Get Smart • Get Efficient • Get to Market Quickly GET CONNECTED with Future Connectivity Solutions ISSUE 03 FEATURED TECHNOLOGIES 802.15.4 / SUB-GIG Bluetooth Cellular Wi-Fi SUPPLIERS Taking the world wireless Connectivity Solutions CSR Digi GainSpan MultiTech Murata Panasonic Silex TABLE OF CONTENTS ISSUE 3 802.15.4 / SUB-GIG DIGI - Digi XLR PRO with Punch2 Technology™ is the Most Reliable Unlicensed 900MHz Radio in Noisy RF Environments – Capable of 100+mile Range 3 BLUETOOTH CSR - CSRmeshTM Low Power Wireless Solution Enables the Internet of Things 5 Murata - Murata Type ZY Bluetooth Smart Module 7 Panasonic - PAN1322 Series - All-In-One, Place and Play Bluetooth® Module 8 CELLULAR Multi-Tech - Fully Certified, Carrier Approved Cellular Connectivity for Your M2M/IOT Application 10 WI-FI Gainspan - GS2011M Ultra-Low Power High Speed 802.11B/G/N Module 13 Silex - SX-PCEAN2: 802.11 A/B/G/N Mini PCIE Radio Module With Industrial Temperature Support 16 GET CONNECTED | ISSUE 3 2 DIGI XLR PRO WITH PUNCH2 TECHNOLOGY™ IS THE MOST RELIABLE UNLICENSED 900MHZ RADIO IN NOISY RF ENVIRONMENTS - CAPABLE OF 100+MILE RANGE The Digi XLR PRO™ is a high performance, industrial grade long-range 900 MHz radio that offers reliable wireless communications for serial and Ethernet devices over long distances. Digi’s patent-pending Punch2 Technology™ enables the Digi XLR PRO to achieve industry-leading range of 100+ miles and interference immunity that will punch through noisy RF environments. Flexible configuration options, including XCTU (Digi’s configuration platform), local Web UI or Digi Remote Device Manager(TM), allow for quick configuration and deployment of multiple Digi XLR PRO radios in the field. Critical device management features include over-the-air firmware updates, device status information and centralized remote management using Digi Remote Device Manager(TM). APPLICATIONS • Oil/Gas – Digital Oilfield Automation • Utilities • Precision Agriculture • Digital Signage FEATURES/BENEFITS Figure 1: Digi XLR PRO with Punch2 Technology™ • Patent-pending Punch2 • Flexible data rates of up to 3.2 Mbps Technology™ enables industry• Simple configuration via XCTU, leading interference immunity local WebUI or Digi Remote Device • Best-in-class range of 1 to 100+ miles Manager(TM) LOS • Scalable device management with • Industrial aluminum-cast design with Digi Remote Device Manager(TM) -40° C to +70° C temperature rating and Class 1 Division 2 certification PART SELECTOR TABLE PART NUMBER DESCRIPTION DOCUMENTS XL9-UA Digi XLR PRO Long-Range 900MHz Modem, Includes Accessories – North America PRODUCT BRIEF XL9-U Digi XLR PRO Long-Range 900MHz Modem, No Accessories – North America PRODUCT BRIEF DOWNLOADABLE EXTRAS • XLR - White Paper • Getting Started Guide: XLR Pro TECHNOLOGY | 802.15.4 / SUB-GIG • Quick Start Guide: XLR Pro 3 XLR PRO PART SPECIFICATIONS GENERAL Dimensions 18 x 13 x 3.8 cm (7.1 x 5 x 1.5 inches) Ethernet Physical Layer 10/100BASE-T/TX Ethernet Protocols UDP/TCP, DHCP Client PERFORMANCE Frequency Range ISM 902 to 928 MHz RF Data Rate 9.3 kbps to 3.2 Mbps Transmit Power (Software Selectable) Up to 30 dBm (highest power level) Range - Line of Sight 100+ Miles Receiver Sensitivity 9.4 kbps: -120 dBm; 141 kbps: -112 dBm; 3.2 Mbps: -98 dBm Receiver Selectivity 141 kbps: 70 dB (below 908 MHz, above 922 MHz) 40 dB (908 MHz to 922 MHz) Throughput Data Rate (Software Selectable) 460.8 kbps (TCP/UDP Socket); 921.6 kbps (Serial RS-485); 460.8 kbps (Serial RS-232) NETWORKING AND SECURITY Modulation Punch2 Technology™ (Patent pending) Supported Network Topologies Point-to-point/point-to-multipoint Encryption 128-bit AES POWER REQUIREMENTS Supply Voltage 9 V to 26 V Receive Current 300 mA @ 9 V; 230 mA @ 12 V; 120 mA @ 26 V Transmit Current 950 mA @ 9 V; 840 mA @ 12 V; 400 mA @ 26 V ENVIRONMENTAL Operating Temperature -40°C to +70°C REGULATORY APPROVALS Emissions/Immunity FCC Part 15B, IC Hazardous Locations Class 1 Division 2 Groups A, B, C, D CONNECTORS Antenna RPTNC Power Supply Phoenix Ethernet (2) RJ45 Serial (1) RJ45 - RS232/485 Configuration Port Mini-USB (Coming Soon) TECHNOLOGY | 802.15.4 / SUB-GIG 4 CSRmeshTM LOW POWER WIRELESS SOLUTION ENABLES THE INTERNET OF THINGS CSRmesh is a configuration and control protocol running over Bluetooth® 4.0 devices that enables messages to be sent to individual devices or groups and relayed over multiple Bluetooth Smart devices thus extending the range of Bluetooth Smart and turning it into a mesh network for the Internet of Things. CSRmesh allows developers to network individual or groups of devices, such as a smartphone or tablet with lighting, heating, security sensors or appliances and thereby create comprehensive home automation connectivity solutions. CSR is actively working with the Bluetooth SIG to standardize the technology and enable wide participation from many manufacturers. Figure 1: CSRmesh™ Development Board APPLICATIONS • Internet of things • Wireless lighting and control • Home automation • H eating, ventilation and air conditioning control and monitoring http://www.csr.com/products/technology/csrmesh BENEFITS • Simple direct configuration and • Virtually unlimited number of devices control from existing Smartphones can be connected (up to 64,000) and tablets. Android and iOS devices • Safe and secure message supported transmission • No need for a complicated or • Robust and failsafe expensive hub device or access point • S ecurity and sensing, door and window locks/sensors • Appliances • Control of home entertainment FEATURES • Single-chip µEnergy® radio with integrated microprocessor and enhanced memory for greater application flexibility • P rotocol layer that runs on top of existing CSR Bluetooth 4.0 devices • E asy to use and configure from Smartphone App • H igh level security prevents eavesdropping, man-in-middle and replay attacks • A uthentication mode for enhanced security Figure 2: CSRmesh™ TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG 5 CSRmesh Development Kits introduce a simplified yet comprehensive development platform for product designers who want to rapidly prototype networking of Bluetooth Smart products using the CSRmesh protocol. CSRMESH DEVELOPMENT BOARD FEATURES Figure 3: CSRMesh Development Kit • CSR1010 IC with 64k EEPROM – a single-chip µEnergy® radio with integrated microprocessor and enhanced memory for greater application flexibility. • PCB antenna • 1x RGB LED • Power switch • 2x user pushbuttons & 1x user slide switch • SPI programming connector • 2x AA battery holders on reverse • Pads to connect IO to external devices TOOL SELECTOR TABLE PART NUMBER DESCRIPTION Full development kit, 3x target DK-CSR1010-10184-1A boards, programmer, cables, batteries DB-CSR1010-10185-1A Board only, 1x development board, batteries TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG DOCUMENTS PRODUCT BRIEF PRODUCT BRIEF 6 MURATA TYPE ZY BLUETOOTH SMART MODULE Murata’s Type ZY Bluetooth SMART Module (part number LBCA2HNZYZ-711) supports Bluetooth v4.1 BLE standard. All protocol stacks required for Bluetooth low energy communication are built in, including various healthcare profiles. It features an onboard PCB Antenna, low current consumption, and ibeacon support. BENEFITS • Extremely flexible for a variety of Bluetooth Low Energy Applications Figure 1: LBCA2HNZYZ-711 • Miniature size (7.4 x 7.0 x 1.0mm) • Outstanding DC current consumption (4.5mA) making it practical to run Bluetooth Low Energy applications from a tiny coin cell battery with long life. FEATURES • Overall dimensions measure a tiny 7.4 x 7.0 x 1.0 mm enabling placement within space critical devices • Offers outstanding DC current consumption (4.5mA) • Two host interfaces, UART and SPI • Additional data sensing interfaces including I2C, GPIOs, ADC, and quadrature decoder • Integrated 2.4GHz antenna contained within the encapsulated module package. • Many BLE profiles are available – standard as well as custom for customer specific applications. • The module is certified for the wireless regulatory domains of FCC for America, Industry Canada, and European CE Mark. Figure 2: Block Diagram PART SELECTOR TABLE PART NUMBER LBCA2HNZYZ-711 DESCRIPTION Type ZY Bluetooth Smart 4.1 Low Energy Module APPLICATIONS • Sensing Nodes • Health & Fitness • Medical Devices • Wearables DEVELOPMENT KIT PART NUMBER LBCA2HNZYZ-TEMP-DK DESCRIPTION Type ZY Bluetooth Smart 4.1 Low Energy Module • Smart Phone Peripherals • Remote Controls • Proximity Tags • Wireless Gadgets TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG 7 PANASONIC PAN1322 SERIES ALL-IN-ONE, PLACE AND PLAY BLUETOOTH® MODULE Panasonic PAN1322 module features an embedded microcontroller, Bluetooth 2.1 + EDR stack, serial port profile (SPP), AT command set API and antenna. This cost engineered solution is based on a single chip solution that integrates an ARM7TDMI processor with a Bluetooth controller. The BT 2.1 + EDR stack provides secure, reliable, high speed data connections using Secure Simple Paring (SSP) eliminating manual password creation. Embedded serial port profile (SPP) frees application resources while the AT command set API creates a simple firmware interface using modem commands. An onboard antenna does away with 2.4GHz RF circuit complexity. Figure 1: PAN1322 Series APPLICATIONS • iOS and Android Devices • Wireless Sensors • Cable Replacement • Industrial • Medical • Automotive FEATURES/SPECS Created with the design engineer in mind, product design cycles are greatly reduced using Panasonic’s reference design and design review services. PCB layouts are simplified using available Gerber files and minimized with Panasonic’s tiny footprint technology. The module is just 15.6mm x 8.7mm x 2.8mm and fully shielded to improve immunity. GPIO is exposed using AT commands. All Panasonic Bluetooth RF modules carry FCC, IC, CE Bluetooth certifications. The PAN1322 Series recognizes Apple’s authentication coprocessor and supports Bluetooth Serial Port Profile (SPP) data communication1 with Apple’s iPhone and iPad®*. Connectivity also includes Android, smart phones and all Bluetooth enabled devices2. Panasonic remains committed to customers as a module manufacturer by extending product life using legacy footprints and firmware interfaces to make the PAN1322 Series fully compatible with the module it replaces, the PAN1321 Series. • SPP Device A and B, RFCOMM Profiles Hardware and firmware prototyping and testing are accelerated using the EVAL_PAN1322 development kit and SPP Toolbox development environment. • Industrial Temperature Range, -40 to +85°C 1. Apple authentication coprocessor and MFI certification is required. 2. Connectivity requires that devices support Bluetooth Serial Port Profile • No External Components Needed *Apple iPad and iPhone are trademarks of Apple Inc. • Bluetooth Version 2.1 + EDR • Onboard Voltage Regulator, VIN=2.7 to 3.6 V • Integrated ARM7RDMI 32-Bit Processor w/Patchable EEPROM • 3.25 MBaud UART • GPIO w/Interrupt and Wake-Up Capabilities EEPROM VDD1 Ceramic Antenna I2C VDD_UART PMB8754 BlueMoon UniCellular UART GPIO VSUPPLY Balun Filter / Matching Voltage Regulator Crystal 26 MHz Figure 2: Block Diagram TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG 8 PART SELECTOR TABLE PART NUMBER DESCRIPTION DATASHEET URL DEV. TOOLS ENW-89841A3KF PAN1322 Bluetooth Module, SPP, Integrated Antenna http://na.industrial.panasonic.com/sites/default/pidsa/files/downloads/files/panasonic_ pan1322_datasheet.pdf YES EVAL_PAN1322 PAN1322 Evaluation Kit http://na.industrial.panasonic.com/products/ wireless-connectivity/evaluation-kits/pan1322evaluation-kit YES Figure 3: Development Tools TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH ANTENNAS / SUB-GIG 9 FULLY CERTIFIED, CARRIER APPROVED CELLULAR CONNECTIVITY FOR YOUR M2M/IOT APPLICATION The SocketModem® Cell embedded cellular modem is ideal for customers looking to add cellular communications to their device or solution. This carrier approved and end-device certified embedded cellular modem offers a universal socket footprint that assures a seamless migration to future technologies. This design approach spans across all major cellular technologies, and provides a long solution lifecycle reducing redesign time and costs. Figure 1: SocketModem Cell MTSMC-H5 APPLICATIONS • • • • Asset Tracking ATM terminals Data collection Industrial and medical remote monitoring systems • Remote diagnostics • • • • • Remote metering Security systems Lighting solutions Vending/gaming machines Other devices requiring cellular connectivity FEATURES • HSPA+, EV-DO Rev A, GPRS Class 10 and CDMA2000 1xRTT models • LTE models – engineering samples available now • Universal Socket connectivity • Serial or USB interfaces • Serial interface supports speeds up to 921.6K bps • USB 2.0 HS compliant (HSPA+ and EV-DO models only) • Two-year warranty BENEFITS Figure 2: SocketModem Cell Pin-out Diagram • Interchangeable communications • Partnerships with leading telecom devices for easy migration and operators, regulatory agencies and upgrades without a redesign service enablement providers in the wireless ecosystem to meet any • Wide selection of cellular Machine-to-Machine challenge technologies and models to optimize deployment needs • Fully certified, carrier approved as an end-device for use in the U.S., • 5-7 year product lifecycle Canada and European Union TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH |ANTENNAS CELLULAR / SUB-GIG 10 PART SPECIFICATIONS MODEL MTSMC-H5 MTSMC-EV3 MTSMC-G2/G3 MTSMC-C2 Technical Specifications Performance HSPA+ Frequency Band EV-DO Rev A GPRS Class 10 CDMA2000 1xRTT 3G: 850/900/1700 800/1900 MHz (AWS)/1900/2100 MHz 2G: 850/900/1800/1900 MHz 850/900/1800/1900 MHz 800/1900 MHz USB USB 2.0 High Speed USB 2.0 High Speed N/A N/A TCP/IP Functions FTP, SMTP, TCP, UDP, SSL, & HTTP FTP, SMTP, TCP, & UDP G2 Models: FTP, HTTP, POP3, SMTP, TCP Client & Server, & UDP Client G3 Model: FTP, SMTP, TCP, & UDP FTP, SMTP, TCP, & UDP Power Draw* 5VDC; 19mA sleep, 28mA idle, 397mA maximum 5VDC; 22mA sleep, 34mA idle, 423mA maximum G2 Models: 5VDC, 15mA sleep, 113mA typical, 240mA maximum G3 Model: 5VDC, 32mA sleep, 54mA idel, 358mA maximum 5VDC; 32mA sleep, 45mA idle, 552mA maximum Input Power 3.3V – 5VDC 3.3V – 5VDC G2 Models: 5VDC G3 Model: 3.3V–5VDC 3.3V – 5VDC Connectors Antenna: 2 UFL Up to 2 UFL (Cellular & Rx Diversity) (Cellular & Rx Diversity) Mini SIM: 1.8V & 3V Antenna: 1 UFL Mini SIM: 1.8V & 3V Antenna: 1 UFL Physical Description Physical Dimensions 3.15” x 1.375” (80.010 mm x 34.925 mm) Environmental Operating Temperature -35° to +85°C -40° to +85°C Storage Temperature -40° to +85°C -40° to +85°C -40° to +85°C Humidity Relative humidity 20% to 90% non-condensing Certifications EMC & Radio Compliance See datasheet Safety See datasheet Network Carrier PTCRB AT&T, Aeris, T-Mobile N/A G2 Models: PTCRB G3 Model: Uses a GCF certified module N/A Verizon, Aeris G2 Models: AT&T, Aeris, T-Mobile Verizon, Aeris, Sprint *See device guides for additional information TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH |ANTENNAS CELLULAR / SUB-GIG 11 DEVELOPMENT TOOLS: MultiTech’s Universal Socket developer’s kit allows you to plug in the communications device and use it for testing, programming and evaluation. The kit includes one development board, universal power supply, antennas, cables and software. Ordering Part Number: MTSMI-UDK MultiTech’s SocketModem® Shield™ is a rapid prototyping and development tool for cellular connectivity. It gives access to MultiTech’s extensive line of fully-certified cellular SocketModem’s through an Arduino Shield interface, the de facto standard for accessory cards in the microcontroller development community. This product also comes with an mbed compatible software library for even faster development. Please visit MultiTech’s mbed page for more information. Ordering Part Number: MTSAS-DK PART SELECTOR TABLE PART NUMBER DESCRIPTION MTSMC-H5 HSPA+ Embedded Modem (Serial Interface) – Global MTSMC-H5-U HSPA+ Embedded Modem (USB Interface) – Global MTSMC-EV3-N3 EV-DO Embedded Modem (Serial Interface) for Verizon Networks MTSMC-EV3-U-N3 EV-DO Embedded Modem (USB Interface) for Verizon Networks MTSMC-EV3-N16 EV-DO Embedded Modem (Serial Interface) for Aeris Networks MTSMC-EV3-U-N16 EV-DO Embedded Modem (USB Interface) for Aeris Networks MTSMC-G2 850/1900 MHz GSM/GPRS Embedded Modem – Global MTSMC-G2-ED 900/1800 MHz GSM/GPRS Embedded Modem – Global MTSMC-G2-V 850/1900 MHz GSM/GPRS Embedded Modem w/Voice – Global MTSMC-G2-V-ED 900/1800 MHz GSM/GPRS Embedded Modem w/Voice – Global MTSMC-G3-EU 850/900/1800/1900 MHz GSM/GPRS Embedded Modem – Euro/GB MTSMC-C2-N2 CDMA2000 1xRTT Embedded Modem (Serial Interface) for Sprint Networks MTSMC-C2-N3 CDMA2000 1xRTT Embedded Modem (Serial Interface) for Verizon Networks MTSMC-C2-N16 CDMA2000 1xRTT Embedded Modem (Serial Interface) for Aeris Networks For information on models for regions not shown above, contact your Future representative. TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | 802.15.4 || BLUETOOTH |ANTENNAS CELLULAR / SUB-GIG 12 GS2011M ULTRA-LOW POWER HIGH SPEED 802.11B/G/N MODULE The GS2011M is an ultra-low power module that provides a high speed serial interface connection to an embedded design built on an 8/16/32-bit microcontroller. The SDIO interface can be clocked at up to 40MHz. FEATURES • Power source: - 3.3V main supply - 3.3V I/O - 1.6V to 3.6V Battery • Certification: FCC, IC, CE/ETSI, • TELEC, Wi-Fi • I/O interfaces : SPI, UART, SDIO, I2C, I2S, GPIO, ADC, JTAG, PWM • Industrial Grade • IEEE 802.11 b/g/n connectivity with PHY rates up to 72 Mbps • Limited AP, Wi-Fi Direct with concurrent mode, WPS 2.0 • UART, SPI, SDIO interface to microcontroller • 27 configurable I/O • Interface clock rate: 40MHz on SDIO, 30MHz on SPI (master), 10MHz on SPI (slave), and 921k baud on UART The module is IEEE 802.11b/g/n compliant, and meets worldwide regulatory and Wi-Fi Alliance certification requirements. It includes two analog to digital converter (ADC) pins for connecting energy measurement and other sensors. It runs the full Wi-Fi and TCP/IP networking stacks on module, completely offloading the host microcontroller. The module supports a complete suite of security protocols, also without tasking the host microcontroller, including WPA/WPA2-Enteprise and Personal security modes, legacy WEP encryption, and upper layer security protocols such as TLS/SSL and HTTPs. Alternatively, it can be run self-contained without a host. For ease of provisioning, the module can be set up simply and easily from a smartphone or laptop through the innovative Limited AP mode or with Wi-Fi Protected Setup (WPS). The GS2011M is available with an u.FL connector to add an external antenna for max performance or a ceramic chip for convenience while saving space. US/Canada (FCC/IC), Europe (CE/ETSI), Japan (TELEC), and Wi-Fi certified. APPLICATIONS • Healthcare and fitness • Commercial Building Automation • Smart Energy • Consumer Electronics • Industrial Controls BENEFITS • Adds low power, high speed Wi-Fi and Internet connectivity to any device with a microcontroller and serial host interface • C ertified module reduces development time, testing, and certification, accelerating time to market • xtensive networking stack and E services • E asy upgrade path: footprint and pin compatible with GS1011M and GS1500M modules • ecurity: 802.11i, WPA/2–Personal S and Enterprise, legacy WEP, TLS • Full offload solution minimizes load on host processor • Easy smartphone provisioning with Limited AP or Wi-Fi Protected Setup (WPS) • U ltra low power consumption through dynamic power management modes and on module DC to DC regulator • Extended range TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE 13 Figure 2: GS2011M System Block Diagram Figure 3: GS2011M Block Diagram GS2011M MODULE SPECIFICATIONS Backwards compatibility Pin compatible to GS1011MIE, GS1011MIP, GS1011MEE, GS1011MEP and GS1500M. Same size and footprint as GS1011MIE and GS1011MIP Radio Protocol IEEE 802.11b/g/n Pin Count 49 pins RF Output Power (Typical) +17 dBm (802.11b 1Mbps), +15dBm (802.11g 6Mbps), +14dBm (802.11n MCS0) Rx Sensitivity -91 dBm (802.11b 1Mbps), -88 dBm (802.11g 6Mbps), -88 dBm (802.11n MCS0) Wake From Standby Time 1.25 millisecond RF Operating Frequency 2.4 - 2.495 GHz Supported Data Rates 72, 65, 58, 43, 29, 22, 14, 7 Mbps (802.11n), 54, 48, 36, 24, 18, 12, 9, 6 Mbps (802.11g) 11, 5.5, 2, 1 Mbps (802.11b) Antenna External Antenna (u.FL connector) or Ceramic Chip Operating Temperature -40° to +85°C Security Protocols WPA/WPA2 - Personal, WPA/WPA2 - Enterprise (PEAP, EAP-FAST, EAP-TLS, EAP-TTLS), WEP, TLS/SSL Client and Server, HTTPs Networking Protocols TCP, UDP, IPv4, IPv6, TLS Client and Server, SNTP client, DHCP Client and Server v4, DHCP Client and Server v6, DNS Client and Server, HTTP Client and Server, XML Parser Certifications and Compliance FCC, IC, TELEC, CE/ETSI, RoHS, Wi-Fi CERTIFIED I/O Interfaces SPI, UART, SDIO, I2C, I2S,GPIO (27), ADC (2), JTAG, PWM (3), RTC (3) Host Connections SPI, UART, SDIO Internal Flash 4 MB Outline Dimensions 22.8 mm x 32.5 mm x 3.63 mm (shield) I/O Voltage 3.3V Operating Voltage 2.7-3.6V VBAT 1.6-3.6V TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE 14 PART SELECTOR TABLE PART NUMBER ANTENNA OPTION DOCUMENTS GS2011MIE External (u.FL) http://www.gainspan.com/docs2/GS2011M-PB-new.pdf GS2011MIZ Ceramic Chip http://www.gainspan.com/docs2/GS2011M-PB-new.pdf The GainSpan GS2011M Evaluation Boards (EVB) provide a quick, easy, and cost-effective platform for customers to add Wi-Fi capabilities to their products with minor impact on the host microcontroller firmware. Users can use the Serial-to-WiFi software packaged with the EVB to build a hosted application or program the board with custom binaries built using the GainSpan SDK Builder or GS2000 SDK. Figure 4: GS2011M/GS2100M EVB EVALUATION BOARD FEATURES • Supports highly integrated 802.11b/g/n GS2011M and GS2100M Wi-Fi modules • S upports multiple serial ports o UART: up to 921 Kbps o SPI: up to 30MHz (master mode) 10MHz (slave mode) o SDIO: up to 40MHz • High resolution sensing and energy measurements for smart energy applications • Temperature and light sensors for quick development of sensor applications • C omes programmed with Serial-to-WiFi software including full Wi-Fi stack - Wi-Fi security (WEP, WPA/2), WPS and networking stack including TCP/UDP/IP, DNS, DHCP, HTTP/s, DTLS, CoAP, TLS/SSL • Push button for WPS, Alarms, Factory Restore, and Reset • JTAG interface for software development • Daughter card connector for connection to • Evaluation Board Product Brief: https://s3.amazonaws.com/site_support/uploads/document_upload/GS2K_BM_EVB_PB_000102.pdf TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE 15 SX-PCEAN2: 802.11 A/B/G/N MINI PCIE RADIO MODULE WITH INDUSTRIAL TEMPERATURE SUPPORT The SX-PCEAN2 is the next generation dual-band 802.11 a/b/g/n PCIe module with industrial temperature support which is designed for devices that require wireless connectivity in a small form factor combined with high data throughput, at extreme temperatures. The SX-PCEAN2 is powered by Qualcomm Atheros radio chip and features 2x2 MIMO technology for higher throughput performance, reliability and range. Figure 1: SX-PCEAN2 BENEFITS • MIMO System: 2x2 stream system and 40MHz channel width provides a strong and • Data Rates: MIMO architecture allows link speeds up to 300Mbps. • Industrial Temperature: Industrial grade module supports extended temperature range from -40°C to +85°C. APPLICATIONS The SX-PCEAN2 is designed to meet the demanding performance requirements of critical embedded applications. • • • • • Medical devices Security Systems Industrial Digital Signs Set-Top/ Net-Top Box • • • • Embedded Industrial applications Tablet PC Handheld devices Thin Client devices and many more FEATURES • Premium Quality: With in-house manufacturing capability, each card is individually tested and inspected to ensure the industry’s highest quality resulting greater performance and reliability. Product Name SX-PCEAN2c / SX-PCEAN2i Radio Chipset AR9582 [commercial] / AR9592 [Industrial] Radio Specifications 802.11a/b/g/n Security Open System, WEP, WPA, WPA2. 80.211x • Modes of Operation: SX-PCEAN2 supports access point, adhoc and client modes. Interface PCI Express mini card edge Operating Voltage 3.3 V Humidity 20 ~ 80% RH • Wi-Fi Protected Setup: WPS 2.0 implementation making it easy to add new devices to an existing network without entering long passphrases. Operating Temperature SX-PCEAN2c: 0°C to +60°C SX-PCEAN2i: -40°C to +85°C Storage Temperature -40°C to +85°C Dimensions 29.85 × 26.80 x 3.45 mm • Certifications: Modular certi¬fications for FCC and TELEC. Weight 3.3 g MTBF 90,000 hours • Driver Support: Silex Linux driver with WEP, TKIP, AES encryption, IEEE 802.11e (QoS), IEEE 802.1X, and hidden SSID support. Open Source driver option as well. Evaluation Platform Freescale i.MX6 TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE 16 Figure 2: Hardware Block Diagram PART SELECTOR TABLE PART NUMBER DESCRIPTION SX-PCEAN2c IEEE 802.11a/b/g/n commercial temperature dual band PCI Express Half-Mini Card. SX-PCEAN2c-SP Sample Pack. IEEE 802.11a/b/g/n commercial temperature dual band PCI Express Half-Mini Card. Individually packaged with 2 antennas & cables. SX-PCEAN2i IEEE 802.11a/b/g/n dual band PCI Express Half-Mini Card with industrial temperature support. SX-PCEAN2-SP Sample Pack. IEEE 802.11a/b/g/n dual band PCI Express Half-Mini Card with industrial temperature support. Individually packaged with 2 antennas & cables TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY TECHNOLOGY | GPS | 802.15.4 || BLUETOOTH |/ANTENNAS CELLULAR GNSS | WI-FI / SUB-GIG MODULE 17
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