session Chairs:
Yong Wae Chet &
Cheong Kuan Yew
Session B2
Design
Meeting Room 3
Session Chairs:
Andreas Knoblauch &
LC Tan
Session C2
Pb-free Technology
Meeting Room 5
Session Chairs:
Loh Jan Sing &
Eu Poh Leng
Session D2
Wirebond I
Meeting Room 6
Session Chairs:
John Xie &
Adrian Tong
1545 A2.1
A Novel Epoxy Flux On
Solder Paste For Assembling
Thermally Warped POP
1545 B2.1
Design and Optimization of
Package Inductor for Efficient
Power Rail Merger
Ming Hu, et. al.
Indium Corporation
Fern Nee
Intel
1545 C2.1
Assessment of High
Temperature, Lead Free
Paste Alternatives for
Semiconductor Packaging
G. P. Neoh
Carsem
1545 D2.1
Challenges of Ultimate UltraFine Pitch Process with Gold
Wire & Copper Wire in QFN
Packages
C. E. Tan, et. al.
On Semiconductor
1605 A2.2
Effect of Sintering
Environment on SilverCopper Die-Attach
Nanopaste
1605 B2.2
Copper Power Pad Design
Challenges for High
Robustness and Energy
Efficient Packages
1605 D2.2
Impact of High Transducer
Frequency on Capillary
Design
Kim Seah et al
Universiti Sains Malaysia
H. J. Chong, et. al.
ON Semiconductor
1605 C2.2
Ball Shear Strength and
Fracture Mode of Lead-Free
Solder Joints Prepared Using
Nickel Nanoparticle Doped
Flux
G. K. Sujana, et. al.
Universiti Malaya
1625 A2.3
Effect of Sintering
Atmosphere on the Shear
Properties of Pressureless
Sintetered Silver Joint
S. T. Chua, et. al.
Universiti Kebangsaan
Malaysia
1625 B2.3
Dual FET Packaging
Advancement Through
Innovative Source Down
1625 C2.3
Effect Of Microwave Hybrid
Heating On The Formation Of
Intermetallic Compound Of
Sn-Ag-Cu Solder Joints
Maisarah Lutfi, et. al
Universiti Malaya
1625 D2.3
Characterization Studies of
Non-Stick On Pad (NSOP)
Using AES, XPS and TOF-SIMS
1645 A2.4
A Comparison Study of
Wafer Backside Coating
Technologies
1645 B2.4
Comprehensive Study in Mold
Compound, Thermal Residual
Stress, Package & Leadframe
Geometry Influence towards
Convex Cavity Package
Warpage
Ng Seng Pau, et. al.
Infineon Technologies
1645 C2.4
Addition of Porous Cu
Interlayer to Sn-3.0Ag-0.5Cu
Lead-free Solder Joint for
High Temperature
Applications
1645 D2.4
Methodology to Characterize
the Capillary Tip Ultrasonic
Vibration With Laser Doppler
Vibrometer
Nashrah Hani Jamadon, et. al.
Universiti Malaya
Ong Chen Ho
Infineon Technologies
1705 A2.5
High-Performance Carbon
Nanotubes Thermal
Interface Materials
1705 B2.5
Single-Sided Cap Solution for
Thinner Z-Height
1705 C2.5
The Effect of Nickel Doping
on SAC305 Lead-free Solders
and EN(B)EPIG Surface Finish
Jamilah Idris et. al
Universiti Teknologi
Malaysia
Po-Loong Chin, et. al
Intel
Salize Azlina, et. al
UTHOM
1705 D2.5
Next Level of Productivity
Through Capillary life
Extension With Automatic
Capillary Cleaning
Sivalingam Thevan, et. al.
Infineon Technologies
Loh Kian Hwa
Carsem
Chong Chooi Mei, et. al.
Infineon Technologies
Tan Kim Guan
Infineon Technologies
Hua Younan, et. al.
WinTech Nano-Technology
Services Pte. Ltd.
11
CONFERENCE: 13 NOVEMBER 2014, THURSDAY [1020 – 1200]
Session A3
Process II
Meeting Room 2
Session Chairs:
Chin Ping Wong & Khor
Swee Har
Session B3
Characterization & Test II
Meeting Room 3
Session Chairs:
Simon Ang &
E.K. Pradeep
Session C3
Wirebond II
Meeting Room 5
Session Chairs:
Wang Soon Wei &
Angeline Fon
Session D3
Reliability
Meeting Room 6
Session Chairs:
Shubhada Sahasrabudhe &
Siow Kim Shyong
1020 A3.1
Crack Block: A Pro Active
Activity on Die Crack
Resolution For Thin Dies
1020 B3.1
(INVITED PAPER)
Comprehensive Solution for
Post-saw Inspection
1020 D3.1
Challenges to Product
Reliability in High Aggressive
Operating Environment
Richard Chay Tan, et. al.
ON Semiconductor
Rajiv Roy, Matt Wilson
Rudolph Technologies
1020 C3.1
3mil Copper Wire Capability
Study in 4m Aluminum Top
Metal by Thermosonic
Bonding
Edsel De Jesus, et. al.
ON Semiconductor
1040 A3.2
Characterization of
Resolution for Integrated
Optical Mach-Zehnder
Interferometer with
Optimization of
Photolithography Process
K. Y. Lau, et. al.
Universiti Malaysia Perlis
1040 B3.2
Winchester-Banana Platform
for High-Temperature and
High-Voltage Reliability
Testing with Voltage
Monitoring Capability
1040 C3.2
Aluminum Oxide Thickness
Impact on Wire Bond Shear
1040 D3.2
Improving Reliability for
Electronic Power Modules
Ronald Rey Molina Pendor
ON Semiconductor
Ong Cheng Nee, et. al.
X-FAB Sarawak
Vemal Raja Manikam, et. al.
ON Semiconductor
1100 A3.3
Operator Efficiency
Improvement Through
Thinking 6 Sigma + Lean
Problem Solving
Approach in IFX OP BE - A
Case Study
Lim Chun Pei, et. al.
Infineon Technologies
1100 B3.3
Front End Wafer Scanning
Infrared Depolarization (SIRD)
Measurement Correlation to
Back End Wafer Backside
Finishing
1100 C3.3
Characterization of 0.6mil Ag
Alloy Wire in BGA Package
1100 D3.3
Characterization Study for
Polymer Core Solder Balls
under AC and TC Reliability
Test
Cheeyang Ng
STMicrolectronics
Toh Lee Chew
STMicrolectronics
Caihui
Freescale
1120 A3.4
Multi Beam Laser Grooving
Process Parameter
Development and Die
Strength Characterization
for 40nm Node Low-K/ULK
Wafer
Koh Wen Shi, et. al.
Freescale
1120 B3.4
Grain Structure and Roughness
Characterization of Electrolytic
Ni-P, Electrolytic Ni and
Electroless Ni-P on Cu by FIB
Voltage Contrast
1120 C3.4
Silver Alloy Wire for IC
Packaging Solution
1120 D3.4
TCoB Reliability For Epad
LQFP 176 in Automotive
Application
Ronizam bin Mohd Salleh, et.
al.
Infineon Technologies
Tan Boo Wei, et. al.
Carsem
Cha Chan Lam, et. al.
Infineon Technologies
1140 A3.5
Prevention on Tilted Units
for Small Size Wafer Level
Package in Taping
1140 B3.5
Six Sigma: Systematic
Approach in Probe Damage
Reduction
1140 C3.5
1140 D3.5
Effect of Copper Particle Size
on Creep Deformation in
Copper Paste Film
Yong Wei Wei, et. al.
Infineon Technologies
Glenn T. Placido
ON Semiconductor
Haley Fu
iNEMI
S. Fukufa
Fine Ceramics Research
Association
12
CONFERENCE: 13 NOVEMBER 2014, THURSDAY [1300 – 1420]
Session A4
Copper Wire
Meeting Room 2
Session Chairs:
Tan Chee Eng &
Koh Byeong Cheon
Session B4
Interconnect
Meeting Room 3
Session Chairs:
Ishak Abdul Azid &
Lim Siew Lan
Session C4
Materials II
Meeting Room 5
Session Chairs:
Christian Burmer &
Mohd. Foad Abdul Hamid
Session D4
Modeling
Meeting Room 6
Session Chairs:
Siow Kim Shyong &
Sandeep Sane
1300 A4.1
Ultra Low Loop Wire
Bonding of 20 μm Palladium
Coated Copper Wire for
Very Thin Packages
Loh Kian Hwa
Carsem
1300 B4.1
Incomplete fill for FlipChip
design in MAP mold package
1300 C4.1
Study On Electrodeposited
Ni-Mo Alloy Barrier Films For
Electronic Interconnects
1300 D4.1
A Review of Computational
Damage Mechanics of Mass
Transport in Solder Joint
Chong Chee Chiew, et. al.
Infineon Technologies
C. W. Tan, et. al.
Universiti Malaya
Mohd Foad Abdul Hamid
Universiti Teknologi Malaysia
1320 A4.2
Challenges and Resolution
of Insulated PdCu Wire
Bond for TBGA HVM
Robustness
1320 B4.2
Microstructure Evolution at
the Solder Joint During
Isothermal Aging
1320 C4.2
New Die Attach Adhesives
for Low-Stress MEMS
Packaging
Siong Chin Teck, et. al.
Freescale
A.M. Zetty Akhtar, et. al.
Universiti Malaysia Pahang
Jooi Liang See
DELO Industrial Adhesives Pte
Ltd
1320 D4.2
Finite Element Analysis Of
Stress Intensity Factor Of
Pre-Cracked Coated
Substrate Under Contact
Sliding
M. L. Mohsin, et. al.
Universiti Teknologi Malaysia
1340 A4.3
Low Cost & High Quality
Copper Wire Bonding in
Increasing Market Growth
1340 B4.3
Nanomechanical Properties of
Intermetallic Compounds
Formed in Electrodeposited
Cu/Sn and Cu/Ni/Sn Multilayer
Interconnects
1340 C4.3
Ultra-Low Residue (ULR)
Semiconductor-Grade Fluxes
for Copper Pillar Flip-Chip
C. E. Tan, et. al.
ON Semiconductor
Abu Zayed Mohammad Saliqur
Rahman
Universiti Malaya
Sze Pei Lim
Indium Corporation
1400 A4.4
Palladium Coated Copper
wire – Characteristics and
Wire Behavior in BSOB
Process and its Reliability
Performance
1400 B4.4
Strain Rate-Dependent
Deformation and Failure
Process of Adhesive Joints
1400 C4.4
SW Wang and Jose Palagud
Jr.
ON Semiconductor
M. Johar, et. al.
Universiti Teknologi Malaysia
1340 D4.3
Modelling Investigation of
the Influence of
Polycrystalline Grain Size on
the Electrical Characteristics
of Polysilicon Diode and
Resistor
Ke Kian Seng Joseph
Infineon Technologies
1400 D4.4
Structural Analysis of an
Electronic Module
Incorporating Hybrid
Microcircuits in Power
Distribution Package of
Satellites
Abhiram B. Aithal, et. al.
M. S. Ramaiah Institute of
Technology
13
POSTER PAPERS
12 November, Wednesday
1000 - 1045
Poster Session I
FOYER
Session Chairs: Shaw Fong Wong & Tze Yang Hin
P1
Vertical Hi-C Capacitor for eVBW in RF Power Amplifiers
Aznita Abdul Aziz
Freescale Semiconductor
P6
Multichannel Module Characterization of Optical Sensors
Employed in Photoplethysmography
Ammar Younis Kadhim
Universiti Kebangsaan Malaysia
P2
Effect of pH on Electroless Nickel Deposition on Alumina
Substrates for Chip Resistor Application
Nor Akmal Fadil, et. al.
Universiti Teknologi Malaysia
P7
Effective Maintenance Strategy to Improve Performance
Through RCM Concept
Sivakumar S.Nadarajan
On Semiconductor
P3
Contamination Elimination at ISO Side of Smart Card
Tape
Zheng Zhirong, et. al.
Infineon China
P8
Saw Chipping Improvement to Achieve Defect Free Bare Die
Products
C.E.Tan, et. al
On Semiconductor
P4
Prediction and Prevention of Mold Compound Chipping
Using Empirical and Simulation Methods
P9
Study On Reduction of Adhesive Pb Flakes on Lead Free Solder
Paste through Oven Reflow Temperature in Clip Bond Package
Hamrija Ariffin, et. al
NXP
Beh Shiao Lin, et.al
Infineon Malaysia
P5
Develop Solution of Permissible Package Warpage for
Board Assembly
Eng Hoo Leow, et. al.
Altera Corporation
14
POSTER PAPERS
13 November, Thursday
1420 - 1500
Poster Session II
FOYER
Session Chairs: Shaw Fong Wong & Tze Yang Hin
P10
Robust Wirebonding for Power Packages with Ball Shear
Test and FEM Modeling
Dr. Xueren Zhang
STMicroelectronics
P14
Comparison Study Between Insulated PdCu Wire and PdCu
Wire on TBGA
Eu Poh Leng, et. al.
Freescale Semiconductor
P11
Performance of Dye-Sensitized Solar Cell Based on
Varied Dye Thermal Extraction
S.Z.Mohamed Siddick, et. al.
Universiti Malaysia Perlis
P15
Factors Contributing to Non-Sticking on Ground Ring for
Copper Wire Bonding
Tan Kian Heong
Infineon Malaysia
P12
Process Controls For Robust Solderability Performance
Of IC On Pre-Plated Frames
Dennis Remolacio, et. al.
On Semiconductor Philippines
P16
Package Mounting Considerations From Product Thinking to
System Understanding (P2S) to Create Greater Value for
Customers
Tan Chee Voon, et. al.
Infineon Malaysia
P13
Schottky Barrier Lowering in Al/Si/Al Back-to-Back
Schottky Contacts by Embedded Gold Nanoparticles
Mohammad Saleh Gorji, et. al.
Universiti Sains Malaysia
P17
Design and Development of Tiny Package for High Voltage
Integrated Circuit Device (HVIC) in QFN
Suhaimi Azizan
On Semiconductor
15
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
16
HOTEL LAYOUT
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
17
SEE YOU IN
JOHOR BAHRU!
Further enquiry, please contact:
• Fadzilatul Husna Adnan
([email protected] ), Secretariat
• Dr. Tze Yang Hin ([email protected]), Program Chair
36th International Electronics Manufacturing Technology Conference
11th - 13th Nov, 2014 at Renaissance Johor Bahru Hotel, Johor, Malaysia
18