1. home and garden
2. home furnishings
3. sofas and chairs

Introduction
On behalf of the Electronic Components and Technology
Conference (ECTC) Program Committee, it is my
pleasure to invite you to submit an abstract for the 65th
ECTC, to be held May 26–29, 2015, at the Sheraton San
Diego Hotel & Marina in San Diego, California, USA. This
premier international conference is sponsored by the IEEE
Components, Packaging, and Manufacturing Technology
(CPMT) Society and covers the entire spectrum of
electronic packaging and interconnect technology. The program committee
represents a wide range of disciplines and expertise and is committed to creating
an engaging technical program covering a broad array of topics, including
electronic components, materials, assembly, interconnections, device and system
packaging, optoelectronics, 2.5D and 3D technology, reliability, and simulation.
ECTC is truly an international conference, typically attracting more than 1,200
attendees from over 25 countries. The 64th ECTC featured 365 papers and
interactive presentations in 41 sessions covering exciting new developments and
application areas. The 65th ECTC will continue to be the venue for showcasing the
latest developments in the electronic components industry where assembly and
packaging provides a competitive advantage.
As in past years, the 65th ECTC program will include six parallel technical sessions
in the mornings and afternoons, along with special topic panel discussions in
Major Topics
Abstracts are rated by the ECTC technical subcommittee members. Highly rated
abstracts are accepted for presentation at the ECTC conference. It is important
that authors identify the subcommittees whose topic areas best fit their abstracts.
Abstracts should include original and previously unpublished, non-confidential, and noncommercial information on new developments, technology, and knowledge in the areas
including, but not limited to, those given below for each technical subcommittee name.
Advanced Packaging: 2.5 & 3D technologies, embedded, wafer and panel level
packaging, flip chip, advanced substrates, interposers, novel assembly technologies,
fan-out, internet-of-things, bio-compatible, wearables, TSVs, MEMS and sensors,
heterogeneous integration, electronic (power & RF) and optoelectronic packaging.
Applied Reliability: System level reliability testing/modeling, reliability test methods
and life models, failure analysis techniques/physics of failure, TSV/3D reliability and
packaging challenges, interconnect reliability, solder and materials characterization, drop
and dynamic mechanical reliability, probabilistic design for reliability (PDfR), automotive
reliability requirements.
Assembly and Manufacturing Technology: Advancement of packaging
and manufacturing technologies in large OEMs, innovation in enabling high density
packages including 3D integration, challenges and solutions of mainstream packaging and
manufacturing technologies, challenges and solutions for medical applications.
Emerging Technologies: Internet-of-things components: wearable electronics,
flexible & stretchable electronics packaging, compact & autonomous sensor packaging;
bioelectronics packaging: microfluidics and MEMS, bio-sensing packaging, new
materials for bio packaging; power technologies: small form factor packaging, high
power packaging; novel advanced packaging: energy harvesting electronics packaging,
photovoltaic packaging, components for wireless packaging, novel approaches to
packaging; complex packaging: security, redundancy, repair, directed assembly, built-in
test, multifunction integration; emerging packaging concepts and technologies: organic IC
& TFT, anti-counterfeiting packaging.
the evenings, which provide high-level perspectives comprising trends and best
practices in the industry. Professional Development Courses (PDCs) covering
16 different topics will be offered by world-class experts in their fields, where
participants can catch up with new technology developments and broaden their
technical knowledge base. The technical program and PDCs will be supplemented
by the Technology Corner Exhibits, which provide an opportunity for leading
companies in the electronics components, materials, and packaging fields to
exhibit their latest technologies and products. Further contributions are welcome
through visible sponsorship opportunities.
I invite you to submit an abstract containing 250 to 750 words that describes
the scope, content, and key points of your proposed technical paper to the
65th ECTC at www.ectc.net. You are also invited to submit proposals for
PDCs. The deadline for abstract and PDC proposal submission is October 13,
2014. Manuscripts conforming to the ECTC format are due in final form for
publication in the Conference Proceedings by February 25, 2015. All abstracts and
manuscripts must be original, free of commercial content, and non-confidential.
On behalf of the ECTC Program Committee, I look forward to meeting you at
the Sheraton San Diego Hotel & Marina in San Diego for the 65th ECTC, May
26–29.
Henning Braunisch, 65th ECTC Program Chair
Intel Corporation, Chandler, Arizona, USA
Phone: +1-480-552-0844
Email: [email protected]
Interconnections: First- and second-level interconnections: designs, structures,
processes, performance, reliability (e.g., electromigration), test; technologies including
TSV, interposers (Si, glass, organic), interconnections for 3D integration & SiP, flip chip,
solder bumping and Cu pillar, wafer-level packaging, wafer and panel level fan-out,
advanced wirebonds, non-traditional interconnections (e.g., electrically conductive
adhesives, carbon nano-tubes, graphene, optical), substrates and PCB solutions for next
generation systems, system packaging and heterogeneous integration; topics of special
interest include new applications in wearables, internet-of-things, cloud, and automotive
electronics.
Materials & Processing: Adhesives and adhesion, lead free solder, novel materials
and processing; underfills, mold compounds, dielectrics, emerging materials, and
processing for 2D and 3D.
Modeling & Simulation: Electrical, thermal and mechanical modeling & simulation,
including: component, board and system level modeling for microelectronics including
3D interconnects (TSV, stacked die), 2.5D packaging (Si interposers), wafer-level
package (WLP), ball grid array (BGA), embedded packages with active and passive
components, system-in-package (SiP), power electronic modules, LED packaging,
MEMS; novel high-speed interconnects and power delivery architectures; fab/thin wafer
handling, wire bonding and assembly manufacture process; reliability modeling related
fracture mechanics, fatigue, electromigration, warpage, delamination/moisture, drop
test, material constitutive relations; novel modeling including multi-scale and multi-physics
techniques and solutions; measurement methodologies and correlations.
Optoelectronics: Fiber optical interconnects, single mode or multicore connectors,
parallel optical transceivers, silicon and III-V photonics packaging, optical chip-scale and
heterogeneous integration, micro-optical system integration and photonic system-inpackage, 3D photonics integration, optoelectronic assembly and reliability, materials and
manufacturing technology, high-efficiency LEDs and high power lasers, integrated optical
sensors.
High-Speed, Wireless & Components: Components, modules and novel
packaging technology solutions for high-frequency, high-speed digital, power, and wireless
applications; embedded/integrated chips & passives; signal and power integrity; sensors,
RFID, RF MEMS, low-power RF design, wireless power transfer and energy harvesting;
cutting-edge component/module technologies for power, RF, millimeter-wave & THz
applications; bio/wearable applications, flexible & printed electronics; meta-materials,
magneto-dielectric nano-composites; SiP, heterogeneous integration.
Interactive Presentations: Abstracts may be submitted related to any of the
nine major program committee topics listed above. Interactive presentations of technical
papers are highly encouraged at ECTC as it allows significant interaction between the
presenter and attendees. It is especially suited for material that benefits from more
explanation than is practical in oral presentations. Interactive presentation session papers
are published and archived in equal merit with the other ECTC conference papers.
Visit the ECTC website (www.ectc.net)
for additional conference information.
Call for Professional Development Courses
See page two.
Abstract and Manuscript Submission
You are invited to submit an abstract of 250–750 words that describes the
scope, content, and key points of your proposed paper via our website at
www.ectc.net. Additional details on how to submit abstracts electronically
can be found on the ECTC website under the Author Information link.
Submitted abstracts become the property of ECTC and ECTC reserves the
right to publish the abstracts accepted for the conference. ECTC also reserves
the right to prohibit, limit, or reject any editing of submitted abstracts. Abstracts
accepted for the conference may not be edited until manuscript submission.
Abstracts must be received by October 13, 2014. Your submission must
be cleared by management and co-authors as applicable and include the mailing
address, business telephone number, and email address of the presenting
author and affiliations of all authors. Please select two different program
subcommittees in order of preference that should evaluate your paper for
acceptance. Authors will be notified of paper acceptance with instructions
for publication by December 14, 2014. At the discretion of the Program
Committee, submitted abstracts may be considered for Interactive Presentation
sessions.
Manuscripts conforming to the ECTC format are due in final form
for publication in the Conference Proceedings by February 25, 2015.
Manuscripts not submitted by this date may be removed
and replaced in the final program at the discretion of the
Program Committee. The submitted content must be original, previously
unpublished, non-confidential, and without commercial content. All submitted
manuscripts are checked for plagiarism and excessive self-duplication of
previously published work through the IEEE CrossCheck system. For additional
information regarding abstract and paper submission, please contact:
Henning Braunisch, 65th ECTC Program Chair
Intel Corporation, Chandler, Arizona, USA
Phone: +1-480-552-0844 • Email: [email protected]
Special Paper Recognition
Best Paper Award: Each year the ECTC selects the best paper whose
author(s) receive an ECTC personalized wall plaque and share a check for US
$2,500.
Best Interactive Presentation Award: Each year the ECTC selects
the best Interactive Presentation paper whose author(s) receive an ECTC
personalized wall plaque and share a check for $1,500.
Outstanding Paper Award: An outstanding conference paper is
also selected for special recognition by the ECTC. The author(s) receive a
personalized wall plaque and share a check for $1,000.
Outstanding Interactive Presentation Award: An outstanding
Interactive Presentation paper is also selected for special recognition by the
ECTC. The author(s) receive a personalized wall plaque and share a check for
$1,000.
Intel Best Student Paper Award: Intel Corporation is sponsoring an
award for the best paper submitted and presented by a student at ECTC. The
winning student will be presented with a wall plaque and a check for $2,500.
See next column for details.
Technology Corner Exhibits
Reserve Your Space Early!
Exhibit your products or services to more than 1,200 engineers and managers
from all areas of the microelectronics packaging industry. These include:
materials & processes for semiconductor packaging, assembly and interconnect
technologies, test & other equipment, market research, and research centers.
Two days: May 27–28, 2015
Ninety-five of the 101 exhibitors at ECTC 2014 will be exhibiting at the 2015
conference. Only six booths are currently available. For information and an
application, contact Joe Gisler at [email protected]. Additional
information is available at www.ectc.net under Technology Corner Exhibits.
Contribution and Visibility Opportunities
through Sponsorship
ECTC also offers excellent opportunities for contributions, promotion and
visibility through gala, badge lanyard, USB Flash drive proceedings, media,
Internet kiosk, luncheon, refreshment break, program, and student reception
sponsorships. Additional information is available at www.ectc.net under
Sponsors. Please contact:
David McCann, Sponsorship Chair
GLOBALFOUNDRIES, USA
Phone: +1-518-222-6128 • Email: [email protected]
Call for Professional Development Courses
Proposals are solicited from individuals interested in teaching educational fourhour long professional development courses (PDCs) on topics described on
the previous page. From the proposals received, 16 PDCs will be selected for
offering at the 65th ECTC on Tuesday, May 26, 2015. Each selected course
will be given a minimum honorarium of $1,000. In addition, instructors of the
selected courses will be offered the speaker discount rate for the conference.
Attendees of the PDCs will be offered Continuing Education Units (CEUs).
These CEUs are recognized by employers as a formal measure of participation
and attendance in “noncredit” self-study courses, tutorials, symposia and
workshops.
Using the format “Course Objectives/Course Outline/Who Should Attend,”
200-word proposals must be submitted via the ECTC website at www.ectc.
net by October 13, 2014. Authors will be notified of course acceptance
with instructions by December 14, 2014. If you have any questions, contact:
Kitty J. Pearsall, Professional Development Courses Chair
Boss Precision, Inc., Austin, Texas, USA
Phone: +1-512-845-3287 • Email: [email protected]
IEEE CPMT Society Travel Award
IEEE CPMT is pleased to continue the CPMT Travel Grant Program for
the 65th ECTC. The goals of this award are to foster maximum student
participation in the ECTC and to recognize students with superior ECTC
papers.
Description: Grants are available to apply towards actual travel expenses,
including airfare, hotel, and meals. Grants will be awarded competitively, based
on abstracts submitted by student authors. One student from each winning
abstract will be provided a travel grant. The student who is named as the
primary author will receive the grant.
Eligibility: The competition is open to all full-time graduate students
enrolled at an accredited institution in a program of study within the scope of
ECTC. The student must be listed as the primary author on the abstract and
present the paper at ECTC. A maximum of two authors (one per paper) from
any one institution will receive a travel grant.
Application Process: To apply, check the “IEEE CPMT Society Travel
Grant” box in the “Awards” section of the online abstract submission form.
Intel Best Student Paper Award
Intel Corporation is sponsoring an award for the best paper submitted and
presented by a student at the ECTC. The winning student will be presented
with a wall plaque and a check for $2,500.
Eligibility: To be considered for the award, the student must be a full-time
student for at least one semester after the conference conclusion. The student
must be the lead author and present the paper at the 65th ECTC conference.
It is the convention at ECTC for the presenter to be listed as the first author.
Finalists will be determined by review of the completed manuscripts by
the judging committee. Manuscripts will be reviewed for relevance to the
competition topics, technical content, and originality. The author of the best
student paper will be notified after the conference and must submit an affidavit
from the student’s faculty advisor certifying that the student meets the eligibility
requirements.
Application Process: To enter the Intel Best Student Paper Award
competition, please check the “Intel Best Student Paper Award” box in the
“Awards” section of the online abstract submission form.
2015 Executive
Committee
2015 Program
Committee
Keith Newman
HP
Donna M. Noctor
Siemens Industry, Inc.
General Chair
Beth Keser
Qualcomm Technologies, Inc.
[email protected]
+1-858-658-3332
Advanced Packaging
Chair
Christopher Bower
X-Celeprint Ltd.
[email protected]
+1-919-522-3230
Vice-General Chair
Alan Huffman
RTI International
[email protected]
+1-919-248-9216
Assistant Chair
Rozalia Beica
Yole Developpement
[email protected]
Jeffrey Suhling
Auburn University
Program Chair
Henning Braunisch
Intel Corporation
[email protected]
+1-480-552-0844
Aleksandar Aleksov
Intel Corporation
Muhannad Bakir
Georgia Institute of Technology
Dongji Xie
NVIDIA Corporation
Daniel Baldwin
Engent, Inc.
Assembly & Manufacturing
Technology
Chair
Shawn Shi
Medtronic Corporation
[email protected]
+1-480-929-5614
Assistant Program Chair
Sam Karikalan
Broadcom Corporation
[email protected]
+1-949-926-7296
Jr. Past General Chair
Wolfgang Sauter
IBM Corporation
[email protected]
+1-802-922-3083
Sponsorship Chair
Sr. Past General Chair
David McCann
GLOBALFOUNDRIES
[email protected]
+1-518-222-6128
Finance Chair
Patrick Thompson
Texas Instruments, Inc.
[email protected]
+1-214-567-0660
Publications Chair
Steve Bezuk
Qualcomm Technologies, Inc.
[email protected]
+1-858-651-2770
Treasurer
Tom Reynolds
T3 Group LLC
[email protected]
+1-850-897-7323
Publicity Chair
Eric Perfecto
IBM Corporation
[email protected]
+1-845-894-4400
Exhibits Chair
Joe Gisler
Vector Associates
[email protected]
+1-480-288-6660
Web Administrator
Mark Poliks
i3 Electronics, Inc.
[email protected]
+1-607-727-7104
Professional Development Courses Chair
Kitty Pearsall
Boss Precision, Inc.
[email protected]
+1-512-845-3287
Arrangements Chair
Lisa Renzi
Renzi & Company, Inc.
[email protected]
+1-703-863-2223
CPMT Representative
C. P. Wong
Georgia Institute of Technology
[email protected]
+1-404-894-8391
Omar Bchir
Qualcomm Technologies, Inc.
Jianwei Dong
Dow Electronic Materials
John H. L. Pang
Nanyang Technological University
S. B. Park
Binghamton University
Lakshmi N. Ramanathan
Microsoft Corporation
Ephraim Suhir
University of California, Santa Cruz
Erik Jung
Fraunhofer IZM
Assistant Chair
Valerie Oberson
IBM Corporation
[email protected]
+1-450-534-7767
Beth Keser
Qualcomm Technologies, Inc.
Sai Ankireddi
Soraa, Inc.
Young-Gon Kim
IDT
Sharad Bhatt
Shanta Systems, Inc.
John Knickerbocker
IBM Corporation
Claudius Feger
IBM Corporation
John H. Lau
ASM Pacific Technology
Mark Gerber
Consultant
Markus Leitgeb
AT&S
Paul Houston
Engent
Dean Malta
RTI International
Sa Huang
Medtronic Corporation
Raj N. Master
Microsoft Corporation
Vijay Khanna
IBM Corporation
Luu T. Nguyen
Texas Instruments Inc.
Chunho Kim
Medtronic Corporation
Deborah Patterson
Amkor Technology, Inc.
Wei Koh
Pacrim Technology
Raj Pendse
STATS ChipPAC, Inc.
Choon Heung Lee
Amkor Technology
Eric Perfecto
IBM Corporation
Mali Mahalingam
Freescale Semiconductor, Inc.
Peter Ramm
Fraunhofer EMFT
Debendra Mallik
Intel Corporation
Subhash L. Shinde
Sandia National Laboratory
Jae-Woong Nah
IBM Corporation
Joseph W. Soucy
Draper Laboratory
Hirofumi Nakajima
Consultant
E. Jan Vardaman
TechSearch International, Inc.
Tom Poulin
Aerie Engineering
Applied Reliability
Chair
Scott Savage
Medtronic Microelectronics Center
[email protected]
+1-480-303-4749
Shichun Qu
Fairchild Semiconductor
Altaf Hasan
Intel Corporation
Assistant Chair
Vikas Gupta
Texas Instruments
[email protected]
+1-214-567-3160
Jo Caers
Royal Philips
Sridhar Canumalla
Microsoft Corporation
Tim Chaudhry
Broadcom Corporation
Tz-Cheng Chiu
National Cheng Kung University
Darvin R. Edwards
Edwards Enterprises
Deepak Goyal
Intel Corporation
Dongming He
Qualcomm Technologies, Inc.
Toni Mattila
Aalto University
Tom Swirbel
Motorola, Inc.
Paul Tiner
Texas Instruments
Sean Too
Microsoft
Andy Tseng
JSR Micro
Shaw Fong Wong
Intel Corporation
Jie Xue
Cisco Systems, Inc.
Jin Yang
Intel Corporation
Tonglong Zhang
Nantong Fujitsu Microelectronics Ltd.
Emerging Technologies
Chair
C. S. Premachandran
GLOBALFOUNDRIES
premachandrancs@globalfoundries.
com
+1-518-305-7317
Assistant Chair
Rabindra N. Das
MIT Lincoln Labs
[email protected]
+1-781-981-1318
Isaac Robin Abothu
Siemens Medical Solutions USA Inc.
Jai Agrawal
Purdue University
Vasudeva P. Atluri
Renavitas Technologies
Mark Bachman
University of California, Irvine
Karlheinz Bock
Fraunhofer EMFT and University of
Berlin
Vaidyanathan Chelakara
Ciena Corporation
John Cunningham
Oracle
Steve Greathouse
Plexus Corporation
Kevin J. Lee
Intel Corporation
Joana Maria
IBM Corporation
Goran Matijasevic
University of California, Irvine
Shah Milind
Qualcomm Technologies, Inc.
Dave Peard
Henkel Corporation
Andrea Paganini
IBM Corporation
Albert F. Puttlitz
Mechanical Eng. Consultant
P. Markondeya Raj
Georgia Institute of Technology
Luca Roselli
University of Perugia
Clemens Ruppel
TDK
Hideki Sasaki
Renesas Electronics Corporation
Li-Cheng Shen
Quanta Research Institute
Manos M. Tentzeris
Georgia Institute of Technology
Frank Theunis
Qualcomm Technologies Netherlands
B.V.
Leena Ukkonen
Tampere University of Technology
Interconnections
Chair
Li Li
Cisco Systems, Inc.
[email protected]
+1-408-527-0801
Assistant Chair
Changqing Liu
Loughborough University
[email protected]
+44-1509-227681
Koneru Ramakrishna
Hewlett-Packard Company
William Chen
Advanced Semiconductor
Engineering, Inc.
Jintang Shang
Southeast University
Kathy Cook
Ziptronix
Nancy Stoffel
GE Global Research
Rajen Dias
Intel Corporation
Vivek Subramanian
University of California
Bernd Ebersberger
Intel Corporation
Klaus-Jürgen Wolter
Technische Universität Dresden
Takafumi Fukushima
Tohoku University
Allison Xiao
Henkel Corporation
Tom Gregorich
Micron
Jimin Yao
Intel Corporation
Wei-Chung Lo
ITRI
High-Speed, Wireless &
Components
Chair
Nanju Na
IBM Corporation
[email protected]
+1-512-695-1425
Nathan Lower
Rockwell Collins, Inc.
Assistant Chair
Prem Chahal
Michigan State University
[email protected]
+1-517-355-0248
Amit P. Agrawal
Cisco Systems, Inc.
Eric Beyne
IMEC
Craig Gaw
Freescale Semiconductor, Inc.
Apostolos Georgiadis
Centre Tecnològic de
Telecomunicacions de Catalunya
(CTTC)
Abhilash Goyal
Oracle
Rockwell Hsu
Cisco Systems, Inc.
Lih-Tyng Hwang
National Sun Yat-Sen University
Mahadevan K. Iyer
Texas Instruments, Inc.
Timothy G. Lenihan
TGL Consulting
Li Li
Freescale Semiconductor, Inc.
Sebastian Liau
ITRI
Lianjun Liu
Freescale Semiconductor, Inc.
James Lu
Rensselaer Polytechnic Institute
Voya Markovich
Microelectronic Advanced Hardware
Consulting, LLC
James E. Morris
Portland State University
Lou Nicholls
Amkor Technology, Inc.
Gilles Poupon
CEA-LETI
Katsuyuki Sakuma
IBM Corporation
Lei Shan
IBM Corporation
Katsuaki Suganuma
Osaka University
Chuan Seng Tan
Nanyang Technological University
Matthew Yao
GE Energy Management
Materials & Processing
Chair
Diptarka Majumdar
Superior Graphite
[email protected]
+1-919-418-8025
Assistant Chair
Bing Dang
IBM Corporation
[email protected]
+1-914-945-1568
Tanja Braun
Fraunhofer IZM
Choong Kooi Chee
KBU International College
Tim Chen
Darbond Technology Co., Ltd.
Frank Wei
Disco Japan
Pradeep Lall
Auburn University
Z. Rena Huang
Rensselaer Polytechnic Institute
Yu-Hua Chen
Unimicron
Myung Jin Yim
Intel Corporation
Takaaki Ishigure
Keio University
C. Robert Kao
National Taiwan University
Tieyu Zheng
Microsoft Corporation
Sheng Liu
Huazhong University of Science and
Technology
Dong Wook Kim
Qualcomm Technologies, Inc.
Modeling & Simulation
Chair
Yong Liu
Fairchild Semiconductor Corporation
[email protected]
+1-207-761-3155
Tony Mak
Wentworth Institute of Technology
Daniel D. Lu
Henkel Corporation
Assistant Chair
Dan Oh
Altera Corporation
[email protected]
+1-408-544-8103
Hongxia Lu
Intel Corporation
Kemal Aygün
Intel Corporation
Jaemin Shin
Samsung Electronics Co., Ltd.
Hongtao Ma
Lightera Corporation
Wendem Beyene
Rambus Inc.
Suresh K. Sitaraman
Georgia Institute of Technology
Mikel Miller
Draper Laboratory
Zhaoqing Chen
IBM Corporation
G. Q. (Kouchi) Zhang
Delft University of Technology (TUD)
Kyung-Wook Paik
KAIST
Kuo-Ning Chiang
National Tsinghua University
Mark Poliks
i3 Electronics, Inc.
Daniel de Araujo
Nimbic, Inc.
Dwayne Shirley
Qualcomm Technologies, Inc.
Xuejun Fan
Lamar University
Optoelectronics
Chair
Stefan Weiss
II-VI Laser Enterprise GmbH
[email protected]
+41-44-455-8732
Ivan Shubin
Oracle
Xiaoxiong (Kevin) Gu
IBM Corporation
Yoichi Taira
IBM Corporation
Woopoung Kim
Qualcomm Technologies, Inc.
Lejun Wang
Qualcomm Technologies, Inc.
Bruce Kim
City University of New York
Kwang-Lung Lin
National Cheng Kung University
Gamal Refai-Ahmed
PreQual Technologies Corp.
Sandeep Sane
Intel Corporation
Assistant Chair
Hiren Thacker
Oracle
[email protected]
+1-858-526-9442
Fuad Doany
IBM Corporation
Gordon Elger
Technische Hochschule Ingolstadt
Rao Bonda
Amkor Technology
Harry G. Kellzi
Teledyne Microelectronic
Technologies
Mark Eblen
Kyocera America, Inc.
John Hunt
ASE US Inc.
Michael Leers
Fraunhofer ILT
Nam Pham
IBM Corporation
Masanobu Okayasu
Oclaro Japan, Inc.
Mark Poliks
i3 Electronics, Inc.
Kannan Raj
Oracle
Nancy Stoffel
GE Global Research
Alex Rosiewicz
Gooch & Housego
Patrick Thompson
Texas Instruments, Inc.
Henning Schroeder
Fraunhofer IZM
Professional Development
Courses
Chair
Kitty Pearsall
Boss Precision, Inc.
[email protected]
+1-512-845-3287
Andrew Shapiro
JPL
Masao Tokunari
IBM Corporation
Jean Trewhella
IBM Corporation
Shogo Ura
Kyoto Institute of Technology
Ping Zhou
LDX Optronics, Inc.
Interactive Presentations
Chair
Ibrahim Guven
University of Arizona
[email protected]
+1-520-626-2257
Assistant Chair
Jeffrey Suhling
Auburn University
[email protected]
+1-334-844-3332
Eddie Kobeda
IBM Corporation
IEEE CPMT
445 Hoes Lane
Piscataway, NJ 08854-4141 USA
Grace Yi Li
Intel Corporation
Erdogan Madenci
University of Arizona
Soon Jang
ficonTEC USA
Sponsored by:
Chin C. Lee
University of California, Irvine
En-Xiao Liu
Institute of High Performance
Computing, A*STAR
Assistant Chair
Michael Mayer
University of Waterloo
[email protected]
+1-519-888-4024