Low Pressure Molding Cost Savings Summary Current Potting Process 1 Capital Equipment $ LPM* Process $ Moldman™ Dispense Equipment Heat Ovens UV Chamber or Tunnel Other (Make Housings/Cover) 2 Production Floorspace Production Floorspace Start to Finish 3 Tooling Costs Moldset Cover Housing Other 4 Work in Process Work in Process Value of Assembly at Dispense Value of Assembly at Precure Value of Assembly at Curing Value of Assembly at Post Cure 5 6 Labor Costs Labor Costs Start to Finish Start to Finish Energy Costs for Equipment Energy Costs for Equipment Dispense Moldman™ Cure 7 Preventative Maintenance Costs for Equipment Preventative Maintenance Costs for Equipment Dispense Moldman™ Cure 8 9 Cycle Time Cycle Time Start to Finish Start to Finish Bill of Materials Costs Bill of Materials Costs Material (Parts) Material (Parts) Potting Material Macromelt® Total Cost Savings * LPM = Low Pressure Molding. Savings Macromelt® Application Questionnaire Maximum operating temperature of final device? Size of the device being encapsulated (length x width)? End environment of printed circut board (e.g. outdoor, office, tire, etc.)? Are there any specific solvents or environments that the coating must withstand? Board complexity: high density or low density? UL required? What surfaces need to be adhered to? Repair or reworkability required? Required output/parts per hour? Except as otherwise noted, all marks used are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S. and elsewhere. ® = registered in the U.S. Patent and Trademark Office. Moldman is a trademark of Cavist Corporation. © Henkel Corporation, 2013. All rights reserved. 9192/LT-6659 (2/13)