Simplifying Wireless Confidence of Certification Integrating LSR wireless modules that are precertified with multiple antennas saves significant certification time and costs for your design project. (Typically $30-$50K in savings) 5.8 GHz 2.4 GHz Bluetooth Stack Bluetooth ® Bluetooth SIG Qualified System-on-Chip Embedded Wireless Modules Selection Guide Unmatched Levels of Support LSR’s US-based technical team is committed to a great customer experience, providing best-inindustry tech support as well as full Design Review services. Silica www.silica.com EBV Elektronik www.ebv.com Telsys (Israel Only) www.telsys.co.il Avnet Australia em.avnetasia.com Farnell www.farnell.com Avnet Electronics Marketing www.avnetexpress.com Mouser Electronics www.mouser.com Important Notice: The products and services of LS Research described herein are sold subject to LS Research standard terms and conditions of sale. Customers are advised to obtain the most current and complete information about LSR products and services before placing orders. LS Research assumes no liability for applications assistance, customer’s applications or product designs, software performance, or infringement of patents. The publication of information regarding any other company’s products or services does not constitute LS Research’s approval, warranty or endorsement thereof. IEEE 802.15.4 Zigbee Arrow Electronics Europe www.arroweurope.com Digi-Key www.digikey.com Cloud Connectivity LSR Design. Create. Certify. Connect. FLEXConnect™ 6LowPan Internet of Things Proprietary Protocols Mesh Networks Arrow Electronics parts.arrow.com ® LSR Authorized Distributors FCC/IC/CE Certification 900 MHz Bluetooth Smart Learn more at www.lsr.com and follow us on LinkedIn and Twitter (@LSResearch). TiWiConnect™ System-on-Chip BLE 4.0 Our experienced professionals are passionate and committed to partnering with you, allowing your team to focus on the most important element of product development: the unique needs of your customers. Small Footprint 802.11 a/b/g/n Wireless LSR’s wireless modules provide a straightforward means for integrating wireless technologies such as Wi-Fi, Bluetooth®, Bluetooth® Smart, and 802.15.4 protocols into either new or legacy product designs. Since 1980, our partners, spanning a wide range of industries, have trusted LSR to help develop solutions that exceed their customers’ expectations. We provide an unmatched suite of wireless product design services, EMC Testing & Certification, and performance RF products, all to improve speed to market and return on your development investment. Wi-Fi 2.4 GHz Bringing a winning product to market in today’s competitive environment requires greater skill, creativity and experience than ever before. More and more, your customers demand intuitive, reliable wireless capabilities that give them the real-time information and controls to be more connected. TCP/IP Stack Inspiring through Wireless InnovationsSM Development Kits WLAN About LSR www.lsr.com | 262.375.4400 LSR Certified Wireless Modules ProFLEX and SiFLEX modules not shown to scale TiWi-BLE™ TiWi5™ TiWi-C-W™ TiWi-SL™ TiWi-uB1™ TiWi-uB2™ Description Wi-Fi with Bluetooth 2.1+ EDR, BLE 4.0 and ANT+ Wi-Fi with Bluetooth 2.1+ EDR, BLE 4.0 and ANT+ Stand-alone 802.11 b/g/n Wi-Fi module with ARM Cortex-M3 apps processor Wi-Fi SPI interface with embedded firmware, drivers, and TCP/IP stack Built in CC2541 single-chip BLE 4.0 System-on-Chip (SoC) Bluetooth 2.1+ EDR, and BLE 4.0 module Frequency Band 2.4 GHz 2.4 & 5.8 GHz 2.4 GHz 2.4 GHz 2.4 GHz 2.4 GHz Microprocessor to run WLAN TCP/IP stack Microprocessor to run WLAN TCP/IP stack Development Architecture: Integration directly into M3 processor, or simple integration over UART interface to external microcontrollers or microprocessors Microcontroller or microprocessor with a serial port (SPI) + 6 KB Flash, 3KB RAM Integrated 8051 microcontroller or network processor interface for applications running on an external microcontroller SDIO (WLAN), UART, and Advanced Audio Interface (Bluetooth®) SDIO (WLAN), UART, and Advanced Audio Interface (Bluetooth®) UART SPI 13 mm x 18 mm x 1.9 mm 13 mm x 18 mm x 1.9 mm 10.5 mm x 10.5 mm x 1.35 mm • • • • • off-module SMT antenna • Dipole via U.FL Host Processor Requirements Hardware Interfaces Size Antenna off-module chip Dipole via U.FL PIFA via U.FL Flexible Dipole via U. FL • • • • off-module chip Dipole Waterproof Dipole FlexPIFA™ 14 mm x 21 mm x 2.8 mm • off-module chip • Dipole via U.FL ProFLEX01-SOC™ SiFLEX02-R2™ SiFLEX02-R2-HP™ Description High performance 802.15.4 radios and microcontrollers High performance 802.15.4 radio based on TI CC2530 SoC High performance 802.15.4 radios and microcontrollers High performance 802.15.4 radios and microcontrollers Frequency Band 2.4 GHz 2.4 GHz <1 GHz <1 GHz 100 100 250 750 Receive Sensitivity -98 dBm -97 dBm -102 dBm <-104 dBm Processor MSP430 MSP430 ATxMega256A3U ATxMega256A3U Radio CC2520 CC2530 AT86RF212B AT86RF212B 22.8 mm x 41.4 mm 22.8 mm x 41.4 mm 22.8 mm x 41.4 mm 22.8 mm x 41.4 mm Output Power Microcontroller or microprocessor with a serial port (UART) UART, SPI, Digital I/O, and Analog Inputs HCI, UART, and Audio PCM interfaces 11.6 mm x 17.9 mm x 2.3 mm 7 mm x 7 mm x 1.5 mm • Hybrid trace antenna • Dipole via U.FL ProFLEX01-R2™ • off-module chip • Dipole via U.FL Certifications Size Antenna • Inverted F • Dipole via U.FL • Inverted F • Dipole via U.FL • • • • RF castellation Wire Dipole via U.FL Helical • RF castellation • Dipole via U.FL Certifications pending for TiWi-C-W™ Wi-Fi + Bluetooth® Bluetooth® Wi-Fi 802.15.4 Module accessories available at LSR.com: TiWi-C-W features a cloud agent for the ™ Module | Cloud | App cloud-connectivity platform Antennas Gateways & Cables Dev Kits
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