Si4833DY Vishay Siliconix P-Channel 30-V (D-S) MOSFET with Schottky Diode VDS (V) rDS(on) () –30 ID (A) 0.085 @ VGS = –10 V 3.5 0.180 @ VGS = –4.5 V 2.5 VKA (V) VF (V) Diode Forward Voltage IF (A) 30 0.5 V @ 1.0 A 1.4 SO-8 A 1 8 K A 2 7 K S 3 6 D G 4 5 D S K D A G Top View Parameter Symbol Limit Drain-Source Voltage (MOSFET) VDS –30 Reverse Voltage (Schottky) VKA 30 Gate-Source Voltage (MOSFET) VGS 20 Continuous Drain Current (TJ = 150C) 150 C) (MOSFET)a, b TA = 25C TA = 70C Pulsed Drain Current (MOSFET) Continuous Source Current (MOSFET Diode Conduction)a, b Average Foward Current (Schottky) Pulsed Foward Current (Schottky) Maximum Power Dissipation (MOSFET)a, b Maximum Power Dissipation (Schottky)a, b TA = 25C 2.8 IDM 20 IS – 1.7 IF 1.4 IFM 30 A 2 1.3 PD W 1.9 TA = 70C Operating Junction and Storage Temperature Range V 3.5 ID TA = 25C TA = 70C Unit 1.2 TJ, Tstg C –55 to 150 Parameter Maximum Junction-to-Ambient (t 10 sec)a Maximum Junction-to-Ambient (t = steady state)a Device Symbol Typical MOSFET Schottky Unit 62.5 Schottky MOSFET Maximum 65 RthJA 90 C/W 92 Notes a. Surface Mounted on FR4 Board. b. t 10 sec. Document Number: 70796 S-56941—Rev. B, 02-Nov-98 www.vishay.com FaxBack 408-970-5600 2-1 Si4833DY Vishay Siliconix Parameter Symbol Test Condition Min VGS(th) VDS = VGS, ID = –250 mA –1.0 Typ Max Unit Static Gate Threshold Voltage Gate-Body Leakage IGSS Zero Gate Voltage Drain Current IDSS On-State Drain Currenta Drain Source On-State Drain-Source On State Resistancea Forward Transconductancea Diode Forward Voltagea ID(on) rDS(on) DS( ) V VDS = 0 V, VGS = "20 V "100 VDS = –30 V, VGS = 0 V –1 VDS = –30 V, VGS = 0 V, TJ = 55C –25 VDS w –5 V, VGS = –10 V –15 nA mA A VGS = –10 V, ID = –2.5 A 0.066 0.085 VGS = –4.5 V, ID = –1.8 A 0.125 0.180 gfs VDS = –10 V, ID = –2.5 A 5.0 VSD IS = –1.7 A, VGS = 0 V –0.8 –1.2 8.7 15 W S V Dynamicb Total Gate Charge Qg Gate-Source Charge Qgs VDS = –10 10 V V, VGS = –10 10 V V, ID = –2.5 25A nC C 1.9 Gate-Drain Charge Qgd 1.3 Turn-On Delay Time td(on) 7 15 tr 9 18 14 27 8 15 50 80 Typ Max Rise Time Turn-Off Delay Time td(off) Fall Time tf Source-Drain Reverse Recovery Time trr VDD = –10 10 V V,, RL = 10 W ID ^ –1 1 A, A VGEN = –10 10 V V, RG = 6 W IF = –1.7 A, di/dt = 100 A/ms ns Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. Parameter Forward Voltage Drop Maximum Reverse Leakage Current M i R L k C Junction Capacitance www.vishay.com FaxBack 408-970-5600 2-2 Symbol VF Irm CT Test Condition Min IF = 1.0 A 0.45 0.5 IF = 1.0 A, TJ = 125C 0.36 0.42 Vr = 30 V 0.004 0.100 Unit V Vr = 30 V, TJ = 100C 0.7 10 Vr = –30 V, TJ = 125C 3.0 20 Vr = 10 V 62 mA A pF Document Number: 70796 S-56941—Rev. B, 02-Nov-98 Si4833DY Vishay Siliconix Output Characteristics Transfer Characteristics 20 20 VGS = 10, 9, 8, 7, 6 V TC = –55C 25C 16 5V I D – Drain Current (A) I D – Drain Current (A) 16 12 8 4V 4 125C 12 8 4 3V 0 0 0 2 4 6 8 0 2 VDS – Drain-to-Source Voltage (V) 4 6 VGS – Gate-to-Source Voltage (V) Capacitance On-Resistance vs. Drain Current 700 0.40 Ciss 0.32 C – Capacitance (pF) r DS(on) – On-Resistance ( ) 600 0.24 VGS = 4.5 V 0.16 VGS = 10 V 500 400 300 Coss 200 0.08 Crss 100 0 0 0 3 6 9 12 0 15 6 ID – Drain Current (A) 2.0 1.8 r DS(on) – On-Resistance ( ) (Normalized) VDS = 10 V ID = 2.5 A 8 12 18 24 30 VDS – Drain-to-Source Voltage (V) Gate Charge 10 V GS – Gate-to-Source Voltage (V) 8 6 4 2 On-Resistance vs. Junction Temperature VGS = 10 V ID = 2.5 A 1.6 1.4 1.2 1.0 0.8 0.6 0 0 2 4 6 Qg – Total Gate Charge (nC) Document Number: 70796 S-56941—Rev. B, 02-Nov-98 8 10 0.4 –50 –25 0 25 50 75 100 125 150 TJ – Junction Temperature (C) www.vishay.com FaxBack 408-970-5600 2-3 Si4833DY Vishay Siliconix Source-Drain Diode Forward Voltage On-Resistance vs. Gate-to-Source Voltage 0.5 r DS(on) – On-Resistance ( W ) I S – Source Current (A) 20 10 TJ = 150C TJ = 25C 0.4 0.3 0.2 ID = 2.5 A 0.1 0 1 0 0.2 0.4 0.6 0.8 1.0 1.2 0 1.4 VSD – Source-to-Drain Voltage (V) 4 6 8 10 VGS – Gate-to-Source Voltage (V) Threshold Voltage Single Pulse Power 0.8 35 ID = 250 mA 0.6 28 0.4 21 Power (W) V GS(th) Variance (V) 2 0.2 14 0.0 7 –0.2 –0.4 –50 0 –25 0 25 50 75 100 125 150 0.01 1 0.1 TJ – Temperature (C) 10 30 Time (sec) Normalized Thermal Transient Impedance, Junction-to-Ambient 2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5 0.2 Notes: 0.1 0.1 PDM 0.05 t1 t2 1. Duty Cycle, D = t1 t2 2. Per Unit Base = RthJA = 90C/W 0.02 3. TJM – TA = PDMZthJA(t) Single Pulse 0.01 10–4 10–3 4. Surface Mounted 10–2 10–1 1 10 100 600 Square Wave Pulse Duration (sec) www.vishay.com FaxBack 408-970-5600 2-4 Document Number: 70796 S-56941—Rev. B, 02-Nov-98 Si4833DY Vishay Siliconix Reverse Current vs. Junction Temperature Forward Voltage Drop 3 1 1 0.1 I F – Forward Current (A) I R – Reverse Current (mA) 20 10 30 V 10 V 20 V 0.01 TJ = 150C TJ = 25C 0.1 0.001 0.01 0.0001 0 25 50 75 100 125 150 0 TJ – Junction Temperature (C) 0.2 0.3 0.4 0.5 0.6 VF – Forward Voltage Drop (V) Capacitance 250 CT – Junction Capacitance (pF) 0.1 200 150 100 50 0 0 4 8 12 16 20 VKA – Reverse Voltage (V) Normalized Thermal Transient Impedance, Junction-to-Ambient 2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2 Notes: 0.1 0.1 PDM 0.05 t1 t2 1. Duty Cycle, D = 0.02 t1 t2 2. Per Unit Base = RthJA = 92C/W 3. TJM – TA = PDMZthJA(t) Single Pulse 0.01 10–4 10–3 4. Surface Mounted 10–2 10–1 1 10 100 600 Square Wave Pulse Duration (sec) Document Number: 70796 S-56941—Rev. 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