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electronica, November 11 – 14, 2014, Messe München
INTEGRATED ELECTRONICS
EFFICIENT, POWERFUL, FLEXIBLE
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INTEGRATED ELECTRONICS
With more than 60 institutes in Germany and as many years’
experience in application-oriented research, the FraunhoferGesellschaft stands for innovation and trailblazing solutions in
science and industry.
At electronica 2014, the world’s leading trade fair for electronics
components, systems and applications, this expertise will be
impressively demonstrated. At the joint Fraunhofer booth
(Hall A4, Booth 113), eleven Fraunhofer Research Institutions
will present a broad spectrum of research projects and findings.
The topics covered include sensors, nanoelectronics, RFID, optical
wireless communications, CMOS processes, 3D integration,
device and manufacturing aspects, energy harvesting, OLED
on silicon, organic electronics or human-machine interfaces,
large-area thin-film electronics, discrete (SiC/Si), highly integrated
power electronics as well as wireless sensor networks. This is
just a sample of the energy and electronics expertise within the
Fraunhofer-Gesellschaft, and underlines the close relationship
between industry and applied research.
Fraunhofer researchers are waiting to talk to you personally. We
look forward to welcoming you!
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FRAUNHOFER TOPICS
Fraunhofer Institute for
Ceramic Technologies and Systems IKTS
Materials and processes for hybrid technology | Ceramic multilayer
and layer deposition method | Systems integration for ceramic
circuit boards | Ceramic components for electronics, power
electronics, energy technology and sensors | Optical diagnosis
methods for x-ray analysis
Fraunhofer Institute for
Electron Beam, Plasma Technology and COMEDD FEP
OLED micro-displays for interactive data glasses and sensors |
OLED microstructures | Flexible OLED | Energy harvesting
Fraunhofer Institute for
Integrated Circuits IIS
Linear position measurement with smart magnetic field sensors |
Joystick – the new HallinOne® generation | Electricity sensors,
based on the HallinOne® technology | Polarization and color
sensors | Development software service | High-speed data
transmission | System-on-chip design | Wireless sensor networks –
energy efficient data acquisition and object tracking with s-net® |
Battery management | Energy harvesting
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Fraunhofer Institute for
Integrated Systems and Device Technology IISB
Certified π-Fab line: small series prototype production of discrete
and integrated Si and SiC components | Power semiconductors |
Monolithic integrated passive components | Detectors and sensors | Integrated nanotechnologies: plasmonics and microfluidics |
Innovative services for process control and documentation |
Process- and manufacturing-focused device development | Largearea and printed thin-film electronics: components and systems |
Solution-processed inorganic functional materials
Fraunhofer Institute for
Photonic Microsystems IPMS
Programmable UHF sensor-transponders | Li-Fi hotspot | Optic
wireless multi-gigabit-class communications module | Capacitive
Micro-machined Ultrasonic Transducers (CMUT) | Nanoelectronics
Fraunhofer Institute for
Production Technology IPT
Micromanipulator technology for precision assembly | Feed technology for micro components | Software for planning automated
assembly processes | R2R processing for printed electronics | LED
low-profile light guides | Modeling and simulation of mechatronic
systems, embedded software development
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Fraunhofer Institute for
Reliability and Microintegration IZM
Development of cost-efficient HF and high-speed components,
modules and systems | electrical modeling and simulation | Waferbond, interposer structures, WL System in Package, rewiring,
bumping, wafer thinning, MEMS packaging | Embedded modular
micro-camera structures
Fraunhofer Institute for
Silicon Technology ISIT
Research, development and production of microsystems and
power electronics components | Innovation Cluster Electronics for
Sustainable Energy Use | New converter concepts for wind farms |
MEMS component development: optics, inertia sensors, gas
sensors | MEMS foundry production
Fraunhofer Institute for
Solar Energy Systems ISE
Highly integrated and efficient power electronics | Control for
high-frequency cycle electronics | Galvanic isolated small signal
probe for medium high voltage applications | Applications with
GaN and SiC devices | Power electronics for renewable energy,
aerospace and e-mobility applications
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PRESS CONFERENCE
I N T E G R AT E D E L E C T R O N I C S –
E F F I C I E N T, P O W E R F U L , F L E X I B L E
Time
Tuesday, November 11, 2014
2.30 to 3.30 p.m.
Location
Joint Fraunhofer booth, Hall A4, Booth 113
FURTHER FRAUNHOFER TRADE FAIR APPEARANCES
Fraunhofer Institute for
Microelectronic Circuits and Systems IMS
Hall A5, Booth 139
Fraunhofer Process Innovation Project Group /
Chair of Manufacturing and Remanufacturing Technology
at the University of Bayreuth
Hall A6, Booth 524
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EXHIBITING FRAUNHOFER INSTITUTES
Fraunhofer Institute for
Ceramic Technologies and Systems IKTS
Winterbergstrasse 28 | 01277 Dresden, Germany
www.ikts.fraunhofer.de
Contact: Dr. Uwe Partsch
Phone +49 351 2553-7696
[email protected]
Fraunhofer Institute for
Electron Beam and Plasma Technology and COMEDD FEP
Maria-Reiche-Strasse 2 | 01109 Dresden, Germany
www.fep.fraunhofer.de
Contact: Ines Schedwill
Phone +49 351 8823-238
[email protected]
Fraunhofer Institute for
Integrated Circuits IIS
Am Wolfsmantel 33 | 91058 Erlangen, Germany
www.iis.fraunhofer.de
Contact: Klaus Taschka
Phone +49 9131 776-4475
[email protected]
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Fraunhofer Institute for
Integrated Systems and Device Technology IISB
Schottkystrasse 10 | 91058 Erlangen, Germany
www.iisb.fraunhofer.de
Contact: Dr. Michael Jank
Phone +49 9131 761-161
[email protected]
Fraunhofer Institute for
Photonic Microsystems IPMS
Maria-Reiche-Strasse 2 | 01109 Dresden, Germany
www.ipms.fraunhofer.de
Contact: Dr. Michael Scholles
Phone +49 351 8823-201
[email protected]
Fraunhofer Institute for
Production Technology IPT
Steinbachstrasse 17 | 52074 Aachen, Germany
www.ipt.fraunhofer.de
Contact: Helen Sophie Rabenau
Phone +49 241 8904-287
[email protected]
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Fraunhofer Institute for
Reliability and Microintegration IZM
Gustav-Meyer-Allee 25 | 13355 Berlin, Germany
www.izm.fraunhofer.de
Contact: Georg Weigelt
Phone +49 30 46403-279
[email protected]
Fraunhofer Institute for
Silicon Technology ISIT
Fraunhoferstrasse 1 | 25524 Itzehoe, Germany
www.isit.fraunhofer.de
Contact: Claus Wacker
Phone +49 4821 17-4214
[email protected]
Fraunhofer Institute for
Solar Energy Systems ISE
Heidenhofstrasse 2 | 79110 Freiburg, Germany
www.ise.fraunhofer.de
Contact: Dirk Kranzer
Phone +49 761 4588-5546
[email protected]
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EDITORIAL NOTES
Technical coordination
Ines Schedwill
Phone +49 351 8823-238
[email protected]
Fraunhofer Institute for
Electron Beam and Plasma Technology and COMEDD FEP
Maria-Reiche-Strasse 2 | 01109 Dresden, Germany
www.fep.fraunhofer.de
Press contact
Mandy Kühn
Phone +49 89 1205-1305
[email protected]
Project management
Susanne Pichotta
Phone +49 89 1205-1377
[email protected]
Fraunhofer-Gesellschaft
Hansastrasse 27c
80686 München, Germany
www.fraunhofer.de
© Fraunhofer-Gesellschaft, München 2014
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SITE PLAN
C1
C2
C3
C4
B1
B2
B3
B4
B5
B6
A1
A2
A3
A4
A5
A6
ICM
B0
Hall A4, Booth 113
Joint Fraunhofer Booth
Messe München GmbH
Messegelände
81823 München, Germany
www.messe-muenchen.de
Photo: Messe München International
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